2005 MTT-S FULL PROG.

Transcription

IMS
2005
2005 IEEE MTT-S
INTERNATIONAL
MICROWAVE SYMPOSIUM
Long Beach, CA • June 12–17, 2005
R
www.ims2005.org RFIC
A
F
T
G
IMS 2005 SYMPOSIUM WEEK AT A GLANCE
IMS
Activity
Location
Tutorials
Workshops
Plenary Session
Technical Sessions
Interactive Forum
Panel Sessions
LBCC & Hyatt
LBCC & Hyatt
LBCC
LBCC
LBCC
Hyatt
EXHIBITS Exhibition
µAPS
LBCC
LBCC
RFIC
LBCC & Hyatt
LBCC
LBCC
LBCC & Hyatt
LBCC
Workshops
Plenary Session
Technical Sessions
Panel Sessions
Interactive Forum
ARFTG Conference
Exhibits
Renaissance
Renaissance
SOCIAL
LBCC
LBCC
Aquarium of the Pacific
Hyatt
Hyatt
Hyatt
Hyatt
Renaissance
Renaissance
Hyatt
Hyatt
MTT Member Breakfast
RFIC Reception
MJ Reception
Industry Reception
MTT Awards Banquet
Student Awards Luncheon
Speakers Breakfast
ARFTG Breakfast
ARFTG Awards Lunch
WIE Reception
Ham Radio Social
SUN/12
M N A
MON/13
E M N A
TUE/14
E M N A
WED/15
E M N A
THU/16
E M N A
FRI/17
E M N A
E
IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM 2005/MICROWAVE WEEK
MORNING
8:00–9:40 AM
LUNCHTIME
12:00–1:15 PM
10:10–11:50 AM
AFTERNOON
1:20–3:00 PM
Sat., June 11,
2005
EVENING
3:30–5:10 PM
Registration 2 to 6 PM
Sunday,
June 12, 2005
Registration 7 AM to 6 PM
TSA: Filter I: RF and Microwave Filter Design
TSB: Basic RFIC Building Blocks
TSC: Monolithic Distributed Power Management
for Next Generation Wireless Applications
WSA: Competitiveness of Broadband Wireless Access (BWA) Systems
WSB: Full CMOS Radio
WSC: Advanced Technologies for Next Generation RFICs
WSD: Advanced System Solutions and Integration Technologies
WSE: Impact of Component Modeling on Microwave …
WSH: Noise Shaping Methods for RFIC Design
WSF: Accuracy of System-level Figures of Merit …
WSI: On-wafer Microwave Measurements: …
WSG: Circuit Characterization, Modeling and Testing: …
WSJ: Practical Implementation of RF Power Amplifiers …
WSK: Design Considerations and Tools for the System Level Design of RFICs
WSL: Multi-band Multi-mode RFICs
RFIC Plenary Session
5:30 to 7 PM
LBCC
RFIC Reception
7 to 9 PM
LBCC
Monday,
June 13, 2005
RFIC Symposium 8 AM to 5 PM
TMA: EMI/EMC Fundamentals for RF/MW Engineers
WMA: Application and Technology of High Speed Analog to Digital Converters
WMB: Filter II: Practical Aspects of Microwave Filter Design and Realization
WMC: Advances in RF Power Amplifiers: Modeling, Design and Linearization
WMD: Terahertz Radiation: Technology, Applications and Measurement Methods
WME: AM Noise in Modern Receivers
WMI: New Developments in Low Noise Frequency Sources
WMF: Packaging and Interconnects for Microwave Photonics Applications
WMJ: Low Cost Packaging for Microwave and mm-wave Products
PMA: CMOS PAs Step on the GaAs!
WMG: Liquid Crystal Polymers for Microwave and mm-wave Packaging
WMK: Technology and Implementation of High Speed/GHz Digital …
WMH: High Frequency Digital Backplane Interconnect …
Tuesday,
June 14, 2005
RFIC Symposium 8 AM to 5 PM
IMS Exhibition 9 AM to 5 PM • µAPS 9 AM to 4:30 PM
TU1A: Radio Over Fiber: Devices,
Techniques and Systems
TU1B: Frequency Conversion
and Control Circuits
TU1C: Frequency Domain
Numerical Techiques
TU1D: Silicon and GaAs Based
Novel Amplifiers and Mixers
TU1E: Filter Theory and Synthesis
Techniques
PTUA: 3G Handsets – Too Much
Power in Your Hands?
PTUB: Outsourcing: The Impact on
the Microwave Industry
TU2A: Plenary Session
PTUC: RF/Microwave/mm-wave
Applications of Metamaterials
RTUIF: INTERACTIVE FORUM 1:30 TO 4:30 PM
TU3A: Sensors and Sensor Systems
TU4A: Filter Design and
Implementation
TU3B: Hot Carrier Effects and Mixer
TU4B: Microwave Component
Technology
Miniaturization, Performance
Optimization, Size Reduction
and Emerging Technology
TU3C: Advances in Time Domain
TU4C: New Applications of
Modeling
Time Domain Methods
TU3D: FBAR Filters for Cellular
TU4D: Microwave Magnetic
Phone (FS)
Devices
TU3E: Memorial Session for Don
TU4E: Distributed RF Sensor
Parker (SS)
Communication (FS)
Microwave Journal/
MTT-S Reception
6 to 8 PM
Aquarium of the
Pacific
Women in Engineering
Reception
5:30 to 7 PM
Hyatt
Education Forum
6 to 8 PM
Hyatt
Ham Radio Social
6 to 9 PM
Hyatt
Wednesday,
June 15, 2005
WE1A: Phased Arrays and
Retrodirective Systems
WE1B: Microwave Acoustic
Devices
WE1C: Components and
Technologies for THz Applications
WE1D: Non-linear Device Modeling
WE2A: Smart Antennas and
Beamforming Techniques
WE2B: Tunable Dielectric Materials
and Devices
WE2C: Terahertz Imaging
(FS)
WE2D: A Tribute to Harold Sobol
PWA: CAD Tools for Microwave IC
Design
PWB: Trends for Future Deep Space
Exploration
(SS)
WE1E: High Power GaN Devices
WE1F: Bandstop and Dual
Resonator Filters
WE1G: Baluns and Transmission
Structures
PWC: Venture Capital and
Entrepreneurial Opportunities
in Microwaves
WE2E: Power Amplifiers for
Wireless Applications
WE2F: Ultra Wideband and
Extended Stopband Filters
WE2G: Novel Components
WEIF: INTERACTIVE FORUM 1:30 TO 4:30 PM
WE3A: Advances in Wireless
WE4A: Future Technologies for
Subsystem Technologies
MW/mm-wave Applications (SS)
WE3B: MEMS Device Technology
WE4B: MEMS Component
Technology
WE3C: Tunable and Active Filters
WE4C: Planar Dual Mode Filters
WE3D: Advances in Nonlinear
Simulation Techniques
WE3E: Advanced Technologies for
Power Amplifiers
WE3F: Advanced Packaging
Materials and Applications I
WE3G: Analysis and App. of Low
Noise Oscillating Syst. Arrays (FS)
WE4D: Nonlinear Behavioral
Modeling of Microwave Circuits
WE4E: Couplers, Hybrids and
Splitters
WE4F: Advancaed Packaging and
Materials II
WE4G: Low Noise Devices and
MMICs
Industry-hosted
Cocktail Reception
5:45 to 7:15 PM
Hyatt
Awards Banquet
7:30 to 10 PM
Hyatt
Thursday,
June 16, 2005
TH1A: Novel Technologies for Signal
Generation
TH1B: High Power Amplifiers
TH1C: mm and submm-wave
Components for Emerging High
Frequency Applications
TH1D: Linear Modeling of Active
and Passive Structures
TH1E: Trends for Future Radar
Systems with Electronically Scanned
Arrays, Part 1 (SS)
TH1F: Superconducting and
Innovative Planar Filters
TH1G: Advance Nonlinear and
Active Device Measurements
THIF: INTERACTIVE FORUM 1:30 TO 4:30 PM
TH3A: Advances in Signal
Generation Techniques
TH4B: Wideband Communications
TH3B: Advanced Radar Systems
Systems
TH4C: High Frequency Propagation
TH3C: Metamaterial Waveguides
and Effects
TH2A: New Approaches for Low
Noise Oscillators
TH2B: Advances in High Power
Amplifier Linearization
TH2C: Millimeter-wave Monolithic
Transceiver Components
TH2D: Neural Network and Space
Mapping Technologies
TH2E: Trends for Future Radar
Arrays, Part 2 (SS)
TH2F: Synthetic Transmission Lines
and Their Applications
TH2G: Innovations in Microwave
Measurement
PTHA: On the Impact
of Nanotechnology
on the Microwave Field
TH3D: Efficient CAD for Multilayer
Cir. and Large Intercon. Networks
TH3E: Biological Effects and
Medical Applications
TH3F: Novel Transmission Lines and
Structures
TH3G: Circuits and Techniques for
Multi-Gigabit/sec Transmission
TH4E: Advances in HF, VHF
and UHF Technology
TH4F: Left Handed Transmission
Lines and Applications
Friday,
June 17, 2005
Registration 7 AM to 9 AM
ARFTG Conference and Exhibition 7 AM to 5 PM – Renaissance
TFA: Ferrite, Ferroelectric and Other Special Materials for Microwave Control
TFB: Signal Integrity Modeling and Analysis
WFA: Physics, Theory, Fabrication and Applications of Microwave Metamaterials
WFB: RF Aspects of Software Defined Radio (SDR)
WFC: Advances in Automated Modeling and Microwave Design
WFD: Advances in High Efficiency Power Device and Circuit Technologies
WFE: Recent Advances in RF MEMs
WFG: Rediscovering Circuit Design Techniques for Microwave Components,
WFF: Very Large Microwave Arrays for Radio Astronomy and Space Comm.
Circuits and Subsystems: The Efficiency and Power of EM/Circuit Codesign
WFH: See Through Wall Radars
FS: Focused Session
SS: Special Session
TABLE OF CONTENTS
INTERNATIONAL MICROWAVE SYMPOSIUM
General Chairman’s Message
Plenary Session
Technical Sessions
Tuesday
Wednesday
Thursday
Panel Sessions
Monday, Tuesday
Wednesday, Thursday
Interactive Forum
Wednesday
Thursday
Special & Focused Sessions
Tuesday, Wednesday
Thursday
Workshops & Tutorials
Sunday
Monday
Friday
µAPS & Exhibition
Social Events
RFIC SYMPOSIUM
2
2
Chairman’s Message
Plenary Session
Technical Sessions
Monday
Tuesday
Interactive Forum
Tuesday
28
36
46
45
55
6
14
15
76
77
ARFTG MICROWAVE MEASUREMENT CONFERENCE
Chairman’s Message
6
Technical Sessions
Friday
61
44
54
34
53
For updates and additional information:
17
22
56
62
71
www.ims2005.org
CONTENTS (LISTED ALPHABETICALLY)
Additional Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Administrative Committee . . . . . . . . . . . . . . . . . . . . . . . .65
ARFTG Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . .6
ARFTG Microwave Measurement Conference . . . . . . .61
Awards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Education Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Exhibition Invitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Exhibitors and Exhibition Hours . . . . . . . . . . . . . . . . . .64
Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Focused Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . .34, 35
Long Beach Convention Center . . . . . . . . . . . . . . . . . . .74
Long Beach Information . . . . . . . . . . . . . . . . . . . . . . . . .70
Future IMS Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
General Chairman’s Message . . . . . . . . . . . . . . . . . . . . . .2
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Guest Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Historical Exhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Hotel Map and Information . . . . . . . . . . . . . . . . . . . . . . .12
Housing Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
IEEE MTT-S Membership Information . . . . . . . . . . . . . .8
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . .44, 54
Microwave Application & Product Seminars . . . . . . . .62
MTT-S Technical Program Chairs’ Message . . . . . . . . . .3
Panel Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45, 55
Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Registration Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Registration Information . . . . . . . . . . . . . . . . . . . . . . . . .13
RFIC Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . .6
RFIC Symposium . . . . . . . . . . . . . . . . . . . . . . . . . . . .14, 76
Social Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Special Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35, 53
Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
Student Paper Competition . . . . . . . . . . . . . . . . . . . . . . .27
Technical Program Committee . . . . . . . . . . . . . . . . . . . .68
Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . .28, 36, 46
Tutorials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17, 22, 56
Visa Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18, 23, 58
1
AN INVITATION TO MICROWAVE WEEK 2005
Welcome to the 2005 IEEE International Microwave Symposium, in Long Beach, California. The Steering Committee will
cram this year’s “Microwave Week” full of
technical paper sessions, focused sessions,
poster sessions, lunch-time panels, unique
and in-depth workshops and tutorials, a student paper competition, a display of historical artifacts, a vendor exhibition, the RFIC
Conference, and the ARFTG Meeting. This
year, there will not be a paper copy of the
digest; there will only be a CDROM. It will
be possible to order a hard copy from the
Charlie Jackson IEEE Conference Publication Program; details will be available on-site.
Long Beach has changed significantly since the Symposium
was last here in 1989. Long Beach now has the Aquarium of the
Tatsuo Itoh
Vice Chair
Pacific, the Queensway project has been completed with the return of the Pike.
The Queen Mary was launched in a bygone era with a wireless
transmitter, before the advent of satellite TV, radar, cell phones,
and microwave ovens. Nowadays, almost every guest on the ship
has their own microwave transceiver: a cell phone. In a way, the
Queen Mary can symbolize how microwaves have become a part
of the fabric of our lives.
The 2005 Steering Committee has been working for eight
years preparing for the Microwave Week, and the entire committee invites you to attend!
Charlie Jackson
General Chairman
2005 International Microwave Symposium
Arvind Sharma
Symposium Secretary
Timothy Lee
Local Arrangements Chair
PLENARY SESSION
The Plenary Session will be the formal opening of IMS2005
and will be held at 10:10 AM on Tuesday, June 14, 2005 in the
Ballroom at the Long Beach Convention
Center. The program for the session includes welcoming and introductory remarks
by Charlie Jackson, Symposium General
Chairman, and K.C. Gupta, President of
MTT-S AdCom, an overview of the technical
program by David Rutledge, Technical Program Chair, and the presentation of IEEE
awards. Two keynote addresses will be presented in this session. Dr. Teresa Meng,
Teresa Meng Professor of Electrical Engineering at Stanford University, will address “Digitally Assisted Analog Design
for Wireless SoCs and Its Future.” Mr. Ziqiang Hou, Professor of
the Institute of Acoustics China Academy of Science, will address “3G and Mobile Broadband Wireless Access.”
Teresa H. Meng is the Reid Weaver Dennis Professor of Electrical Engineering at Stanford University. In 1999, Dr. Meng took
leave from Stanford and founded Atheros Communications, Inc.,
which delivers the core technology for high-performance wireless communication systems. As a result of this effort, Dr. Meng
was named one of the Top 10 Entrepreneurs in 2001 by Red
Herring, Innovator of the Year in 2002 by MIT Sloan School eBA,
and received the CIO Magazine 20/20 Vision Award in 2002. Dr.
Meng’s current research interests include circuit optimization
and neural signal processing. She has received many awards and
honors for her research work at Stanford: an NSF Presidential
Young Investigator Award, an ONR Young Investigator Award,
an IBM Faculty Development Award, a Best Paper Award and a
Distinguished Lecturer Award from the IEEE Signal Processing
Society, the Eli Jury Award from UC Berkeley, and awards from
other industry and academic organizations. Dr. Meng is a Fellow
of the IEEE. She received her PhD in EECS from the University
of California at Berkeley in 1988.
Mr. Ziqiang Hou, previously the Chairman of the Board of KeJian Co. and Chief
Scientist of China Netcom, is a professor of
the Institute of Acoustics, China Academy
of Science (CAS). Mr. Hou was the Secretary General of the Chinese Academy of Sciences from 1988 to 1993, and Director of
the Institute of Acoustics CAS from 1993 to
1997. Mr. Hou is also an independent Nonexecutive Director of China Netcom Group
Corporation (Hong Kong) Ltd., Chairman of Ziqiang Hou
China Cellular Phone Handset Industry Summit Forum, Committeeman of the Telecommunication Science and Technology
Committee of the Ministry of Information Industry (MII), a senior consultant to the National Bureau of Broadcast and TV, and
a member of Information Expert Group of Shanghai, Tianjin, and
Shenzhen. He leads an R&D group in digital information, consumer electronics products and broadband wired and wireless IP
network area, in the DSP center of the Institute of Acoustics,
CAS. He has won the 1st Class Chinese National Award of Science and Technology Progress.
2
IMS2005 TECHNICAL PROGRAM
Welcome to the 2005 International Microwave Symposium.
The 200 members of the Technical Program Committee have developed an exciting technical program. This
year there were 984 submissions. The committee chose 344 papers for oral presentations, and 149 for the
poster sessions. Scott
Wedge and Jim Rosenberg organized the student
competition.
There are 20 student
papers nominated for
Dave Rutledge the competition. The
student paper awards will be presented at
the Awards Luncheon on Thursday, June
Mike DeLisio
16th.
There will also be workshops, organized by Ethan Wang, special sessions, organized by Alina Moussessian, and lunch panel
sessions, organized by Emilio Sovero. There are 38 workshops
on Sunday, Monday and Friday, and eight special sessions during the week. Panel sessions are on Monday,
Tuesday, Wednesday, and Thursday at
noon. Panel sessions are open to all who are
registered for the IMS, with lunch available
for an extra charge.
We would like to thank Jeff Pond, Jon
Hacker, Tim Lee, and Larry Whicker for
their work in paper management, and the
volunteers of the Long Beach Steering Committee for all of their arrangements. We
Bob York hope that you have an interesting week, and
that you enjoy your stay in Long Beach.
IMS2005 PROGRAM GUIDE
IMS2005 PUBLICATIONS
We have prepared this program guide to assist you during
your visit to Long Beach for the 2005 IEEE International Microwave Symposium. The program guide
contains a listing of the technical program
and information on registration, hotels, social programs and other useful items. Despite all our attempts to keep the information accurate, there will be errors and there
will be changes after the printed version
goes to press. Additional information will be
available in the registration area during the
conference. Please check www.ims2005.org
Steve Swift for updates.
Enjoy your visit to Long Beach in 2005
Steve Swift, Publicity Chair
All IMS2005 registrants will receive a symposium CDROM digest. We are not publishing any paper copy of the symposium digest. The CDROM will contain all IMS2005
technical papers as well as 65th ARFTG. Instructions for how to order a paper copy of
the digest will be available on-site at the
symposium.
In addition to the CDROM, registrants will
receive an abstract book containing technical session information and brief summaries
of the symposium technical papers. The spiral bound abstract book will have space beDebabani Choudhury side each abstract for notes.
We hope that the availability of the CDROM and abstract book
will help you enjoy the symposium technical sessions.
Debabani Choudhury, Publications Chair
Dave Rutledge, IMS2005 TPC Chair
Mike DeLisio, IMS2005 TPC Co-Chair
Bob York, IMS2005 TPC Co-Chair
IMS2005 WEB TEAM
The IMS2005 website is located at http://www.ims2005.org. It
presents the important information that you need about this
conference. The website has been categorized into seven different pages for navigation. The home page shows important dates
and conference sponsors. The Steering
Committee page lists members, positions,
telephone numbers and email addresses.
Author Information describes how to submit
your paper and offers tips on how to prepare an effective presentation. The Attendee Information page contains useful inTimothy Lee formation to help you register for the con-
ference, reserve hotel rooms, arrange your trip, and get familiar
with Long Beach before you arrive for the conference. The
Technical Program page contains the complete technical program for the conference. The Social Program contains information to help you relax and enjoy time away from the meetings.
The Exhibitor Information page contains a list of all exhibitors,
instructions on how to become an exhibitor and exhibitor hotel
reservations. Please continue to check the website for useful updates both before and during the conference. We hope this website helps you enjoy IMS2005.
Timothy Lee
IMS2005 Web Team Chair
3
2005 INTERNATIONAL MICROWAVE SYMPOSIUM —
INTERACTIVE FORUM
IMS2005 UNIVERSITY LIAISON ACTIVITIES
This year’s International Microwave Symposium will once
again have up to ten booths in the symposium exhibit hall devoted to publicizing university programs. Universities with regional, national, and international audiences are contacted in early
February to gauge interest in this important
educational outreach activity. Stop by the
booths, talk with the students and faculty,
and view the latest research being done at
these universities.
The IMS2005 will also
Bill Deal have student volunteers assisting the Steering Committee during the conference. A number of graduate
and undergraduate students from local universities in the Los Angeles Basin have been
invited to assist the symposium.
All of the booths will display interesting Vesna Radisic
information on current projects, and students will staff them.
Spend a few moments chatting with these students. You will find
their youthful enthusiasm bodes well for the future of the MTT
society.
Bill Deal and Vesna Radisic
IMS2005 University Liaison
The Interactive Forum (IF) is the International Microwave
Symposium’s name for what is commonly called a poster session.
The IF provides an opportunity for presenters to engage in discussions with symposium attendees in a lively and personal way
not available from the front of a lecture hall.
Each IF session will be organized to present
approximately 70 papers each, and an additional special Student Paper session is
planned for this year’s symposium. Every
IMS technical specialty will be represented
at the IFs. Space will be provided for all IMS
Hector J. De Los Santos authors to discuss and answer questions on
their papers in a space adjacent to the IF area associated with
their technical interest. All IMS attendees are invited to attend
the IF sessions. Complimentary food and beverages will be provided.
Hector J. De Los Santos
IMS2005 Interactive Forum Chair
2005 WORKSHOPS AND TUTORIALS
to the RF integrated circuit community. Nearly all of the workshops devoted to RF and microwave test and measurement will
be held on Monday, so as not to overlap the 65th ARFTG Conference which is being held on Friday.
More details on the IMS2005 Sunday workshops and tutorials
begin on page 17. Further information on Monday’s offerings
start on page 22. Detailed descriptions of the Friday workshops
and tutorials commence on page 56.
There will be 31 workshops and six tutorials held in Long
Beach during Microwave Week. The IMS and RFIC 2005 workshops and tutorials cover a broad range of topics from fundamental microwave filter design to in-depth applications such as
radio astronomy and space communications. At the same time,
several “hot spots” aimed for modern wireless applications are
highlighted. This should bring significant interests of attendees
from both industry and academia. The majority of the workshops
and tutorials on Sunday will be focused on technology of interest
Y. Ethan Wang
Workshops and
Tutorials Chair
Yi-Chi Shih
Sunday Workshops
Kevin M.K.H. Leong
Monday Workshops
4
Kevin Miyashiro
Monday Workshops
Paul Yu
Friday Workshops
IMS2005 SPECIAL AND FOCUSED SESSIONS
IMS2005 PANEL SESSIONS
The IMS2005 Technical Program Committee has organized
special and focused sessions in technically diverse areas of interest. These sessions present the latest information on rapidly
evolving areas related
to microwave theory
and techniques. All papers in these sessions
were solicited and invited by the session organizers. This year’s focused and special sesAlina Moussessian sion topics are:
John Horton
✗ FBAR Filters for Cellular Phone
Applications
✗ Distributed RF Sensor/Communication Systems
✗ Terahertz Imaging
✗ Analysis and Applications of Low Phase-Noise Oscillating
System Arrays
✗ Future Technologies for Microwave/Millimeter-wave
Applications
✗ Trends for Future Radar Systems with Electronically
Scanned Arrays, Part I
✗ Trends for Future Radar Systems with Electronically
Scanned Arrays, Part II
Alina Moussessian
IMS2005 Special and Focused Session Co-Chair
John Horton
IMS2005 Special and Focused Session Co-Chair
Microwaves Week 2005 will feature eight lunchtime (12:00 to
1:20 PM) panel sessions. Six of these panel sessions are sponsored by IMS2005. One is sponsored by
RFIC2005 and one is sponsored by both
IMS2005 and RFIC2005. These panel sessions will provide attendees with the opportunity to hear different views from panels of
experts on subjects of current interest,
while at the same time allowing a high level
of audience interaction. The following topics will be discussed:
Emilio Sovero
Monday, June 13, 2005
✗ CMOS PAs Step on the GaAs!
Tuesday, June 14, 2005
✗ 3G Handsets – Too Much Power in Your Hands?
✗ Outsourcing: The Impact on the Microwave Industry
✗ RF/Microwave/Millimeter-wave Applications
of Metamaterials
Wednesday, June 15, 2005
✗ CAD Tools for Microwave IC Design
✗ Trends for Future Deep Space Exploration
✗ Venture Capital and Entrepreneurial Opportunities
in Microwaves
Thursday, June 16, 2005
✗ On the Impact of Nanotechnology on the Microwave Field
Detailed descriptions of each of the panel sessions can be
found on pages 45 and 55.
The panel sessions are open and free to conference registrants, and do not require separate registration for participation.
A convenient box lunch will be available at a nominal cost for
those attending the panel sessions and others. Please use the
registration form on page 9 to purchase a box lunch on a particular day.
Emilio Sovero
IMS2005 Panel Sessions Chair
PAPER SUBMISSIONS
This year has marked the return of the all-volunteer technical
paper handling system that had its debut at IMS2000. We have
worked hard to make it as robust and intuitive as possible while retaining the flexibility to handle the complexities of the conference with its 30 technical program committees and 200 reviewers. This year we
received over 1000 paper submissions, with
more than half received in the final day; as
good a test as anyone could devise and one
that was passed without significant complications. We hope that authors liked the new
Jon Hacker streamlined approach to paper submission
for IMS2005. Every effort was made to eliminate asking authors
for unnecessary or redundant information during the submission
process.
Without the efforts of a paid team, we have had to rely heavily
on the skilled help of our dedicated IMS volunteers. We are especially thankful to Jeff Pond, who wrote the system code and
worked tirelessly to make it better throughout the year. We are
also indebted to Blythe Deckman who built and managed our
wireless network for the TPC meetings, and Tim Lee who
worked with Jeff to get the system ported over to the MTT Society web server. This permanent server site should make using
the system in future years straightforward, and hopefully eliminate the past ritual of changing the submission and review software every few years. With a stable foundation now established,
we can instead focus on refining the process to make it even better down the road. In the meantime, we look forward to welcoming you to Long Beach.
Jon Hacker
IMS Electronic Paper Manager
2005 EXHIBITION
The exhibition that is part of Microwave Week gives you the
opportunity to visit displays from more than 400 companies
that will be showing the latest products and
services available to our industry. The exhibition will be held in Halls A, B and C on the
lower level of the convention center and will
also include the Historical Exhibit and the
Microwave Application and Product Seminars (µAPS), which are now in their tenth
year. These seminars have grown in popularity and will be expanded, once again, this
year. The exhibition is open from 9:00 AM to
Harlan Howe, Jr. 5:00 PM on Tuesday and Wednesday and
from 9:00 AM to 3:00 PM on Thursday. (Please note that children
under the age of 14 will not be admitted to the exhibition hall at
any time.) I hope that you will take advantage of this unique
chance to visit the largest group of microwave exhibitors at any
show in the world.
Harlan Howe, Jr.
Exhibition Manager
5
MESSAGE FROM THE RFIC CHAIRMAN
guished guests will share their views on the future direction of
semiconductor device technology applied to wireless and mobile
communications IC’s. Sunday evening also features the RFIC Reception. The Reception begins after the conclusion of the Plenary and provides a social venue allowing old friends and new
acquaintances to meet and catch up on the wireless industry.
The technical program continues on Monday and Tuesday
with oral paper presentations, panel sessions, and an interactive
forum. A Monday Panel Session during lunch will allow interactive discussions on the research vs. realities of Si device technology competing with GaAs technology for handset power amplifiers. Panelist from academia and industry will express their
views on this topic. A Tuesday Panel session during lunch focuses on a hot 3G phone topic, quite literally, “Too Much Power in
Your Hands?.” The interactive forum begins on Tuesday afternoon and is an excellent opportunity for attendees to meet authors and discuss their presentations in detail. The RFIC Symposium concludes on Tuesday allowing participants to attend the
IMS and ARFTG as well as plenty of time to visit the exhibit hall.
Welcome to the 2005 RFIC Symposium! Again this year, the
RFIC Symposium continues to build upon its heritage as one of
the foremost IEEE technical conferences
dedicated to the latest innovations in RFIC
development of wireless and wire line communication ICs with an exciting technical
program. Running in conjunction with the
International Microwave Symposium and
Exhibition, the RFIC Symposium adds to
the excitement of the microwave week with
three days focused exclusively on RFIC
technology and innovation. The symposium
Joseph Staudinger begins on Sunday, June 12th, with tutorials
and workshops focused on RF technology, design, and system issues.
The RFIC Plenary Session begins at 5:30 PM on Sunday, June
12th, following the workshops. It will be held in the Ballroom of
the Long Beach Convention Center and opens the formal technical program. Note that the placement of the Plenary Session on
Sunday evening at 5:30 PM represents a change in date/time from
past years. The Plenary Session will feature two distinguished
speakers from industry, Mr. Jerry Neal from RF Micro Devices
and Mr. Ed Healy from Silicon Laboratories. These two distin-
Joseph Staudinger
General Chairman
2005 RFIC Symposium
65TH ARFTG MICROWAVE MEASUREMENT CONFERENCE
Welcome to the 65th Automatic RF Techniques Group
(ARFTG) Conference being held at the Renaissance Hotel on
Friday, June 17, 2005. The conference will
include technical presentations, an interactive forum, and an exhibition; all to give you
ample opportunity to interact with your colleagues in the automated RF and microwave test community. The conference
theme is “Measurements for MillimeterWave Applications” with papers focusing on
measurements for point-to-point communications, line-of-sight systems, automotive
Tom Ruttan radar, differential measurements, trace-ability to national standards laboratories, models for measurement
verification, vector network analysis, large-signal network analysis, power, and noise including on-wafer measurements. Also, be
sure to check for any joint ARFTG/IMS workshops being held.
This year ARFTG is co-sponsoring two workshops: “On-Wafer
Microwave Measurement: State of the Art and Future Direc-
tions” and “High Frequency Digital Backplane Interconnect
Characterization and Design.” An important part of any ARFTG
Conference is the opportunity to interact one-on-one with colleagues, experts and vendors in the RF and microwave test and
measurement community. Whether your interests include highthroughput production or one-of-a-kind metrology measurements, complex systems or simple circuit modeling, small signal
S-parameter or large-signal non-linear measurements, phase
noise or noise figure, DC or lightwave, you will find an interested
party and most likely an expert. Starting with the continental
breakfast in the exhibition area, continuing through the two exhibition/interactive forum sessions and the luncheon, there will
be ample opportunity for discussion with others facing similar
challenges. You, along with the other attendees, may find that
these interactions are often the best source of ideas and information for their current projects. So come and join us. You’ll find
that the atmosphere is informal and friendly.
Tom Ruttan
Conference Chair
6
ADDITIONAL MEETINGS (CHECK WWW.IMS2005.ORG FOR UPDATES)
Saturday, June 11
10:00 AM–12:00 PM
1:00 PM–3:00 PM
3:00 PM–5:00 PM
5:00 PM–7:30 PM
7:30 PM–11:30 PM
7:00 AM–9:00 AM
Sunday, June 12
7:00 AM–8:30 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
8:00 AM–5:00 PM
12:00 AM–1:00 PM
12:00 AM–1:00 PM
7:00 PM–9:00 PM
Monday, June 13
7:00 AM–9:00 AM
7:00 AM–8:00 AM
7:00 AM–5:00 PM
12:00 PM–1:00 PM
12:00 PM–2:00 PM
5:45 PM–8:00 PM
Tuesday, June 14 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
12:00 PM–1:30 PM
12:00 PM–2:00 PM
1:30 PM–4:00 PM
4:30 PM–8:30 PM
5:30 PM–7:00 PM
6:00 PM–9:00 PM
6:00 PM–8:00 PM
Wednesday, June 15 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
12:00 PM–2:00 PM
5:45 PM–7:15 PM
7:30 PM–10:00 PM
Thursday, June 16 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:00 PM
12:00 PM–2:00 PM
12:00 PM–2:00 PM
Friday, June 17
7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–1:00 PM
12:00 PM–1:00 PM
AdCom Budget Committee
AdCom Long Range Planning
Speakers’ Preparation
AdCom Reception and Dinner
AdCom Meeting
Speakers’ Breakfast
AdCom Breakfast
Workshops Breakfast
AdCom Meeting
AdCom Lunch
Workshops Lunch
RFIC Reception
Workshops Breakfast
Workshops Lunch
TMTT & MWCL Editor’s Luncheon
Microwave Journal Reception
Attendees’ Breakfast
TCC Meeting
2005 RFIC TPC Lunch
Student Paper Competition
Chapter Chairs’ Reception and Meeting
Women in Engineering Reception
Ham Radio Social
RF and Microwave Education Forum
2006 IMS TPC Lunch
Industry–hosted Cocktail Reception
MTT-S Awards Banquet
2005/2006 IMS Steering Committee Lunch
Students Awards Luncheon
Workshops Breakfast
Workshops Lunch
RF AND MICROWAVE EDUCATION FORUM
TUESDAY, JUNE 14, 2005, 6:00-8:00 PM
LONG BEACH HYATT REGENCY
The Forum, held during the International Microwave Symposium, is an annual gathering of educators from around the world
who have professional interest in RF and microwave engineering. It provides an opportunity for meeting, and networking with,
colleagues having common interests, and serves as a venue for
discussing topics of current interest to the educators in this
field, examining innovative ideas related to education, and sharing information. A different theme is selected each year for the
Forum to focus the discussion.
2005 Theme:
Creating Online Content and Using Web-Based
Learning Tools in Microwave Education
Organizers:
Hyatt
Hyatt
LBCC
Hyatt
Hyatt
Hyatt
Hyatt
Hyatt
LBCC
Hyatt
Hyatt
LBCC
LBCC
Hyatt
LBCC
LBCC
LBCC
Hyatt
Aquarium of the Pacific
Hyatt
LBCC
LBCC
Hyatt
Hyatt
LBCC Ballroom
Hyatt
Hyatt
Hyatt
Hyatt
Hyatt
LBCC
LBCC
Hyatt
Hyatt
Hyatt
Hyatt
LBCC
LBCC
Hyatt
Hyatt
LBCC
Hyatt
LBCC
LBCC
Online education has gained recent attention in both academic and post-graduate educational settings. The Tuesday Rump
Session will include talks from a panel of educators and other
content providers who have used this new medium. In addition
to the talks, a demonstration of the capabilities of the new IEEE
Xplore-Enabled Learning Library (XELL) project will also be offered. An interactive discussion between panelists and the audience will conclude the session. A buffet dinner will be provided
for all attendees.
Please direct all inquiries and communications regarding the
2005 Forum to its organizer, Prof. J. Stevenson Kenney at
[email protected].
J. Stevenson Kenney,
Georgia Institute of Technology
Sanjay Raman, Virginia Polytechnic Institute
7
2005 IEEE MICROWAVE THEORY AND TECHNIQUES SOCIETY MEMBERSHIP
The IEEE (Eye-triple-E) is a non-profit, technical professional association of more than 380,000 individual members in 150 countries.
The full name is the Institute of Electrical and Electronics Engineers, Inc., although the organization is most popularly known and referred to by the letters I-E-E-E. Through its members, the IEEE is a leading authority in technical areas ranging from computer engineering, biomedical technology and telecommunications, to electric power, aerospace and consumer electronics, among others.
The IEEE Microwave Theory and Techniques Society (MTT-S) is a transnational society with more than 11,000 members and
110 chapters worldwide. Our society promotes the advancement of microwave theory and its applications, usually at frequencies from
200 MHz to 1 THz and beyond. As we enter into an exciting future our mission is to continue to understand and influence microwave
technology.
The benefits of IEEE membership include these offerings:
• Conference registration discounted rates (save $180 on IMS-2005 registration)
• Membership in one or more of 37 IEEE Societies and four Technical Councils
• Subscriptions to online reference materials through IEEE Xplore and IEEE Member Digital Library
• Free IEEE Email Alias including virus scanning and optional spam filtering
• Get the IEEE Financial Advantage – negotiated exclusively for IEEE members
• More than 1,150 student branches at universities worldwide
To Join IEEE or renew your membership, please go to http://www.ieee.org/services/join/
Send email to [email protected], or call 1 (800) 678-IEEE.
IEEE MEMBERSHIP DUES (STANDARD RATES SHOWN, PROVISIONAL RATES AVAILABLE)
Residence
Member
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Member
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Student
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Student
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$75.50
$69.56
$74.20
$63.50
$60.00
$60.50
$30.00
$32.10
$34.50
$25.00
$25.00
$25.00
$15.00
$16.05
$17.25
$12.50
$12.50
$12.50
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$17.50
$17.00
$14.00
United States
Canada (incl. GST)
Canada (incl. HST)
Africa, Europe, Middle East
Latin America
Asia, Pacific
SOCIETY DUES
Microwave Theory and Techniques
PUBLICATIONS
Microwave (society magazine)
MTT CD-ROM Collection
Microwave and Wireless Components Letters
Transactions on Microwave Theory and Techniques
n/c
$116.00
$116.00
$124.00
n/c
$18.00
$18.00
$112.00
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8
Advance Conference Registration
IEEE MTT-S MICROWAVE WEEK EVENTS
June 12–17, 2005 ✦ Long Beach, CA ✦ IMS ✦ RFIC ✦ ARFTG
Each registrant must submit a separate form. A copy may be used.
Registration deadlines: May 5, 2005 for advance fax or mail; May 12, 2005 for advance Website.
30% higher on-site fees apply thereafter.
Fax (Credit Card only)
781-769-5037
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On-line
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Mail (Check or Credit Card)
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For information or handicap special needs only (phone registration is not available) (781) 769-9750.
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For a complimentary badge for plenary session and exhibits
To register, check ✓ the appropriate boxes and enter corresponding fees in the Remittance column.
ONLY PAID ATTENDEES WILL BE ADMITTED TO THE WORKSHOPS AND TECHNICAL SESSIONS.
WORKSHOPS AND TUTORIALS For paid attendees only.
(SEE BACK OF THIS PAGE FOR TITLES.)
STUDENT/RETIREE/
IEEE MEMBER
NON-MEMBER
LIFE MEMBER
If you are not an IEEE Member and wish to take advantage of IEEE Member
registration rates, you may, before mailing or faxing this form to enter your registration, call IEEE at 800-678-IEEE or go to http://www.ieee.org/services/join/ and
become an IEEE Member.
(Includes abstract book, exhibits and µAPS)
Full Day
Half Day
SUNDAY
WSA
WSB
WSC
WSD
WSE
WSF
WSG
WSH
WSI
WSJ
WSK
WSL
INTERNATIONAL MICROWAVE SYMPOSIUM (Tue., Wed. & Thur.)
All IMS Sessions (with IMS CD ROM)
All IMS Sessions (no IMS CD ROM)
Single-Day Registration (with IMS CD ROM)
Student, Retiree, Life Member (with IMS CD ROM)
RFIC SYMPOSIUM (Mon. & Tue.)
IEEE
MEMBER
$370
$320
$190
$160
NONMEMBER
$550
$490
$270
$120
REMITTANCE
$ _____________
$ _____________
$ _____________
$ _____________
$195
$280
$ _____________
$250
$470
$ _____________
MEMBER
NONMEMBER
$180
$120
$280
$120
(Includes exhibits, RFIC Sessions & Reception, RFIC Digest & CD ROM.)
RFIC Reception Only
ARFTG – MICROWAVE MEASUREMENT
CONFERENCE (Fri.)
(Includes exhibits, breakfast, lunch, Digest & ARFTG Exhibition.
Member rates available to ARFTG or IEEE members.)
ARFTG Student, Retiree, Life Member
ADDITIONAL DIGESTS AND CD ROMS
$ _____________
$ _____________
$ _____________
$ _____________
AWARDS BANQUET (Wed. Eve.)
$ _____________
$70
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
MONDAY
WMA
WMB
WMC
WMD
WME
WMF
WMG
WMH
WMI
WMJ
WMK
TMA
OPTIONAL BOX LUNCHES FOR PANEL SESSIONS
(Attendance is open to all. See reverse side for schedule.)
PMO: Monday
$15
PTU: Tuesday
$15
PWE: Wednesday
$15
PTH: Thursday
$15
$150
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Morning)
(Morning)
(Morning)
(Afternoon)
(Afternoon)
(Afternoon)
(Afternoon)
(Afternoon)
$225
$175
FRIDAY
WFA
WFB
WFC
WFD
WFE
WFF
WFG
WFH
TFA
TFB
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Morning)
(Morning)
(Afternoon)
(Afternoon)
$____
$____
$____
$____
$____
$____
$____
$____
(Full Day) $____
(Morning) $____
(Afternoon) $____
TOTAL $ ________
GUEST PROGRAMS (FULL DAY UNLESS OTHERWISE NOTED)
GSA:
GSB:
GSC:
GSD:
GSE:
GSF:
GSG:
Getty Museum Tour (Half Day)
A Day in San Juan Capistrano
Pasadena and the Huntington
Exploring Long Beach
Long Beach Multi-cultural Tour
Catalina Island Trip*
Golf Outing*
The only acceptable forms of payment are check, money order, MasterCard, VISA or American Express.
Make your check or money order (US $ ONLY on a US Bank or Traveler’s Check) payable to: IEEE/MTT-S
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$____
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$____
Full day and morning workshop or tutorial fees include workshops CD-ROM, continental breakfast,
lunch and refreshment breaks. Afternoon workshop or tutorial fees include workshops CD-ROM,
lunch and afternoon refreshments. Presenter notes are available at the workshop.
*Advance registration only
MasterCard
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Morning)
(Morning)
(Morning)
(Morning)
(Afternoon)
(Afternoon)
(Afternoon)
$105
$180
TSA (Full Day) $____
TSB (Full Day) $____
TSC (Morning) $____
$ ______________
$ ______________
(For pickup on-site only. After the Symposium, Digests and CD ROMs will be available from the IEEE.)
IMS and ARFTG CD ROM
Qty. ___ @ $150
$100
$ _____________
RFIC Digest
Qty. ___ @ $150
$175
$ _____________
$100
$ _____________
RFIC CD-ROM
Qty. ___ @ $150
$150
$ _____________
ARFTG Digest
Qty. ___ @ $130
$ _____________
$100
Workshop CD-ROM I (Sun./Mon.)
Qty. ___ @ $150
Workshop CD-ROM II (Mon./Fri.)
Qty. ___ @ $150
$100
$ _____________
Qty. ___ @
$155
$105
TOTAL
____ @$55
____ @$75
____ @$75
____ @$50
____ @$60
____ @$65
____ @$70
$________
$________
$________
$________
$________
$________
$________
GUEST PROGRAM TOTAL$________
TOTAL REMITTANCE
$ _________________
INDIVIDUAL PAYMENT MUST ACCOMPANY FORM
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Exp. Date
Written requests for refunds will be honored if received by April 25, 2005.
9
FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2005.ORG
Sunday
Monday
Friday
TUTORIALS
T
TSA
TSB
TSC
TMA
TFA
TFB
8:00 AM–5:00 PM
Filter I: RF and Microwave
Filter Design
UTORIALS
8:00(F
AMOR
–5:00
PM DETAILED
Basic
RFIC Building
Blocks
A MORE
DESCRIPTION
OF ANY
OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2005.ORG)
8:00 AM–12:00 PM
Monolithic Distributed Power Management for Next Generation Wireless Applications
1:00 PM–5:00 PM
EMI/EMC Fundamentals for RF/MW Engineers
8:00 AM–5:00 PM
Ferrite, Ferroelectric and Other Special Materials for Microwave Control
Signal Integrity Modeling and Analysis
8:00 AM–12:00 PM
Friday
June 17, 2005
Monday
June 13, 2005
Sunday
June 12, 2005
WORKSHOPS
WSA
WSB
WSC
WSD
WSE
WSF
WSG
WSH
WSI
WSJ
WSK
WSL
WMA
WMB
WMC
WMD
WME
WMF
WMG
WMH
WMI
WMJ
WMK
WFA
WFB
WFC
WFD
WFE
WFF
WFG
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
WFH
1:00 PM–5:00 PM
Monday
Tuesday
Tuesday
Tuesday
Wednesday
Wednesday
Wednesday
Thursday
PMA
PTUA
PTUB
PTUC
PWA
PWB
PWC
PTHA
Competitiveness of Broadband Wireless Access (BWA) Systems
Full CMOS Radio
Advanced Technologies for Next Generation RFICs
Advanced System Solutions and Integration Technologies for High Volume Wireless LAN Applications
Impact of Component Modeling on Microwave and Millimeter-wave Circuit Performance
Accuracy of System-level Figures of Merit for Wireless Applications
Circuit Characterization, Modeling and Testing: Can It Really Be Done Without Impedance Tuners?
Noise Shaping Methods for RFIC Design
On-wafer Microwave Measurements: State of the Art and Future Directions
Practical Implementation of RF Power Amplifiers for Cellular Base Stations
Design Considerations and Tools for the System Level Design of RFICs
Multi-band Multi-mode RFICs
Application and Technology of High Speed Analog to Digital Converters
Filter II: Practical Aspects of Microwave Filter Design and Realization
Advances in RF Power Amplifiers: Modeling, Design and Linearization
Terahertz Radiation: Technology, Applications and Measurement Methods
AM Noise in Modern Receivers
Packaging and Interconnects for Microwave Photonics Applications
Liquid Crystal Polymers for Microwave and Millimeter-wave Packaging
High Frequency Digital Backplane Interconnect Characterization and Design
New Developments in Low Noise Frequency Sources
Low Cost Packaging for Microwave and Millimeter-wave Products
Technology and Implementation of High Speed/GHz Digital Interconnections
Physics, Theory, Fabrication and Applications of Microwave Metamaterials
RF Aspects of Software Defined Radio (SDR)
Advances in Automated Modeling and Microwave Design
Advances in High Efficiency Power Device and Circuit Technologies
Recent Advances in RF MEMs
Very Large Microwave Arrays for Radio Astronomy and Space Communications
Rediscovering Circuit Design Techniques for Microwave Components, Circuits and Subsystems:
The Efficiency and Power of EM/Circuit Codesign
See Through Wall Radars
PANEL SESSIONS
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
12:00 PM–1:20 PM
CMOS PAs Step on the GaAs!
3G Handsets – Too Much Power in Your Hands?
Outsourcing: The Impact on the Microwave Industry
RF/Microwave/Millimeter-wave Applications of Metamaterials
CAD Tools for Microwave IC Design
Trends for Future Deep Space Exploration
Venture Capital and Entrepreneurial Opportunities in Microwaves
On the Impact of Nanotechnology on the Microwave Field
µAPS
Tuesday 9:00 AM–4:30 PM • Wednesday 9:00 AM–4:50 PM • Thursday 9:00 AM–12:00 PM
SOCIAL EVENTS
Sunday
Monday
Tuesday
Tuesday
Wednesday
Wednesday
7:00 PM–9:00 PM
6:00 PM–8:00 PM
5:30 PM–7:00 PM
6:00 PM–9:00 PM
5:45 PM–7:15 PM
7:30 PM–10:00 PM
RFIC Reception
Microwave Journal Reception
Women in Engineering Reception
Ham Radio Social
Industry Reception
Awards Banquet
NOON–5:00 PM
9:00 AM–3:30 PM
9:00 AM–3:00 PM
9:00 AM–3:00 PM
9:00 AM–3:00 PM
9:00 AM–5:00 PM
7:30 AM–1:30 PM
Getty Museum Tour
Long Beach Multi-cultural Tour
Catalina Island Trip
Golf Outing
GUEST PROGRAMS
Sunday
Monday
Tuesday
Wednesday
Thursday
Thursday
Friday
GSA
GSB
GSC
GSD
GSE
GSF
GSG
10
CONFERENCE HOUSING
2005 IEEE MTT-S INT’L
MICROWAVE SYMPOSIUM
ATTENDEE
JUNE 11–17, 2005 • LONG BEACH, CA
MTT-S • ARFTG • RFIC
ATIMS
use code
Reservations may be made only on-line, by fax or by mail and must be received by the Housing Bureau between February 1, 2005 and May 10, 2005.
Changes and modifications should be made through the Housing Bureau until May 10, 2005 using one of these methods.
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13
2005 IEEE RADIO FREQUENCY INTEGRATED CIRCUIT
(RFIC) SYMPOSIUM
RFIC STEERING COMMITTEE
Joseph Staudinger, General Chair
Stefan Heinen, TPC Co-Chair
Luciano Boglione, TPC Co-Chair
Albert Jerng, Digest & CD-ROM
David Ngo, Transactions
Jenshan Lin, Finance
Tina Quach, Publicity
Jacques C. Rudell, Invited Papers
Derek Shaeffer, Special Sessions
Larry Kushner, Secretary
Yann Deval, Workshops
Takao Inoue, Web Master
Larry Whicker, Conference Coordinator
On behalf of the Technical Program Committee, welcome to the 2005 IEEE
Radio Frequency Integrated Circuits (RFIC) Symposium. The RFIC Symposium is a leading edge IEEE technical conference dedicated to the advancement of integrated circuits and
sub-systems for RF and communications systems. The
RFIC Symposium begins on Sunday, June 12th with
workshops and tutorials addressing RF technology,
design and simulation, at both system and circuit level. The Plenary Session will be held on Sunday
evening, right after the workshops. Two leading experts will share their own views during Sunday
evening’s plenary session: Jerry Neal, Co-founder and
Vice President, RF Micro Devices, will talk about “Integration Technologies: Cellular and Beyond”; Ed
Healy, Vice President of Silicon Laboratories, will disStefan Heinen cuss “The Drive for Integration.” The RFIC reception
will follow the plenary session to allow for everyone to relax and discuss the industry outlook among friends. The regular technical program begins on Monday
featuring invited and submitted technical papers. A
Panel Session entitled “CMOS PAs Step on the GaAs!”
will take place during lunch on Monday and it is posed
to allow for many interactive discussions with the audience! Another panel session on Tuesday, “3G Handsets – Too Much Power in Your Hands?,” will have
panelists from both industry and academia offer their
views on the challenges ahead. The interactive forum
on Tuesday afternoon also gives attendees a further
oppportunity to meet one-on-one with authors. In all,
the RFIC symposium features 25 technical sessions,
an interactive forum, 160 presentations, workshops,
panel sessions and tutorials. The interest in RFIC
technology, and the venue offered by the Symposium Luciano Boglione
to showcase the latest advancements, continues to grow as evidence by a
record number of papers submitted to this year’s conference. The 2005 Technical Program Committee keeps working diligently toward the goal of strengthening the technical quality and breadth of the program, to maintain and improve
the legacy left by the previous Symposia. This would not be possible without attracting the professional in the field. We would like to thank all the authors for
submitting their work to the RFIC conference: this truly exciting program
would not be possible without their efforts!
Advisory Board
Fazal Ali
Natalino Camilleri
Eliot Cohen
Reynold Kagiwada
Sayfe Kiaei
Mahesh Kumar
Louis Liu
Steve Lloyd
Dave Lovelace
Vijay Nair
Kenneth O
RFIC TECHNICAL PROGRAM COMMITTEE
Walid Ali-Ahmad, AUB/MAXIM
Integrated Products
Kirk Ashby, Microtune Inc.
Bertan Bakkaloglu,
Arizona State University
Didier Belot, ST Microelectronics
Georg Boeck, Berlin University
of Technology
Sudipto Chakraborty,
Texas Instruments
Glenn Chang, MaxLinear
Yuhua Cheng, Skyworks Solutions
Thomas Cho, Marvell
Stephen Dow, ON Semiconductor
Werner Geppert, Infineon Technologies
Ranjit Gharpurey, University
of Michigan
Aditya Gupta, Anadigics
Andre Hanke, Infineon
Frank Henkel, IMST GmbH
Wang Huei, National Taiwan University
Stavros Iezekiel, University of Leeds
Kursad Kiziloglu, Intel Corp.
Kevin Kobayashi, Sirenza Microdevices
Kevin Kornegay, Cornell University
Larry Kushner, Kenet Inc.
Ting-Ping Liu,
Winbond Electronics Corp.
Stefan Heinen and Luciano Boglione
RFIC Technical Program Committee Chairs
2005 IEEE RFIC Symposium
Kevin McCarthy,
University College Cork
Srenik Mehta,
Atheros Communications
Jyoti Mondal, Freescale Semiconductor
Tadao Nakagawa, NTT Corp.
Dan Nobbe, Peregrine Semiconductor
Jeffrey Ou, Intel
Allen Podell, Podell Consulting
Sanjay Raman, Virginia Tech
Madhukar Reddy,
Skyworks Solutions Inc.
Bill Redman-White,
Philips Semiconductors/
Southampton University
Eli Reese, TriQuint Semiconductor
Pallavi Sandhiya, Filtronic Sigtek
Marko Sokolich, HRL Laboratories LLC
Noriharu Suematsu,
Mitsubishi Electric
Bruce Thompson, Motorola Labs
Freek van Straten,
Philips Semiconductors
Albert Wang, Illinois Institute
of Technology
Patrick Yue, Carnegie Mellon
University
RFIC PLENARY SESSIONS
Integration Technologies: Cellular and Beyond
By Jerry Neal, Co-founder and Vice President, RF Micro Devices
The Drive for Integration
By Ed Healy, Vice President of Silicon Laboratories
Over the last decade, wireless connectivity has become a way of life. As the
world’s highest volume consumer electronics product, the cellular phone is a leading driver of mobility. Consumers continue to demand cell phones that feature advanced capabilities, including web access, cameras and even television tuners,
which require higher data rates. To accommodate this trend, handset manufacturers are focusing on incorporating these advanced functionalities into the cell phone,
and they are looking to their semiconductor suppliers to provide more highly integrated components and complete system solutions that are smaller, better performing and more cost competitive. To drive these higher levels of integration and develop more complex, complete system solutions with optimal performance, RF Micro
Devices specializes in using a combination of multiple process and packaging technologies. In addition, RF Micro Devices is honing its radio expertise beyond cellular
to provide handset manufacturers multiple radios, including Bluetooth,® wireless
LAN and GPS, all of which are forecast to populate cell phones and a proliferation of
other wireless devices in the future.
As the handset emerges as a platform for the convergence of communications applications, the requirements for smaller, easier-to-implement components are necessary in order to make room for application processors, display requirements and
memory chips. Fully-integrated, mixed-signal ICs that offer high performance, flexibility and ease-of-use will continue to dominate the cellular handset market. Monolithic RF ICs in CMOS will enable the technology leap required to meet the challenging integration and cost savings goals of handset manufacturers.
In a market ruled by the consumer, ease-of-use and continuous integration will
become increasingly important to handset manufacturers who must deliver cost-effective and differentiated solutions quickly. Best-in-class components allow handset
manufacturers to enjoy supply chain control and flexibility as well as faster design
cycles. Semiconductor companies that succeed in the cellular market will abandon
incremental levels of integration that require multiple discretes, opting rather for
revolutionary, first of a kind innovations that push the boundaries of design resulting in integrated, easy-to-use, high performance solutions.
About Jerry D. Neal:
About Ed Healy:
Jerry D. Neal, the company’s executive vice president of
marketing and strategic development and co-founder, has
over 30 years experience in the RF and wireless industry.
After obtaining his college education at Gaston Technical
Institute and North Carolina State University, Mr. Neal
continued his education in the area of computer technology during his employment with Hewlett-Packard. An entrepreneur at heart, Mr. Neal founded Moisture Control
Systems, which he later sold to Hancor, Inc. Before cofounding RF Micro Devices, he broadened his exposure to
sales and technical business aspects at Analog Devices.
Ed Healy has served as vice president focused on wireless
products since 1998. Prior to Silicon Laboratories, Mr.
Healy worked as general manager of the Magnetic Storage
Division at Crystal Semiconductor/Cirrus Logic. Mr. Healy
also held various senior marketing and product planning
positions for Zilog, a designer and manufacturer of application specific standard products, and GEC Plessey Semiconductor. Additionally, Mr. Healy was an assistant professor of electrical engineering at the United States Military Academy after serving as an infantry officer. Mr.
Healy holds a bachelor’s degree in electrical engineering
from the United States Military Academy, a master’s degree in electrical engineering from Georgia Institute of Technology and a master’s degree in management from
Stanford University.
14
2005 RFIC TECHNICAL PROGRAM — MONDAY, JUNE 13, 2005
RMO1A Cellular Transmitters — LBCC 101
Chair: F. Ali, Nokia • Co-chair: A. Hanke, Infineon
8:00 AM: RMO1A-1: Invited: A Quad-band 8PSK/GMSK Polar Transceiver
A.W. Hietala, RF Micro Devices
8:20 AM: RMO1A-2: Invited: Polar Loop Transmitter for GSM/GPRS/EDGE
T. Sowlati, D. Rozenblit, R. Pullela, M. Damgaard, D. Koh, D. Ripley, E. McCarthy, F. Balteanu,
I. Gheorghe, K. Juan,
S. Wloczysiak, D. Firoiu, Skyworks
8:40 AM: RMO1A-3: A Highly Integrated CMOS Zero-IF Transmitter for Cellular CDMA
Applications
J. Zhou, W. Sheng, X. Zhang, N. Kim, J. Woolfrey, M. Margarit, S. Vora, C. Persico, Qualcomm
Inc.
9:00 AM: RMO1A-4: A Digital-to-RF-Amplitude Converter for GSM/GPRS/EDGE in 90 nm
Digital CMOS
P. Cruise, C-M. Hung, R.B. Staszewski, O. Eliezer, S. Rezeq, D. Leipold, K. Maggio, Wireless
Analog Technology Center, Texas Instruments Inc.
9:20 AM: RMO1A-5: A 1 GHz CMOS Current-Folded Direct Digital RF Quadrature Modulator
Y. Zhou, J. Yuan, Institute for Infocomm Research, Competence Center for Circuit Design,
Dept. of Electroscience, Lund University
RMO1B Small Signal LNAs — LBCC 102A/B
Chair: A. Podell, Consultant • Co-chair: V. Nair, Intel Corp.
8:00 AM: RMO1B-1: A CMOS 5 GHz Micro-Power LNA
H-H. Hsieh, L-H. Lu, National Taiwan University
8:20 AM: RMO1B-2: A Sub-mW 960 MHz Ultra-Wideband CMOS LNA
Stanley B.T. Wang, A.M. Niknejad, R.W. Brodersen, Berkeley Wireless Research Center, Dept.
of EECS, UC Berkeley
8:40 AM: RMO1B-3: A 3–10 GHz Bandwidth Low-Noise and Low-Power Amplifier for FullBand UWB Communications in 0.25 µm SiGe BiCMOS Technology
N. Shiramizu, T. Masuda, K. Washio, Central Research Lab, Hitachi Ltd.; M. Tanabe, Renesas
Northern Japan Semiconductor Inc.
9:00 AM: RMO1B-4: An ESD-Protected, 2.45/5.25 GHz Dual-Band CMOS LNA with Series LC
Loads and a 0.5 V Supply
S. Hyvonen, Intel Corp.; K. Bhatia, E. Rosenbaum, University of Illinois at Urbana-Champaign
9:20 AM: RMO1B-5: 18–26 GHz Low-Noise Amplifiers Using 130 and 90 nm Bulk CMOS
Technologies
S-C. Shin, S-F. Lai, K-Y. Lin, M-D. Tsai, H. Wang, National Taiwan University; C-S. Chang, Y-C.
Tsai, Taiwan Semiconductor Manufacturing Co.
RMO1C CMOS RF Device Technology — LBCC 102C
Chair: J. Ou, Intel • Co-chair: A. Gupta, Anadigics
8:00 AM: RMO1C-1: Invited: Scalability of RF CMOS
C.P. Yue, Dept. of Electrical & Computer Engineering, Carnegie-Mellon University; S.S. Wong,
Electrical Engineering Dept., Stanford University
8:20 AM: RMO1C-2: Invited: RF FET Layout and Modeling for Design Success in RFCMOS
Technologies
B. Jagannathan, D. Greenberg, R. Anna, X. Wang, J. Pekarik, M. Breitwisch, M. Erturk, L.
Wagner, C. Schnabel, D. Sanderson,
S. Csutak, SRDC, IBM Microelectronics
8:40 AM: RMO1C-3: Properties of RFLDMOS with Low Resistive Substrate for Handset Power
Applications
J. Ko, S. Lee, H. Oh, J. Jeong, D. Baek, K. Koh, I. Son, Samsung Electronics; J. Han, S.Hong,
KAIST
9:00 AM: RMO1C-4: Intermodulation Linearity Characteristics of CMOS Transistors in a 0.13
µm Process
G. Niu, J. Pan, X. Wei, Auburn University; S.S. Taylor, Intel; D. Sheridan, IBM
9:20 AM: RMO1C-5: Analysis and Modeling of LNA Circuit Reliability
E. Xiao, University of Texas at Arlington
RMO1D Wideband Communications Circuits and Systems — LBCC 103A/B
Chair: J.C. Rudell, Berkana Wireless
Co-chair: A. Wang, Illinois Institute of Technology
8:00 AM: RMO1D-1: Invited: Integrated TV Tuner Design for Multi-standard Terrestrial
Reception
I. Mehr, Analog Devices
8:20 AM: RMO1D-2: A New Integrated Monocycle Generator and Transmitter for Ultrawideband (UWB) Communications
M. Regis, F. Pourchet, ACCO S.A.; A. Azakkour, LISIF - Université Pierre et Marie Curie; G.
Alquié, Cedex
8:40 AM: RMO1D-3: A 3.1–10.6 GHz Ultra-Wideband Pulse-Shaping Mixer
D.D. Wentzloff, A.P. Chandrakasan, Massachusetts Institute of Technology
9:00 AM: RMO1D-4: A Wide-band Low-crosstalk Switch-matrix and Output Buffer for DVB-S
Applications
T. Copani, University of Catania; G. Girlando, S. Smerzi, A. Castorina, G. Palmisano,
STMicroelectronics
9:20 AM: RMO1D-5: Design of 24 GHz SiGe HBT Balanced Power Amplifier for System-on-aChip Ultra-wideband Applications
N. Kinayman, A. Jenkins, D. Helms, R.I. Gresham, M/A-COM, a Tyco Electronics company
RMO2A Challenges in RF IC Design — LBCC 101
Chair: S. Heinen, RWTH Aachen University • Co-chair: L. Boglione, Filtronics
10:10 AM: RMO2A-1: Invited: RF ICs at Millimeter-waves and Beyond
T.H. Lee, Stanford University
10:30 AM: RMO2A-2: Invited: 17 GHz Transceiver Design in 0.13 µm CMOS
M. Tiebout, C. Sandner, H-D. Wohlmuth, M. Berry, A.L. Scholtz, Infineon Technologies AG; C.
Kienmayer R. Thringer,
Technical University of Vienna
10:50 AM: RMO2A-3: Invited: Challenges in RF Simulation
K.S. Kundert, Cadence Design Systems
11:10 AM: RMO2A-4: Invited: RF Integrated Feedback Circuits Using On-chip Magnetics
J.R. Long, Electronics Research Laboratory/DIMES, Delft University of Technology
11:30 AM: RMO2A-5: Invited: Redundant MEMS Resonators for Precise Reference Oscillators
E.P. Quevy, R.T. Howe, University of California at Berkeley
RMO2B Advanced VCO Techniques — LBCC 102A/B
Chair: A. Jerng, MIT • Co-chair: Y. Deval, IXL lab
10:10 AM: RMO2B-1: A First RF Digitally-controlled Oscillator for Mobile Phones
R.B. Staszewski, C-M. Hung, N. Barton, M-C. Lee, D. Leipold, Wireless Analog Technology
Center, Texas Instruments Inc.
10:30 AM: RMO2B-2: A Sub-100 µW 1.9 GHz CMOS Oscillator Using FBAR Resonator
Y.H. Chee, A.M. Niknejad, J. Rabaey, Berkeley Wireless Research Center, Dept. of EECS,
University of California at Berkeley
10:50 AM: RMO2B-3: A 26 GHz Coplanar Stripline-based Current Sharing CMOS Oscillator
H. Krishnaswamy, H. Hashemi, University of Southern California
11:10 AM: RMO2B-4: A Low Phase Noise 52 GHz Push-push VCO in 0.18 µm Bulk CMOS
Technologies
Y-H. Cho, M-D. Tsai, H-Y. Chang, C-C. Chang, H. Wang, National Taiwan University
11:30 AM: RMO2B-5: A 5 GHz pHEMT Transformer-coupled VCO
P.W. Lai, S.I. Long, ECE Dept., University of California, Santa Barbara
RMO2C Active Device Modeling — LBCC 102C
Chair: Y. Cheng, Siliconlinx Inc. • Co-chair: F. Henkel, IMST GmbH
10:10 AM: RMO2C-1: Invited: Next Generation CMOS Compact Models for RF and
Microwave Applications
A.M. Niknejad, C.H. Doan, S. Emami, M. Dunga, X. Xi, J. He, R. Brodersen, C. Hu, Berkeley
Wireless Research Center, UC Berkeley
10:30 AM: RMO2C-2: A Lossy Substrate Model for Sub-100 nm, Super-100 GHz fT RF CMOS
Noise Extraction and Modeling
J.C. Guo, Y.M. Lin, Dept. of Electronics Engineering, National Chiao Tung Univ.
10:50 AM: RMO2C-3: A Large-signal Model of RF LDMOS with Skin Effects of Power
Combining Structures
J. Han, C. Park, S. Hong, KAIST; D. Baek, K. Koh, J. Ko, I. Shon, Samsung Electronics Co. Ltd.
11:10 AM: RMO2C-4: An Improved Silicon RF LDMOSFET Model with a New Extraction
Method for Nonlinear Drift Resistance
K. Lee, J. Yoon, J. Yim, J. Kang, B. Kim, Pohang Unversity of Science and Technology; D.
Baek, S. Lee, I. Shon, Samsung Electronics Co. Ltd.
11:30 AM: RMO2C-5: Modeling RF MOSFETs After Electrical Stress Using Low Noise
Microstrip Line Layout
H.L. Kao1, J.M. Lai1, C.F. Lee1, K.C. Chiang1, S.P. McAlister, Dept. of Elect. Eng., Nat’l ChiaoTung Univ.; A. Chin, G.S. Samudra, SNDL, Dept. of Elec. Eng.
RMO2D CMOS Mixers — LBCC 103A/B
Chair: W.Y. Ali-Ahmad, AUB/Maxim • Co-chair: S. Kiaei, ASU, Connection One
10:10 AM: RMO2D-1: A 60 GHz Down-converting CMOS Single-gate Mixer
S. Emami, C.H. Doan, A.M. Niknejad, R.W. Brodersen, Berkeley Wireless Research Center,
Dept. of EECS, University of California, Berkeley
10:30 AM: RMO2D-2: Ultra-Low-Voltage Mixer and VCO in 0.18 µm CMOS
H-H. Hsieh, K-S. Chung, L-H. Lu, National Taiwan University
10:50 AM: RMO2D-3: A Low-IF CMOS Double Quadrature Mixer Exhibiting 58 dB of Image
Rejection for Silicon
M. Notten, Philips Research; J. van Sinderen, F.Seneschal, F.Mounaim, Philips
Semiconductors
11:10 AM: RMO2D-4: A New 0.25 µm CMOS Doubly Balanced Sub-harmonic Mixer for 5 GHz
ISM Band Direct Conversion Receiver
P. Upadhyaya, M. Rajashekharaiah, D. Heo, Washington State University, The School of
Electrical Engineering and Computer Science; Y-J. Emery Chen, National Taiwan University,
Department of Electrical Engineering
11:30 AM: RMO2D-5: A Wide-band Mixer for WCDMA/CDMA2000 in 90 nm Digital CMOS
Process
S. Peng, C.C. Chen, Texas Instruments; A. Bellaouar, Sirific Corp.
15
2005 RFIC TECHNICAL PROGRAM — MONDAY, JUNE 13, 2005
RMO3A WLAN Systems and Architectures — LBCC 101
Chair: D. Shaeffer, Aspendos Communications • Co-chair: N. Camilleri, RFWDS
1:20 PM: RMO3A-1: Invited: Circuit Implications of MIMO Technology for Advanced
Wireless Local Area Networks
W.J. Choi, Q. Sun, J.M. Gilbert, Atheros Communications Inc.
1:40 PM: RMO3A-2: A 1.4 V, 13.5 mW, 10/100 MHz 6th Order Elliptic Filter/VGA with DC-Offset
Correction in 90 nm CMOS
M. Elmala, B. Carlton, R. Bishop, K. Soumyanath, Communications Circuits Lab, Intel Corp.
2:00 PM: RMO3A-3: Low Power Consumption 2.4 GHz WLAN Front-end Module for a
Multiple Radio Handset
C-W.P. Huang, W. Vaillancourt, A. Parolin, C. Zelley, SiGe Semiconductor
2:20 PM: RMO3A-4: A Fully Integrated Receiver Front-end Reconfigured by PLL
S.H. Han, C.S. Kim, M.Y. Park, H.K. Yu, Electronics and Telecommunications Research
Institute (ETRI)
2:40 PM: RMO3A-5: A 5 GHz Direct-conversion Receiver with I/Q Phase and Gain Error
Calibration
W-Z. Chen, T-L. Lee, T-Y. Lu, Integrated Circuits and System Lab, Innovative Package
Research Center, Department of Electronics Engineering, National Chiao-Tung University
RMO3B Frequency Generation Circuits II:
PLLs and Synthesizers — LBCC 102A/B
Chair: B. Bakkaloglu, Arizona State University
Co-chair: K.T. Kornegay, Cornell University
1:20 PM: RMO3B-1: A sub-1 psrms Jitter 1–5 GHz 0.13 µm CMOS PLL Using a Passive
Feedforward Loop Filter with Noiseless Resistor Multiplication
A. Maxim, M. Gheorghe, Crystal
1:40 PM: RMO3B-2: Bandwidth Extension of Low Noise Fractional-N Synthesizers
S.E. Meninger, M.H. Perrott, Massachusetts Institute of Technology
2:00 PM: RMO3B-3: A Fully Integrated Compact CMOS Fractional Signal Generator for
GSM/WCDMA Dual-band Applications
Y. Park, C.-H. Lee, J. Laskar, Georgia Institute of Technology
2:20 PM: RMO3B-4: A Fully Integrated GMSK Modulator using BiCMOS Sigma-Delta
Frequency Synthesizer with Automatic Loop Gain Calibration
H. Lee, P. Good, Skyworks Solutions Inc.
RMO3C Front-end Design Techniques — LBCC 102C
Chair: S. Chakraborty, Texas Instruments Inc
Co-chair: K. Ashby, Microtune Inc
1:20 PM: RMO3C-1: Invited: Circuit Techniques for CMOS Multiple-antenna Transceivers
D.J. Allstot, S. Aniruddhan, M. Chu, S. Shekhar, Univ. of Washington; G. Banerjee, J.
Paramesh, Univ. of Washington/Intel Corp.;
X. Li, K. Soumyanath, QualComm Corp.
1:40 PM: RMO3C-2: An Integrated LMS Adaptive Filter of TX Leakage for CDMA Receiver
Front Ends
V. Aparin, G. Ballantyne, C. Persico, A. Cicalini, Qualcomm Inc.
2:00 PM: RMO3C-3: Experimental Results at 1 GHz on Linearizing an NMOS Transistor with
a Parallel PMOS Transistor
T.P. Weldon, D.T. Lieu, M.J. Davis, University of North Carolina at Charlotte
2:20 PM: RMO3C-4: A 13 dB IIP3 Improved Low-power CMOS RF Programmable Gain
Amplifier Using Differential Circuit Transconductance Linearization
T.W. Kim, K. Lee, Dept. of EECS, KAIST; B. Kim, Y. Cho, B. Kim, Integrant Technologies Inc.
2:40 PM: RMO3C-5: Using Auxiliary Amplifier to Cancel Third-order Intermodulation
Distortion for A 1.9 GHz CMOS Linear Amplifier Design
K-H. Liang, C-C. Ho, M-W. Hsieh, Y-J. Chan, Dept. of Electrical Engineering, National Central
University
RMO3D Efficiency Improvement Topologies — LBCC 103A/B
Chair: T. Quach, Freescale Inc. • Co-chair: D. Ngo, RF Micro Devices Inc.
1:20 PM: RMO3D-1: A 20 mA Quiescent Current 40% PAE WCDMA HBT Power Amplifier
Module with Reduced Current Consumption Under Backoff Power Operation
G. Hau, S. Caron, J. Turpel, B. MacDonald, Fairchild Semiconductor Corp.
1:40 PM: RMO3D-2: A SiGe PA with Dual Dynamic Bias Control and Memoryless Digital
Predistortion for WCDMA Handset Applications
J. Deng, P.S. Gudem, L.E. Larson, D. Kimball and P.M. Asbeck, Center for Wireless
Communications, Dept. of ECE, UC San Diego
2:00 PM: RMO3D-3: Linear RF CMOS Power Amplifier with Improved Efficiency and
Linearity in Wide Power Levels
N. Srirattana, P. Sen, C-H. Lee, P.E. Allen, J. Laskar, Georgia Institute of Technology; H-M.
Park, Maxim Integrated Circuits
2:20 PM: RMO3D-4: A Single-chip Variable Supply Voltage Power Amplifier
I.A. Rippke, Xpedion Design Systems Inc.; J.S. Duster, K.T. Kornegay, Cornell University
2:40 PM: RMO3D-5: A New Series-Type Doherty Amplifier for Miniaturization
J. Jung, U. Kim, J. Jeon, J. Kim, Y. Kwon, Seoul National University; K. Kang, Wavics Co. Ltd.
RMO4A RF Transceivers for 2G & 3G Systems — LBCC 101
Chair: M. Reddy, MaxLinear Inc. • Co-chair: D. Belot, ST Microelectronics
3:30 PM: RMO4A-1: Invited: Digital RF CMOS Transceivers for GPRS and EDGE
C. Monker, B-U. Klepser, Infineon Technologies; B. Neurauter, C. Mayer, DICE GmbH & Co.
KG
3:50 PM: RMO4A-2: A Fully Integrated Inter-stage-bandpass-filterless Direct-conversion
Receiver for W-CDMA
M. Tamura, T. Nakayama, Y. Hino, A. Yoshizawa, K. Takagi, Sony Ericsson Mobile
Communications Japan Inc.
4:10 PM: RMO4A-3: Compact Radio System Module for Triple-band GSM Cellular Phones
H. Okabe, T. Ido, Hitachi Ltd.; T. Endo, Renesas Technology Corp.
4:30 PM: RMO4A-4: A 1.9 GHz SiGe BiCMOS PHS Transceiver with an Integrated PA and a
Fast Settling PLL
M.A.I. Mostafa, C.K. Quek, A.E. Moznine, W. Roberts, M. Romney, D. Walker, D. Stegmeir, K.
Tran, N. King, S. Farahvash, R. Koupal, Micro Linear Corp.
4:50 PM: RMO4A-5: Invited: A Tri-band (2100/1900/800 MHz) Single-chip Cellular
Transceiver for WCDMA/HSDPA
D. Kaczman, C. Dozier, N. Godambe, H. Guimaraes, M. Shah, M. Rachedine, M. Alam, L. Han,
W. Shepherd, D. Cashen, J. Ganger,
K. Couglar, B. Getka, E. Brotkowski, Freescale Semiconductor
RMO4B Passive Modeling, De-embedding
and Design Methodology — LBCC 102A/B
Chair: K. McCarthy, University College Cork
Co-chair: P. Yue, Carnegie Mellon University
3:30 PM: RMO4B-1: Invited: Analog RF Model Development With Verilog-A
B. Troyanovsky, P. O’Halloran, M. Mierzwinski, Tiburon Design Automation
3:50 PM: RMO4B-2: Characterization, Design, Modeling and Model Validation of Silicon OnWafer M:N Balun Components Under Matched and Un-Matched Con
F. Rotella, G. Tkachenko, Y. Cheng, Skyworks Solutions
4:10 PM: RMO4B-3: Modeling Methodology of Integrated Five-port Balun Using Two-port RF
Measurement
K-Y. Huang, C-J. Hsu, L-Y. Leu, Winbond Electronics Corp.
4:30 PM: RMO4B-4: A Decomposition and Reconstruction Scheme for Broadband Modeling
of On-chip Passive Components Using Modified T-equivalent Circuit
T.S. Horng, J.K. Jau, Y.S. Tsai, C.S. Huang, Department of Electrical Engineering, National
Sun Yat-Sen University
RMO4C Optical System ICs and Architectures — LBCC 102C
Chair: L. Liu, Northrop Grumman • Co-chair: K. Kiziloglu, Intel Corp.
3:30 PM: RMO4C-1: 1V, 10 mW, 10 Gb/s CMOS Optical Receiver Front-end
D. Guckenberger, D. Kucharski, K.T. Kornegay, Cornell University; J.D. Schaub, IBM Austin
Research Lab
3:50 PM: RMO4C-2: A 3.3V 10 Gb/s SiGe Limiting Transimpedance Amplifier Using a Pseudodifferential Input and a Limiting Cherry-hooper Stage
A. Maxim, Maxim Integrated Products, Fiber Communications Div.
4:10 PM: RMO4C-3: Low Power Consumption 10 Gb/s SiGe Modulator Drivers with 9 Vpp
Differential Output Swing Using Intrinsic Collector-base Capacitanc
D-U. Li, L-R. Huang, C-M. Tsai, SoC Technology Center, Industrial Technology Research
Institute
4:30 PM: RMO4C-4: High Voltage Swing and High Data Rate Multiplexers in SiGe
Technology
M. Wurzer, H. Knapp, T.F. Meister, Infineon Technologies AG
4:50 PM: RMO4C-5: An 80 Gb/s 2.7 Vp-p Driver IC Based on Functional Distributed Circuits
for Optical Transmission Systems
Y. Suzuki, Z. Yamazaki, H. Hida, System Devices Research Laboratories, NEC Corp.
RMO4D UWB — LBCC 103A/B
Chair: S. Mehta, Atheros Communications
Co-chair: D. Lovelace, PropheSi Technologies Inc.
3:30 PM: RMO4D-1: Invited: Design Challenges in Emerging Broadband Wireless Systems
R. Gharpurey, Dept. of Electrical Engineering and Computer Science, University of Michigan
3:50 PM: RMO4D-2: A 5.4 mW LNA Using 0.35 µm SiGe BiCMOS Technology for 3.1–10.6 GHz
UWB Wireless Receivers
M-D. Tsai, K-Y. Lin, H. Wang, National Taiwan University
4:10 PM: RMO4D-3: A 0.25 mm CMOS Ultra-wideband Amplifier for Time-Domain UWB
Applications
X. Guan,C. Nguyen, Texas A&M University
4:30 PM: RMO4D-4: A 3.1–10.6 GHz RF Front-end for MultiBand UWB Wireless Receivers
B. Shi, Y.W. Chia, Institute for Infocomm Research
4:50 PM: RMO4D-5: A Low Power Noncoherent CMOS UWB Transceiver ICs
Y. Zheng, W.G. Yeoh, Institute of Microelectronics, Y-P. Xu, F. Lin, National University of
Singapore; Y. Tong, J. Yan, Institute
of Microelectronics/National University of Singapore
4:50 PM: RMORB-5: A Fully-scalable De-embedding Method for On-wafer S-parameter
Characterization of CMOS RF/Microwave Devices
M.H. Cho, C.S. Chiu, G.. Huang, Y.M. Teng, L.H. Chang, K.M. Chen, National Nano Device
Labs
[Tuesday Sessions continued on page 76]
16
TSC: MONOLITHIC DISTRIBUTED POWER MANAGEMENT FOR
NEXT GENERATION WIRELESS APPLICATION
Date & Time: Sunday, June 12; 8:00 AM–12:00 PM
These tutorials are targeted for people who
are new to microwave design or new to specific
technical areas. Each starts with basics to
help you “impedance match” into the topic and
help you understand papers on these topics
later in Microwave Week.
Location:
Topics & Speakers:
✗ Monolithic Power Management Circuits and Applications for
RF Transceivers – Overview, S. Abedinpour, Freescale
Inc.
✗ Power Management for High Spectral Purity RF
Synthesizers, B. Bakkaloglu, Texas Instruments
✗ DC/DC converters and Noise Shaping Techniques for
Switched-Mode DC/DC Converters for RF Transceivers,
S. Kiaei, Connection One, ASU
✗ Design of Microfabricated Transformers and Inductors for
High-Frequency Power Conversion, A. Lotfi, Enpirion Inc.
✗ Adaptive Power Management for RF Power Amplifiers,
G. Rincon-Mora, Georgia Institute of Technology,
Analog Consortium
TSA: FILTER I: RF AND MICROWAVE FILTER DESIGN
Date & Time: Sunday, June 12; 8:00 AM–5:00 PM
Location:
Long Beach Convention Center, Room 203
Organizer:
H. Clark Bell, HF Plus
Sponsor:
MTT-8: Filters and Passive Components
This course will present design basics for passive RF and microwave filters. Included will be discussions of performance parameters, types of filter responses, estimating filter performance, characteristics of various filter technologies, specifying
filters realistically to avoid surprises, and use of filter design software. Specific filter topics will include doubly-terminated twoport network chain parameters and scattering parameters; lowpass and highpass ladder networks and Chebyshev filter; immittance inverters and transformation to bandpass and bandstop
coupled-resonator prototypes; narrow-band design using coupling bandwidth and loading bandwidth; relation of resonator Q,
delay and loss, and effect of lossy coupling; TEM coupled line
pair equivalent circuits; TEM resonator, combline and interdigital bandpass filters; TEM resonator bandstop filters; waveguide
resonator bandpass filters; general coupled-resonator prototype;
loss approximation, the elliptic function filter and approximate
formulas; realization polynomials and immittances; bandpass filters with single negative or positive cross coupling; dual mode n
= 4 and n = 8 filters; environmental effects on filter performance.
Date & Time:
Location:
Long Beach Convention Center, Room 102AB
Topics & Speakers:
✗ An Overview of Mobile Radios’ RF System Architectures,
W. Ali-Ahmad, Maxim
✗ Design of LNAs, D. Shaeffer, Aspendos Communications
✗ Design of Up and Down converters, S. Kiaei, ASU
✗ Design of Controlled Oscillators, F. Svelto, University of
Pavia
✗ Design of Frequency Synthesizers, M. Perrott, MIT
✗ Design of Power Amplifiers, R. Gupta, Berkana Wireless
✗ Design of Duplexers, A. Cathelin, ST Microelectronics
Y. Deval, IXL Lab
D. Shaeffer, Aspendos Communications
C. Rudell, Berkana Wireless
Sponsors:
MTT-23: RFIC
RFIC Symposium
Organizers:
B. Bakkaloglu, Texas Instruments
S. Abedinpour, Freescale Semiconductor
S. Kiaei, Connection One
Sponsors:
MTT-23: RFIC
RFIC Symposium
As CMOS technology is rapidly moving towards deep submicron gate lengths, there are several new challenges for the design of RF and analog circuits. One of the main challenges is the
drastic reduction on the supply voltage, which limits the linearity and the dynamic range, and increases the supply ripple sensitivity of RF circuits. With the reduction of the RF supply voltage,
noise, ripple and cross-coupling on the power supply is playing a
dominant role in the transceiver noise budget. Specifically, synthesizer and reference oscillator phase noise, LNA and mixer
noise figure and the adjacent channel requirement of the PA is
heavily influenced by the supply noise and spurious content.
With increasing drive towards higher level of integration, lower
cost, and longer battery life in RF applications, there is a need
for efficient monolithic DC-DC power converters. This workshop
summarizes the topology tradeoffs that are involved in the implementation of monolithic distributed power management circuits for future generation portable wireless applications. RF
supply regulators require high power density, high energy efficiency, low noise and ripple, high PSRR at a wide frequency
range, small size, and low cost. The advantages and application
areas of low-dropout linear, switched-mode DC-DC converters
are examined in light of these requirements.
TSB: BASIC RFIC BUILDING BLOCKS
Sunday, June 12; 8:00 AM–5:00 PM
Organizers:
This tutorial presents an overview of the design of integrated
radiofrequency systems. The specific constraints of designing
RFIC in low-cost silicon technologies will be highlighted. First, as
a matter of introducing building blocks and their specifications,
RF system architectures are described. Second, key building
blocks are detailed, down to the transistor level. Device limitations due to the integration within silicon technologies are reviewed for each block. Last, reliability and test of highly integrated RF circuits are tackled.
17
SUNDAY
SUNDAY TUTORIALS
SUNDAY
SUNDAY WORKSHOPS
WSA: COMPETITIVENESS OF BROADBAND WIRELESS ACCESS
(BWA) SYSTEMS
Date & Time: Sunday, June 12, 8:00 AM–5:00 PM
Location:
✗ Bandwidth-Enhanced CMOS Fractional-N Synthesizers,
I. Galton, UC San Diego
✗ Future of MEMS in Full CMOS Radio, G. Rebeiz,
UC San Diego
Hyatt Regency A
Organizers:
W.Y. Ali-Ahmad, Maxim Integrated Products
W. Khalil, Intel Corp.
Sponsors:
MTT-23, RFIC
RFIC Symposium
Topics & Speakers:
✗ BWA Competitiveness Issues, F. Ivanek,
Stanford University
✗ WIMAX – Overview of WiMAX Forum Strategy and Plan,
M. Shakouri, WiMAX Forum
✗ Emerging Chips for BWA Applications, R. Golshan,
Fujitsu Microelectronics America
✗ Recent Developments in Broadband Wireless Access,
S. Varma, Aperto Networks
✗ Status and Development of Broadband Wireless Access in
Japan: Fixed, Mobile and Nomadic, A. Hashimoto,
NTT DoCoMo
✗ 2.3 GHz Portable Internet (WiBro) for Wireless Broadband
Access, D. Hong, Sogang University
✗ Wireless Access – Key to Broadband Internet in Rural India,
M. Pitke, AXES Technologies
✗ Operators’ Choices among New BWA Standards,
G. Marzocchi, Multiservices
✗ BWA Competitiveness in Brazil, S.E. Barbin,
University of Sao Paulo
✗ Wireless Platform at High Altitude in the Stratosphere:
Its Advantages and Trials, R. Miura, National Institute of
Information and Communications Technology
✗ Role of Satellites for Broadband Wireless Access,
R.K. Gupta, AM COM Communications
Organizers:
F. Ivanek, Stanford University
G. Heiter, Heiter Microwave Consulting
R. Gupta, AM COM Communications
Sponsors:
MTT-16, Microwave Systems
MTT-19, Microwave Technology Business Issues
MTT-20, Wireless Communications
As CMOS technology is scaling down, the question poses itself: What is the future of all-CMOS radio on a chip? The concept
of full CMOS radio is an evolving reality, and the motivation for
this workshop is to present key technical issues and put forward
recommendations for future enabling technologies and design
ideas. The workshop explores the impact of transistor and supply scaling on all-CMOS RF and mixed-signal circuits. The allCMOS radio SoC (System-on-Chip) concept is compared against
the all-CMOS SiP (System-in-Package) concept with stress on
design challenges and on integration and cost issues. The major
topics addressed in this workshop include reducing substrate
noise effects in all-CMOS radio chip, future RF CMOS modeling,
digital calibration of Fractional-N synthesizers and modulators,
concepts of embedding high power CMOS PAs, power management circuits, and MEMS in full CMOS radio SoC.
WSC: ADVANCED TECHNOLOGIES FOR NEXT GENERATION
RFICS
Location:
Topics & Speakers:
✗ Prospects on Silicon CMOS for High Frequency Application,
J.D. Alamo, MIT
✗ BAW and MEMs above Silicon for RF Applications,
P. Ancey, STMicroelectronics
✗ Bulk Acoustic Wave Filters and New Architectures for RF
Applications, C. Enz, CSEM
✗ FBAR for RF Applications, R. Ruby, Agilent
✗ Advanced Technologies to Cover Future RF Applications
Needs, M. H. Smith, Intel
✗ Bulk Acoustic Wave Filters for Mobile Cellular
Communications, H.J. Timme, Infineon
✗ Impact of New Technologies for New RF Systems,
C. Nguyen, DARPA
✗ Freescale’s RFIC Technologies – The Role of III-V
and Si-Based Devices in Advanced RF Applications,
M. Huang, Motorola
Terrestrial fixed broadband wireless access (BWA) deployment in competition with wireline access systems using XDSL,
cable modems or optical fiber is on the rise. The workshop will
cover existing and emerging BWA systems with data rates ranging from Megabits/sec to Gigabits/sec, and will focus on the potential of WiMAX. Speakers from the Americas, Asia and Europe
will address the key issues including market requirements and
drivers, spectrum usage, technological progress, standardization
and regulation, fixed-nomadic-mobile convergence, and the
BWA potential of high altitude platform systems (HAPS) and
satellite systems. The second half of the afternoon program is reserved for short ad hoc presentations by advance arrangement
with the organizers, and for a general discussion with focus on
BWA competitiveness and prospects.
Date & Time:
WSB: FULL CMOS RADIO
Sunday, June 12, 8:00 AM–5:00 PM
Location:
Hyatt Regency B
Organizers:
D. Belot, STMicroelectronics
Y. Deval, IXL Lab
D. Saias, STMicroelectronics
Sponsors:
MTT-23, RFIC
RFIC Symposium
New technologies are currently emerging, which will dramatically impact the design of radio frequency integrated circuits in
the near future. Among them, the advent of Bulk Acoustic Wave
(BAW) devices as well as Silicon On Insulator (SOI) industrial
processes will undoubtedly open the way to a new era of RFIC
System On Chip - assuming that the cost remains as low as possible and the reliability as high as possible. This workshop addresses different BAW technologies and approaches, emphasizing RF functions for which this device cannot be overlooked. SOI
technologies will be addressed too, for their influence on high
frequencies as well as low power consumption, and mixed-signal
circuits. Finally, carbon nanotubes will be presented, as they
might become an alternative to silicon transistors in the future.
Topics & Speakers:
✗ Impact of Technology Scaling on Mixed Signal Design,
C. Sodini, MIT
✗ Challenges in Design of Single Chip Radio for Cellular
Communication Systems, S. Embabi, Sirific
✗ The Future of RF CMOS Modeling, A. Niknejad,
UC Berkeley
✗ CMOS PAs, A. Hajimiri, Caltech
✗ New Dimensions in CMOS RF Technologies, D. Ham,
Harvard University
✗ Full CMOS Radio: Design Issues and Challenges,
A. Rofougaran, Broadcomm
18
Location:
✗ MIMO WLAN Transceiver Concepts and Their Implication
on the FEM Development, A. Biran, Intel Corp.
✗ Ultra-Compact WLAN FEMs for the High-Volume Wireless
Mobile Market, P. Heide, EPCOS AG
✗ RF Silicon Integrated Passives (RFIPDs) for WLAN
Applications, C.H. Wang, Telephus
✗ Laminate-Based RF Integrated Passive Front End Devices
for WLAN Application, J. Chamberlin, JMD
✗ LTCC Front End Module for WLAN Application (IEEE
802.11a/b/g), S. Kemmochi, Hitachi Metals
✗ Small-Size WLAN Integrated Modules, K. Kato,
Kyocera Corp.
✗ FEMs for Mobile/Cellular Applications, B. Hemish,
P. Huang, SiGe Semiconductor
P. Heide, EPCOS AG
A. Biran, Intel Corp.
C. Ruppel, EPCOS AG
Sponsors:
MTT-23, RF Integrated Circuits
RFIC Symposium
The WLAN market demonstrated enormous growth rates in
the last few years. The WLAN market, like the cellular phone
market, has seen strong component cost reductions, with simultaneous increase in the complexity of WLAN radio transceivers from single to multi-band/multi-mode solutions, coexistence
with Bluetooth, novel cellular functions and, most recently, the
realization of 802.11n and MIMO concepts. Apparently, the size
of a WLAN radio transceiver RFIC and its adjacent FEM became
a critical system-implementation factor. Wireless connectivity
has become an embedded feature in mobile PCs, PDAs and
smart phones, where the number of functions per sq. mm is the
limiting functionality factor. Very small WLAN RFICs with form
factors compatible with CF and SD cards, memory sticks and
USB-interfaces have been introduced in 2004. Highly integrated
FEM and single-chip radios have for the first time been applied
to allow those innovative implementations. Most recently, the
cellular industry has set the very challenging target of implementing a high-performance WLAN radio within 150 sq. mm
(802.11g) and 250 sq. mm (802.11a + g). This will further drive
the trend for higher integration levels, cost reduction, reliability
and yield improvements.
Sponsor:
MTT-1, Computer-Aided Design
WSF: ACCURACY OF SYSTEM-LEVEL FIGURES OF MERIT FOR
WIRELESS APPLICATIONS
Location:
Hyatt Regency C
Topics & Speakers:
✗ System-Level Figures of Merit and Measurement Accuracy,
R. Trott, Aeroflex
✗ Memory Effects and System-Level Figures of Merit: Limits
on Digital Pre-Distortion, P. Draxler, Qualcomm & UCSD
✗ Power Measurements in Communications as a Figure of
Merit, D. Adamson, NPL
✗ Advantages and Limits of Error Vector Usage in Performance
Assessment of Wireless Systems and Apparatuses,
L. Angrisani, Università di Napoli Federico II
✗ Error Vector Magnitude for 802.11a Systems, M.D.
McKinley, K.A. Remley, RF Electronics Group, NIST
WSE: IMPACT OF COMPONENT MODELING ON MICROWAVE AND
MILLIMETER WAVE CIRCUIT PERFORMANCE
Location:
D. Schreurs, K.U.Leuven
A. Beyer, Duisburg-Essen University
S. Maas, Applied Wave Research
The objective of this Workshop is to shed a light on the interactions happening in the chain leading to successful circuit designs. One obvious aspect is the propagation of Figures of Merit
(FOMs) of passive and active components into microwave circuit performance. Technology reproducibility and quality of
component models are two other key factors. The first part of
the Workshop focuses on the component level. The usual FOMs
(Q, fT, fMAX, FMIN…) supplemented by other requirements that
are of high importance (low-power consumption, cost, area, level of integration…) are first reviewed. Trade-offs are illustrated
by comparing several fabrication technologies of passive and active components. As example, the varying quality of a spiral inductor as processed on GaAs, bulk Si, back-end Si, and MCM-D
substrates, is mentioned. Next, the interrelationships between
model requirements and circuit specifications are addressed. An
example is the necessity of having temperature-dependent models when designing power amplifiers, while this is optional in oscillator design. Due to the more complex modulation schemes on
the system level, model requirements have become more stringent and now require validations, e.g. of EVM and ACPR predictability. The relative importance of these key technology and
modeling indicators across the spectrum of microwave and millimeter-wave circuits (LNA, oscillator, PA, mixer...) is covered.
Finally, participants are given the opportunity to share their
views.
Topics & Speakers:
Organizers:
Organizers:
Long Beach Convention Center, Room 102C
Organizers:
D. Adamson, NPL
K. Remley, NIST
J. Horton, J.B. Horton Group
Sponsors:
MTT-11, Microwave Measurements
A clear need for improved accuracy in wireless measurements
was identified in one of the workshop sessions at IMS 2004. This
workshop will focus on the key system-level measurands that are
used to determine the performance of wireless systems. The objective will be to present and discuss the current state of the art
relating to accuracy of these measurands. The workshop will begin with an overview of system-level figures of merit and follow
with more detailed presentations on several of the key measurands, presenting work from industry, academia and National
Standards Laboratories.
Topics & Speakers:
✗ On-Chip and In-Package Passive Component Integration,
G. Carchon, IMEC
✗ Nonlinear Circuit Performance and FOMs, R. Trew,
North Carolina State University
✗ Modeling Devices at Millimeter Wave Frequencies, J. East,
University of Michigan
✗ Sensitivity of Linear Circuit Applications to Imperfect
Component Models, A. Beyer, Duisburg-Essen University
✗ Relating Non-Linear Circuit Design Specifications to
Properties of Component Models, S. Maas,
Applied Wave Research
19
SUNDAY
SUNDAY WORKSHOPS
WSD: ADVANCED SYSTEM SOLUTIONS AND INTEGRATION
TECHNOLOGIES FOR HIGH-VOLUME WIRELESS LAN
APPLICATIONS
SUNDAY
SUNDAY WORKSHOPS
WSG: CIRCUIT CHARACTERIZATION, MODELING AND TESTING:
CAN IT REALLY BE DONE WITHOUT IMPEDANCE TUNERS?
Date & Time:
Sunday, June 12, 8:00 AM–12:00 PM
Location:
noise in modulated fractional-N controllers will be introduced.
This workshop summarizes the topology tradeoffs that are involved in the implementation of various RF CMOS blocks utilizing noise shaping methodologies, and their application for future
generation portable wireless systems.
Topics & Speakers:
WSI: ON-WAFER MICROWAVE MEASUREMENTS: STATE OF THE
ART AND FUTURE DIRECTIONS
Date & Time: Sunday, June 12, 1:00 PM–5:00 PM
✗ Active and Passive Load Pull Systems: From the Basic to
the Future of Variable Impedance Device Characterization,
A. Ferrero
✗ Active Load Pull: Tuning of Active Devices under Modulated
Excitation, P.J. Tasker
✗ Multi-Purpose, Multi-Probe Tuner for On-Wafer Harmonic
Tuning, C. Tsironis
✗ Comments on Synthesis and Realization of Interstage
Impedance Transformation Networks, J. Sevic
✗ Multiharmonic Active and Passive Load-Pull
Characterization: A Helpful Tool for Designers? M. Tutt
✗ The Sense And Nonsense Of Load Pull, S. Cripps
Organizer:
M.V. Bossche
Sponsor:
Location:
Topics & Speakers:
✗ On-Wafer VNA Calibration, D.F. Williams, NIST
✗ Calibration Comparison and Applications, D.K. Walker,
NIST
✗ On-Wafer Interconnect Characterization, U. Arz, PTB
✗ Repeatability and Reproducibility Across International
Borders, N. Ridler, R.A. Dudley, NPL; U. Arz,
D. Schubert, PTB
✗ Emerging On-Wafer Measurement Techniques for MMICs,
R.A. Dudley, NPL; P. Hale, NIST
At low frequencies, active sub-circuits are mainly designed with
low or high impedance input/output stages, simplifying the realization of complete circuits and increasing the level of integration. At
high frequencies, supported by S-parameters, most design techniques are based on matched circuit design. This is valid for smallsignal designs. But nowadays, small-signal design is not adequate
anymore. Transistors are squeezed in performance and exercised
by signals that result in nonlinear effects. Therefore S-parameter
techniques are not adequate. Also, at the heart of the higher power systems are transistors that are far from matched in 50 Ω.
Source and load pull techniques and systems have been developed to exercise a component under non 50 Ω conditions.
This workshop starts with some presentations giving an
overview of actual systems that synthesize both source and load
impedances. Passive and active approaches are both highlighted.
After an update of existing techniques, reflections are given on
the usefulness of impedance tuning in the design of amplification chains, on the use of source and load-pull systems in combination with design tools.
Long Beach Convention Center, Room 201B
Topics & Speakers:
B. Bakkaloglu, Texas Instruments
Sponsors:
MTT-23, RFIC
RFIC Symposium
U. Arz, PTB
D. Williams, NIST
R. Dudley, NPL
Sponsors:
65th ARFTG Conference
WSJ: PRACTICAL IMPLEMENTATION OF RF POWER AMPLIFIERS
FOR CELLULAR BASE STATIONS
✗ Overview of Transmit and Linear PA Up-Converters,
✗ Fractional-N Frequency Synthesizers, I. Galton,
UC San Diego
✗ Polar Modulation Methods for Power Amplifiers,
T. Sowlati, Skyworks
✗ Algorithms and Amplifiers for Digital Generation of
Microwave Signals with Time-Varying Envelope, P. Asbeck,
J. Rode, I. Galton, L. Larson, UC San Diego
Organizers:
Organizers:
A half-day workshop to address current state of the art onwafer device characterization using electrical and optical methods
from commercial and research systems. The workshop begins
with a review of on-wafer Vector Network Analyzer (VNA) calibration methods for two-port scattering parameter measurements, including a discussion of the merits of on- versus off-chip
calibrations. Emphasis will be given to the treatment of losses in
planar circuits, which necessitates an extension of scattering parameter definition derived from a general circuit theory. A quantitative method for comparing two given on-wafer calibrations will be
discussed, highlighting the applications of this comparison method
before moving on to measurement methods suitable for characterizing the frequency-dependent behavior of planar high-speed interconnects. The final part of the workshop will report on an international on-wafer S-parameter repeatability and reproducibility
exercise conducted by two national laboratories using commercial
equipment. The workshop will conclude with a discussion of techniques that offer alternative methods for on-wafer measurement
such as electro-optic sampling and field mapping.
WSH: NOISE SHAPING METHODS FOR RFIC DESIGN
Location:
Hyatt Regency C
Location:
Topics & Speakers:
✗ Device Technologies for Cellular Base Station PAs,
M. Feng, University of Illinois
✗ High Efficiency GaN Devices for WCDMA Base Station
Applications, Y. Tateno, Eudyna Devices Inc.
✗ High-Voltage HBTs for Cellular Base Station PAs, L. Wang,
Watkins
✗ Physics-Based and Scalable BSIM4 Models for
LD-MOSFETs, J. Hwang, Lehigh University
✗ Distributed Effects of LDMOS PAs, K. Goverdhanam,
Agere Systems
✗ Thermal Models for LD-MOSFETs, P. Roblin,
Ohio University
✗ High Power and High Efficiency Balanced Amplifier
Reference Design Implementation, C. Shih, Infineon
This workshop presents noise shaping and digital signal processing techniques for RFIC Design. The tutorials will cover fundamentals of modulation and various noise shaping techniques,
development of Direct Digital Synthesis modulators and design
of fractional-N synthesizers. Tradeoffs between phase noise and
loop bandwidth in conventional fractional phase-locked loops
will be analyzed and various techniques to cancel excess phase
20
Sponsor:
K. Goverdhanam, Agere Systems
J. Hwang, Lehigh University
P. Gammel, Agere Systems
O. Lopez, Agere Systems
WSL: MULTI-BAND, MULTI-MODE RFICS
MTT-5, Microwave High-Power Techniques
Topics & Speakers:
Location:
Wideband Front-End ICs and Their Compensation
Techniques, T. Nakagawa, NTT
Multi-Mode CMOS Transceivers And Architectures,
T. Manku, Sirific Wireless Corp.
Concurrent Multiband RFICs, H. Hashemi, University of
Southern California
✗ Switched Multi-Mode Receiver ICs, J. Ryynänen, Helsinki
University of Technology
✗ A Broadband SiGe Quadrature Mixer for 0.8–5.2 GHz
Wireless Applications, N. Suematsu, Mitsubishi Electric
RF power amplifiers (PAs) for third and later generations of
cellular base stations such as those of UMTS, Edge, etc. remain a
technical challenge. PA designs must meet stringent linearity requirements for multi-tone high peak-to-valley modulation operations. High-efficiency and thermally stable PAs are needed for
tower-top locations. New packages such as those made of liquid
crystal polymers promise low cost and near hermeticity. Alternative device technologies are desirable for higher-frequency operations but their cost and reliability are not proven. Non-proprietary device models are critical for foundry-independent and
mixed-mode designs. Distributed and balanced amplifier designs
can lessen the demand on device technology. The solutions for
the technical challenges must be low cost, as unit price continues to erode. This workshop focuses on the above-mentioned
challenges for practical implementation of RF power amplifiers
for cellular base station applications.
Topics & Speakers:
✗ Mixed-Signal Integrated Circuit Design Methodology and
Challenges, M. Sunori, Matsushita Electric Industrial Co.
Ltd.
✗ The RF Bottleneck in Wireless Design, J. Hartung,
Cadence Design System Inc.
✗ Early Verification of Emerging UWB and WMAN Radio
Systems, T. Phillips, Agilent Technologies
Organizers:
A. Dengi, Cadence Design Systems Inc.
W. Geppert, Infineon Technologies
Sponsors:
MTT-23, RFIC
RFIC Symposium
Organizers:
T. Nakagawa, NTT
N. Suematsu, Mitsubishi Electric
Sponsors:
MTT-23, RFIC
RFIC Symposium
Wireless communications, including 2G and 3G cellular, 2.4
and 5 GHz wireless LAN, Bluetooth and GPS, have proliferated
rapidly. These forms of communication will not be confined to a
single system. In fact, one of the main user requirements is to be
able to connect to networks anytime, anywhere using the most
suitable of all the various wireless systems available, according
to the situation. This broad requirement has led to a demand for
multi-band and multi-mode transceiver ICs. Even though such
transceivers feature both multi-band and multi-mode operations,
they must be small and economical and have low power consumption. There are various integrated approaches to multiband ICs, such as parallel RF paths, wideband circuits, multipass band circuits, tunable circuits and switching circuits.
This half-day workshop will review these and other techniques
for achieving multi-band and multi-mode RFICs, and discuss
what the right approach is, in the light of RF performance and
cost, at present and in the future.
WSK: DESIGN CONSIDERATIONS AND TOOLS FOR THE SYSTEM
LEVEL DESIGN OF RFICS
Location:
The complexity of communication systems is increasing with
each generation of communications standards, e.g., 802.11a/b/g,
2G/2.5G/3G, etc. With deep submicron technologies, a significant
part of a communication system can now be integrated into one
integrated circuit. Shrinking time-to-market requirements combined with the increasing complexity of integrated circuits have
necessitated changes and improvements in IC design methodology and supporting design automation tools. System level simulation and verification, signal integrity analysis, unifying system
level and circuit level design tools are some of the challenges.
This workshop will present some of these design challenges and
propose some methodology and design automation solutions for
the next generation of communications integrated circuits.
2005 RFIC Symposium
Plenary Session
Sunday, June 12, 5:30 PM
LBCC Grand Ballroom
21
ALSO
OCCURRI
NG
SUNDAY
SUNDAY WORKSHOPS
Organizers:
MONDAY
MONDAY PANEL SESSION
MONDAY TUTORIAL
PMA: CMOS PAS STEP ON THE GAAS!
Date & Time: Monday, June 13, 12:00 PM–1:20 PM
TMA: EMI/EMC FUNDAMENTALS FOR RF/MW ENGINEERS
Date & Time: Monday, June 13; 1:00 PM–5:00 PM
Location:
Long Beach Convention Ctr., Grand Ballroom 1
Location:
Organizers:
Fazal Ali, Nokia
Mike Golio, RF Power Devices
Topics & Speakers:
Panel:
Julio Costa, RFMD
Pete Zampardi, Skyworks
Ali Hajimari, Axiom/Caltech
Shankar Krishnamurty, VT Silicon
Sponsor:
RFIC Symposium
✗
✗
✗
✗
Introduction to EMC, W.H. Cantrell
EMC Fundamentals, Part I., A. Mediano
EMC Fundamentals, Part II, W.H. Cantrell
Basic Design & Diagnosis/Problem Solving Techniques,
A. Mediano
✗ RF/MW EMI Problem Solving Strategies, W.H. Cantrell
Research and development of RF/microwave power amplifiers
based on CMOS technology has been ongoing for the last
decade. In the past year, some CMOS based mobile phone product offerings have been demonstrated. Could this represent the
beginning of the end for GaAs HBT and Si BJT technologies... or
are CMOS PAs ultimately destined for the ash heap? Although
the physical limitations of CMOS devices ensure that the incumbent (GaAs HBT and Silicon BJT) technologies will always be
preferred for the mobile phone’s power amplifier from a pure
performance perspective, can the CMOS PAs offer other compelling advantages? The experts on our panel will discuss the
performance (RF, thermal, robustness), process technology,
cost, and maturity (levels of integration and packaging) related
to CMOS power amplifier design and deployment. The panelists
will also debate the specific future of GaAs HBT and CMOS power amplifiers for handset applications.
Organizers:
W.H. Cantrell, Motorola and the University
of Texas at Arlington
A. Mediano, The University of Zaragoza
Sponsor:
MTT-17: HF, VHF, UHF Techniques
Many companies are beginning to view Electromagnetic Compatibility (EMC) as an important part of an engineer’s basic
training, as well as a desirable skill-set for obtaining a competitive edge in the marketplace. This tutorial provides a basic introduction to EMC, and covers the four EMC coupling mechanisms:
1. Common impedance coupling (sharing a common
impedance for the return currents)
2. Capacitive coupling (electric field coupling in the
near-field)
3. Inductive coupling (magnetic field coupling in the
near-field, Faraday’s Law)
4. Radiated coupling (electromagnetic propagation in the
far-field)
Some of the EMC regulatory requirements are discussed, including how to make radiated emissions measurements at an
Open Area Test Site (OATS), and how to make conducted emissions measurements using a Line Impedance Stabilization Network (LISN). Other topics include return current flow and the
concept of minimum loop area, filtering techniques with ferrites,
decoupling and bypassing, grounding strategies, and PCB design
techniques to minimize emissions. The performance of shields
and their shielding effectiveness is discussed including methods
to obtain extremely high levels of isolation between system components, in excess of 150 dB. This includes an analysis of the
role of apertures and airholes, seams and gaps in an enclosure,
as well as wires (I/O lines) that penetrate the enclosure. Basic
design techniques to avoid EMC problems are presented. Practical tools, hints and examples are presented on how to find and
solve EMC problems. Finally, a unique problem solving strategy
is presented using two examples common to the RF & microwave industry: (1) Identifying the amount of isolation, the
shielding requirements, and the I/O filtering needed between
stages in a typical transmitter line-up to avoid gain flatness problems, and (2) Elimination of undesired radiated coupling between a co-located transmitter & receiver, both operating on the
same carrier frequency.
22
Location:
✗ Practical Issues of Realizing Filter Couplings, I. Hunter,
D. Swanson, University of Leeds/TYCO
✗ Designing Filters to Withstand Inimical Ambient
Environments, D. Snyder, RS Microwave
✗ Temperature Compensation of Microwave Filters, C. Wang,
Orbital Communication
✗ RF Voltage Breakdown: Case Studies and Prevention,
H.C. Bell, HF Plus
✗ Peak Power Handling Limited by Microwave Breakdown in
Air – Design and Validation, T. Olsson, Powerwave
Technologies
✗ Passive Intermodulation – Experimental Investigation,
P. Macchiarella, A. Sartorio, Politecnico di Milano/Forem
✗ Passive Intermodulation (PIM) in Dielectric Resonators,
C. McLaren, P. Kumar, Mitec Telecom
✗ Microstrip Filter Design, J. Hong, Heriot-Watt University
✗ Practical Design Issues of Low Cost Polymer Waveguide
Filters, E. Wheatley, Nera Research
✗ High Power Handling and DR – State of the Art Output
Multiplexers, J-J. Herren, ALCATEL
Topics & Speakers:
✗ ADC Requirements for DOD Systems, S. Hary, AFRL
✗ Continuous-Time Modulators for RF Applications,
J. Jensen, HRL
✗ High Sampling Rate III-V ADCs, B. Skones, Northrop
Grumman
✗ Commercializing R&D Data Converters , M.J. Choe,
Rockwell Scientific
✗ Military Applications of High-Speed ADCs, L. Pellon,
Lockheed Martin
✗ High-Resolution ADC Techniques, B-S. Song, UCSD
✗ Building the World’s Fastest 8-bit ADC - In CMOS,
K. Poulton, Agilent
✗ ADC Requirements for Commercial Systems and HighSpeed ADC Products, D. Robertson, Analog Devices
✗ High-Speed SiGe ADCs , M. Wingender, Atmel
✗ Emerging Interface Standards for High-Speed Analog-toDigital Conversion, TBD, National Semiconductor
✗ Attacking the Analog Scaling Problem with Novel Silicon
Device Technology, M. Anthony, Kenet
Organizers:
K.C. Wang, HRL
E. Martinez, Purdue University
L. Kushner, Kenet
Sponsor:
MTT-9, Digital Signal Processing
M. Yu, COM DEV
D. Snyder, RS Microwave
Sponsor:
MTT-8, Filters and Passive Components
Are you twisted into a knot by rotations? Are you entangled in
the Battle of the Matrices? Have incessant positive-real polynomials in filter papers made you conclude that, “positively, I’m
gone?” Have you been wondering if you should be optimistic
about optimization? Have genetic algorithms gotten to your DNA
and neural networks to your neurons? Then relax, sit back, learn
about the practical side of filters. Given a proper appreciation of
theory, how does a practioner apply theory-based design information to produce filters that will survive in the nasty, real world
out there? Within this workshop, we hope to provide many practical tips, because with filters, “the devil is in the details.” You
have computed the required coupling coefficient. How do you
actually achieve the positive and negative values? How can you
implement the filter and have a warm, fuzzy feeling about survival and performance of your design with variations in temperature, humidity, during shock, vibration, at high altitude, submerged in jet fuel or other corrosive liquids including salt water?
How to you ensure physical reliability while minimizing weight?
What margins are required for high power operation at various
altitudes, ranging from sea level to open space? How do these
power margins relate to bandwidth and frequency? Why and under what conditions will a passive filter generate interference or
intermodulation products in your receiver? Given the multiplicity of design approaches available for dielectric resonator filters,
what approach should be selected for given situations? Similarly,
what choices drive the design of microstrip filters? You won’t
emerge from this workshop knowing everything about filters,
but you will unequivocally be more useful as a designer because
of the information you will acquire during the eight intense
hours of our workshop. The presenters selected for this workshop have many years of battle hardening and want to pass this
information on to the microwave community. We hope for an interactive and busy session, and encourage your attendance.
High-speed analog to digital converters (ADCs) have enabled
many new commercial and military digital sensor and communication systems. They play a key role in interfacing the analog nature of sensing with digital information processing. Tremendous
efforts have been invested in developing new circuit architectures, sampling techniques, and advanced device technologies to
enhance the resolution and bandwidth performance of highspeed ADCs. As a result of these efforts, today’s society benefits
from networks of broadband communication systems, wireless
personal devices with multi-functional capabilities, industrial
sensor systems with direct connectivity to computer networks,
advanced medical instrumentation, etc. In the military market,
specialized ADCs have enabled digital radar systems, software
re-configurable radios and communication systems, precision
weapon systems, as well as other data acquisition systems in
space-borne, airborne, and ground-based platforms. The requirements for performance, qualification, and lifetime are stringent. High-speed ADCs have been implemented with virtually all
available IC technologies, e.g. Si CMOS and BJT, SiGe HBT, and
various III-V HBT and HFET. ADCs have been developed with
many novel architectures and circuit design techniques, such as
flash, pipeline, ripple-through, folding, interpolation, delta-sigma, etc., In this workshop, a group of experts will present and
discuss the latest status and challenges of applications, requirements, architectures, designs, IC technologies, and testing of
high-speed ADCs. There will be a panel discussion session following the presentations. All attendees are invited to participate
in the discussion.
WMC: ADVANCES IN RF POWER AMPLIFIERS: MODELING,
DESIGN AND LINEARIZATION
Date & Time: Monday, June 13, 8:00 AM–5:00 PM
WMB: FILTER II: PRACTICAL ASPECTS OF MICROWAVE FILTER
DESIGN AND REALIZATION
Location:
Organizers:
Location:
Topics & Speakers:
Hyatt Regency A
✗ Construction and Validation of Black-Box Behavioral Models
of RF Amplifiers, J. Wood, Agilent Technologies
✗ Time Domain Characterization of Nonlinearity and Memory
in Power Amplifiers, P. Asbeck, University of California,
San Diego
Topics & Speakers:
✗ Introduction to Practical Aspects of Microwave Filter
Design and Realization, M. Yu, COM DEV
23
MONDAY
MONDAY WORKSHOPS
WMA: APPLICATION AND TECHNOLOGY OF HIGH-SPEED
ANALOG TO DIGITAL CONVERTERS
MONDAY
MONDAY WORKSHOPS
✗ Separation, Identification, and Compensation of PA Memory
Effects at the Circuit and Device Level, S. Kenney,
✗ Advanced Techniques for PA IMD Control at the Active
Device Level, J.C. Pedro, University of Aveiro
✗ Linearization Issues and Some New Challenges in Microwave
Amplifiers, M. O’Droma, University of Limerick
✗ Methodology to Validate and Compare RF Device and
Circuit Models, D. Schreurs, K.U. Leuven
✗ Advances in GaAs pHEMT Power Amplifier Design and
Manufacture, W. Bosch, Filtronic Ltd.
✗ SiGe Power Amplifier Design for Wireless Applications,
L. Roselli, University of Perugia
✗ Advances in Active Harmonic Load Pull Systems,
M. Mayer, T.U. Wien
Organizers:
T.J. Brazil, University College Dublin
J.C. Pedro, Institute of Telecommunications,
University of Aveiro
D. Schreurs, K.U. Leuven
Sponsors:
✗ THz Compact Range Radar for Military Imaging, W. Nixon,
US Army National Ground Intelligence Center
✗ Novel Bio-Molecular Architectures for Enhanced THz
Sensing, D. Woolard, US ARL
✗ Sources for Space Applications, I. Mehdi, JPL
✗ Remote Sensing Applications, R. Wylde,
QMC Instruments Ltd.
D. Adamson, NPL
D. Woolard, US ARL/ARO
R. Dudley, NPL
Sponsors:
MTT-4, Terahertz Technology
In recent years there has been a resurgence in interest in the
THz region and a significant amount of published work has focused on new sources and detection schemes, leading to a range
of new applications. The objective of this workshop will be to
present a review of THz devices, measurement systems, applications and measurement issues. The workshop will include presentations from traditional users of the THz region to more recent users from the optics world. Presentations will also focus on
the issues of measurement calibration and repeatability, which
are becoming important with the commercialization of THz
systems.
Broadband wireless access will play a dominant role in the development of a mobile information society in the immediate future. Carrier frequencies in the microwave range and modulation
schemes producing signals with high crest factors are common
to all concepts for the air link. Both in the uplink and in the
downlink of a wireless access scheme the power amplifier plays
a crucial role: It is responsible for leaving the highly dynamic
output signal undistorted while converting the battery power to
microwave power at an efficiency as close to 100% as possible.
The conflicting demands of linearity, efficiency, cost and performance create enormous technical challenges. This workshop will
bring together a variety of perspectives on this challenging
theme including device technology, characterization and measurement, circuit/system level modeling and design, architecture
and linearization techniques. Part of the presentations will center on the results of a major new European cooperative research
network in RF/Microwave power amplifiers (TARGET) involving
some 47 organizations and addressing many of these issues.
WME: AM NOISE IN MODERN RECEIVERS
Location:
Topics & Speakers:
✗ System Noise Modeling of Mixers, S. Maas,
Applied Wave Research
✗ Noise, LO and Spurious Effects on Even Harmonic Mixers,
K. Itoh, Mitsubishi Electric Corp.
✗ AM Noise in MMIC Block Receivers, S. Mahon,
Mimix Broadband
✗ CMOS Direct Conversion Receiver Design for Low Noise,
P. Zhang, RF Micro Devices
✗ Direct Conversion: Circuit Tradeoffs for Low Noise Reception,
M. Camiade, United Monolithic Semiconductor
WMD: TERAHERTZ RADIATION: TECHNOLOGY, APPLICATIONS
AND MEASUREMENT METHODS
Location:
Organizers:
Hyatt Regency C
Topics & Speakers:
✗ Science & Technology Issues for THz Imaging, M. Rosker,
DARPA
✗ Terahertz Spectroscopy of Inorganic Materials, B. Miles,
Leeds University
✗ Precision Imaging and Spectroscopy at Terahertz
Frequencies, E. Gerecht, NIST
✗ THz Technology and Molecular Interactions, F.D. Lucia,
Ohio State University
✗ Advanced THz-Frequency Diode-Based Transmitter and
Receiver Technology, T. Crowe, Virginia Diode Inc.
✗ Traceability in THz, D. Adamson, R. Dudley, NPL, UK
✗ THz Sources — Future Developments, H. Ito,
Tohoku University
✗ Low Loss and Low Dispersion Guiding of THz Pulses,
D. Mittleman, Rice University
✗ Pharmaceutical Measurement Demands for Commercial
THz Systems, P. Taday, Teraview Ltd.
✗ THz Remote Sensing of Biological Agents, E. Brown, UCSB
✗ Millimeter Wave (THz) Signature Characterization
of Bio-Stimulants, R. Abreu, Goodrich Corp.
✗ THz Characterization of DNA and Proteins, T. Globus,
University of Virginia
Organizers:
E. Camargo, iTerra Communications
B. Henderson, M/A-COM
Sponsors:
MTT-22, Signal Generation
and Frequency Conversion
MTT-1, Computer Aided Design
Communications receivers operating from VHF through Millimeter Wave have been assembled in recent years with a mixture of MMICs and discrete components on PCB or ceramic substrates. The MMICs have usually been amplifiers, either low
noise or drivers; and the discrete components have been diode
mixers and filters. Increasingly this approach is giving way to
higher levels of chip integration due to ever-increasing market
demands for lower costs. Higher levels of chip integration exist
in heterodyning block down converters, and in direct conversion
receivers with zero or near-zero frequency IF. Direct conversion
MMICs are already in use in cellular phones and may soon migrate to higher frequencies. A clear understanding of AM noise is
critical to meeting the needs of communications receivers, especially as the density of MMICs continues to increase. The focus
of this half-day workshop will be on the analysis of image and LO
AM noise effects on the down conversion process, either for fundamental or sub-harmonic, and how these types of noise can be
calculated and minimized in the development of low cost receiver chips. Phase noise, as it relates to this, will also receive limited
coverage. The subject will be approached from the points of
view of system design and circuit design. Experts in system de-
24
MONDAY WORKSHOPS
Sponsor:
Liquid Crystal Polymer (LCP) has recently received much attention as a high frequency circuit substrate and package material. The advantages of LCP compared to other organic substrate
materials are low moisture absorption, low coefficient of hydroscopic expansion (CHE), excellent barrier properties, and adjustable coefficient of thermal expansion (CTE) through thermal
treatment process. Passive circuits on LCP substrates have been
demonstrated to have low loss and high performance in the microwave and millimeter-wave regime. LCP is a serious substrate
candidate for next generation microwave/millimeter-wave multichip-modules (MCM), systems-on-package (SOP) and advanced
packaging technology. Furthermore, LCP has recently been used
to develop low-cost microwave/millimeter-wave hermetic shield
air-cavity packages for electronics, optoelectronics, and MEMS.
In this half-day workshop, the participants will obtain an
overview of LCP material properties, fabrication processes and
design guidelines of multi-layer LCP substrates, fundamental
limitations of multi-layer LCP substrates, demonstration of microwave and millimeter-wave circuits and modules using LCP
substrates, and hermetic shield air cavity packages using molded-LCP.
WMF: PACKAGING AND INTERCONNECTS FOR MICROWAVE
PHOTONICS APPLICATIONS
Location:
Topics & Speakers:
✗ Chip to Chip Gbit/Sec Optoelectronic Interconnects for
Microwave Monolithic Integrated Circuits, R. Simons,
NASA Glenn Research Center
✗ Packaging and Interconnect Considerations for 40 Gbit/Sec
Optoelectronic Components, K. Goverdhanam,
Agere Systems
✗ Micromachined Integrated Packages for Optoelectronic
Applications, R. Drayton, University of Minnesota
✗ Stacked Thin-film Surface-mount Packaging with High Density
and High Resolution for Compact, High Performance 40 Gbps
Applications, L. Studebaker,
W. Sitch, Centellax; J. Wolf, American Technical Ceramics
✗ The Space Radiation Environment and Its Effect on
Semiconductors and Fiber Optic Systems, K.A. LaBel,
NASA/GSFC
Organizers:
K. Goverdhanam, Agere Systems
R.N. Simons, NASA Glenn Research Center
Sponsor:
MTT-3, Microwave Photonics
WMH: HIGH FREQUENCY DIGITAL BACKPLANE INTERCONNECT
CHARACTERIZATION AND DESIGN
Location:
✗ High Speed Digital Design and Measurements Using VNA
and Time Domain
✗ Relfectometry, M. Resso, Agilent Technologies Inc.
✗ 10 Gb/s Backplane Design Using Full-wave
Electromagnetics, L. Williams, Ansoft
✗ Obtaining Accurate Device-only S-parameter Data Using
In-fixture Measurement Techniques, D. Helster,
C. Morgan, Tyco Electronics
✗ Smoothline TRL Calibration Technique, Y. Ling, Intel Corp.
✗ Measurement Techniques and Results Using 4 and 8 Port
VNA Test Systems, T. Ruttan, Intel Corp., A. Ferrero,
University of Torino
WMG: LIQUID CRYSTAL POLYMERS FOR MICROWAVE
AND MILLIMETER WAVE PACKAGING
Organizers:
T. Ruttan, Intel Corp.
K. Wong, Agilent Technologies Inc.
Sponsors:
MTT-12, Microwave and Millimeter-wave
Packaging
65th ARFTG Symposium
With microprocessors pushing higher and higher into the GHz
range, packaging and interconnects must be taken into consideration along with circuit layout and device characteristics. Backplane designs for computer systems are also migrating to differential bus structures, which imply multi-port design and measurement challenges. In addition, the design needs to be low
cost and suitable for high volume manufacturing. These are very
challenging requirements. The same design challenges are also
applicable to various high frequency digital telecommunication
devices and systems.
In this half-day workshop, the participants will be exposed the
language of high speed digital design, the meaning of signal integrity, frequency domain and time domain measurement techniques, multiport measurement techniques, modeling tools and
best design practices.
Hyatt Regency B
Topics & Speakers:
✗ RF and Millimeter-wave Multi-layer LCP Modules and
MEMS Packaging, A-V. Pham, University of California,
Davis
✗ Moisture Resistant Air Cavity LCP Plastic Microwave Power
Packages, J.W. Roman, RJR Polymers Inc.
✗ Recent Advances in LCP Based 3D RF and Millimeter-wave
Front End, S. Pinel, J. Papapolymerou, Georgia
Institute of Technology
✗ 15 Years In and Out of Liquid Crystalline Polyester Films,
D. Haas, Sanmina-SCI
✗ Microfabrication Techniques for Liquid Crystal Polymer
Substrates, B. Farrell, Foster Miller
Organizers:
Topics & Speakers:
Design of efficient packages and interconnects plays a vital
role in the performance of high-speed optoelectronic components. In this workshop, various topics that address these challenges for a range of optoelectronic components from 2.5
GBits/sec to 40 Gbits/sec will be presented. Emphasis will be
placed on electromagnetic field theoretical aspects behind the
package and interconnect design as well as on developing manufacturable packaging solutions. Integrated optoelectronic packaging techniques using micromachining will be presented. Novel
optoelectronic interconnect schemes for intra/inter chip signal
transfer will be discussed. In addition, packaging considerations
from a radiation tolerance perspective, space radiation effects on
semiconductor and optical systems and ways to mitigate bit error rate degradation due to radiation will be presented.
Location:
Packaging
A-V. Pham, University of California, Davis
G. Ponchak, NASA Glenn Research Center
J. Laskar, Georgia Institute of Technology
25
MONDAY
sign will focus on the mixing process as a behavioral model that
combines characterization data from individual components to
estimate overall performance. And experts in circuit design will
focus on minimizing noise contributions of the individual components. There will be overlap from both sides to maximize clarity
and accuracy of this, often confusing subject.
MONDAY WORKSHOPS
WMI: NEW DEVELOPMENTS IN LOW-NOISE
FREQUENCY SOURCES
Location:
Sponsor:
Cost is usually the most important parameter determining the
success or failure of a packaging solution. In fact, it is usually a
balancing act between cost and performance that must be successfully equalized. However, many designers do not have a full
grasp of the cost drivers that affect possible solutions. In addition,
new technologies are emerging and old technologies are being applied in new ways. Increased awareness of cost impacts will increase the effectiveness of any engineer tasked with developing or
managing microwave, millimeter-wave or high-speed packaging.
This session will review major packaging process technologies
available for electronics and the issues that affect cost for those
technologies. These are HTCC, LTCC, thick film, thin film, laminates, metal housings with glass seals, HDI, LCP and emerging
technologies. Each of these will be explained with a goal of
achieving understanding of cost drivers and how to apply the
technology to real packaging problems. Also, examples of applications requiring low cost packaging will be presented. Users will
present how they have applied the available processes to yield
cost effective packaging solutions.
MONDAY
Topics & Speakers:
✗ LTV Analysis, Cyclostationary Noise and Low-Noise
Oscillator Design, A. Hajimiri, California Institute
of Technology
✗ Recent Advances in Signal Generation Techniques above
10GHz, W. Heinrich, FBH
✗ Optical Techniques for Low-Noise Microwave Frequency
Sources, L. Maleki, Jet Propulsion Lab
✗ Low-Noise CMOS Direct Digital Synthesizers, T. Harris,
Analog Devices
✗ Recent Developments in PLL Technologies, R. Reedy,
Peregrine Semiconductor
Organizers:
G. Lyons, MIT Lincoln Lab
P. Khanna, Celeritek
Sponsors:
MTT-22, Signal Generation & Frequency
Conversion
WMK: TECHNOLOGY AND IMPLEMENTATION OF HIGH
SPEED/GHZ DIGITAL INTERCONNECTIONS
The past few years have seen several significant new developments in the creation and understanding of low-noise frequency
sources. The purpose of this workshop is to review these new
developments and extrapolate trends within these new development areas. An effort will be made to evaluate the impact of
these new developments on future microwave systems and applications. The workshop will have a tutorial flavor and the focus
will be on providing a thorough understanding of each of the
new developments within the broad context of the signal generation field. New understanding comes from the application of linear time varying (LTV) theory to the analysis of low-noise
sources. Progress continues to be made in generating low-noise
signals at high frequency (X-band), while new optical techniques challenge traditional low-phase-noise microwave sources.
Direct digital synthesis (DDS) is now among the standard lownoise techniques with the advent of advanced CMOS DDS chips.
Finally, sigma-delta fractional-N PLL techniques, Ku-band
CMOS prescalars, and integrated VCO/PLLs have given additional flexibility to low-noise sources.
Location:
✗ Overview of Gigabit Backplane Technologies: Optical vs
Electrical, M. Mandich, Bell Labs
✗ Research in Multi-Gigabit Chip-to-Chip Connections,
R. Mooney, Intel Corp.
✗ CDMA and FDMA Based Interconnects for Future
Inter-ULSI Communications, F. Chang, University
of California, Los Angeles
✗ Novel Compliant Interconnects for 10 GHz and Above,
E. Bogatin, Interconnect Devices
✗ CMOS Equalizer for Multi Gigabit FR-4 Backplane Channels,
J. Laskar, Georgia Institute of Technology
Organizers:
H. Boss, Rohde & Schwarz
Y-K Chen, Bell Labs
C. Pobanz, Inphi Corp.
Sponsor:
Some years ago “high speed interconnections” were single
50 Ω transmission lines between microwave transistors or amplifiers. This has changed as applications have progressed rapidly
from the MHz to the GHz range (wireless systems, backplane
communications, microprocessors…) and gigabit-rate digital signals are now routinely traversing low-cost PC boards and IC
packages. Proper design and implementation of these systems
requires expertise beyond digital design, into the realm of RF
and microwave engineering.
This workshop will give a state of the art overview of technology and implementation of high speed interconnections. We will
show the possibilities of high speed signaling with electrical and
optical interconnections, present novel GHz interconnect-systems and the implementation of interconnection systems for
such high speeds. The speakers are well recognized experts
from research, industry and academia. There will be a panel discussion session following the presentations. All attendees are invited to participate in the discussion.
Hyatt Regency B
Topics & Speakers:
✗ HTCC & LTCC Packaging Methods for Cost Sensitive
Products, B. Minehan, AdTech Ceramics
✗ Achieving Low Cost Thick Film Microwave Circuits,
C. Kucenas, Microplex Inc.
✗ Cost Drivers in Thin Film Circuits, B. St. Pierre,
Ultra Source
✗ Laminate Technology Packaging, J. Dobrick, Rogers Corp.
✗ HDI, LCP and Emerging Packaging Technologies,
J. Laskar, Georgia Institute of Techology
✗ Low Cost MEM Packaging, D. Hyman, Xcom Wireless
✗ Low Cost High Power Packaging, R. Sturdivant,
Microwave Packaging Technology Inc.
Organizers:
Topics & Speakers:
WMJ: LOW COST PACKAGING FOR MICROWAVE
AND MILLIMETER WAVE PRODUCTS
Location:
Packaging
R. Sturdivant,
Microwave Packaging Technology Inc.
W. Heinrich, Ferdinand-Braun Institute
A. Lindner, Remec Inc.
26
Twenty student paper finalists were selected. The finalists will
be given complimentary registration for IMS2005, complimentary tickets to the MTT-S Awards Banquet, and some travel subsidies sponsored by the IEEE and the National Science Foundation. The student finalists will present their papers at their appropriate regular sessions, and also make special presentations
at the Interactive Forum on Tuesday, June 14, from 1:30 to 4:30
PM. All symposium participants are welcome and encouraged to
visit the student papers during the Interactive Forum, at which
time they will also be evaluated by a group of judges. Six top papers and four honorable mentions will be selected to receive
cash awards, certificates, and gifts. These will be announced and
presented during the Student Awards Luncheon on Thursday,
June 16.
We are very pleased to announce the finalists for the IMS2005
Student Paper Competition:
A 60 GHz MMIC Dual-Quadrature Mixer in pHEMT Technology
for Ultra Wideband IF Signals and High LO to RF Isolation
S. Gunnarsson, Microwave Electronics Laboratory,
Goteborg, Sweden
New Triangular Microstrip Loop Resonators for Bandpass
Dual-mode Filter Applications
R. Wu, Royal Military College of Canada, Kingston, Canada
Linearity Enhancement of a Directly Modulated Uncooled DFB Laser
in a Multi-channel Wireless-over-fibre Systems
T. Ismail, University College London, London, UK
Analysis of the Frequency Response of SAW Filters Using
Finite-difference Time-domain Method
K. Wong, Hong Kong Polytechnic University, Hong Kong, China
Tunable Planar Combline Filter with Multiple Source/Load Coupling
M. Sanchez-Renedo, Universidad Politecnica de Madrid,
Madrid, Spain
A 5.8 GHz SiGe HBT Direct-conversion I/Q-Channel Sub-harmonic
Mixer for Low Power and Simplified Receiver Architecture
B.G. Choi, Information and Communications University,
Daejeon, Republic of Korea
Propagation of Resonance Cones in Truncated Hyperbolic
Transmission-Line Grids Over Ground
O. F. Siddiqui, University of Toronto, Toronto, Canada
A Retrodirective Array with Interference Rejection Capability
D. S. Goshi, University of California, Los Angeles, Los Angeles, USA
A 2.7 kW, 29 MHz Class-E/Fodd Amplifier with a Distributed Active
Transformer
S. Jeon, California Institute of Technology, Pasadena, USA
Design of Push-push Oscillators for Reducing 1/f Noise Upconversion
J. Choi, University of Michigan, Ann Arbor, USA
A Predistortion Linearization System for High Power Amplifiers
with Low Frequency Envelope Memory Effects
W. Woo, Georgia Institute of Technology, Atlanta, USA
Tissue Sensing Adaptive Radar for Breast Cancer Detection:
Preliminary Experimental Results
J.M. Sill, University of Calgary, Calgary, Canada
Integrated THz Receivers Based on NbN HEB Mixers and InP MMIC
IF Amplifiers
F. Rodriguez-Morales, University of Massachusetts, Amherst, USA
Design of Ring Resonator Mode Spacing and Bandwidth Using the
Phase Response of Composite Right/Left Handed Transmission Lines
C.A. Allen, University of California, Los Angeles, Los Angeles, USA
Reconfigurable MEMS Transmission Lines with Independent
ZO- and beta-Tuning
B. Lakshminaryanan, University of South Florida, Tampa, USA
Transient Electromagnetic Modeling Using Recurrent Neural
Networks
H. Sharma, Carleton University, Ottawa, Canada
A Novel MEMS Impedance Tuner Simultaneously Optimized
for Maximum Impedance Range and Power Handling
Y. Lu, The University of Michigan, Ann Arbor, USA
Embedded Dielectric Resonator Filter in Layered Polymer Packaging
W. She, Purdue University, West Lafayette, USA
Location Tracking with Directional Antennas in Wireless Sensor
Networks
C. Yang, Purdue University, West Lafayette, USA
Experimental Evaluation of an Active Envelope Load Pull
Architecture for High Speed Device Characterization
T. Williams, Cardiff University, Cardiff, UK
Scott Wedge
Jim Rosenberg
Co-Chairs, Student Paper Competition
STUDENT HIGH EFFICIENCY POWER AMPLIFIER DESIGN COMPETITION
MTT-5 (High Power Microwave Components Committee) will
hold a new competition at IMS2005. The contest will take place
in the Interactive Forum (IF) area, and will have a display during
IF session hours. The contest is open to all students and graduate students registered at an educational establishment. The
competitors are required to design, construct, and measure a
high efficiency power amplifier, at a frequency of their choice
above 1 GHz but less than 20 GHz, and having an output power
level of at least 5 watts, but less than 100 watts into a 50 ohm
load. The winner will be judged on the design, which demonstrates the highest power added efficiency (PAE). The power
amplifiers will be tested to verify their performance during the
Interactive Forum at IMS2005. The winner will receive a prize of
$1000 and will be invited to submit a paper describing the design
for the MTT Microwaves Magazine. Contestants must notify the
MTT-5 committee by e-mailing to Kiki Ikossi at [email protected]
of their intention to compete in the contest before April 1, 2005.
Questions can also be sent to this address.
27
TUESDAY
MTT-S STUDENT PAPER COMPETITION
A longstanding tradition of the International Microwave Symposium is the Student Paper Competition. Each year, the papers
that represent the research accomplishments of individual students undergo an arduous review process to identify and acknowledge the best and brightest students in our microwave
community. The high standards of reviewers and judges ensure
that the best papers of the Student Paper Competition also rank
among the best papers of the Symposium.
This year we received 304 submissions for the Student Paper
Competition. Approximately 50% of these papers were accepted
for presentation, and then given additional detailed scrutiny by
the subcommittees of the TPC to select a group of finalists. A
step in this process included ranking student paper nominations
relative to all other accepted papers. Although no surprise, many
of the student paper finalists were ranked by their reviewing
subcommittee as the best paper they reviewed.
IEEE MTT-S IMS TECHNICAL SESSIONS
TU1C Frequency Domain
Numerical Techniques
Chair: D. Yang
Co-chair: L. Perregrini
LBCC 202C
8:00–9:40 AM
TU1B Frequency Conversion
and Control Circuits
Chair: L. Reynolds
Co-chair: F. Schindler
LBCC 202AB
TU1D Silicon- and GaAs-based Novel
Amplifiers and Mixers
Chair: T. Tokumitsu
Co-chair: D.E. Meharry
LBCC 203
TU1A-1: Bi-directional 60 GHz Radio-onfiber Systems Using Cascaded SOA-EAM
Frequency Up/Down Converters.
J. Seo, C. Choi, W. Choi, Yonsei University; Y.
Kang, Y. Jung, J. Kim, Electronics and
Telecommunications Research Institute
TU1B-1: A Subharmonic CMOS Mixer Based
on Threshold Voltage Modulation
B.G. Perumana, C. Lee, J. Laskar, Georgia
Institute of Technology; S. Chakraborty, Texas
Instruments
TU1C-1: Rapid 3D Electromagnetic
Simulation of Quasi-periodic Structures
S.J. Cooke, B. Levush, Naval Research Lab
TU1D-1: Intermodulation Reduction Concept
for Cascode RF Amlifiers
Z.M. Nosal, Warsaw University of Technology
TU1A-2: Linearity Enhancement of a
Directly Modulated Uncooled DFB Laser in a
Multi-channel Wireless-over-fibre Systems
T. Ismail, J.E. Mitchell, A.J. Seeds, University
College London
TU1B-2: A 6-30 GHz Image-rejection
Distributed Resistive MMIC Mixer in a Low
Cost Surface Mount Package
K. Fujii, H. Morkner, Agilent Technologies
Inc.
TU1C-2: A Surface Integral Equation
Formulation for Dielectric Post Structures
in Waveguides
F. Arndt, V. Catina, University of Bremen; J.
Brandt, MiG Microwave Innovation Group
TU1D-2: Attenuation Compensation
Techniques in Distributed SiGe HBT
Amplifiers Using Highly Lossy Thin Film
Microstrip Lines
C. Schick, T. Feger, E. Soenmez, K.B. Schad,
A. Trasser, H. Schumacher, University of Ulm
TU1A-3: Radio-on-fiber Downlink
Transmission Systems Based on Optically
Controlled InP/InGaAs HPT Oscillators
C. Choi, J. Seo, W. Choi, Yonsei University; H.
Kamitsuna, M. Ida, K. Kurishima, NTT Corp.
TU1B-3: An Ultra Compact and Broadband
15-75 GHz BPSK Modulator Using 0.13 µm
CMOS Process
H. Chang, P. Wu, T. Huang, H. Wang, National
Taiwan University; Y. Tsai, C. Chen, TSMC
TU1C-3: Efficient CAD of Optimal Multi-port
Junctions Loaded with Partial-height
Cylindrical Posts Using the 3D BI-RME Method
A.A. San-Blas, Univ. Miguel Hernandez de
Elche; F. Mira, V.E. Boria, Univ. de Valencia;
B. Gimeno, M. Bressan, G. Conciauro, P.
Arcioni, Univ. degli Studi di Pavia
TU1D-3: Micro-power Amplifiers for Wireless
PAN Applications
B.G. Perumana, C. Lee, J. Laskar, Georgia
Institute of Technology; S. Chakraborty, Texas
Instruments
TU1C-4: On the Rigorous Calculation of All
Ohmic Losses in Rectangular Waveguide
Multi-Port Junctions
M. Taroncher, S. Cogollos, V.E. Boria, A. Vidal,
J. Hueso, Univ. Politecnica de Valencia; B.
Gimeno, Universidad de Valencia; I. Hidalgo,
Alcatel Espacio
TU1D-4: Highly-integrated Low-power
WCDMA SiGe Transceiver for Mobile
Terminals
H. Shih, T. Fu, Y. Chen, J. Liu, P. Su, K. Juang,
T. Yang, Industrial Technology Research
Institute
TU1A-4: A Predistortion Type Equi-path
Linearizer Designed for Radio-on-fiber
System
S. Tanaka, N. Taguchi, Y. Atsumi, Optowave
Lab Inc.; T. Kimura, Yazaki Corp
9:20 AM
9:30 AM
TU1B-4: Low-voltage and Broadband V-band
InP HEMT Frequency Doubler MMIC
K. Nishikawa, T. Enoki, S. Sugitani, T. Kosugi,
M. Tokumitsu, I. Toyoda, K. Tsunekawa, NTT
Corp.
TU1A-5: Simultaneous All-optical Frequency
Upconversion for WDM Radio over Fiber
Applications
H.J. Song, J.S. Lee, J.I. Song, Gwangju
Institute of Science and Technology (GIST)
TU1B-5: Low Power 71 GHz Static Frequency
Divider in SiGe:C HBT Technology
L. Wang, G. Wang, J. Borngraeber, IHP GmbH;
A. Thiede, University of Paderborn
9:10 AM
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
TUESDAY, JUNE 14, 2005
TU1A Radio Over Fiber: Devices,
Techniques and Systems
Chair: E. Rezek
Co-chair: D. Novak
LBCC 201B
TU1A-6: Relative-intensity-noise Reduction
Technique for Frequency-converted Radioon-fiber System
N. Taguchi, S. Tanaka, Y. Atsumi, Optowave
Lab Inc.; T. Kimura, Yazaki Corp.
TU1B-6: A Millimeter-wave Wideband SPDT
Switch with Traveling-wave Concept Using
0.13 µm CMOS Process
M. Yeh, Z. Tsai, K. Lin, H. Wang, National
Taiwan University; C. Sut, C. Chao, Taiwan
Semiconductor Manufacturing Co.
TU1D-5: One Single Traveling-wave MMIC
for Highly Linear Broadband Mixers and
Variable Gain Amplifiers
I. Kallfass, H. Schumacher, T. Purtova,
University of Ulm; A. Brokmeier, W. Ludwig,
TU1C-5: On the Definition and the
Derivation of the Characteristic Parameters
of Coupled Lines and Application to MoM
Analysis
M. Farina, A. Morini, T. Rozzi, Univ.
Politecnica delle Marche
TU1A-7: Photonic Vector Modulation Tx/Rx
Architecture for Generation, Remote
Delivery and Detection of M-QAM Signals
M.A. Piqueras, B. Vidal, J. L. Corral, V. Polo,
H. Pfrommer, A. Martinez, J. Marti,
Polytechnic University of Valencia
TU1D-6: First Demonstration of Low Power
Monolithic Transimpedance Amplifier
Using InP/GaAsSb/InP DHBTs
X. Zhu, J. Wang, D. Pavlidis, University of
Michigan; S. Hsu, National Tsinghua
University
28
TU1E Filter Theory and Synthesis
Techniques
Chair: M. Yu
Co-chair: S. Kanamaluru
LBCC 204
8:00 AM
TU1E-1: Cascaded Singlets Realized by Node
Insertions
H.C. Bell, HF Plus
2005 IEEE MTT-S
International Microwave Symposium
TUESDAY
TU1E-2: Direct-coupled Realizations for
Microwave Bandstop Filters
R. J. Cameron, COMDEV Europe Ltd.; Y.
Wang, M. Yu, COMDEV Ltd.
TU1E-3: A Design Technique for Symmetric
Dualband Filters
G. Macchiarella, Politecnico di Milano; S.
Tamiazzo, Andrew, Agrate
TU1E-4: Coupling Matrix Synthesis for a
New Class of Microwave Filter
Configuration
F. Seyfert, INRIA; R.J. Cameron, COMDEV;
J.C. Faugere, Univ. Paris VI
9:10 AM
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
Plenary Session
Tuesday, June 14, 10:10 AM
LBCC Grand Ballroom
ALSO
OCCURRI
NG
9:30 AM
9:20 AM
TU1E-5: Inhomogeneous Stepped-impedance
Corrugated Waveguide Low-pass Filters.
R. Levy, R. Levy Assoc.
29
TU3B Hot Carrier Effects
and Mixer Technology
Chair: H.C. Huang
Co-chair: Z. Bardai
LBCC 202AB
TU3C Advances in time domain
modeling
Chair: L. Roselli
Co-chair: M. Celuch
LBCC 202C
TU3A-1: Location Tracking with Directional
Antennas in Wireless Sensor Networks
C. Yang, S. Bagchi, W.J. Chappell, Purdue
University
TU3B-1: Distortion Free Varactor Diode
Topologies for RF Adaptivity
K. Buisman, L.C. de Vreede, M. Spirito, A.
Akhnoukh, T.L. Scholtes, L.K. Nanver, Delft
University of Technology; L.E. Larson,
University of California at San Diego UCSD
TU3C-1: Transfer Function Representation of
Passive Electromagnetic Structures
Y. Kuznetsov, A. Baev, T. Shevgunov, Moscow
Aviation Institute (State University of
Technology, Moscow, Russia); M. Zedler, P.
Russer, TU Muenchen
TU3A-2: Environmental Effects on RFID Tag
Antennas
D.M. Dobkin, Enigmatics; S.M. Weigand, WJ
Communications Inc.
TU3B-2: Impact of Hot Carrier Stress on RF
Power Characteristics of MOSFETs
S. Huang, D. Yang, C. Chang, National Chiao
Tung University; K. Chen, G. Huang, National
Nano Device Labs; V. Liang, H. Tseng, United
Microelectronics Corp.
TU3C-2: State Space System Representation
of Time Domain Responses from
Electromagnetic Simulations
K. Naishadham, J.E. Piou, MIT Lincoln Lab
1:20–3:00 PM
TU3D FBAR Filters for Cellular
Phone Applications Focused Session
Chair: R. Weigel
Co-chair: C. Ruppel
LBCC 203
TU3D-1: Invited: High-Q Resonators Using
FBAR/SAW Technology and Their
Applications
M. Ueda, T. Nishihara, J. Tsutsumi, S.
Taniguchi, T. Yokoyama, S. Inoue, Y. Satoh,
Fujitsu Labs; T. Miyashita, Fujitsu Media
Devices
TU3B-3: Hot Carrier Effect on Power
Performance in GaAs PHEMT MMIC Power
Amplifiers
Y. Chou, R. Grundbacher, R. Lai, B. Allen, B.
Osgood, A. Sharma, Q. Kan, D. Leung, D. Eng,
P. Chin, T. Block, A. Oki, Northrop Grumman
Space Technology
TU3A-3: RF Barcodes Using Multiple
Frequency Bands
I. Jalaly, University of Surrey; I.D. Robertson,
University of Leeds
TU3B-4: Isolation Issues in multifunctional
Si/SiGe ICs at 24 GHz
E. Sonmez, S. Chartier, A. Trasser, H.
Schumacher, University of Ulm
2:50 PM
2:40 PM
2:30 PM
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
TU3A Sensors and Sensor Systems
Chair: I. Gresham
Co-chair: G. Hopkins
LBCC 201B
TU3D-2: Invited: Ultra-miniature Monolithic
FBAR Filters for Wireless Applications
D. Shim, Y. Park, K. Nam, S. Yun, D. Kim, B.
Ha, I. Song, Samsung Advanced Institute of
Technology
TU3C-3: Domain Decomposition FDTD
Algorithm Combining with Numerical TL
Calibration Technique for Parameter
Extraction of Substrate Integrated Circuits
F. Xu, K. Wu, Ecole Polytechnique
TU3D-3: Invited: The Effect of Perimeter
Geometry on FBAR Electrical Performance
R. Ruby, J. Larson, Agilent Technologies
TU3C-4: Low Reflection Macromodels for a
Stable FDTD Scheme Operating with Highly
Refined Local Meshes
P. Sypek, L. Kulas, M. Mrozowski, Gdansk
Univ. of Technology
TU3D-4: Invited: A Tunable Bandpass BAW
Filter Architecture and Its Application to
WCDMA Filter
J.F. Carpentier, C. Tilhac, G. Caruyer, P.
Ancey, STMicroelectronics; F. Dumont,
STMicroelectronics, G. Parat, CEA-LETI
TU3A-4: A Conformal 10 GHz Rectenna for
Wireless Powering of Piezoelectric Sensor
Electronics
C. Walsh, S. Rondineau, M. Jankovic, Z.
Popovic, University of Colorado; G. Zhao,
Intelligent Automation Inc.
TU3A-5: A Novel Small Tapered Slot Antenna
for Passive Imaging Sensors
M. Sato, T. Hirose, Fujitsu Labs Ltd.
TU3D-5: Invited: Energy Loss Mechanisms in
SMR-type BAW Devices
R. Thalhammer, R. Aigner, Infineon
Technologies
TU3B-5: A Fully Integrated 5.2 GHz SiGe
HBT Upconversion Micromixer Using
Lumped Balun and LC Current Combiner
T. Wu, C. Meng, T. Wu, National Chiao Tung
University; G. Huang, National Nano Device
Labs
TU3C-5: A Novel Wave Separation Scheme
for the Extraction of S-parameters in NonTEM Waveguides for the FVTD Method
D. Baumann, C. Fumeaux, R. Vahldieck, ETH
Zurich
TU3A-6: Cement Kiln Temperature
Measurements Using Microwave
Radiometry
K.D. Stephan, E. Ryza, Texas State UniversitySan Marcos; J.A. Pearce, L. Wang, University
of Texas at Austin
TU3D-6: Invited: Comparison of Modeconversion, Energy-trapping and Lateral
Acoustic Coupling in FBAR and SBAR
R.F. Milsom, H-P. Löbl, F. Vanhelmont, A.B.M.
Jansman, J-W. Lobeek, A. Tuinhout, Philips
Research Labs
TU3D-7: Invited: Design Flow and
Methodology on the Design of BAW
Components
E. Schmidhammer, B. Bader, W. Sauer, M.
Schmiedgen, H. Heinze, C. Eggs, T. Metzger,
EPCOS
TU3B-6: A 5.8 GHz SiGe HBT Directconversion I/Q-channel Sub-harmonic Mixer
for Low Power and Simplified Receiver
Architecture
B.G. Choi, C.S. Park, Information and
Communications University
30
TU3C-6: A Multigrid-enhanced Iterative ADI
Method
S. Wang, Kelly Scientific Inc.; J. Chen,
University of Houston
TU3D-8: Invited: Simulation of Transverse
Effects in FBAR Devices
A. Reinhardt, V. Laude, S. Ballandras,
FEMTO-ST Institute, Universite de Franche
Comte
NOTES
TUESDAY
See page 45 for Tuesday Panel Sessions
31
3:30–5:10 PM
TU4B MW Component Miniaturization,
Performance Optimization, Size
Reduction & Emerging Tech.
Chair: C.P. Wen
Co-chair: D. Hornbuckle
LBCC 202AB
TU4C New Applications of Time
Domain Methods
Chair: M.M. Tentzeris
Co-chair: W.J.R. Hoefer
LBCC 202C
TU4D Microwave Magnetic Devices
Chair: D. Adam
Co-chair: B. El-sharawy
LBCC 203
TU4A-1: Symmetrical Realization for
Predistorted Microwave Filters
M. Yu, R.J. Cameron, D.J. Smith, V. Dokas, Y.
Wang, COM DEV Ltd.
TU4B-1: CMOS Antenna Tuning Unit for 2.4
GHz ISM Band
P. Sjblom, H. Sjland, Lund University
TU4C-1: Analysis of the Frequency Response
of SAW Filters Using Finite-difference Timedomain Method
K. Wong, W. Tam, Hong Kong Polytechnic
University
TU4D-1: Stress Related Insertion Loss in
Longitudinal Field Ferrite Devices
C.R. Boyd, Jr., Microwave Applications Group
TU4A-2: LTCC Wide-band Canonical Ridge
Waveguide Filters
M.M. Fahmi, K.A. Zaki, University of
Maryland; J.A. Ruiz-Cruz, Universidad
Politecnica de Madrid; A.J. Piloto, Kyocera
America
TU4B-2: 800 MHz-2.5 GHz Miniaturized
Multilayer Symmetrical Stacked Baluns for
Silicon Based RF ICs
K. Ma, J. Ma, L. Jia, B. Ong, K. Yeo, M. Do,
Nanyang Technological University
TU4C-2: Topology and Design of Wideband
3D Metamaterials Made of Periodically
Loaded Transmission Line Arrays
W.J. Hoefer, P.P. So, University of Victoria; D.
Thompson, M.M. Tentzeris, Georgia Inst. of
Technology
TU4D-2: Left-handed Rectangular
Waveguides Periodically Filled with Ferrite
T. Ueda, Kyoto Institute of Technology; M.
Tsutsumi, Fukui University of Technology
3:50 PM
3:40 PM
3:30 PM
TU4A Filter Design
and Implementation
Chair: H-W. Yao
Co-chair: J. Modelski
LBCC 201B
TU4D-3: Low Loss Two-port Lumped Element
Isolator Using Improved Gyrator Circuit
T. Hasegawa, T. Makino, S. Hino, K. Ohira, T.
Okada, Murata Manufacturing, Co. Ltd.
4:00 PM
TU4A-3: Parallel Coupled Line Notch Filter
with Wide Spurious-Free Passbands
R.V. Snyder, S. Shin, RS Microwave
TU4B-3: Very High Density RF MIM
Capacitor Compatible with VLSI
K. Chiang, C. Lai, H. Kao, National ChiaoTung Univ., SNDL, Dept of Elec & Comp. Eng.;
A. Chin, Inst of Microelectronics; S.
McAlister, Nat’l Research Council
TU4A-5: Embedded Dielectric Resonator
Filter in Layered Polymer Packaging
W. She, E.E. Hoppenjans, W.J. Chappell,
Purdue University
TU4B-4: Impact of Design on High Frequency
Performances of Advanced MIM Capacitors
Using SiN Dielectric Layers
J. Piquet, C. Bermond, T. Lacrevaz, B.
Blampey, B. Flechet, G. Angenieux, LAHC;
M. Thomas, A. Farcy, J. Torres, STMicroelec.
TU4A-6: Discrete Tunable Dielectric
Resonator for Microwave Applications
G. Panaitov, R. Ott, N. Klein,
Forschungszentrum Juelich
TU4B-5: Low Noise and High Gain RF
MOSFETs on Plastic Substrates
H. Kao, B. Hung, K. Chiang, Z. Lai, Nat’l
Chiao-Tung Univ.; G. Samudra, Nat’l Univ. of
Singapore; A. Chin, Inst. of Microelectronics;
S. McAlister, Nat’l Res. Council of Canada
5:00 PM
TU4C-3: Efficient Finite-difference Timedomain (FDTD) Modeling of Periodic Leakywave Structures
T. Kokkinos, C.D. Sarris, G.V. Eleftheriades,
University of Toronto
TU4D-4: Design Optimization of Lumped
Element Circulator Based on Inductance
Eigenvalue Evaluation
T. Miura, University of Manchester
TU4C-4: Transient Modeling of
Gyromagnetic Materials with the TLM Intercell Network Concept
H. Du, P.P. So, W.J. Hoefer, University of
Victoria
TU4A-7: Rectangular Waveguide Elliptic
Filters with Capacitive and Inductive Irises
and Integrated Coaxial Excitation
J.A. Ruiz-Cruz, J.R. Montejo-Garai, J.M.
Rebollar, Universidad Politecnica de Madrid;
K.A. Zaki, University of Maryland
TU4A-8: Novel Waveguide Filters with
Multiple Attenuation Poles Using Frequency
Selective Surfaces
M. Ohira, H. Deguchi, M. Tsuji, H. Shigesawa,
Doshisha University
TU4D-5: Duplexing Ferrite Reciprocal Phase
Shifters
C.R. Boyd, Jr., Microwave Applications Group
TU4D-6: Ferromagnetic RF Integrated
Inductor with Closed Magnetic Circuit
Structure
M. Yamaguchi, S. Bae, K. Kim, Tohoku
University; K. Tan, T. Kusumi, K. Yamakawa,
Akita Research Institute of Advanced
Technology
TU4B-6: A K-band AlGaN/GaN HFET MMIC
Amplifier on Sapphire Using Novel
Superlattice Cap Layer
M. Nishijima, T. Murata, Y. Hirose, M. Hikita,
N. Negoro, H. Sakai, Y. Uemoto, K. Inoue, T.
Tanaka, D. Ueda, Matsushita Electric
Industrial Co., Ltd.
4:50 PM
4:40 PM
4:30 PM
4:20 PM
4:10 PM
TU4A-4: A 26 GHz Band Dielectric
Waveguide Diplexer with Flange Interfaces
K. Sano, K. Ito, TOKO Inc.
TU4C-5: Efficient Modeling of PIN Diode
Switches Employing Time-domain
Electromagnetic-physics-based Simulators
Y.A. Hussein, Stanford University; S.M. ElGhazaly, University of Tennessee, Knoxville;
S.M. Goodnick, Arizona State University
TU4B-7: A Poly-Si Gate Carbon Nanotube
Field Effect Transistor for High Frequency
Applications
S. Kim, L. Rabieirad, J. Jeon, S. Mohammadi,
Purdue University; T. Choi, University of
Michigan; M. Shim, University of Illinois
TU4D-7: Tunable and Simple Microwave
Detector Using MSW Oscillator
K. Horikawa, T. Kodera, Osaka Institute of
Technology
32
TU4E Distributed RF Sensor
Communication Systems
Focused Session
Chair: B. Spielman
Co-chair: T. Kemerley
LBCC 204
TUESDAY
TU4E-2: Invited: The Intel Mote Platform:
Bluetooth-based Sensor Networks and
Applications
R.M. Kling, Intel Corp.
4:00 PM
3:50 PM
3:40 PM
3:30 PM
TU4E-1: Invited: A Vision for Wireless Sensor
Networks
M. Horton, Crossbow Technology Inc.
TU4E-4: Invited: Networked Infomechanical
Systems (NIMS): Next Generation Sensor
Networks for Environmental Monitoring
W.J. Kaiser, Electrical Engineering Dept.,
Center for Embedded Networked Sensing,
UCLA
TU4E-5: Invited: Fine Grained Composition
of Distributed Sensor System Infrastructure
V. Subramonian, C. Gill, Washington
Univeristy in St. Louis
5:00 PM
4:50 PM
4:40 PM
4:30 PM
4:20 PM
4:10 PM
TU4E-3: Invited: Defense Applications for
Large Numbers of Distributed Small Sensors
R. Parker, B. Schott, USC/ISI-East
33
TUESDAY FOCUSED SESSIONS
TU3D: FBAR FILTERS FOR CELLULAR PHONE APPLICATIONS
Date & Time: Tuesday, June 14, 1:20–3:00 PM
TU4E: DISTRIBUTED RF SENSOR/COMMUNICATION SYSTEMS
Location:
Location:
Chair:
Robert Weigel,
University of Erlangen-Nuremberg,
Germany
Chair:
Barry E. Spielman,
Washington University in St. Louis
Co-Chair:
Tim Kemerley, Wright Patterson AFB
Co-Chair:
Clemens Ruppel, EPCOS AG, Munich,
Germany
Sponsors:
MTT-6, Microwave & MM-wave IC
MTT-12, Microwave & MM-wave Packaging
BAW/FBAR technology has recently emerged as a preferred
technology for the realization of miniaturized high performance
RF filters and duplexers for wireless applications like cellular
phones for US PCS application. In US PCS CDMA systems due to
the small frequency separation of only 20 MHz between transmit
and receive bands, duplexer filters with steep skirts, a narrow
roll-off band and strong nearby selectivity are required. In addition, the duplexer filters are expected to satisfy the more general requirements of low insertion attenuation of typically 3 to 3.5
dB, and a high power durability for the TX duplexer filter. These
requirements may be met by bulk acoustic wave (BAW) and/or
film bulk acoustic wave resonator (FBAR) filters. Design, fabrication, and application of BAW/FBAR filters will be highlighted
in this session.
This focused session will deal with emerging technologies and
applications involving a large number of distributed, extremely
small sensors that independently collect information, possibly interpret that information, and communicate a response to the
other sensors as an ad hoc network and/or a central location to
effect a collective objective. These technologies have potential
for impacting: defense applications, medical applications, agricultural management, structure and earthquake monitoring, industrial controls, machinery condition monitoring, transportation and shipping, power grid monitoring and management, fire
fighting and rescue operations, home automation, and interactive toys. The presenters will be asked to address when possible,
issues relating to chip and sensor integration and packaging,
software/middleware (including self-organizing and self-repairing networking protocols and security issues), and operating
systems. The session will focus on applications involving
MOTES, MEMS, and RF sensors.
TU3E: MEMORIAL SESSION FOR DON PARKER
Location:
Chair:
Robert L. Eisenhart, Eisenhart & Assoc.
Organizer:
Robert L. Eisenhart, Eisenhart & Assoc.
Sponsor:
IMS2005 Steering Committee
This session is an opportunity to show our deep respect and
admiration for Don Parker who recently passed away. Although
Don is credited with innumerable contributions to the MTT-S, he
is best remembered for his soft-spoken ways of accomplishing
things and getting others involved. Several of Don’s friends and
associates will say a few words in remembrance. Please let me
know (contact [email protected]) if you would like to participate in the session. You may speak or provide a letter that
can be read for you. Particularly interesting would be unique circumstances you shared with Don.
34
WEDNESDAY FOCUSED SESSIONS
WEDNESDAY SPECIAL SESSIONS
Date & Time:
WE2C: TERAHERTZ IMAGING
Wednesday, June 15, 10:10–11:50 AM
Date & Time:
Location:
Location:
Chair:
Peter H. Siegel, Caltech/JPL
Chair:
Co-Chair:
Koji Mizuno, Tohoku University
David McQuiddy, Jr.,
TriQuint Semiconductor Inc.
Sponsor:
MTT-4, Terahertz Techniques
Co-Chair:
John Horton, J.B. Horton Group
Organizers:
John Horton, Vansant Prabhu, Ayre Rosen
Sponsor:
IMS 2005 Steering Committee
This special focused session highlights both traditional and
novel applications of THz Imaging, from space science to agriculture to biology and medicine. Five distinguished invited speakers
will summarize their work in this very interesting and rapidly expanding field.
WE2D: A TRIBUTE TO HAROLD SOBOL
Wednesday, June 15, 10:10–11:50 AM
IMS2005 will honor Harold Sobol for his many contributions
to the microwave industry and to IEEE, especially to the Microwave Theory and Techniques, and the Communications societies. This session will include an overview of Hal’s career, given
in presentations by his co-workers. Members of his family are
expected to attend this session. If you wish to make a presentation at the session, please contact John Horton via e-mail at
[email protected], Vansant Prabhu at [email protected], Jitenda
Goel at [email protected] or Ayre Rosen at
[email protected].
WE3G: ANALYSIS AND APPLICATIONS OF LOW PHASE-NOISE
OSCILLATING SYSTEM ARRAYS
Date & Time: Wednesday, June 15, 1:20–3:00 PM
Location:
Chair:
Viktor Krozer, Technical University
of Denmark
Co-Chair:
Jaijeet Roychowdhury,
University of Minnesota
WE4A: FUTURE TECHNOLOGIES FOR MICROWAVE/MILLIMETER
WAVE APPLICATIONS
Date & Time: Wednesday, June 15, 3:30–5:10 PM
Sponsors:
Location:
Chair:
John Horton, J.B. Horton Group USA
Co-Chair:
Timothy Lee, The Boeing Co.
This session covers the progress in linear and nonlinear
analysis methods for coupled oscillators and oscillator coupling
in array systems. It will also discuss stability analysis of oscillator
arrays. The first two papers describe successful methods for
coupled oscillator analyses. The following two papers focus on
the trade-off between phase accuracy and phase-noise. The last
two papers deal with harmonic-balance phase-noise analysis of
unforced and injection locked coupled oscillator arrays.
This session reports on the status of development in five technology areas that could provide enhanced system performance
through the application of microwave and millimeter-wave technology to systems. Technologies being investigated include carbon nanotube devices, devices developed on diamond substrate,
MEMS applications in microwave systems, photonic devices for
direct modulation and new circuit designs for future systems.
[see page 55 for Wednesday Panel Sessions]
35
WEDNESDAY, JUNE 15, 2005
WE1A-1: Transmit Receive Module for Space
Ground Link Subsystem (SGLS) and Unified
S-band (USB)Satellite Telemetry, Tracking
and Commanding (TT&C) and Comm.
S. Bharj, M. Thaduri, N. Patel, L. Qu,
Princeton Microwave Tech.; P. Oleski, R.W.
Patton, Air Force Research Lab/IFGC
8:20 AM
WE1B-1: Spurious Mode Supression in
Coupled Resonator Filters
G.G. Fattinger, M.R. Fattinger, K. Diefenbeck,
P. Moller, R. Aigner, Infineon Technologies
AG
9:10 AM
WE1A-5: Adaptive Power Controllable
Retrodirective Array System for Portable
Battery Operated Applications
S. Lim, K.M. Leong, T. Itoh, University of
California, Los Angeles
WE1D-1: Large Signal Modeling of High
Voltage GaAs Power HBTs
M. Rudolph, R. Doerner, Ferdinand-BraunInstitut (FBH)
WE1D-3: Improvement of PHEMT Intermodulation Prediction Through the Accurate
Modeling of Low Frequency Dispersion Effects
A. Raffo, G. Vannini, Univ. of Ferra; A.
Santarelli, P. Traverso, F. Filicori, Univ. of
Bologna; M. Pagani, F. Palomba, CiRiTel; F.
Scappaviva, MEC srl
WE1A-3: Design of MMIC Based
Electronically Steerable RF
MultiBeamformer for 3D Radars
S. P, A.K. Singh, M.R. Y, Electronics and
Radar Development Establishment (LRDE);
C. S, Center for Air Borne Systems (CABS)
WE1A-4: A Retrodirective Array with
Interference Rejection Capability
D.S. Goshi, K.M. Leong, T. Itoh, University of
WE1D Non-Linear Device Modeling
Chair: Y. Tajima
LBCC 201B
WE1C-2: Development of a Multi-layer SU-8
Process for Terahertz Frequency Waveguide
Blocks
C. H. Smith, H. Xu, N. S. Barker, University of
Virginia, Charlottesville
WE1B-3: Simulation of Stressed FBAR
Thanks to a Perturbation Method
J. Masson, A. Reinhardt, S. Ballandras,
Institut FEMTO-ST
WE1C-3: High Efficiency Heterostructure
Barrier Varactor Frequency Triplers Using
AlN Substrates
Q. Xiao, J.L. Hesler, T.W. Crowe, R.M. Weikle,
Y. Duan, B.S. Deaver, University of Virginia,
Charlottesville
WE1B-4: Study on Photo-induced Acoustic
Charge Transport Effect in GaN Film
K. Hohkawa, C. Kaneshiro, K. Koh, Kanagawa
Institute of Technology; K. Nishimura, N.
Shigekawa, Nippon Telephon & Telegraph Co.
WE1D-4: Nonlinear HEMT Modeling Using
Artificial Neural Network Technique
J. Gao, L. Zhang, J. Xu, Q. Zhang, Carleton
University
WE1C-4: Semimetal Semiconductor
Junctions for Low Noise Zero-bias Rectifiers
A.C. Young, J.D. Zimmerman, E.R. Brown,
A.C. Gossard, University of California Santa
Barbara
WE1D-5: Efficient PA Modeling Using Neural
Network and Measurement Set-up for
Memory Effect Characterization in the
Power Device
A.M. Ahmed, E.R. Srinidhi, G. Kompa,
University of Kassel
WE1C-5: Design and Characterization of 180
GHz Filters in Photoimageable Thick-film
Technology
D. Stephens, University of Surrey; P.R. Young,
University of Kent; I.D. Robertson, University
of Leeds
WE1D-6: A State-space Modeling Approach
for Dynamic Nonlinear Microwave System
Based on Large Signal Time Domain
Measurements
A. Cidronali, C. Accillaro, G. Manes,
University of Florence; M. Myslinski, D.
Schreurs, KU Leuven
WE1B-5: Theoretical and Experimental
Results of Ultra Wide Band and Arbitrary
Band Width Ladder Type SAW Filters Using
Ultra-high Coupling Zero TCF SiO2/Y-X
LiNbO3 Substrates
K. Yamanouchi, Y. Satoh, H. Isono, D.
Kawasaki, Tohoku Institute of Technology
WE1B-6: Behavior of BAW Devices at High
Power Levels
R. Aigner, N. Huynh, M. Handtmann, S.
Marksteiner, Infineon Technologies AG
9:20 AM
9:30 AM
WE1C-1: Integrated THz Receivers Based on
NbN HEB Mixers and InP MMIC IF
Amplifiers
F. Rodriguez-Morales, S. Yngvesson,
University of Massachusetts, Amherst
8:00–9:40 AM
WE1D-2: Design of Power FETs Based on
Coupled Electro-Thermal-Electromagnetic
Modeling
D. Denis, I.C. Hunter, School of Electronic &
Electrical Engineering; C.M. Snowden,
Filtronic Compound Semiconductor Ltd.
WE1A-2: A Broadband Millimeter-wave Dual
Polarized Phased Array for Radar Front
End Applications
L. Schulwitz, A. Mortazawi, University of
Michigan
8:30 AM
8:40 AM
WE1C Components and Technologies
for THz Applications
Chair: E. Bryerton
Co-chair: L. Samoska
LBCC 103AB
9:00 AM
8:50 AM
WE1B Microwave Acoustic Devices
Chair: C. Ruppel
Co-chair: R. Weigel
LBCC 102
WE1B-2: High-tone Bulk Acoustic Resonator
Integrated with FBAR Filter on a Single
Chip
W. Pang, H. Zhang, J. Kim, H. Yu, E. Kim,
University of Southern California
8:10 AM
8:00 AM
WE1A Phased Arrays and
Retrodirective Systems
Chair: R.Y. Miyamoto
Co-chair: J. Navarro
LBCC 101
WE1A-6: A Combined Distributed
Amplifier/True-time Delay Phase Shifter for
Broadband Self-steering Arrays
G.S. Shiroma, R.Y. Miyamoto, W.A. Shiroma,
University of Hawaii
36
WE1F Bandstop and Dual Resonator
Filters
Chair: I. Hunter
LBCC 203
WE1G Baluns and Transmission
Structures
Chair: J. Taub
Co-chair: C. Buntschuh
LBCC 204
WE1E-1: 150 W GaN-on-Si RF Power
Transistors
W. Nagy, S. Singhal, R. Borges, W. Johnson, J.
Brown, R. Therrien, A. Chaudhari, A. Hanson,
J. Riddle, S. Booth, P. Rajagopal, E. Piner, K.
Linthicum, Nitronex Corp.
WE1F-1: Compact, Frequency-agile,
Absorptive Bandstop Filters
D.R. Jachowski, Naval Research Laboratory
WE1G-1: Is the Second Order Lattice Balun a
Good Solution in MMICs? A Comparison
with a Direct Coupled Transformer Balun
D.U. Kuylenstierna, P. Linner, B. Hansson,
Chalmers University of Technology
WE1E-2: High Power, High Efficiency,
AlGaN/GaN HEMT Technology for Wireless
Base Station Applications
R. Vetury, Y. Wei, D. Green, S. Gibb, T.
Mercier, K. Leverich, P. Garber, M. Poulton,
J.B. Shealy, RF Micro Devices
WE1F-2: Perfectly Matched Bandstop Filters
Using Lossy Resonators
A.C. Guyette, I.C. Hunter, R.D. Pollard,
University of Leeds; D.R. Jachowski, Naval
Research Lab
WE1G-2: Analysis and Design of Compact
Wideband Baluns on Multilayer Liquid
Crystalline Polymer (LCP) Based Substrates
V. Govind, W. Yun, V. Sundaram, M.
Swaminathan, Georgia Institute of
Technology; S. Dalmia, G. White, Jacket Micro
Devices Inc.
WE1E-4: A C-band AlGaN/GaN HEMT with CatCVD SiN Passivation Developed for an Over 100
W Operation
Y. Kamo, T. Kuniim H. Takeuchi, Y. Yamamoto, M.
Totsuka, T. Shiga, H. Minami, T. Kitano, S. Miyakuni,
T. Oku, A. Inoue, T. Nanjo, Y. Tsuyama, R. Shirahana,
K. Iyomasa, K. Yamanaka, T. Ishikawa, T. Takagi, K.
Marumoto, Y. Matsuda, Mitsubishi Elec. Corp.
WE1F-3: High Rejection Multilayer C-band
DBR Planar Filter
Y. Clavet, E. Rius, C. Quendo, C. Person, J.
Favennec, LEST-UMR CNRS; C. Zanchi,
CNES; P. Moroni, J. Cayrou, J. Cazaux, Alcatel
Space
WE1G-3: Wideband, Low Loss and Compact
3D LTCC Balun with Asymmetric Structure
for Millimeter-wave Applications
N. Kidera, S. Watanabe, K. Watanabe, Asahi
Glass Co. Ltd.; S. Pinel, J. Laskar, Georgia
WE1E-5: Dynamic Gate Bias Technique for
Improved Linearity of GaN HFET Power
Amplifiers
A.M. Conway, Y. Zhao, P.M. Asbeck, University
of California, San Diego; M. Micovic, J.S.
Moon, HRL Labs LLC
WE1F-4: Ku-band Microstrip Diplexer Based
on Dual Behavior Resonator Filter
A. Manchec, E. Rius, C. Quendo, C. Person, J.
Favennec, LEST – UMR CNRS; P. Moroni, J.
Cayrou, J. Cazaux, Alcatel Space
WE1F-5: Miniaturized High Rejection
C-band Planar Band-pass Filter for a
Spatial Application
E. Rius, C. Quendo, Y. Clavet, A. Manchec, C.
Person, J. Favennec, LEST; P. Moroni, J.
Cayrou, J. Cazaux, Alactel Space
9:30 AM
WE1F-6: Dual-band Filters for WLAN
Applications on Liquid Crystal Polymer
Technology
R. Bairavasubramanian, S. Pinel, J.
Papapolymerou, J. Laskar, Georgia Institute
of Technology; C. Quendo, E. Rius, A.
Manchec, C. Person, LEST - UMR CNRS
WE1G-5: Narrow Passband Response of
Unbalanced CRLH Transmission Line
Structure Composed of Capacitively Coupled
Dielectric Resonators
Y. Horii, Kansai University; C. Caloz, Ecole
Polytechnique de Montreal; T. Itoh,
University of California at Los Angeles
9:20 AM
9:10 AM
WE1E-6: Experimental Investigation of DCRF Dispersion in AlGaN/GaN HFET GaAs
Using Pulsed I-V and Time-domain
Waveform Measurements
P. McGovern, P. Tasker, Cardiff University
WE1G-4: An Ultra-wideband Microwave
Balun Using a Tapered Coaxial Coil
Structure Working from kHz Range to
Beyond 26.5 GHz
G. A. Hofbauer, Hofbauer & Stock Microwave
Corp.
WE1E-7: High Temperature Operation of
AlGaN/GaN HEMT
N. Adachi, Y. Tateno, S. Mizuno, A. Kawano, J.
Nikaido, S. Sano, Eudyna Device Corp.
37
WEDNESDAY
WE1E-3: C-band Single-chip GaN-FET Power
Amplifiers with 60 W Output Power
Y. Okamoto, A. Wakejima, Y. Ando, T.
Nakayama, K. Matsunaga, H. Miyamoto, R&D
Association for Future Electron Devices
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
8:10 AM
8:00 AM
WE1E HighPower GaN Devices
Chair: A. Platzker
Co-chair: J.L. Heaton
LBCC 202
WE2B Tunable Dielectric Materials
and Devices
Chair: B. York
Co-chair: S. Gevorgian
LBCC 102
WE2C Terahertz Imaging
Focused Session
Chair: P. Siegel
Co-chair: K. Mizuno
LBCC 103AB
WE2A-1: A Phase and Amplitude Control
Front End Chip in SiGe for Phased-Array Cband Radar Applications
H. Thiesies, H. Berg, Ericsson Microwave
Systems AB
WE2B-1: Demonstration of 124°/dB Phase
Tuning at 30 GHz for a Bulk Ferroelectric
Beam Steering Device
O. Tageman, S. Gevorgian, L. Carlsson,
Ericsson AB; D. Iddles, Filtronic Comtek; P.
Filhol, Temex; V.O. Sherman, A.K. Tagantsev,
EPFL
WE2A-2: Ka-band 32 GHz Planar Integrated
Switched-beam Smart Antenna
A. Liu, C.C. Tzuang, R. Wu, National Taiwan
University; H. Wu, National Chiao-Tung
University
WE2B-2: Cost Effective Ferroelectric Thick
Film Phase Shifter Based on Screen Printing
Technology
W. Hu, D. Zhang, M.J. Lancaster, K. Yeo, T.W.
Button, B. Su, Emerging Device Technology
Centre
WE2A-3: A Uni-planar Fed 2-D Slot Array for
Digital Beamforming
S. Kim, Y.E. Wang, University of California,
Los Angeles
WE2B-3: A Tunable Combline Bandpass
Filter Using Barium Strontium Titanate
Interdigital Varactors on an Alumina
Substrate
J. Nath, D. Ghosh, W.M. Fathelbab, J. Maria,
A.I. Kingon, P.D. Franzon, M.B. Steer, North
Carolina State University
WE2C-1: Invited: Terahertz Space
Applications and Technology
P. De Maagt, Electromagnetics Division,
European Space Research and Technology
Centre (ESTEC), European Space Agency; J.
Charlton, Sula Systems Ltd.
WE2C-2: Invited: Terahertz Imaging Appl. in
Spectroscopy of Biomolecules
E. Bründermann, U. Heugen, A. Bergner, R.
Schiwon, B. Born, G.W. Schwaab, M. Heyden, M.
Krüger, I. Kopf, G. Wollny, J. Samson, S.
Ebbinghaus, K. Schröck, M. Havenith, Ruhr-Univ.
Bochum; D.R. Chamberlin, Agilent; E.E. Haller,
UC Berke
WE2A-4: Wideband Reflective Array Based
on Loaded Metal Rings
A.E. Martynyuk, J.I. Martinez Lopez, J.
Rodriguez Cuevas, UNAM, Mexico; Y.K.
Sydoruk, NTUU Kiev Polytechnic Institute
11:10 AM
WE2A-5: Reduction of Mutual Coupling in
Active Antenna Arrays by Optimized
Interfacing between Antennas and
Amplifiers
T.M. Brauner, Elektrobit AG; R. Vogt, W.
Bachtold, ETH Zurich
WE2B-5: Continuously Tunable Impedance
Matching Network Using Ferroelectric
Varactors
P. Scheele, F. Goelden, A. Giere, S. Mueller,
R. Jakoby, TU Darmstadt
WE2C-4: Invited: Terahertz Surface and
Interface Characterization
T. Löffler, K.J. Siebert, T. Hahn, G. Loata, R.
Wipf, M. Kreß, M. Thomson, H.G. Roskos,
Physikalisches Institut, Johann Wolfgang
Goethe-Universitat; N. Hasegawa, Nippon
Steel Corp.
WE2B-6: Microwave Planar Capacitors
Employing Low Loss, High-K and Tunable
BZN Thin Films
J. Park, J. Lu, S. Stemmer, R.A. York,
University of California, Santa Barbara
11:20 AM
11:30 AM
11:40 AM
WE2C-3: Invited: New Applications of
Millimeter-wave Incoherent Imaging
K. Mizuno, H. Matono, Y. Wagatsuma, S.
Miyanaga, Research Institute of Electrical
Communication, Tohoku Univ.; H. Warashina,
Sendai National College of Technology; H.
Sato, Y. Yamanaka, EE Dept., Tohoku Univ.
WE2B-4: LTCC Compartible Ferroelectric
Phase Shifters
A.N. Deleniv, S.S. Gevorgian, Chalmers
University of Technology; H. Jantunnen, T.
Hu, University of Oulu
11:00 AM
10:50 AM
10:40 AM
10:30 AM
10:20 AM
10:10 AM
WE2A Smart Antennas and Beam
Forming Techniques
Chair: A. Mortazawi
Co-chair: W. Shiroma
LBCC 101
WE2A-6: A New Beam Direction Finding
Circuit Based on Six Port Technology
S.O. Tatu, T.A. Denidni, Institut National de
la Recherche Scientifique INRS-EMT
WE2B-7: Characterization of Thin Film BST
Tunable Capacitors Using A Simple Two
Port Measurement Technique
X. Zhu, D. Chen, Z. Jin, J.D. Phillips, A.
Mortazawi, University of Michigan
WE2C-5: Invited: Development of a Handheld TPI System for Medical Applications
V.P. Wallace, A.J. Fitzgerald, B. Robertson, B.
Cole, Teraview Ltd.; E. Pickwell, Cambridge
University
WE2B-8: Intermodulation Distortion in
Wide-band Dual-mode Bulk Ferroelectric
Bandpass Filters
T. Chakraborty, I. Hunter, R. Kurchania, A.
Bell, University of Leeds; S. Chakraborty,
University of Cambridge
38
10:10–11:50 AM
WE2D A Tribute to Harold Sobol
Special Session
Chair: D. McQuiddy
Co-chair: J. Horton
LBCC 201B
10:10 AM
WE2F Ultra Wideband and Extended
Stopband Filters
Chair: Q.R. Chen
LBCC 203
WE2G Novel Components
Chair: J. Owens
Co-chair: C. Nguyen
LBCC 204
WE2E-1: Wideband Envelope Elimination
and Restoration Power Amplifier with High
Efficiency Wideband Envelope Amplifier for
WLAN 802.11g Applications
F. Wang, D. Kimball, J. Popp, A. Yang, D.Y.
Lie, P. Asbeck, L. Larson, University of
California at San Diego
WE2F-1: An Ultra-wideband Bandpass Filter
Using Broadside-coupled Microstripcoplanar Waveguide Structure
K. Li, D. Kurita, T. Matsui, National Institute
of Information and Communications
Technology (NiCT)
WE2G-1: High Performance Micro-machined
Inductors on CMOS Substrate
D. Weon, J. Kim, J. Jeon, S. Mohammadi, L. P.
Katehi, Purdue University
WE2E-2: Enhanced Linearity and Efficiency
of HBT Power Amplifiers for 5 GHz WirelessLANs
T. Oka, M. Hasegawa, K. Fujita, M. Yamashita,
M. Hirata, H. Kawamura, K. Sakuno, Sharp
Corp.
WE2F-2: Microstrip Bandpass Filters for
Ultra-wideband (UWB) Wireless
Communications
C. Hsu, F. Hsu, J. Kuo, National Chiao Tung
University
WE2G-2: Design of Toroidal Inductors Using
Stressed Metal Technology
J. Kim, D. Weon, J. Jeon, S. Mohammadi, L.P.
Katehi, Purdue University
WE2E-3: CDMA Handset Power Amplifier
with Diode Load Modulator
S. Kim, K. Lee, B. Kim, POSTECH; P.J.
Zampardi, Skyworks Solutions Inc.
WE2F-3: Microstrip Bandpass Filters with
Ultra-broad Rejection Band Using Stepped
Impedance Resonator and High-impedance
Transformer
H. Wang, L. Zhu, Nanyang Technological
University
11:00 AM
11:20 AM
WE2E-6: Switch Less Impedance Matching
type W-CDMA Power Amplifier with
Improved Efficiency and Linearity under
Low Power Operation
T. Tanoue, M. Ohnishi, H. Matsumoto, Central
Research Laboratory, Hitachi, Ltd.
11:40 AM
WE2E-5: A Novel Tunable Broadband Power
Amplifier Module Operating from 0.8 GHz to
2.0 GHz
H. Zhang, H. Gao, G. Li, University of
California, Irvine
11:30 AM
11:10 AM
WE2E-4: A 900/1500/2000 MHz Triple-band
Reconfigurable Power Amplifier Employing
RF-MEMS Switches
A. Fukuda, H. Okazaki, S. Narahashi, Y.
Yamao, NTT DoCoMo Inc.; T. Hirota,
Kanazawa Institute of Technology
WE2F-4: Parallel-coupled Microstrip Filters
with Over-coupled Stages for Multispurious
Suppression
J. Kuo, M. Jiang, M. Wu, National Chiao Tung
University
WE2F-5: Miniature Microstrip Parallelcoupled Bandpass Filters Based on Lumpeddistributed Coupled-line Sections
Y. Lin, H. Yang, C. Chen, Graduate Institute of
Communication Engineering
WE2G-4: An Integrated RF Balanced-filter
with Enhanced Rejection Characteristics
L.K. Yeung, K. Wu, The Chinese University of
Hong Kong
WE2F-6: Serially-connected-series-stub
Resonators and Their Applications in
Coplanar Stripline Bandpass Filter Design
N. Yang, Z. Chen, X. Qing, Y. Guo, Institute for
Infocomm Research
WE2G-5: Ultra-wideband Differential Mode
Bandpass Filters Embedded in Selfcomplementary Antennas
A. Saitou, K. Sato, T. Koyama, K. Watanabe,
YKC Corp.; H. Aoki, N. Satomi, K. Honjo, The
University Electro-Communications
WE2E-7: A High Efficiency, High Voltage,
Balanced Cascode FET
A. Inoue, S. Goto, T. Kunii, T. Ishikawa, Y.
Matsuda, Mitsubishi Electric Corp.
39
WEDNESDAY
WE2G-3: Design of Ring Resonator Mode
Spacing and Bandwidth Using the Phase
Response of Composite Right/Left Handed
Transmission Lines
C.A. Allen, K.M. Leong, T. Itoh, UCLA
10:50 AM
10:40 AM
10:30 AM
10:20 AM
WE2E Power Amplifiers for Wireless
Aplications
Chair: P. Zampardi
Co-chair: A-V. Pham
LBCC 202
WE3A-1: An Active Interference Canceller for
Multistandard Collocated Radio
A. Raghavan, M.M. Tentzeris, J. Laskar,
Georgia Institute of Technology; E. Gebara,
Quellan Inc.
WE3B MEMS Device Technology
Chair: B. Pillans
Co-chair: D. Peroulis
LBCC 102
WE3C Tunable and Active Filters
Chair: P. Blondy
LBCC 103AB
WE3B-1: Miniature RF MEMS Switched
Capacitors
D. Mercier, K. Van Caekenberghe, G. Rebeiz,
WE3C-1: Tunable Planar Combline Filter
with Multiple Source/Load Coupling
M. Sanchez-Renedo, J.I. Alonso, Universidad
Politecnica de Madrid
1:40 PM
WE3B-2: A High-Q Low Voltage HARPSS
Tunable Capacitor
P. Monajemi, F. Ayazi, Georgia Institute of
Technology
WE3D-1: Accurate and Efficient InCorp. of
Frequency-domain Data within Linear and
Non-linear Time-domain Transient
Simulation
T. Brazil, University College Dublin
WE3C-3: Single Switch Reconfigurable
Bandpass Filter with Variable Bandwidth
Using a Dual-mode Triangular Patch
Resonator
C.A. Lugo, J. Papapolymerou, Georgia
Instititute of Technology
WE3D-3: Harmonic-balance Technique for
the Shortening of the Initial Transient of
Microwave Oscillators
F. Ramérez, A. Suärez, University of
Cantabria
2:00 PM
1:50 PM
WE3A-2: Novel High-rejection LTCC
Diplexers for Dual-band WLAN Application
D. Orlenko, K. Markov, S. Royak, A.
Gordiyenko, O. Chernyakov, T. Kerssenbrock,
G. Sevskiy, P. Heide, EPCOS AG
2:10 PM
WE3B-3: Modeling and Characterization of
Dielectric Charging Effects in RF MEMS
Capacitive Switches
X. Yuan, J.C. Hwang, Lehigh University; D.
Forehand, C.L. Goldsmith, MEMtronics Corp.
WE3C-4: Antenna Impedance Mismatch
Measurement and Correction for Adaptive
CDMA Transceivers
D. Qiao, Y. Zhao, T. Hung, D. Kimball, M. Li, P.
M. Asbeck, University of California, San
Diego; D. Choi, Nokia; D. Kelly, Peregrine
Semiconductor
2:20 PM
WE3D-4: Large-signal Stability Analysis of
Microwave Amplifiers under Complex
Modulated Signals with Time-varying
Envelope
A. Collado, A. Suarez, University of Cantabria;
J.M. Collantes, University of the Basque
Country
WE3A-4: A Single Chip SiGe BiCMOS
Transceiver and SiGe Power Amplifier for
5.8 GHz WDCT Applications
R. Reimann, G. Krimmer, W. Bischof, S.
Gerlach, Atmel Germany GmbH
WE3B-4: Modeling of the Dielectric Charging
Kinetic for Capacitive RF-MEMS
S. Melle, D. De Conto, L. Mazenq, D. Dubuc,
K. Grenier, L. Bary, R. Plana, LAAS-CNRS; O.
Vendier, J. Muraro, J. Cazaux, Alcatel Space
WE3C-5: New MMIC Approach for Low Noise
High Order Active Filters
L. Darcel, P. Dueme, R. Funck, Thales
Airborne Systems; G. Alquie, University of
Pierre et Marie Curie
WE3D-5: Circuit-level
Nonlinear/Electromagnetic Co-simulation of
an Entire Microwave Link
V. Rizzoli, A. Costanzo, D. Masotti, P. Spadoni,
University of Bologna
WE3C-6: Active Impedance Profil Technique
for Selective Tunable Active Filter with Gain
S. Dardillac, L. Billonnet, B. Jarry, IRCOM
WE3D-6: Inferring Nonlinear Distortion
Performance of Power Amplifiers Subject to
Telecommunications Signals from Two Tone
Measurements
J.C. Pedro, N.B. Carvalho, Universidade de
Aveiro
WE3B-5: On the Dielectric Polarization
Effects in Capacitive RF-MEMS Switches
G. Papaioannou, M. Exarchos, V. Theonas,
The University of Athens; G. Wang, J.
Papapolymerou, Georgia Institute of
Technology
2:40 PM
2:30 PM
WE3D Advances in Nonlinear
Simulation Techniques
Chair: A. Suarez
Co-chair: V. Rizzoli
LBCC 201B
WE3D-2: Simulation of Nonlinear RF
Circuits Driven By Multi-carrier Modulated
Signals
N.B. Carvalho, J.C. Pedro, Universidade de
Aveiro; W. Jang, M.B. Steer, North Carolina
State University
WE3A-3: Bandpass Pulse-width Modulation
(BP-PWM)
S. Rosnell, J. Varis, Nokia
2:50 PM
1:20–3:00 PM
WE3C-2: Novel Tunable Lowpass Filters
Using Folded Slots Etched in the Ground
Plane
R. Zhang, R.R. Mansour, University of
Waterloo
1:30 PM
1:20 PM
WE3A Advances in Wireless
Subsystem Technologies
Chair: J. Lin
Co-chair: O. Boric-Lubecke
LBCC 101
WE3A-5: A Highly Integrated Dual Band
Receiver IC for DAB
Y.H. Chen, S.F. Chen, C.F. Lee, K.C. Juang,
Y.L. Yu, T.Y. Yang, Industrial Technology
Research Institute
WE3B-6: Wide-band Low-loss MEMS
Packaging Technology
J.B. Muldavin, C. Bozler, S. Rabe, C. Keast,
MIT Lincoln Lab
40
WE3F Advanced Packaging Materials
and Applications I
Chair: B. Kopp
Co-chair: K. Goverdhanam
LBCC 203
WE3G Analysis and Applications of
Low Noise Oscillating System Arrays
Focused Session
Chair: V. Krozer
Co-chair: J. Roychowdhury
LBCC 204
WE3E-1: A 28 V Over 300 W GaAs
Heterojunction FET with Dual Fieldmodulating Plates for W-CDMA Base
Stations
K. Ishikura, I. Takenaka, H. Takahashi, M.
Kanamori, K. Hasegawa, K. Asano, NEC
Compound Semiconductor Devices Ltd.
WE3F-1: Noise Reduction and Design
Methodology in Mixed Signal Systems with
Alternating Impedance Electromagnetic
Bandgap (AI-EBG) Structure
J. Choi, V. Govind, R. Mandrekar, M.
Swaminathan, Georgia Inst. of Tech.; S.
Janagama, State Univ. of NY at Stony Brook
WE3G-1: Invited: Fast and Accurate
Simulation of Coupled Oscillators Using
Nonlinear Phase Macromodels
X. Lai, J. Roychowdhury, Dept. of Electrical
and Computer Engineering
WE3E-2: Distributed Effects in High Power
RF LDMOS Transistors
K. Goverdhanam, W. Dai, M. Frei, D. Farrell,
J. Bude, H. Safar, M. Mastrapasqua, T.
Bambridge, Agere Systems
WE3F-2: Broadband Dual-Via Architectures
for Multilayer PCB Signal Injection and
Intra-layer Transition
C. Metz, A. Lyons, Bell Laboratories-Lucent
Technologies; T. Baras, TU Hamburg-Harburg
WE3G-2: Invited: Oscillator Dynamics
M. Odyniec, Odyniec Consulting
WE3E-3: A High Power Density TaN/Au Tgate pHEMT with High Humidity Resistance
for Ka-band Applications
H. Amasuga, S. Goto, T. Shiga, M. Totsuka, T.
Kunii, T. Oku, T. Ishikawa, Y. Matsuda,
Mitsubishi Electric Corp.
WE3F-3: RF Characteristics of Thin Film
Liquid Crystal Polymer (LCP) Packages for
RF MEMS and MMIC Integration
D. Thompson, N. Kingsley, G. Wang, M.M.
Tentzeris, J. Papapolymerou, Georgia
WE3G-3: Invited: Phase Noise and Phase
Accuracy in Multiphase LC Oscillators
C. Samori, DEI-Dipartimento di Elettronica e
Informazione, University of Milano
2:30 PM
2:40 PM
2:50 PM
WE3G-4: Invited: Trade-off Between Phasenoise and Signal Quadrature in
Unilaterally Coupled Oscillators
T. Djurhuus, V. Krozer, J. Vidkjær, T.K.
Johansen, Technical University of Denmark,
Oersted-DTU Dept., Electromagnetic Systems
WE3F-4: Magnetically Aligned Anisotropic
Conductive Adhesive for High Frequency
Interconnects
Y. Huang, X. Gong, W.J. Chappell, Purdue
University; T. Bruemmer, S.K. Khanna,
Nexaura Systems, LLC
WE3E-5: Power and Spectral Regrowth
Performance of 10 W and 16 W Ka-band
Power Amps with Single-chip Output Stages
M.P. DeLisio, B.C. Deckman, C. Cheung, S.C.
Martin, C.J. Rollison, J.J. Rosenberg,
Wavestream Corp.; J. Eisenberg, G. Smith,
Xicom Technology
WE3E-6: W-band Metamorphic HEMT with
267 mW Output Power
K.J. Herrick, K.W. Brown, F.A. Rose, C.S.
Whelan, J. Kotce, J.R. Laroche, Y. Zhang,
Raytheon
WE3G-5: Invited: Harmonic-balance
Techniques for the Design of Coupledoscillator Systems in Both Unforced and
Injection-locked Operation
A. Suárez, A. Collado, F. Ramírez,
Communications Engineering Dept.,
University of Cantabria
WE3F-5: Variable Dielectric Constants by
Structured Porosity for Passive Ceramic
Components
W. She, W.J. Chappell, Purdue University; Z.N.
Wing, J.W. Halloran, Univeristy of Michigan
WE3G-6: Invited: Low Phase Noise Oscillator
Modeling in a System Environment
R. Quéré, J.C. Nallatamby, A. Layec, M.
Prigent, IRCOM-CNRS University of Limoges
41
WEDNESDAY
WE3E-4: A Broadband Power Amplifier
Design Based on the Extended Resonance
Power Combining Technique
X. Jiang, A. Mortazawi, Rad Lab
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
WE3E Advanced Technologies for
Power Amplifiers
Chair: C. Weitzel
Co-chair: P. Asbeck
LBCC 202
3:30–5:10 PM
WE4B MEMS Component Technology
Chair: J. Hayden
Co-chair: B. Lakshminarayanan
LBCC 102
WE4C Planar Dual Mode Filters
Chair: V.E. Boria
LBCC 103AB
WE4A-1: Invited: Carbon Nanotube Devices
for GHz to THz Applications
P.J. Burke, University of California, Irvine
WE4B-1: 6-15 GHz RF MEMS Tunable Filters
B.W. Pillans, A. Malczewski, R. Allison, J.
Brank, Raytheon
WE4C-1: New Triangular Microstrip Lopp
Resonators For Bandpass Dual-mode Filter
Applications
R. Wu, S. Amari, Royal Military College of
Canada
WE4D-1: RF Power Amplifier Behavioral
Modeling Using Volterra Expansion with
Laguerre Functions
A. Zhu, T.J. Brazil, University College Dublin
WE4A-2: Invited: Diamond for High Power
Electronics
E. Kohn, A. Denisenko, University of Ulm
WE4B-2: W-band RF MEMS Double and
Triple-stub Impedance Tuners
G. Rebeiz, University of Michigan; T. VahaHeikkila, J. Varis, J. Tuovinen, MilliLab, VTT
Information Technology
WE4C-2: Microstrip Dual-mode Band Reject
Filter
J. Hong, Heriot-Watt University
WE4D-2: Detailed Analysis of IMD in an
LDMOS RF Power Amplifier
J.P. Aikio, T.E. Rahkonen, University of Oulu
WE4A-3: Invited: MEMS for Future
Microwaves Systems
H.J. De Los Santos, NanoMEMS Research; S.
Rassoulian, J. Maciel, Radant MEMS
WE4B-3: A Novel MEMS Impedance Tuner
Simultaneously Optimized for Maximum
Impedance Range and Power Handling
Y. Lu, The University of Michigan; L.P. Katehi,
D. Peroulis, Purdue University
WE4C-3: Planar Asymmetric Dual-mode
Filters Based on Substrate Integrated
waveguide (SIW)
X. Chen, Z. Hao, W. Hong, T. Cui, State Key
Lab of Millimeter-waves, Southeast University
WE4D-3: New Method for Phase
Characterization of Nonlinear Distortion
Products
J.C. Pedro, J.P. Martins, P.M. Cabral,
Universidade de Aveiro
WE4A-4: Invited: Directly Modulated
Photonic Devices for Microwave
Applications
R.V. Penty, I.H. White, P. Hartmann, J.D.
Ingham, X. Qian; Cambridge University
WE4B-4: A Single-pole 6 Throw (SP6T)
Antenna Switch Using Metal Contact RF
MEMS Switches for Multi-band Applications
J. Lee, C. Je, S. Kang, C. Choi, Electronics and
Telecommunictions Research Institute
(ETRI)
WE4C-4: LTCC Technology for 40 GHz
Bandpass Waveguide Filter
R. Valois, D. Baillargeat, S. Verdeyme,
IRCOM; M. Lahti, T. Jaakola, VTT Electronics
WE4D-4: Behavioral Modeling of RF and
Microwave Circuit Blocs for Hierarchical
Simulation of Modern Transceivers
A. Soury, E. Ngoya, J. Rousset, IRCOM University of Limoges
WE4A-5: Invited: Circuit and System Design
for Future Microwave Systems
L.E. Larson, UC San Diego
WE4B-5: Multi-port RF MEMS Waveguide
Switch
M. Daneshmand, R.R. Mansour, University of
Waterloo
WE4C-5: Two Simple Implementations of
Transversal Filters with Coupling Between
Non-resonant Nodes
D. Caoete-Rebenaque, F. Quesada-Pereria,
J.G. Tornero, J.P. Garcia, A.A. Melcon,
Technical University Cartagena
WE4D-5: A New PA Behavioral Model Based
on the Linearization of Multivariable
Nonlinearities and Interpolation
Y. Shen, J. Tauritz, University of Twente
WE4D Nonlinear Behavioral
Modeling of Microwave Circuits and
Systems
Chair: K. Remley
Co-chair: P. Draxler
LBCC 201B
5:00 PM
4:50 PM
4:40 PM
4:30 PM
4:20 PM
4:10 PM
4:00 PM
3:50 PM
3:40 PM
3:30 PM
WE4A Future Technologies for
Microwave/Millimeter-wave
Applications
Special Session
Chair: J. Horton • Co-Chair: T. Lee
LBCC 101
42
WE4F Advanced Packaging and
Materials II
Chair: W. Heinrich
Co-chair: R.F. Drayton
LBCC 203
WE4G Low Noise Devices and MMICs
Chair: J. Whelehan
Co-chair: F. Danneville
LBCC 204
WE4E-1: Synthesis of a Compound Tjunction for a Two Way Splitter with
Arbitrary Power Ratio
S. Yang, A.E. Fathy, University of Tennessee
WE4F-1: W-band Flip-chip VCO in Thin-film
Environment
F.J. Schmõckle, F. Lenk, M. Hutter, M. Klein,
M. Tõpper, K. Riepe, W. Heinrich, FerdinandBraun-Institut (FBH); H. Oppermann, G.
Engelmann, Fraunhofer IZM, United
Monolithic Semicon GmbH
WE4G-1: An Ultra-low Power InAs/AlSb
HEMT W-band Low Noise Amplifier
J. Hacker, J. Bergman, G. Nagy, G. Sullivan, B.
Brar, Rockwell Scientific Co.; C. Kadow, H.
Lin, A. Gossard, M. Rodwell, University of
California, Santa Barbara
WE4E-2: A Broadband Surface
Micromachined 15-45 GHz Microstrip
Coupler
B. Pan, Y. Yoon, Y. Zhao, J. Papapolymerou,
M.M. Tentzeris, M. Allen, Georgia Institute of
Technology
WE4F-2: The Flip-chip Mounted MMIC
Technology Using the Modified MCM-D
Substrate for Compact and Low Cost W-band
Transceiver
S. Song, S. Kim, S. Yeon, S. Park, J. Lee, S.
Lee, W. Choi, Y. Kwon, K. Seo, Seoul National
University
WE4G-2: A Lattice Matched InP Chip Set for
a Ka-Band Radiometer
D. Kettle, N. Roddis, University of
Manchester; R. Sloan, University of
Manchester
WE4E-3: A Novel 20 to 40 GHz Monolithic
Passive Differential Coupler for MMICs
Applications
K.W. Hamed, A.P. Freundorfer, Queen’s
University; Y.M. Antar, Royal Military College
of Canada
WE4F-3: Monolithic LTCC SiP Transmitter
for 60GHz Wireless Communication
Terminals
Y. Lee, W. Chang, C. Park, Information and
Communications University (ICU)
WE4G-3: Ka-band (35 GHz) 3-stage SiGe HBT
Low Noise Amplifier
P.J. Riemer, B.R. Buhrow, J.D. Coker, B.A.
Randall, R.W. Techentin, B.K. Gilbert, E.S.
Daniel, Mayo Clinic
WE4E-4: Design of a Compact Broadband
Branch-line Hybrid
Y. Chun, J. Hong, Heriot-Watt University
WE4F-4: An X-band System-in-package
Active Antenna Module
N. Khandelwal, R.W. Jackson, University of
Massachusetts
WE4G-4: A Very Low Power SiGe LNA for
UWB Application
Y. Park, C. Lee, J.D. Cressler, J. Laskar,
Georgia Electronic Design Center; A. Joseph,
IBM Microelectronics
WE4E-5: A Novel N-port Series Divider Using
Infinite Wavelength Phenomena
A. Lai, K.M. Leong, T. Itoh, University of
WE4F-5: An Improved Packaging Technology
for RF Power Transistors
S. McCarthy, P. Smith, J.L. Walker, Semelab
plc
WE4G-5: The Extraction and Modeling of
Intrinsic RF Noise Sources in 0.13 µm
nMOSFETs
S. Venkataraman, B. Banerjee, C. Lee, J. D.
Cressler, J. Laskar, J. Papapolymerou,
Georgia Institute of Technology; A.J. Joseph,
S.L. Sweeney, IBM Microelectronics
5:00 PM
4:50 PM
4:40 PM
4:30 PM
43
WEDNESDAY
4:20 PM
4:10 PM
4:00 PM
3:50 PM
3:40 PM
3:30 PM
WE4E Couplers, Hybrids and
Splitters
Chair: A. Fathy
Co-chair: M.D. Abouzahra
LBCC 202
WEDNESDAY, JUNE 15, 2005 • WEIF INTERACTIVE FORUM • 1:30–4:30 PM
WEDNESDAY
CHAIR: H.J. DE LOS SANTOS, NANOMEMS RESEARCH • CO-CHAIR: R.L. EISENHART, EISENHART & ASSOCIATES • LBCC GRAND BALLROOM
WEPA-1: A Frequency-differential Representation of Losses to Express Quality Factor in Terms of
Reactance-slope Parameters for Three-dimensional, Arbitrarily-shaped Resonators
B.E. Spielman, Washington University in St. Louis
WEPA-2: Multipactor Breakdown Prediction in Rectangular Waveguide-based Components
C. Vicente, B. Mottet, H.L. Hartnagel, Tech. Univ. Darmstadt; M. Mattes, J. Mosig, Ecole Polytech
Federale; D. Wolk, D. Raboso, Tesat-Spacecom, Payload Sys. Div.
WEPA-3: Waveguide Dielectric Phase Shifter with Fast Piezoelectric Control
V. Kazmirenko, Y. Poplavko, National Technical University of Ukraine; M. Jeong, S. Baik, Pohang
University of Science and Technology
WEPA-4: Realization Concepts for Compact Microstrip Antennas with Periodically Loaded Lines
M. Scheáler, C. Damm, J. Freese, R. Jakoby, TU Darmstadt
WEPA-5: Accurate Modal Representation of Arbitrarily Shaped Multiconductor Transmission
Lines Enclosed in Homogeneous Waveguides
E. Tarõn-Tarõn, P. Soto-Pacheco, V.E. Boria-Esbert, Universidad Politecnica de Valencia
WEPA-6: Analysis of Truncated 2D periodic structures
A.N. Deleniv, Chalmers University of Technology
WEPA-7: High-Q Dielectric Resonator with Operated Slit (Tunability, Thermal Stability, Film
Measurements)
A. Eremenko, D. Shmigin, V. Pashkov, V. Molchanov, Y. Poplavko, Nat’l Tech. Univ. of Ukraine
WEPA-8: Photonic Crystal Non-radiative Dielectric Waveguide
S. Tse, P.R. Young, University of Kent
WEPA-9: Method of Discrete Singularities in the Accurate Modeling of a Reflector Beam Waveguide
A.A. Nosich, Y.V. Gandel, Kharkov National University
WEPA-10: Characterization of Stripline Circuit by Planar Circuit/Equivalent Network and
Demonstration of its Validity by 1D, 2D and 3D Analysis for Practical Structures
J. Hsu, T. Hiraoka, Kanagawa University; T. Ogawa, MEL Inc.
WEPB-1: A Congruent Compact Cell Approach for Global EM Analysis of Multi-scale Integrated
Circuits
S. Wane, H. Baudrand, Enseeiht; D. Bajon, Supaero
WEPB-2: Solution of Homogeneous Electromagnetic Problems via the Tracking of the Matrix
Eigenvalues: Application to the Analysis of NRD Components
M. Bozzi, S. Germani, L. Perregrini, University of Pavia; D. Li, K. Wu, Ecole Polytechnique de
Montreal
WEPC-1: Analysis of Distributed Multi-finger High-power Transistors Using the FDTD Method
G.F. Formicone, W. Burger, B. Pryor, Freescale Semiconductors
WEPC-2: Circuit Modeling of Resonant Modes in MMIC Packages Using Time Domain Methods
B. Neuhaus, A. Beyer, University Duisburg-Essen, Campus Duisburg; T. Bolz, IMST GmbH
WEPC-3: Analysis of Multiconductor Transmission Lines with Frequency-dependent Parameters
and Incident Electromagnetic Fields
G.S. Shinh, N. Nakhla, R. Achar, M. Nakhla, I. Erdin, Carleton University
WEPC-4: Time-domain Techniques for Computation and Reconstruction of One-dimensional
Profiles
M. Rahman, R. Marklein, University of Kassel
WEPC-5: High Throughput Transmission Line Matrix (TLM) System in Grid Environment for
Microwave Design, Analysis and Optimizations
P. Lorenz, J.V. Vital, B. Biscontini, P. Russer, Technical University Munich
WEPC-6: The Complex Envelope (CE) ADI-FDTD Method
C. Ma, Z.D. Chen, Dalhousie University
WEPC-7: Haar-MRTD Time and Space Adaptive Grid Techniques for Practical RF Structures
N. Bushyager, M.M. Tentzeris, The Georgia Institute of Technology
WEPD-1: A Space Mapping Method Allowing Models with Different Parameter Rank and
Physical Meanings for Coarse and Fine Model
H. Bilzer, F. Frank, W. Menzel, University of Ulm
WEPD-2: Restoration of Passivity in S-parameter Data of Microwave Measurements
D. Saraswat, R. Achar, M. Nakhla, Carleton University
WEPD-3: Modular Configuration Rprop/SF-ANN for Microwave Waveguide on EBG Structures
Modeling
E.Q. Fernandes, UERN; P.F. Silva, CEFET-JP; M.B. Melo, UFCG; A.G. D’Assuncao, UFRN-CT-Dee
WEPE-1: Implementable Space Mapping Approach to Enhancement of Microwave Device Models
J.W. Bandler, Q.S. Cheng, S. Koziel, McMaster University
WEPE-2: Empirical Model Generation Techniques for Planar Microwave Components Using
Electromagnetic Linear Regression Models
J. Hinojosa, G. Domenech, J. Martõnez, J. Garrigõs, Universidad Politecnica de Cartagena
WEPF-1: New interpolation and Smoothing Techniques for Nonlinear Models
R. Follmann, D. Koether, I. Wolff, IMST GmbH
WEPF-2: An Electro-thermal HBV Model
M. Ingvarson, J. Vukusic, A. Olsen, A. Emadi, J. Stake, Chalmers University of Technology
WEPF-3: Large-signal PHEMT Switch Model which Accurately Predicts Harmonics and Two Tone
Intermodulation Distortion
C. Wei, A. Klimashov, Y. Zhu, E. Lawrence, G. Tkachenko, C. Zhang, Skyworks Solution Inc.
WEPF-4: A General Procedure for Extraction of Bias Dependent Dynamic Self Heating Model
Parameters
K. Andersson, C. Fager, Chalmers University of Technology; J.C. Pedro, Instituto de
Telecomunicaqes,
WEPF-5: A Verilog-based Temperature-dependent BSIM4 Model for RF Power LD-MOSFETs
M.N. Marbell, J. Hwang, Lehigh University; W. Dai, M. Frei, A. Shibib, Agere Systems
WEPF-6: Large Signal HBT Model with Measurement-based Charge Formulations
S. Cheon, J. Lim, D. Park, Knowledge*on Semiconductor Inc.; J. Park, Matsushita Electric
Industrial Co. Ltd.
WEPG-1: Ultra Low Noise Low Cost Ultra Wideband N-Push VCO
U.L. Rohde, A.K. Poddar, Synergy Microwave Corp.
WEPG-2: A Ka-band Direct Oscillation HBT VCO MMIC with Parallel Negative Resistor Circuit
K. Choumei, T. Matsuzuka, S. Suzuki, N. Ogawa, M. Komaru, Y. Matsuda, S. Hamano, K.
Kawakami, Mitsubishi Electric Corp.
WEPG-3: High Temperature Performance of a SiC MESFET Based Oscillator
Z.D. Schwartz, Analex Corp. at NASA Glenn Research Center; G.E. Ponchak, NASA Glenn
Research Center
WEPG-4: Spurious Suppression Scheme by Phase Difference Control For Delta-Sigma FractionalN PLL Synthesizer with Analog PD
K. Tajima, R. Hayashi, T. Takagi, Mitsubishi Electric Corp.
WEPG-5: Linear Analysis of Ring-type Coupled ILO Array
C. Hsiao, T. Chu, National Taiwan University
WEPG-6: On Orbit Programmable Frequency Generation System for JCSAT 9 Spacecraft
L. Dayaratna, L.G. Ramos, M. Hirokawa, S. Valenti, Lockheed Martin Commercial Space
WEPG-7: Power Efficient RF Pulse Compression Through Switched Resonators
S. Kim, X. Xu, Y.E. Wang, University of California, Los Angeles
WEPH-1: Compact Colinear End-launcher for Rectangular Waveguides
M. Simeoni, C. Coman, I.E. Lager, Delft University of Technology
WEPH-2: Novel Integrated Coaxial Line to Cylindrical Waveguide Directive Couplers in Pipelines
for Process Monitoring Applications
A. Penirschke, J. Freese, R. Jakoby, Technische Universitaet Darmstadt; B. Allenberg, J. Biebel,
Schenck Process GmbH
WEPI-1: A New Planar Marchand Balun
Z. Zhang, Y. Guo, L. Ong, M. Chia, Institute for Infocomm Research, Singapore
WEPI-2: Miniaturization and Harmonic Suppression of Branch-line and Rat-race Hybrid
Coupler Using Compensated Spiral Compact Microstrip Resonant Cell
J. Gu, C. Wang, X. Sun, Shanghai Institute of Microsystem & Information Technology of Chinese
Academy of Science
WEPI-3: Design of Dual-band Waveguide Transformers
U. Rosenberg, Marconi Communications GmbH; J. Bornemann, University of Victoria; S. Amari,
Royal Military College of Canada
WEPI-4: Ridge Waveguide Branch-line Directional Couplers for Wideband Applications and
LTCC Technology
J.A. Ruiz-Cruz, J.M. Rebollar, Universidad Politecnica de Madrid; Y. Zhang, K.A. Zaki, University
of Maryland; A.J. Piloto, Kyocera America
WEPI-5: Matched Symmetrical Six-port Microstrip Coupler
Y. Chen, S.P. Yeo, National University of Singapore
WEPI-6: Compact Top-wall Hybrid/Coupler Design for Extreme Broad Bandwidth Applications
R. Beyer, Mician GmbH; U. Rosenberg, Marconi Communications GmbH
WEPI-7: Design of Novel Attenuator Structure with Quad Spiral Shaped Defected Ground Structure
Y. Jeong, D. Ahn, Soonchunhyang University
WEPI-8: Size Reduction of Coupled-microstrip 3 dB Forward Couplers by Loading with Periodic
Shunt Capacitive Stubs
T. Fujii, I. Ohta, University of Hyogo
WEPI-9: A Novel Design of High Directivity CPW Directional Coupler Design by Using DGS
D. Kim, Y. Jeong, J. Kang, J. Kim, D. Ahn, Soonchunhyang University; C. Kim, RRC for Wireless
Communication Devices
WEPI-10: Dev. of a Low-loss Multilayered Broadband Balun Using Twin-thickness Thin-film
A.C. Chen, A.H. Pham, University of California; R.E. Leoni, Raytheon Co.
WEPI-11: Design of Broadband Semi-lumped and Lumped Element Quadrature Hybrids
J. Yamasaki, I. Ohta, T. Kawai, Y. Kokubo, University of Hyogo
WEPJ-1: Folded-waveguide Resonator Filters
J. Hong, Heriot-Watt University
WEPJ-2: Modular Design of Dual-mode Filters Using Elliptic Cavities
S. Amari, Royal Military College of Canada; U. Rosenberg, Marconi Communications, GmbH
WEPJ-3: Waveguide Filters with Ridged and Unequal Width Resonators
N. Yildirim, A. Hizal, Middle East Technical University
WEPJ-4: An Efficient Optimization Design of a Manifold Multiplexer Using an Accurate
Equivalent Circuit Model of Coupling Irises of Channel Filters
M. Uhm, J. Lee, J. Park, ETRI; J. Kim, Chung-Ang Univ.
WEPK-2: A 20 GHz MOD-made BST Thin Film Tunable Phase Shifter for Phase Adjustment of
Digital 360° PHEMT Phase Shifter
M. Noda, D. Popovici, M. Okuyama, Osaka Univ.; Y. Sasaki, M. Komaru, Mitsubishi Elect.Corp.
WEPK-3: Thickness Dependences on Microwave Tunable Properties for (Ba,Sr)TiO3 Thin Films
in Planar Capacitor Structure.
K. Kageyama, A. Sakurai, A. Ando, Y. Sakabe, Murata Manufacturing Co., Ltd.
WEPK-4: Wide Piezoelectric Tuning of LTCC Bandpass Filters
M. Al-Ahmad, R. Maenner, R. Matz, Siemens AG; P. Russer, Technische Universitaet Muenchen
WEPK-5: Electrically Tunable and Temperature Compensated FBAR
W. Pang, H. Yu, H. Zhang, E. Kim, University of Southern California
WEPL-1: Accurate In-situ Monitoring of Q-factor and BER Using Adaptive Sampling in a 10 Gb/s
CMOS Optical Receiver IC
Y. Chang, S. Killmeyer, B. Gomatam, Vitesse Semiconductor Corp.
WEPL-2: A 1 GHz Continuous-Time Sigma-Delta A/D Converter in 90 nm Standard CMOS
R. Schoofs, M. Steyaert, W. Sansen, Katholieke Universiteit Leuven
WEPL-3: Design Rules for Mode Conversion Reduction in High-speed On-chip Interconnects
Y. Quere, T. Le Gouguec, P. Martin, D. Le Berre, F. Huret, Laboratoire d’Electronique et Systemes
de Telecommunications UMR
WEPM-1: A 50 W LDMOS Current Mode 1800 MHz Class-D Power Amplifier
J. Kim, S. Stapleton, D. Han, J. Kim, Kwangwoon University
WEPO-1: A Novel Process-controlled-monitor Structure Suitable for RF CMOS Characterization
C. Chiu, G. Huang, D. Chiu, K. Chen, M. Cho, S. Wang, National Nano Device Labs
WEPO-2: A Novel Multiresolution High-dynamic Ultra-broadband Time-domain EMI
Measurement System
S. M. Braun, A. Alt, P. Russer, Technische Universitet Menchen
WEPO-3: Unified Parasitic De-Embedding Methodology of On-wafer Multi-port Device Characterization
M. Cho, G. Huang, C. Chiu, K. Chen, National Nano Device Labs
WEPO-4: Active Harmonic Load-pull for Charachterizing Highly Mismatched High Power
Transistors
Z. E. Aboush, J. Lees, J. Benedikt, P. Tasker, Cardiff University
WEPO-5: A Signal Model to Extract Intrinsic Parameters of High-Q Dielectric Resonators from
Noisy Measurements
K. Naishadham, J.E. Piou, MIT Lincoln Lab
WEPP-1: Application of the Multiplicative Regularized Contrast Source Inversion Method to Real
Biological Data
A. Abubakar, Schlumberger-Doll Research; S.Y. Semenov, V.G. Posukh, Carolinas Medical Center;
P.M. van den Berg, Delft University of Technology
WEPP-2: The Scaled SAM Models and SAR for Handset exposure at 835 MHz
A. Lee, H. Choi, J. Choi, Elec. and Telecom.Research Institute; J. Pack, Chungnam Nat’l Univ.
WEPP-3: Influence of the Ear’s Morphology on Specific Absorption Rate (SAR) Induced in a Child
Head Using Two Source Models.
A. Hadjem, C. Dale, M. Wong, J. Wiart, France Telecom; D. Lautru, V. Fouad Hanna, Univ. Pierre
& Marie Curie; N. Gadi, I. Bloch, Ecole Nationale Superieure des Telecommunications
WEPQ-1: Detection of Moving Targets by Ground Bistatic Radar
G.A. Andreyev, Institute of Radio Engineering and Electronics; A.V. Zhuravlev, Moscow Institute
of Physics and Technology
WEPQ-2: Radar Imaging Using Noncoherent Sensors
F.B. Helmbrecht, E.M. Biebl, TU Muenchen
WEPQ-3: Robust Passive Shaping Network for Impulse Radio and UWB Signal Generator
A. Mollfulleda, J. Mateu, CTTC; P. Miskovsky, UPC
44
PANEL SESSIONS
PMA: CMOS PAS STEP ON THE GAAS!
Location:
Long Beach Convention Ctr., Grand Ballroom 1
Organizers:
Fazal Ali, Nokia
Mike Golio, RF Power Devices
Panel:
Sponsor:
PTUB: OUTSOURCING – THE IMPACT ON THE
MICROWAVE INDUSTRY
Date & Time: Tuesday, June 14, 12:00 PM–1:20 PM
Location:
Organizer and Moderator:
Ferdo Ivanek, Stanford University
Julio Costa, RFMD
Pete Zampardi, Skyworks
Ali Hajimari, Axiom/Caltech
Shankar Krishnamurty, VT Silicon
Research and development of RF/microwave power amplifiers
based on CMOS technology has been ongoing for the last
decade. In the past year, some CMOS based mobile phone product offerings have been demonstrated. Could this represent the
beginning of the end for GaAs HBT and Si BJT technologies... or
are CMOS PAs ultimately destined for the ash heap? Although
the physical limitations of CMOS devices ensure that the incumbent (GaAs HBT and Silicon BJT) technologies will always be
preferred for the mobile phone’s power amplifier from a pure
performance perspective, can the CMOS PAs offer other compelling advantages? The experts on our panel will discuss the
performance (RF, thermal, robustness), process technology,
cost, and maturity (levels of integration and packaging) related
to CMOS power amplifier design and deployment. The panelists
will also debate the specific future of GaAs HBT and CMOS power amplifiers for handset applications.
Manfred Schindler, RF Micro Devices
Boston Design Center
Lamberto Raffaelli, LNX Corporation
Gabriele Marzocchi, Multiservices
Madhukar Pitke, AXES Technologies
Sponsors:
MTT-19, Microwave Technology Business Issues
IMS 2005
Outsourcing was one of several subjects covered in the IMS
2004 Panel Session, “There’s no Business Like Microwave Business!” (PWA), but this subject dominated the discussion. The
demonstrated level of interest stimulated organizing a follow-up
panel session focused on the impact of outsourcing on the microwave industry worldwide. Panelists from the USA, Europe
and Asia will address the subject from their different viewpoints.
PTUC: RF/MICROWAVE/MILLIMETER-WAVE APPLICATIONS
OF METAMATERIALS
PTUA: 3G HANDSETS – TOO MUCH POWER IN YOUR HANDS?
Hyatt Regency, Regency A/B/C
Organizer:
Derek Shaeffer, Aspendos Communications
Panel:
Aarno Parssinen, Nokia
Bill Krenik, Texas Instruments
Kamal Sahota, Qualcomm
Larry Larson, UCSD
Bernd Adler, Infineon
Kevin Traylor, Freescale
Tirdad Sowlati, Skyworks Solutions
Sponsors:
Panel:
RFIC Symposium
Location:
Hyatt Regency, Regency D/E
RFIC Symposium
IMS 2005
They’re hot — literally. Third-generation cellular handsets still
have a huge power problem compared to their more mature 2G
counterparts. Closing the power gap is a significant problem and
the focus of much industry effort. And, the multi-mode transceiver issues aren’t getting any easier, now that we can expect to
see any number of ‘alternative’ wireless interfaces popping up in
cell phones in the future, many of which already have bandwidths far exceeding those of the current cellular standards.
How will the power gap be closed in these advanced phones?
What architectures can deliver the needed power reduction
while solving the multi-mode problem? Will these be extensions
of existing approaches, which have been highly optimized for 2G
applications, or are we in for something entirely new? And, what
technologies will be required to make this happen? Will we ever
see the day when a single transceiver can handle these numerous standards?
Location:
Hyatt Regency, Beacon B
Organizers:
Barry E. Spielman,
Washington University in St. Louis
Wolfgang J.R. Hoefer, University of Victoria
Sponsors:
Integrated Circuits
MTT-13, Microwave Ferrites and Ferroelectrics
MTT-15, Microwave Field Theory
IMS 2005
Moderator:
Christophe Caloz,
Ecole Polytechnique de Montreal
Panel:
Arthur Oliner, Polytechnic University
Tatsuo Itoh, UCLA
Sheldon Schultz, UCSD
George Eleftheriades, University of Toronto
Nader Engheta, University of Pennsylvania
Richard Ziolkowski, University of Arizona
This panel session will provide a forum to identify important
applications of metamaterials that exploit left-handed (backward) wave propagation (or alternatively, doubly-negative materials or materials with negative-refractive index). Such applications might include, but are not limited to directional couplers,
filters, and antennas. The panelists will be asked to provide their
vision of the applications that this field is most likely to impact.
[Continued on page 55]
45
TH1A-1: High Power GaN Oscillators Using
Field-plated HEMT Structure
H. Xu, C. Sanabria, S. Heikman, S. Keller, U.K.
Mishra, R.A. York, University of California at
Santa Barbara
TH1B-1: A V-band Eight-way Combined
Solid-state Power Amplifier with 12.8 W
Output Power
K. Ngo-Wah, J. Goel, Y. Chou, R. Grundbacher,
R. Lai, G. Nassour, E. Divish, G. Schreyer, K.
Whitney, A. Oki, Northrop Grumman Space
Technology
TH1C-1: DC-to-135 GHz SPST and 15-to-135
GHz SPDT Traveling Wave Switches Using
FET-integrated CPW Line Structure
Z. Tsai, M. Yeh, M. Lei, H. Chang, C. Lin, H.
Wang, National Taiwan University
TH1D-1: Verification of p-equivalent Circuitbased Microwave Noise Model on AIIIBV
HBTs with Emphasis on HICUM
J. Herricht, P. Sakalas, M. Schrõter, Y.
Zimmermann, TU Dresden; P. Zampardi,
Skyworks Solutions; F. Korndõrfer, IHP; A.
Simukovic, Spi
TH1B-2: A Highly Efficiency and Linear
Integrated PA for Ka-/Q-bands
A. Katz, The College of New Jersey; R. Gray,
Linearizer Technology Inc.; J. Matsuoka, NEC
Microwave Tube Ltd.
TH1C-2: Low-loss Quasi-optical Filters with
Thick Silicon Substrates for Sub-mm Wave
Frequency Multipliers
S. Biber, O. Guenther, L.P. Schmidt,
University of Erlangen-Nuremberg; M. Bozzi,
L. Perregrini, University of Pavia
TH1D-2: A New Parameter Extraction
Method for GaN-based HEMT Small Signal
Model
8:30 AM
TH1A-3: Reconfigurable MEMS-enabled LCtank for Multi-band CMOS Oscillator
R. Gaddi, A. Gnudi, E. Franchi, D. Guermandi,
P. Tortori, University of Bologna; B. Margesin,
F. Giacomozzi, ITC-IRST
TH1D-3: Delay-Extraction Based Sensitivity
Analysis of Multiconductor Transmission
Lines with Nonlinear Terminations
N.M. Nakhla, M.S. Nakhla, R. Achar, Carleton
University; A. Dounavis, University of Western
Ontario
TH1B-3: X-band, 17 W, Solid State Power
Amplifier for Space Applications
W.R. Boger, R.G. Honda, D.H. Burgess, C.R.
Nuckolls, General Dynamics
8:40 AM
8:50 AM
TH1D Linear Modeling of Active and
Passive Structures
Chair: B. Jackson
Co-chair: A. Weisshaar
LBCC 201B
TH1A-2: Active-Inductor-based Low-power
Broadband Harmonic VCO in SiGe
Technology for Wideband and Multistandard Applications
R. Mukhopadhyay, Y. Park, S. Yoon, C. Lee,
J.D. Cressler, J. Laskar, Georgia Electronic
Design Center; S. Nuttinck, Philips Res. Labs
TH1C-3: Opto Controlled Substrate Losses in
a Coplanar Waveguide on HR-Si
G. Poesen, G. Koers, J. Stiens, R. Vounckx,
Vrije Universiteit Brussel; G. Carchon, W. De
Raedt, IMEC
TH1A-4: A CMOS Voltage-controlled
Oscillator Using High-Q On-chip Inductor
Implemented in a Wafer-level Package
S. Yoon, S. Pinel, J. Laskar, Georgia
Electronic Design Center
TH1C-4: Novel Microstrip Antenna
Employing Stacked Rings on Multi-layer
Ceramic Substrate for mm-wave
Applications
T. Seki, N. Honma, K. Nishikawa, K.
Tsunekawa, NTT Corp.
TH1D-4: Guaranteed Passive Coupledmicrostrip Interconnect Modeling Using
Finite Element Method
S. You, E.F. Kuester, University of Colorado
TH1C-5: Surface Mounted Millimeter
Waveguide Devices Based on Metallized
Dielectric Foam or Plastic Materials
D. Lohinetong, P. Minard, C. Nicolas, A.
Louzir, Thomson R&D France; J. Thevenard,
J. Coupez, C. Person, Bretagne
TH1D-5: Analytic Approximations for
Multilayer Substrate Coplanar-plate
Capacitors
S. Abadei, Chalmers University of Technology;
S. Gevorgian, Ericsson AB
TH1C-6: A 60 GHz Stripline BPF for LTCC
System-in-package Applications
Y. Lee, C. Park, Information and
Communications University (ICU)
TH1D-6: A Linear Time Implicit Congruence
Sparsification Technique for BEM
Capacitance Extraction
R. Jiang, University of Wisconsin, Madison; C.
Chen, National Taiwan University
TH1B-4: 60 W Doherty Amplifiers Using High
Gain 2-stage Hybrid Amplifier Modules
E.J. Crescenzi, Jr., R.S. Pengelly, S.M. Wood,
R.E. Buss, Cree Microwave Corp.
9:00 AM
9:10 AM
TH1C Millimeter and Submillimeterwave Components for Emerging High
Frequency Applications
Chair: R. Emrick
Co-chair: G. Brehm
LBCC 103AB
8:00–9:40 AM
TH1B High Power Amplifiers
Chair: J. Komiak
Co-chair: F. Sechi
LBCC 102
TH1A-5: Low DC-power Ku-band RTD VCO
based on an InP monolithic RTD/HBT
technology
S. Choi, Y. Jeong, K. Yang, KAIST
TH1B-5: Linearity Optimization of a High
Power Doherty Amplifier
K. Cho, S.P. Stapleton, Simon Fraser
University; I. Hwang, J. Kim, Kwangwoon
University
9:20 AM
9:30 AM
TH1A Novel Technologies for Signal
Generation
Chair: T. Ruttan
Co-chair: J. Papaplymerou
LBCC 101
8:20 AM
8:10 AM
8:00 AM
THURSDAY, JUNE 16, 2005
TH1A-6: A Self-sustained Electrical Soliton
Oscillator
D.S. Ricketts, X. Li, M. DePetro, D. Ham,
Harvard University
46
TH1E-1: Invited: Progress in Phased-array
Radar Applications
U. Nickel, J. Ender, H. Wilden, R. Klemm, A.
Brenner, T. Eibert, D. Nuessler, FGAN
TH1G Advance Nonlinear and Active
Device Measurements
Chair: A. Ferrero
Co-chair: J. Martens
LBCC 204
TH1F-1: High-order Superconducting Filter
with Group Delay Equalization
J. Hong, E.P. McErlean, B. Karyamapudi,
Heriot-Watt University
TH1G-1: Mixer-based, Vector-corrected,
Vector Signal/Network Analyzer Offering 300
kHz-20 GHz Bandwidth and Traceable Phase
Response
P.S. Blockley, Macquarie University; J.B.
Scott, D.B. Gunyan, Agilent Technologies
TH1E-2: Invited: Current Status of Airborne
Active Phased Array (AESA) Radar Systems
and Future Trends
H. Hommel, H-P. Feldle; EADS Deutschland
GmbH
TH1F-3: A Novel Quasi Lumped-element
Resonator Using A Left-handed
Transmission Line Section
H. Salehi, R.R. Mansour, University of
Waterloo
TH1G-2: An Improved Broadband
Conversion Scheme for the Large Signal
Network Analyzer
W. Van Moer, Y. Rolain, Vrije Universiteit
Brussel
TH1E-3: Invited: Status of a UAV SAR
Designed for Repeat Pass Interferometry for
Deformation Measurements
S. Hensley, K. Wheeler, G. Sadowy, T. Miller,
Y. Lou, R. Muellerschoen, S. Madsen, P.
Rosen, JPL; H. Zebker, Stanford Univ.
TH1F-4: Compact Bandpass Filtes Using
Defected Ground Structure (DGS) Coupled
Reonators
A.B. Abdel-Rahman, A.R. Ali, A.S. Omar, OvG
Magdeburg University; S. Amari, Royal
Military College of Canada
TH1G-3: Phase Characterization of Two-tone
Intermodulation Distortion
C. Crespo-Cadenas, J. Reina-Tosina, M.J.
Madero-Ayora, University of Seville, ESI
TH1E-4: Invited: Naval Radar in a Littoral
nvironment
R. de Jongh; Thales Nederland
TH1F-5: Compact Microstrip Lowpass Filterbased on Defected Ground Structure and
Compensated Microstrip Line
J. Li, J. Wang, University of Electronic
Science and Technology of China; Q. Xue, J.
Chen, City University of Hong Kong
TH1G-4: Experimental Evaluation of an
Active Envelope Load Pull Architecture for
High Speed Device Characterization.
T. Williams, J. Benedikt, P.J. Tasker, Cardiff
University
9:20 AM
9:30 AM
TH1E-5: Invited: Advanced Ground-based
ESCAN Radars
U. Fuchs, W. Sieprath; EADS Deutschland
GmbH
THURSDAY
TH1F-6: A New Two-layer Bandpass Filter
Using Stepped Impedance Hairpin
Resonators for Wireless Applications
A. Djaiz, T. Denidni, Institut National de la
Recherche Scientifique
9:10 AM
9:00 AM
8:50 AM
8:40 AM
8:30 AM
8:20 AM
TH1F Superconducting and
Innovative Planar Filters
Chair: D. Swanson
Co-chair: R. Mansour
LBCC 203
TH1F-2: Tuning Fork Filter Design for Hand
Scribe Tuning
G. Tsuzuki, M.P. Hernandez, B.A. Willemsen,
Superconductor Technologies
8:10 AM
8:00 AM
TH1E Trends for Future Radar
Arrays, Part 1 • Special Session
Chair: H. van Bezouwen
Co-chair: J. Horton
LBCC 202
TH1G-5: Production Test Method for
Evaluating the Effect of Narrow-band
Interference on Data Errors in Ultra-wideband (UWB) Receivers
S. Bhattacharya, R. Senguttuvan, A.
Chatterjee, Georgia Institute of Technology
TH1F-7: Design of Narrow Bandpass Filters
for Millimeter-wave Applications up to 220
GHz
G. Prigent, LEN7; E. Rius, LEST; K. Blary, H.
Happy, S. Lepilliet, G. Dambrine, A. Cappy,
IEMN
47
TH2D Neural Network and Space
Mapping Technologies
Chair: Q.J. Zhang
Co-chair: K.C. Gupta
LBCC 201B
TH2A-1: Accurate Design of HBT VCOs with
Flicker Noise Up-conversion Minimization,
Using an Advanced Low-frequency
Cyclostationary Noise Model.
C. Gourdon, D. Baglieri, M. Camiade, UMS; J.
Nallatamby, M. Prigent, J. Obregon, IRCOM
TH2B-1: A Predistortion Linearization
System for High Power Amplifiers with Low
Frequency Envelope Memory Effects
W. Woo, J.S. Kenney, Georgia Institute of
Technology
TH2C-1: A 77 GHz Monolithic IMPATT
Transmitter in Standard CMOS Technology
T. Al-Attar, A. Hassibi, T.H. Lee, Stanford
University
TH2D-1: Transient Electromagnetic
Modeling Using Recurrent Neural Networks
H. Sharma, Q.J. Zhang, Carleton University
TH2B-2: Memory Effect Evaluation and
Predistortion of Power Amplifiers
P.J. Draxler, J. Deng, UCSD & QUALCOMM
Inc.; D. Kimball, I. Langmore, P.M. Asbeck,
Univ. of California
TH2C-2: A 44 GHz High-linearity MMIC
Medium Power Amplifier with a Low-loss
Built-in Linearizer
J. Tsai, H. Chang, P. Wu, T. Huang, H. Wang,
National Taiwan University
TH2D-2: A Neural Network Method for the
Analysis of Multilayered Shielded
Microwave Circuits.
J. Pascual-Garcia, F.D. Quesada-Pereira, D.
Caete-Rebenaque, J.L. Gomez-Tornero, A.
Alvarez-Melcon, Universidad Politecnica de
Cartagena
TH2B-3: EDGE Transmitter with
Commercial GSM Power Amplifier Using
Polar Modulation with Memory
Predistortion
G.J. Seegerer, G. Ulbricht, Fraunhofer
Institute for Integrated Circuits
TH2C-3: Metamorphic 94 GHz Power
Amplifier MMICs
A. Tessmann, A. Leuther, H. Massler, M. Kuri,
C. Schwoerer, M. Schlechtweg, G. Weimann,
Fraunhofer Institute IAF
TH2D-3: Tuning of Microwave Filters by
Extracting Human Experience Using Fuzzy
Logic
V. Miraftab, R. Mansour, University of
Waterloo
TH2A-2: A Fully Integrated 70 GHz SiGe Low
Phase Noise Push-push Oscillator
R. Wanner, G. Olbrich, P. Russer, Technische
Universitõút Menchen; H. Schõúfer, R.
Lachner, Infineon Technologies
10:40 AM
10:50 AM
11:00 AM
TH2A-3: Low Phase Noise X-band Push-push
Oscillator with Frequency Divider
M. Schott, F. Lenk, C. Meliani, W. Heinrich,
Ferdinand-Braun-Institut fer
Hechstfrequenztechnik (FBH)
TH2A-4: Design of Push-push Oscillators for
Reducing 1/f Noise Upconversion
J. Choi, A. Mortazawi, University of Michigan
TH2A-5: A Low Power, Low Phase Noise
Local Oscillator for Chip-scale Atomic Clocks
A.S. Brannon, J. Breitbarth, Z. Popovic,
University of Colorado
TH2C-4: Medium Power Amplifiers Covering
90-130 GHz for the ALMA Telescope Local
Oscillators
L.A. Samoska, D. Pukala, A. Peralta, JPL, Cal.
Tech.; E. Bryerton, M. Morgan, D. Thacker, K.
Saini, T. Boyd, Nat’l Radio Astr Obs; M. Hu, A.
Schmitz, HRL Labs LLC
TH2B-4: Closed-loop Digital Pre-distortion
with Memory Effects Using Genetic
Algorithms
R. Sperlich, J.S. Kenney, Georgia Institute of
Technology; J.A. Sills, KhiMetrics Inc.
11:10 AM
11:40 AM
10:10–11:50 AM
TH2C Millimeter-wave Monolithic
Transceiver Components
Chair: D. Choudhury
Co-chair: P. Saunier
LBCC 103AB
TH2A-6: Low Power and Low Phase Noise 5.7
GHz LC VCO in OOK Transmitter for
Neurosensory Application
P. Upadhyaya, M. Rajashekhraiah, D. Heo,
D.M. Rector, Washington State University;
Y.E. Chen, National Taiwan University
TH2D-4: Enhanced Surrogate Models for
Statistical Design Exploiting Space
Mapping Technology
S. Koziel, J.W. Bandler, A.S. Mohamed,
McMaster University; K. Madsen, Technical
University of Denmark
TH2B-5: Positive Feedback Pilot Generation
and Detection for Use in Feedforward Loop
Control
R.N. Braithwaite, Powerwave Technologies
TH2C-5: A mm-wave Diode-MMIC Chipset for
Local Osc. Generation in the ALMA Telescope
M. Morgan, E. Bryerton, T. Boyd, D. Thacker,
K. Saini, National Radio Astronomy
Observatory; P. Cesarano, L-3
Communications; S. Weinreb, California
TH2D-5: New Multimodel Aggressive Space
Mapping Technique for the Efficient Design
of Complex Microwave Circuits
H. Esteban, V. Boria, C. Bachiller,
Universidad Politecnica de Valencia; J.
Morro, A. Coves, Universidad Miguel
Hernandez de Elche
11:30 AM
11:20 AM
TH2B Advances in High Power
Amplifier Linearization
Chair: J. Staudinger
Co-chair: A. Katz
LBCC 102
10:30 AM
10:20 AM
10:10 AM
TH2A New Approaches for Low Noise
Oscillators
Chair: D. Elad
Co-chair: P. Khanna
LBCC 101
TH2B-6: The 3rd and 5th Order Base-band
Component Injection for Linearization of
Power Amplifier in Cellular Phone
N. Mizusawa, S. Kusunoki, Sony Ericsson
Mobile Communications Japan Inc.
TH2C-6: InP/InGaAs-DHBT Distributed
Amplifier MMICs Exceeding 80 GHz Bandwidth
K. Schneider, R. Driad, R.E. Makon, A.
Tessmann, R. Aidam, R. Quay, M.
Schlechtweg, G. Weimann, Fraunhofer
Institute for Applied Solid-State Physics
(IAF)
48
TH2E-1: Invited: Status and Trends for
Space-borne Phased Array Radar
M. Ludwig, C. Buck, M. Suess, F. Coromina;
ESA/ESTEC
TH2G-2: A New Multiport Measurementmethod Using a Two-port Network Analyzer
F. Lenk, R. Doerner, Ferdinand-BraunInstitut (FBH)
TH2F-3: Design and Measurement of a
Smart Tunable Periodic Material
L. Mercier, M. Thõvenot, A. Crunteanu, B.
Jecko, P. Blondy, IRCOM; J. Orlianges, C.
Champeaux, A. Catherinot, SPCTS
TH2G-3: Statistical Analysis of Random
Errors from Calibration Standards
X. Chen, BreconRidge Manufacturing
Solutions
TH2F-4: Propagation Characteristics of Wide
Synthetic Quasi-TEM Transmission Line
S. Wang, C.K. Tzuang, National Taiwan
University; H.S. Wu, National Chiao Tung
University
TH2G-4: New Methods for the
Characterization of Thin Dielectric Samples
at Low Frequencies
D. Koether, J. Berben, A. Bettray, IMST
GmbH
TH2E-4: Invited: Design Considerations for
Space-based Radar Phased Arrays
J.S.Herd, A.J. Fenn; MIT Lincoln Lab
TH2G-5: A Novel MEMS Probe Array for the
Biological Measurement
J. Kim, C. Baek, J. Cho, Y. Kwon, Y. Kim,
Seoul National University; D. Oh, C. Cheon,
University of Seoul
TH2F-5: Experimentally Investigating Slowwave Transmission Lines and Filters Based
on Conductor-backed CPW Periodic Cells
K. Ma, J. Ma, M. Do, K. Yeo, Nanyang
Technological University
TH2G-6: Measurement of Electrotextiles for
High Frequency Applications
Y. Ouyang, W.J. Chappell, Purdue University
49
THURSDAY
10:40 AM
TH2F-2: A Novel Feeding Technique for
Antipodal Linearly Tapered Slot Array
Antenna
H. ZhangCheng, H. Wei, C. JixIn, C. XiaoPing,
Southeast University; W. Ke, Montreal,
Montreal, Canada
TH2E-3: Invited: Digital Beam Forming
Synthetic Aperture Radar
C. Heer, P.F. Shutie; EADS Astrium
10:50 AM
11:00 AM
TH2G-1: A 220 GHz Wafer Probe Tip with
Reduced Stray Fields
R.L. Campbell, M. Andrews, L. Bui, Cascade
Microtech Inc.
11:40 AM
11:30 AM
TH2G Innovations in Microwave
Measurement
Chair: L. Hayden
Co-chair: R. Henderson
LBCC 204
TH2F-1: Reconfigurable MEMS
Transmission Lines with Independent ZOand beta-tuning
B. Lakshminaryanan, T. Weller, University of
South Florida
11:20 AM
11:10 AM
TH2F Synthetic Transmission Lines
and Their Applications
Chair: M.S. Gupta
Co-chair: P. Russer
LBCC 203
TH2E-2: Invited: System Concepts and
Technologies for High Orbit SAR
A. Moussessian, W. Edelstein, C. Chen, S.
Madsen; Jet Propulsion Lab
10:30 AM
10:20 AM
10:10 AM
TH2E Trends for Future Radar
Arrays, Part 2 • Special Session
Chair: J. Horton
Co-chair: A. Moussessian
LBCC 202
TH3C Metamaterial Waveguides
Chair: A.A. Oliner
Co-chair: N. Engheta
LBCC 103AB
1:20–3:00 PM
TH3B Advanced Radar Systems
Chair: G. Heiter
Co-chair: K. Breuer
LBCC 102
TH3D Efficient CAD for Multilayer
Circuits and Large Interconnect
Networks
Chair: A. Sharma
Co-chair: N. Buris
LBCC 201B
TH3A-1: Triply Wideband VCO with Triple
Tuned Circuits in C-/Ku-band
M. Tsuru, K. Kawakami, K. Tajima, K.
Miyamoto, M. Nakane, M. Miyazaki, T. Takagi,
Mitsubishi Electric Corp.
TH3B-1: An Active Membrane Phased Array
Radar
A. Moussessian, L. Del Castillo, J. Huang, G.
Sadowy, J. P. Hoffman, P. Smith, T. Hatake,
C.G. Derksen, B.C. Lopez, E. Caro, Jet
Propulsion Lab
TH3C-1: Compact Leaky-wave Components
Using Metamaterials
A. Aloe, N. Engheta, University of
Pennsylvania; F. Bilotti, L. Vegni, University
of Roma Tre
TH3D-1: Efficient Planar Electromagnetic
Analysis by Impedance Matrix Interpolation
M. Mongiardo, R. Sorrentino, C. Tomassoni,
Univ. of Perugia
TH3A-2: A 60 GHz-band Subharmonically
Injection Locked VCO MMIC Operating over
Wide Temperature Range
S. Kishimoto, K. Maruhashi, M. Ito, T.
Morimoto, Y. Hamada, K. Ohata, NEC Corp.
TH3B-2: A Multilayer Front-end for an
Imaging Radar Sensor
M. Leib, W. Mayer, H. Bilzer, W. Menzel,
University of Ulm
TH3C-2: Experimental Verification of
Surface Waves of Metamaterials
A. Sanada, I. Matsuda, Yamaguchi University
TH3D-2: Enhanced PEEC Modeling for
Embedded RF Passives of Irregular Shapes
M. Hu, J. Wang, K. Wu, The Chinese
University of Hong Kong
TH3C-3: New Interpretation of Wave
Propagation in High Impedance Surfaces
R. Ramprasad, University of Connecticut; M.
Petras, Freescale Semiconductor
TH3D-3: Accelerated Optical Topography
Inspection Using Parameterized Model
Order Reduction
J. Lee, D. Vasilyev, A. Vithayathil, L. Daniel, J.
White, Massachusetts Institute of Technology
TH3C-4: Evanescent Rectangular Waveguide
with Corrugated Walls: A Composite
Right/Left-handed Metaguide
I.A. Eshrah, A.A. Kishk, A.B. Yakovlev, A.W.
Glisson, University of Mississippi
TH3D-4: Efficient Generation of Multiparameter Closed-form Expressions for High
Speed Transmission Line Networks
A. Jerome, N. Rodrigues, P. Gunupudi, M.
Nakhla, Carleton University; R. Khazaka,
McGill University
1:50 PM
1:40 PM
1:30 PM
1:20 PM
TH3A Advances in Signal Generation
Techniques
Chair: H.J. Kuno
Co-chair: S. Wetenkamp
LBCC 101
2:00 PM
TH3B-3: Retrodirective Noise-correlating
Radar at X-Band: First Demonstration of
Small Target Detection
E.B. Brown, Physical Domains; E.R. Brown,
2:50 PM
2:40 PM
2:20 PM
2:20 PM
2:10 PM
TH3C-5: Left Handed Behavior of
Transmission Lines Based on SRR Filled
Waveguides
J. Carbonell, L.J. Roglõä, V.E. Boria,
Universidad Politecnica de Valencia
TH3A-3: Frequency Sweep Linearization for
FMCW Sensors with High Measurement Rate
M. Pichler, Center of Mechatronics GmbH; A.
Stelzer, Johannes Kepler Univ.; P. Gulden, C.
Seisenberger, Siemens AG, M. Vossiek, Tech.
Univ. Clausthal
TH3B-4: Single Antenna Microwave Nulling
Using Time-Reversal Techniques
A.G. Cepni, D.D. Stancil, Carnegie Mellon
University
TH3C-6: Propagation of Resonance Cones in
Truncated Hyperbolic Transmission-Line
Grids Over Ground
O.F. Siddiqui, K.G. Balmain, G.V.
Eleftheriades, University of Toronto
TH3D-5: Passive Model Order Reduction for
Interconnect Networks with Large Number
of Ports
M. Ma, R. Khazaka, McGill University
TH3B-5: Compensation of the Doppler Shift
for a Local Position Measurement System by
Using a Kalman Filter
K. Pourvoyeur, Linz Center of Mechatronics
GmbH; A. Stelzer, Johannes Kepler University
Linz; A. Fischer, Abatec Electronic AG
TH3C-7: Waves in Anisotropic Metamaterials
Comprised of Finite L-C Meshes
E.P. Brennan, A. Gardiner, A. Schuchinsky, V.
Fusco, Queen’s University Belfast
TH3D-6: An Adjoint-based Approach to
Computing the Time-domain Sensitivity of
Systems Described by Reduced-order Models
T. Ahmed, E. Gad, M. Yagoub, Univ. of Ottawa
TH3A-4: Design and Analysis of VCO with
Tunable Ring Filter
H. Ishida, National Institute of Information;
K. Araki, Tokyo Institute of Technology
TH3A-5: 38-43 GHz Quadrature VCO on 90
nm VLSI CMOS with Feedback Frequency
Tuning
F. Ellinger, H. Jaeckel, ETH Zurich
TH3A-6: A 12 GHz GaInP/GaAs HBT VCO
Based on Push-push Output Extraction from
Capacitive Common-node
J. Kim, N. Kim, H. Shin, Kwangwoon
University; S. Jeon, S. Moon, Knowledge*On
Inc.
50
TH3F Novel Transmission Lines and
Structures
Chair: G.E. Ponchak
Co-chair: C-K.C. Tzuang
LBCC 203
TH3G Circuits and Techniques for
Multi-Gigabit/sec Transmission
Chair: S. Marsh
Co-chair: H. Boss
LBCC 204
TH3E-1: Tissue Sensing Adaptive Radar for
Breast Cancer Detection: Preliminary
Experimental Results
J.M. Sill, E.C. Fear, University of Calgary
TH3F-1: On the mm-wave Characteristics
and Model of On-chip Interconnect
Transmission Lines Up to 110 GHz
M.T. Yang, P.C. Ho, T.J. Yeh, Y.J. Wang, D.
Kuo, C.W. Kuo, S.C. Yang, S. Liu, TSMC; A.
Mangan, S. Voinigescu, University of Toronto
TH3G-1: Estimating Data-dependent Jitter of
a General LTI System from Step Response
B. Analui, J. Buckwalter, A. Hajimiri,
California Institute of Technology
TH3E-2: Design and Modeling of a Specific
Microwave Applicator for Treatment of
Snoring
P. Cresson, C. Ricard, N. Bernardin, L.
Dubois, J.P. Pribetich, Universite des
Sciences et Technologies de Lille
TH3F-2: Q Enhancement with Crossconnected Coplanar Waveguides in Thick
Dual Damascene Cu
W.D. van Noort, C. Detcheverry, G.
Verheijden, P. Bancken, R. Daamen, Philips
Research Leuven; L. Tiemeijer, R. Havens,
Philips Research Eindhoven
TH3G-2: A Fully Integrated 0.18 µm CMOS
Equalizer with an Active Inductance
Peaking Delay Line for 10 Gbps Data
Throughput over 500 m Multimode Fiber
M. Maeng, Y. Hur, S. Chandramouli, H. Kim,
C. Chun, J. Laskar, Georgia Electronic Design
Center; F. Bien, E. Gebara, Quellan Inc.
TH3E-3: Advances in Microwave
Hyperthermia of Large Superficial Tumors
P.F. Maccarini, University of California
TH3F-3: High Quality Microstrip
Termination for MMIC and Millimeter-wave
Applications
R.R. Monje, V.V. Vassilev, A. Pavolotsky , V.
Belitsky, Chalmers University of Technology
TH3G-3: Performance Analysis of MultiGigahertz Parallel Bus with Transmit Preemphasis Equalization
W.T. Beyene, N. Cheng, J. Feng, H. Shi, D. Oh,
C. Yuan, Rambus Inc.
TH3F-4: Increasing the Speed of Microstrip
Line-type PDLC Devices
Y. Utsumi, T. Kamei, K. Saito, H. Moritake,
National Defense Academy
TH3G-4: EAM DFF-driver Optimization for
40 Gb/s Transmitter
A. Konczykowska, F. Jorge, C. Kazmierski, F.
Blache, J. Godin, Alcatel-Thales III-V Labs
TH3F-5: Influence of Design Liquid Crystalbased Devices on the Agility Capability
N. Martin, P. Laurent, C. Person, P. Gelin, F.
Hiret, LEST UMR
TH3G-5: A 40 Gbps GaAs-HBT Distributed
Amplifier with an Over-fT Cut-off Frequency:
Analytical and Experimental Study
C. Meliani, M. Rudolph, W. Heinrich, FBH
(Ferdinand-Braun-Institut fõ-r
Hoechstfrequenztechnik)
TH3E-4: Electromagnetic Interactions
between Biological Tissues and Implantable
Biotelemetry Systems
J. Kim, Y. Rahmat-Samii, University of
2:50 PM
2:40 PM
TH3E-5: Thermal Steady State in Human
Head under Continuous EM Exposure
W. Kim, J. Yook, Yonsei University
TH3E-6: Permittivity Measurement for
Biological Application Using
Micromachined Probe
J. Kim, J. Cho, Y. Kwon, Y. Kim, Seoul
National University; D. Oh, C. Cheon,
University of Seoul; J. Park, LG Electrionics
TH3E-7: Microwave Sterilization by the
Catalyst Coated with Metal Thin Film
H. Wang, Y. Miyakawa, Y. Kanno, University of
Yamanashi
THURSDAY
2:30 PM
2:20 PM
2:10 PM
2:00 PM
1:50 PM
1:40 PM
1:30 PM
1:20 PM
TH3E Biological Effects and Medical
Applications
Chair: A. Omar
Co-chair: A. Vander Vorst
LBCC 202
TH3G-6: Design of a Fully HBT 40 GS/s
Sampling Circuit for Very Large Bandwidth
Non-repetitive Signal Analysis
H. El Aabbaoui, N. Rolland, A. Benlarbi-Delai,
P. Rolland, IEMN Univ. of Lille; N. Fel, V.
Allouche, CEA DAM; B. Riondet, Greenfield
Tech.
51
TH4E Advances in HF, VHF and UHF
Technology
Chair: R. Caverly
Co-chair: M. Eron
LBCC 202
3:30–5:10 PM
TH4C High-frequency Propagation
and Effects
Chair: J. Zehentner
Co-chair: D. Jackson
LBCC 103AB
TH4F Left Handed Transmission
Lines and Applications
Chair: K. Wu
Co-chair: W. Gwarek
LBCC 203
TH4B-1: Wireless Uncompressed-HDTVSignal Transmission System Utilizing
Compact 60 GHz Band Transmitter and
Receiver
K. Maruhashi, S. Kishimoto, M. Ito, K. Ohata,
Y. Hamada, T. Morimoto, H. Shimawaki, NEC
Corp.
TH4C-1: High-frequency Excitation of a
Microstrip Line by a Probe
R. Rodrõguez-Berral, F. Mesa, Universidad de
Sevilla; D.R. Jackson, University of Houston
TH4E-1: Improved LINC Power
Transmission Using a Quadrature
Outphasing Technique
G.M. Hegazi, T.T. Chu, R.A. Groshong,
Rockwell Collins; M.T. Durkin, NavAir
TH4F-1: A New Realization of Left-handed
Transmission Lines Employing A Coaxial
Waveguide Structure
H. Salehi, R.R. Mansour, University of
Waterloo
TH4B-2: Ultra-wideband (UWB) RF Frontend Module Implementation for Multi-band
OFDM System
Y. Park, R. Mukhopadhyay, K. Lim, C. Lee, J.
Laskar, Georgia Electronic Design Center,
School of ECE; A. Wakejima, Photonic and
Wireless Devices Research Labs
TH4C-2: Transmission Characteristics of the
First Higher Mode in a Strip Line at
Millimeter-wavelength
F. Kuroki, K. Miyamoto, S. Nishida (retired),
Kure Nat’l College of Technology
TH4E-2: A 2.7 kW, 29 MHz Class-E/Fodd
Amplifier with a Distributed Active
Transformer
S. Jeon, D.B. Rutledge, California Institute of
Technology
TH4F-2: Fourier Synthesizer Using Lefthanded Transmission Lines
H. Kim, A.B. Kozyrev, S. Ho, D.W. van der
Weide, University of Wisconsin - Madison
3:50 PM
3:40 PM
3:30 PM
TH4B Wideband Communications
Systems
Chair: R. Knoechel
Co-chair: G. Lyons
LBCC 102
TH4B-3: Novel Circular Polarized Antenna
Array Substrates for 60 GHz Band
H. Uchimura, N. Shino, K. Miyazato, Kyocera
Corp. R&D Center
TH4C-4: Flat Waveguide with a Longitudinal
Slot
J. Zehentner, J. Mrkvica, J. Machac, Czech
Technical University in Prague
TH4E-3: A Novel Surface-mount RF Delay
Filter for Feedforward LPAs
W.H. Cantrell, D.R. Anderson, W.R. Meszko,
Motorola
TH4F-3: A Broadband Microstrip-to-CPS
Transition Using Composite Right-/Lefthanded Transmission Lines with an
Antenna Application
C. Lee, K.M. Leong, T. Itoh, University of
TH4B-4: Development of a Twin-feedhorn for
Dual Linear DBS Reflector Antennas
S. Lee, L. Schmieder, A.E. Fathy, S.M. ElGhazaly, University of Tennessee; G. Rodeffer,
B. Zihlman, Winegard Co.
TH4C-5: Analysis of Printed Periodic
Structures on a Grounded Substrate: A New
Brillouin Dispersion Diagram
P. Baccarelli, S. Paulotto, La Sapienza
University of Rome; D.R. Jackson, University
of Houston; A.A. Oliner, Polytechnic
University
TH4E-4: A Mammalian Cochlea-based RF
Channelizing Filter
C.J. Galbraith, G.M. Rebeiz, The University of
Michigan; R.D. White, K. Grosh, The
TH4F-4: Equivalent Circuit Modeling of
Symmetric Composite Right-/Left-handed
Coplanar Waveguides
S. Mao, M. Wu, National Taipei University of
Technology
5:00 PM
4:50 PM
4:40 PM
4:30 PM
4:20 PM
4:10 PM
4:00 PM
TH4C-3: Simulation of Subterahertz
Attenuation in Coplanar Waveguides
J. Zhang, T.Y. Hsiang, University of Rochester
TH4B-5: Broadband/Multiband Conformal
Circular Beam-steering Array
J.J. Wang, D.J. Triplett, C.J. Stevens, Wang
Electro-Opto Corp.
TH4B-6: Phase-synchronization in UWB
Receivers with Sampling Phase Detectors
A. Reisenzahn, T. Buchegger, G. Kaineder,
C.G. Diskus, Johannes Keppler University
TH4C-6: Modeling of Three-dimensional
Electromagnetic Band-gap Structures
N. Bottari, F. Frezza, L. Pajewski, G.
Schettini, Rome, Italy,
TH4F-5: Left-handed Coplanar Waveguide
J. Machac, M. Hudlicka, J. Zehentner, Czech
Technical University; N. Spiliotis, A. Omar,
University of Magdeburg
TH4B-7: Impact of Group Delay in RF BPF
on Impulse Radio Systems
S. Myoung, J. Yook, Yonsei Univ.
52
THURSDAY SPECIAL SESSIONS
TH1E: TRENDS FOR FUTURE RADAR SYSTEMS
ELECTRONICALLY SCANNED ARRAYS, PART I
Date & Time: Thursday, June 16, 8:00 to 9:40 AM
TH2E: TRENDS FOR FUTURE RADAR SYSTEMS
ELECTRONICALLY SCANNED ARRAYS, PART II
Date & Time: Thursday, June 16, 10:10 to 11:50 AM
WITH
WITH
Location:
Location:
Chair:
Hans van Bezouwen, EADS, Germany
Chair:
John Horton, J.B. Horton Group, USA
Co-Chair:
John Horton, J.B. Horton Group, USA
Co-Chair:
Alina Moussessian,
Jet Propulsion Laboratory USA
For IMS2005, the session is expanded into two sessions to include additional papers on space-based applications of electronically scanned phased array radars. This session, Part I, includes
a general overview paper regarding new technologies for radar
with electronically scanned arrays, as well as focused papers on
airborne, naval and ground-based applications. Each application
area is analyzed to define technology advancements needed to
meet future system requirements, e.g., space, power, efficiency
and cost.
This session, Part II, is focused on technology advancements
needed in space-based radars using electronically scanned arrays. Each application area is analyzed to define technology advancements needed to meet future system requirements, i.e.,
space, weight, power consumption, efficiency and cost. The session includes two papers from the European Radar Conference
(EuRAD), held in Amsterdam in October 2004. Two papers are
added to cover development work in the USA on similar application areas.
53
THURSDAY, JUNE 16, 2005 • THIF INTERACTIVE FORUM • 1:30–4:30 PM
THURSDAY
CHAIR: H.J. DE LOS SANTOS, NANOMEMS RESEARCH • CO-CHAIR: J. GOEL, RAYTHEON • LBCC GRAND BALLROOM
THPA-1: Estimation of In-band Distortion in Digital Communication System
K.G. Gard, M.B. Steer, North Carolina State University; K.M. Gharaibeh, Yarmouk University
THPA-2: Nonlinear Behavioral Modeling of Power Amplifiers Using Radial-Basis Function
Neural Networks
M. Isaksson, D. Rõnnow, University of Gõúvle; D. Wisell, Ericsson AB
THPA-3: Extending Static Models by Using Time Series to Identify the Dynamical Behavior
J. Wood, J. Horn, D. Root, Agilent Technologies Inc.
THPA-4: Broadband, Multi-harmonic Frequency Domain Behavioral Models from Automated
Large-signal Vectorial Network Measurements
J. Verspecht, Jan Verspecht bvba; D.E. Root, J. Wood, A. Cognata, Agilent Technologies
THPA-5: Behavioral Modeling of Power Amplifiers Using Fully Recurrent Neural Networks
D. Luongvinh, Y. Kwon, Seoul National University
THPA-6: Behavior Modeling Procedure of Wideband RF Transmitters Exhibiting Memory Effects
T. Liu, S. Boumaiza, M. Helaoui, H. Ben Nasr, F.M. Ghannouchi, Ecole Polytechnique de Montreal
THPA-7: Macro-Modeling of Non-linear Pre-emphasis Differential Driver Circuits
B.M. Mutnury, M. Swaminathan, Georgia Institute of Technology; M. Cases, N. Pham, D. de
Araujo, E. Matoglu, IBM
THPB-1: A 60 GHz MMIC Dual-quadrature Mixer in pHEMT Technology for Ultra Wideband
IF Signals and High LO to RF Isolation
S. Gunnarsson, Microwave Electronics Lab; H. Zirath, Microwave Electronics Lab
THPB-2: Double-balanced, Hybrid Mixer with Multi-decade Bandwidth
D.B. Gunyan, Agilent Technologies
THPB-3: Digital Predistortion of Frequency Multiplier for Dual band Wireless LAN Transmitter
J. Choi, S. Kang, K. Koo, University of Incheon
THPB-4: Compact Tunable Periodically LC Loaded Microstrip Line for Phase Shifting Applications
C. Damm, M. Schõáler, M. Oertel, R. Jakoby, Technische Universitõút Darmstadt
THPB-5: MMIC HEMT Switch for Switch Matrix of Satellite Communication System
K. Ryu, Hanbat National University; D. Shin, I. Yom, J. Park, S. Lee, ETRI; M. Lee, Univ. of Seoul
THPB-6: Development of a Low Cost 5 Bit Ku-band Phase Shifter Using HJ-FET Packaged
Devices for DBS Mobile Reception
S. Yang, A.E. Fathy, University of Tennessee
THPB-7: A Miniaturized Wideband 4x4 Switch Matrix IC Using Four InP-HEMT SP4T Switches
H. Kamitsuna, Y. Yamane, M. Tokumitsu, H. Sugahara, M. Muraguchi, NTT Photonics Labs., NTT
Corp.
THPB-8: A Subharmonic Self-oscillating Mixer Using Substrate Integrated Waveguide Cavity
for Millimeter-wave Application
J. Xu, K. Wu, Ecole Polytechnique de Montreal
THPC-1: Class-F Power Amplifier Using a Multi-frequency Composite Right-/Left-handed
Transmission Line Harmonic Tuner
A. Dupuy, K.M. Leong, T. Itoh, University of California, Los Angeles
THPC-2: Prediction of Error Vector Magnitude Using AM/AM, AM/PM Distortion of RF Power
Amplifier for High Order Modulation OFDM System
J. Kim, J. Jung, K. Lee, ETRI, Daejeon; C. Park, ICU
THPC-3: Comparison of X-band MESFET and HBT Class-E Power Amplifiers for EER Transmitters
S. Pajic, N. Wang, Z. Popovic, University of Colorado at Boulder
THPC-4: First Demonstration of 4H-SiC RF Bipolar Junction Transistors on a Semi-insulating
Substrate with fT/fMAX of 7/5.2 GHz
F. Zhao, I. Perez-Wurfl, C. Huang, J. Torvik, B. Van Zeghbroeck, PowerSicel Inc., Univ. of Colorado
THPC-5: An X-band Hybrid MIC Feedforward Amplifier for Low Residual Noise Operation
V. Sokolov, J.N. Kruchowski, M.E. Vickberg, B. Buhrow, S. Schuster, J. Bublitz, B.K. Gilbert, E.S.
Daniel, Mayo Clinic
THPC-6: Digitally Controlled RF Predistortion with Digital Predictor for Feedforward Delay
Compensation
I. Teikari, J. Vankka, K. Halonen, Helsinki University of Technology
THPC-7: Nonlinear System Performance of Shared Amplifiers based on 3-way Microstrip Phase
Combiners
T. Baras, TU Hamburg-Harburg; C. Metz, Bell Labs - Lucent Technologies
THPC-8: High Pass Output Matching Technique with Enhanced Third Harmonic Rejection for
CDMA Power Amplifiers
Y. Yang, Skyworks Solutions Inc.
THPD-1: Digital Memory-based Predistortion
S.M. McBeath, D.T. Pinckley, Motorola Labs
THPD-2: Efficiency Enhancement Method for High-power Amplifiers Using a Dynamic Load
Adaptation Technique
H. Jeong, H. Lee, I. Chang, Sogang University; C. Kim, Sewon Teletech Inc.
THPD-3: Linearity Improvement for Power MESFET Devices Using Source Inductive Feedback
and Input Impedance Mismatch
C. Meng, National Chiao Tung University; W. Wang, National Chung-Hsin University
THPE-1: Layout Effects on Design Optimization of CMOS LNA and Mixer
W. Wu, M. Chan, Hong Kong University of Science and Technology, Hong Kong
THPE-2: A Miniature Dual-band Low-noise Amplifier Module for IEEE 802.11b/g/a WLAN
Applications
Y.H. Chow, T.C. Chong, Z. Hasan-Abrar, C.C. Loh, T.L. Tan, E.C. Chew, Agilent Technologies
THPE-3: Prototype Development of a Geostationary Synthetic Thinned Aperture Radiometer
(GeoSTAR)
P. Kangaslahti, A. Tanner, W. Wilson, B. Lambrigtsen, S. Dinardo, Jet Propulsion Lab
THPF-1: Complex Permittivity Measurements of Dielectrics and Semiconductors at Millimeterwaves with High Power Sources
M.N. Afsar, K.A. Korolev, L. Subramanian, I.I. Tkachov, Tufts University
THPF-2: LTCC Reduced-size Bandpass Filters Based on Capacitively Loaded Cavities for Qband Application
P. Ferrand, D. Baillargeat, S. Verdeyme, IRCOM; J. Puech, CNES (French Space Agency); M.
Lahti, T. Jaakola, VTT
THPF-3: A 60 GHz Band Dielectric Waveguide Filter Made of Crystalline Quartz
K. Ito, K. Sano, TOKO Inc.
THPF-4: A Compact-sized NRD Guide Single Mixer Using Band-pass Filters at 60 GHz
F. Kuroki, M. Kimura, Y. Murata, Kure Nat’l. College of Technology; T. Yoneyama, Tohoku Inst. of
Tech.
THPF-5: 77 GHz Band Antenna Array Substrate for Short Range Car Radar
N. Shino, H. Uchimura, K. Miyazato, Kyocera Corp. R&D Center
THPF-6: Fully Integrated Distributed Amplifier Design on InP HBT Technology for
Optoelectronics Application
L. Robin, M. Regis, H. Cam, ACCO; A. Perennec, D. Herve, D. Le Berre, A. Peden, Univ. de
Bretagne Occidentale; H. Yano, S. Furudate, S. Yaegassi, Sumitomo Elec. Ind.
THPF-7: Terahertz Time-domain Spectroscopy of Crushed Wheat Grain
H. Chua, A.D. Haigh, A.A. Gibson, Univ of Manchester; J. Obradovic, P.C. Upadhya, O. Hirch, D.
Crawley, L.F. Gladden, Univ of Cambridge; E.H. Linfield, Univ. of Leeds
THPF-8: Millimeter-wave Microstrip-to-waveguide Transition Operating over Broad Frequency
Bandwidth
Y. Deguchi, K. Sakakibara, N. Kikuma, H. Hirayama, Nagoya Institute of Technology
THPF-9: A 77 GHz Automotive Radar MMIC Chip Set Fabricated by a 0.15 µm MHEMT Tech.
D. Kang, J. Hong, J. Shim, J. Lee, H. Yoon, K. Lee, ETRI
THPF-10: Integration of Silicon Etched Waveguides with MCM-D for V- and W-band
I. Ocket, B. Nauwelaers, KU Leuven; G.J. Carchon, A. Jourdain, W. De Raedt, IMEC
THPG-1: Crosstalk Improved Three Channel Receiver Module for 10 Gb/s Parallel Optical
Interconnect Application
S. Park, C. Park, Information and Communications University
THPG-2: Electromagnetic Simulation of Photonic Mixing in Ultra-Wideband TWPDs
I. Jaeger, D. Pasalic, R. Vahldieck, Swiss Federal Institute of Technology
THPG-3: Implementation of the Phased-lock Loop Clock Recovery Module for 40 Gb/s Optical
Receivers
C. Park, D. Woo, T. Kim, K.W. Kim, Kyungpook National University; S. Lim, Electronics and
Telecommunications Research Institute
THPG-4: Suppression of Optical Beat Interference in WDM-SCMA Networks Using Modulated
Optical Combs
H. Jung, Y. Won, S. Han, Yonsei University
THPH-1: Determination of Intermodulation Distortion in a MEMS Microswitch
J. Johnson, G.G. Adams, N.E. McGruer, Northeastern University
THPH-2: Widely Tunable High-Q Evanescent-mode Resonators Using Flexible Polymer Substrates
S. Hajela, X. Gong, W.J. Chappell, Purdue University
THPH-3: Skin Effect Aggregated Heating in RF MEMS Suspended Structures
L.L. Chow, Z. Wang, B.D. Jensen, K. Saitou, K. Kurabayashi, University of Michigan; J.L. Volakis,
Ohio State University
THPH-4: Fabrication and Measurements Using Ultra-tall Near-field Coaxial Tips
Y. Wang, C.A. Paulson, G. Ning, D.W. van der Weide, University of Wisconsin-Madison
THPI-1: Conductor Roughness Reduced Low-loss Coplanar Waveguides on Low Resistivity
Silicon by Employing Magnetorheological Finishing
S. Lee, J. Yook, S. Park, J. Lee, Y. Kim, S. Lee, Yonsei University
THPI-2: Crosstalk Attenuation with Ground Plane Structures in Three-dimensionally
Integrated Mixed Signal Systems
S.K. Kim, C.C. Liu, S. Tiwari, Cornell University; L. Xue, Advanced Micro Devices
THPI-3: Ultrawideband Characterisation of Photoimageable Thick Film Materials for
Microwave and Millimeter-wave Design
K. Samanta, I.D. Robertson, University of Leeds; D. Stephens, University of Surrey
THPI-4: Is Hermitic Encapsulation of GaAs MMIC Still Required for Space Applications?
P. Monfraix, J. Monsarrat, J. Muraro, C. Drevon, J. Cazaux, Alcatel Space; S. Dareys, M. Billot,
CNES
THPI-5: Wideband Organic Solutions for MMIC Packaging
T. Barbier, D. Caban-Chastas, V. Rananjason, P. Kertesz, Thales Airborne Systems
THPJ-1: Improvement of Gain Compression in Microwave Lumped and Transversal Bandpass
Filters
W.W. Choi, K.W. Tam, R.P. Martins, University of Macau
THPJ-2: Microstrip Dual-mode Bandpass Filter Design with Simultaneous Size Reduction and
Spurious Response Suppression
S. Fok, P. Cheong, K. Tam, University of Macau; R.P. Martins, Instituto Superior Tecnico
THPJ-3: New Coupled Microstrip SIR Bandpass Filters with Transmission Zeros
H. Gan, D. Yang, Laboratory of Radio Frequency and Microwave Technology
THPJ-4: A Design of a Ring Bandpass Filters with Wide Rejection Band Using DGS and Spurline Coupling Structures
C. Kim, D. Ahn, Soonchunhyang University; K. Leong, T. Ito, University of California, Los Angeles
THPJ-5: Novel Dual-band Planar Resonator and Admittance Inverter For Filter Design and
Applications
A.H. Yim, K.M. Cheng, The Chinese University of Hong Kong
THPJ-6: Transmission Line Filter Design with Fully Controllable Second Passband
C. Tsai, H. Lee, C. Tsai, National Cheng Kung University
THPJ-7: Coupling Dispersion of Parallel-coupled Microstrip Lines for Dual-band Filters with
Controllable Fractional Pass bandwidths
S. Sun, L. Zhu, Nanyang Technological University
THPJ-8: Synthesis and Diagnosis of RF Filters in Liquid Crystalline Polymer (LCP) Substrate
S. Mukherjee, M. Swaminathan, Georgia Institute of Technology; S.S. Dalmia, Jacket Micro Devices
THPJ-9: Wideband, High Rejection and Miniaturized Fifth Order Bandpass Filter on LCP Low
Cost Organic Substrate
C. Quendo, E. Rius, C. Person, J. Favennec, Y. Clavet, A. Manchec, LEST - UMR; A.
Bairavasubramanian, S. Pinel, J. Papapolymerou, J. Laskar, Georgia Electronic Design Center
THPJ-10: Analysis of a Novel Active Capacitance Circuit Using BJT and Its Application to RF
Bandpass Filters
I. Kim, S. Yun, Sogang University; Y. Chun, Dongguk University
THPJ-11: GaAs Varactor Tuned Filter For Low Power Applications
A. Eriksson, A. Deleniv, S. Gevorgian, Chalmers; B. Lumetzberger, N. Billstrem, Ericsson
THPJ-12: Flat Time Delay Low Pass Filters Using Two CPW Topologies
S. Khireddine, M. Drissi, National Institut of Science Application (INSA); R. Soares, DAlightCom
THPJ-13: Dual-band Bandpass Filter in LTCC
Y. Guo, L. Ong, M. Chia, Institute for Infocomm Research
THPJ-14: Design Method of Closed Loop Resonator Filter Using Parallel Capacitor to Reduce Size
H.J. Hong, Electronics and Telecommunications Research Institute; D.C. Park, Chungnam
National University
THPJ-15: Miniaturization of Lowpass Filter by Using Artificial Transmission Lines
J.W. Park, G.N. Kim, J.P. Kim, Chnug-Ang University
THPK-1: A Metamorphic GaAs HEMT Distributed Amplifier with 50 GHz Bandwidth and Low
Noise for 40 Gbits/s
G. Wolf, H. Happy, G. Dambrine, Inst d’Electronique de Microectronique et de Nanotechnologie;
S. Demichel, R. Leblanc, OMMIC, F. Blache, R. Lefevre, OPTO+
THPK-2: Microwave VCO Susceptibility to Substrate Noise in a Fully-integrated 150 GHz SiGe
HBT BiCMOS Technology
J.P. Comeau, J.D. Cressler, Georgia Institute to Technology
THPK-3: The High Frequency and Power Performance of SiGe HBTs with SIC Structure at
Cryogenic Temperature
M. Hsieh, Y. Chan, K. Liang, National Central University; C. Lee, D. Tang, G. Chen, Taiwan
Semiconductor Manufacturing Co.
THPK-4: Low Power 23 GHz and 27 GHz Distributed Cascode Amplifiers in a Standard 130 nm
SOI CMOS Process
C. Pavageau, A. Siligaris, L. Picheta, F. Danneville, IEMN-UMR CNRS; M. Si Moussa, J. Raskin, D.
Vanhoenacker-Janvier, UCL; J. Russat, N. Fel, CEA
THPL-1: Dual-band Butler Matrix for WLAN Systems
C. Collado, Technical University of Catalonia; A. Grau, F. De Flaviis, University of California
THPL-2: Understanding and Analyzing the Performance of MIMO Systems from the Microwave
Perspective
M.E. Bialkowski, S. Durrani, K. Bialkowski, P. Uthansakul, University of Queensland
THPL-3: Miniaturized Rx Front-end Modules for Digital Beam Forming Arrays
C. Person, LEST/ENST Bretagne-UBO; J. Coupez, ENST Bretagne; E. Goron, Y. Toutain, H.
Lattard, F. Perrot, ANTENNESSA
THPM-1: A Novel 5 GHz and 2.4 GHz Dual Band Transmitter Using Microstrip Defected Ground
Structure
S. Kang, J. Choi, K. Koo, University of Incheon
54
PANEL SESSIONS (cont)
PWA: CAD TOOLS FOR MICROWAVE IC DESIGN
Date & Time: Wednesday, June 15, 12:00 PM–1:20 PM
Location:
PWC: VENTURE CAPITAL AND ENTREPRENEURIAL
OPPORTUNITIES IN MICROWAVES
Hyatt Regency, Beacon B
Organizer and Moderator:
Emilio Sovero, Vitesse Corp.
Panel:
Sponsor:
Kurt Johnson, Cadence Corp.
Lawrence Williams, Ansoft Corp.
Joe Civello, Agilent Technologies
Organizers:
Mike DeLisio, Wavestream Corp.
Dave Rutledge,
California Institute of Technology
Panel:
Ed Tuck, Falcon Fund
Rich Wolf, Head of Tech Transfer at Caltech
Doug Lockie, Gigabeam
Mehran Matloubian,
Smart Technology Ventures
Sponsor:
IMS 2005
The microwave industry has presented interesting opportunities for entrepreneurs. We have asked an outstanding panel to
participate, with noted representatives from academics, the venture community, as well as microwave entrepreneurs. Our panel
will discuss some of the new companies that they have been associated with, as well as the opportunities and challenges that
they encountered along the way.
PWB: TRENDS FOR FUTURE DEEP SPACE EXPLORATION
Location:
Hyatt Regency, Regency A/B/C
Organizers:
John Horton, J.B. Horton Group
Alina Moussessian, JPL/Caltech
Sponsor:
Hyatt Regency, Regency D/E
IMS 2005
The increasing complexity of microwave and millimeter-wave
circuits and systems requires a complete design system that will
go from the design to production with as little iteration as possible. At the present time a designer must use different tools for
different aspects of the design, i.e. electrical, electromagnetic,
thermal all of which could seriously impact its performance.
Proper interface is always a design risk. This panel will explore
current and future developments of integrated tools to address
these issues.
Panel:
Location:
PTHA: ON THE IMPACT OF NANOTECHNOLOGY
ON THE MICROWAVE FIELD
Date & Time: Thursday, June 16, 12:00 PM–1:20 PM
Rob Manning, JPL/Caltech
Adam Steltzner, JPL/Caltech
Chad Edwards, JPL/Caltech
Faramaz Davarian, JPL/Caltech
Location:
Hyatt Regency, Regency A/B
Organizer:
Héctor J. De Los Santos,
NanoMEMS Research, LLC
Panel:
Imran Mehdi, JPL, Caltech
Peter Burke, University of California, Irvine
Victor Lubecke, University of Hawaii
Robert E Miles, University of Leeds
Olivier Vendier, Alcatel Space
Robert Trew,
North Carolina State University
Sponsor:
IMS 2005
IMS 2005
This panel session will provide a forum to discuss challenges
and future technologies for deep space exploration. The panelists will discuss past and future Mars missions. This will include the successful Mars Exploration Rover mission and future
Mars Science Laboratory (MSL) and Mars Reconnaissance Orbiter (MRO) missions. Challenges of landing on Mars and future
deep space telecommunication strategies including a Ka-band
communication link will also be discussed.
Nanotechnology has been heralded as “the next big thing.” Indeed, the annual federal budget for Nanotechnology R&D
reached $849M in 2004. While the potential for big payoffs in the
areas of Nanoelectronics, Nanocomputation, Nanomechanics,
Nanoengineering, Nanobiotechnology, Nanomedicine and
Nanochemistry dominates research, little attention seems to
have been paid to the exploitation of nanotechnology in the field
of microwave technology. This panel brings together experts in
nanotechnology and microwaves, who will explore how the
virtues of nanotechnology, in particular, its ability to produce
electronic and mechanical devices with dimensions down to
nanometer scales, may motivate and impact the development of
new opportunities in our field of microwave technology.
55
FRIDAY TUTORIALS
TFA: FERRITE, FERROELECTRIC, AND OTHER SPECIAL
MATERIALS FOR MICROWAVE CONTROL
Date & Time: Friday, June 17; 8:00 AM–5:00 PM
Location:
vide tunability for filters, phase control for steerable antennas,
or nonreciprocal behavior. This workshop will concentrate on
the fabrication and application of a wide variety of these “microwave control materials.” Speakers from both industry and
academia from the US, Europe, and Japan will present results of
their ongoing studies. Several promising techniques aimed at
low-cost fabrication and improved performance of these materials have been under development in recent years. Entirely new
materials fabrication techniques are being investigated, and the
resulting microwave properties are being evaluated. The session
will start with a discussion of the criteria for selecting ferrite materials to achieve specific requirements of operating frequency,
power level, tunability, and environmental conditions such as
temperature. Emphasis will be on recent developments in manufacturing methods for these materials, including traditional ceramic processing, new tape casting methods, and low temperature cofired ceramic (LTCC) techniques. The next speakers will
describe new techniques for the fabrication of artificial ferrites
and composite ferrite/dielectric structures. These approaches
give a unique ability to control the microwave properties of
these materials. We next have a presentation on the application
of these types of ferrites for optical devices. The possibility of
making high frequency and millimeter-wave nonreciprocal devices without magnets will be explored in a presentation on the
fabrication and application of magnetic nanowires embedded in
nonmagnetic substrates. The application of nanotechnology
promises to allow entirely new microwave materials to be developed. Two talks will describe recent work in RF-absorbing ferrites for noise suppression in high speed digital systems, and the
development of international standards for these materials. The
final speakers will cover the companion “controlled material”
area of ferroelectrics. These are the dielectric analogs of ferrites.
An overview of the topic will be followed by presentations on recent advances in producing materials with improved microwave
properties.
This tutotial extends the sequence of workshops in previous
years: “Ferrite CAD and Applications” (1996), “System Requirements for Ferrite Components” and “Ferrite Measurements and
Device Applications” (both in 1997), “Integration of Ferrite Devices into Future Radar, Wireless and Space Applications”
(1998), “Future Trends in Ferrite Devices and Technology”
(2000), “Ferrite Devices and Materials for Millimeter-Wave Applications” (2001), “Issues in Ferrites and Dielectrics for High
Power Applications” (2003), “Modern Measurements of Ferrite
Materials for Microwave and Millimeter-wave Devices” (2004).
Topics & Speakers:
✗ Narrow Linewidth Ferrites and Behavior in Circulators,
G. Argentina, Pacific Ceramics
✗ Low-Anisotropy Ferrites and Hexagonal Ferrites,
T. Countis, Countis Labs
✗ Microwave Ferrites and Device Fabrication, T. Vaughn,
EMS Technologies
✗ LTCC Compatible Garnets, R. Lebourgeois, Thales R&T
✗ LTCC Compatible Dielectrics, J-P. Ganne, Thales R&T
✗ Ferromagnetic Loaded Composites as Substitute Materials
for Ferrites to Achieve Microwave Tunability, P. Queffelec,
P. Gelin, Univ. of Brest
✗ Garnet Oxide Crystals for Optical Devices, T. Sekijima,
Murata Mfg. Co. Ltd.
✗ Modeling and Design of Microwave Devices Based
on Ferromagnetic Nanowires, A. Saib, Université
Catholique de Louvain
✗ Noise Suppression Sheet/Films for Digital Devices
and Equipment, M. Yamaguchi, Tohoku University
✗ World Standardization of Noise Suppression Sheets at IEC
TC51/WG10, H. Ono, NEC Tokin Co.
✗ Tutorial Overview of Tunable Dielectrics, S. Stemmer,
✗ BST Process and Integration Issues, T. Taylor,
Agile Materials & Technologies Inc.
✗ MBE Growth of Oxides, D. Schlom, Penn State Univ.
Organizers:
S.N. Stitzer, Northrop Grumman Corp.
R. York, Agile Materials & Technologies
J.D. Adam, Northrop Grumman Corp.
L.E. Davis, University of Manchester
Sponsor:
MTT-13: Ferrites and Ferroelectrics
FRIDAY
Traditionally, the study of materials whose microwave properties can be controlled externally has focused on ferrites. Recent
advances in materials technology have expanded this topic so
that it now covers both magnetic and dielectric materials whose
microwave properties can be controlled by the application of external magnetic or electric fields. Use of these materials can pro-
56
FRIDAY TUTORIALS
TFB: SIGNAL INTEGRITY MODELING AND ANALYSIS
Date & Time: Friday, June 17; 8:00 AM–12:00 PM
Location:
trends and consequently, it makes signal integrity analysis a critical part in the design cycle. Therefore, accurate and complex
models that include second order effects become an essential
part in studying and analyzing the whole system performance.
Consequently, measurement, characterization, and validations of
these models become very vital in order to maximize the models
accuracy and render them more beneficial to the analysis. With
chip frequency approaching 5GHz and beyond and with the integration of RF fronts ends in mobile computing platforms, microwave principles have to be applied for managing electromagnetic interference. This is becoming a major problem due to the
complexity of the system containing thousands of interconnects
with embedded RF functions in the package.
This half-day workshop covers recent advances in signal integrity modeling and design. The topics covered include on-die
substrate coupling, a subject that has recently received considerable attention, especially with the emergence of the need for
GHz range mixed signal designs integration. The workshop will
also discuss modeling of on-die inductors and on-board EBG
structures, two critical advances that are expected to have a
strong impact on board and chip design. Moreover, the workshop will discuss practical 3D modeling for interconnects in full
wave analysis packages, including accurate port definitions and
placement. Different methodologies for targeting a comprehensive understanding for the system under test in both the frequency and time domains will be addressed. This workshop will
present these and other critical advances, but more importantly,
the workshop will address the relevance of these advances to
practical real-world engineering design.
Topics & Speakers:
✗ High-Speed Signal Integrity Issues, M. Abdulla, Intel Corp.
✗ Signal Integrity Methodologies; Time Domain vs. Frequency
Domain, A. Badawi, Cairo University
✗ Power Delivery Analysis, M. Swaminathan,
✗ EMI/EMC and Advanced Topics including Electromagnetic
Band Gap Structures, O.M. Ramahi, University of
Maryland at College Park
Organizers:
M. Abdulla, Intel Corp.
O.M. Ramahi, University of Maryland
at College Park
Sponsors:
MTT-1: Computer-Aided Design
MTT-15: Microwave Field Theory
In the last decade, the accumulated knowledge on signal integrity analysis and design has matured considerably. This is accompanied by the emergence of specialized simulations, modeling, and analysis tools. Typically, signal integrity analysis is applied to the system, package, and on-die circuit design cycles.
Furthermore, in complex system design, the signal integrity requirements strongly drive the physical design of the system,
such as on-die layout, package and board designs. In addition,
the on-chip system integration is among the current industry
57
FRIDAY WORKSHOPS
WFA: PHYSICS, THEORY, FABRICATION AND APPLICATIONS OF
MICROWAVE METAMATERIALS
Date & Time: Friday, June 17, 8:00 AM–5:00 PM
Location:
Software Defined Radios require specific concentration of RF
research and engineering work. The scope of this workshop is to
discuss the most important RF aspects of this field. Regulatory
issues may influence and will be influenced by the advance of
SDRs. Broadband and multiband antennas will play an important
role for the realization of SDRs with spectral adaptivity. In order
to shift the digital signal processing parts as close as possible to
the antenna the required RF components have to fulfill a number of requirements. Different schemes for the receiver architectures as well as transmitter approaches will be discussed. Presentations on SDR and beamforming and the relation between
analog and digital aspects of SDRs will conclude the workshop.
Topics & Speakers:
✗ Negative Index Metamaterials: Fundamentals and
Possibilities, D.R. Smith, Duke; J. Pendry,
Imperial College London
✗ Electromagnetic Theory of Metamaterials and Their
Potential Engineering Concepts, N. Engheta, University
of Pennsylvania; R.W. Ziolkowski, University of Arizona
✗ Negative Refractive Index Transmission Line Metamaterials
and Microwave Applications, G.V. Eleftheriades,
A.K. Iyer, University of Toronto
✗ Recent Advances in CRLH Based Microwave Circuit
Components, C. Caloz, École Polytechnique of Montreal,
T. Itoh, University of California, Los Angeles
✗ Application of Metamaterial Concepts to The Design Of
Compact Microwave Filters, F. Martín, Universitat
Autònoma de Barcelona; R. Marqués, Universidad de
Sevilla; M. Sorolla, Universidad Pública de Navarra
✗ Engineering Plasmonic Metamaterials and Superlens,
X. Zhang, University of California
Organizers:
C. Caloz, École Polytechnique of Montréal
F. Martín, Universitat Autònoma de Barcelona
Sponsor:
WFC: ADVANCES IN AUTOMATED MODELING
AND MICROWAVE DESIGN
Location:
Topics & Speakers:
✗ Knowledge-Aided Design, and Directions for Microwave
CAD, K.C. Gupta, University of Colorado
✗ Automated Design and Optimization Exploiting Surrogate
Models and Space Mapping, J.W. Bandler, Bandler Corp.
✗ Automated Modeling and Trends in ANNs for Microwave
Design, Q.J. Zhang, Carleton University
✗ Applications of Fuzzy Logic for Microwave Design,
R. Mansour, University of Waterloo
✗ Advances in Simulation and Optimization of Large
Nonlinear RF/Microwave Circuits, V. Rizzoli, University of
Bologna
✗ Automated Tuning and Optimization of Microwave Filters
and Multiplexers, M. Yu, ComDev
✗ Advances in Nonlinear Behavioral Modeling, D. Shreurs,
Katholieke University Leuven
✗ Applications of ANN to Microwave Component and Circuit
Modeling, J. Xu, Carleton University; M. Yagoub,
University of Ottawa
✗ Computational Intelligence, R. Hecht-Nielsen, University
of California San Diego
✗ RF Amplifier Modeling and Compensation: Model Reference
Adaptive Control (MRAC) and Cortical Theory Based
Models, P. Draxler, Qualcomm
Metamaterials (MMs) are electromagnetically homogeneous
structures exhibiting exciting properties not readily available in
nature. They include the so-called left-handed (LH) materials,
also referred to as negative refractive index (NRI) materials,
which are characterized by anti-parallel phase and group velocities or, equivalently, simultaneously negative permittivity and
permeability. Over the past five years, the fundamental properties of MMs have been demonstrated theoretically, numerically
and experimentally by various groups around the world, and the
first applications have already started to emerge. This workshop
displays a panel comprehending the most prominent pioneers of
MMs, who will cover all the aspects of the field: fundamental
physics and electromagnetic theory, transmission line theory
and microwave applications, and micro-nanofabrication technologies. In addition, future prospects for MMs will be discussed.
WFB: RF ASPECTS OF SOFTWARE DEFINED RADIO (SDR)
Location:
Topics & Speakers:
✗ Regulatory Issues: Spectrum Pooling, D. Shrum
✗ Broadband Antennas, S. Lindenmeier, Universität der
Bundeswehr München
✗ Configurable RF Systems, J.-F. Luy, DaimlerChrysler
✗ Direct RF Sampling, D. Akos, University of Colorado
✗ Frequency Conversion Processes in SDR Front-Ends,
T. Mack, DaimlerChrysler
✗ Six Port Technology, K. Wu, University of Montreal
✗ Challenges for SDR – Transmitters, G. Fischer,
Lucent Technologies
✗ SDR and Beamforming, J. Morton, University of Miami
✗ RF Front-End and Digital Signal Processing, M. Sliskovic,
HarmanBecker
J.-F. Luy, DaimlerChrysler
Y.T.J. Morton, University of Miami
Sponsors:
RFIC Symposium
Organizers:
Q.J. Zhang, Carleton University
K.C. Gupta, University of Colorado
Sponsor:
Significant advances continue in modeling and CAD, to meet
the challenges of next generation microwave design. Increasing
design complexity, coupled with tighter component tolerances
and shorter design cycles, demand tools that are faster, more accurate and more automated than possible today. It becomes important to achieve EM/physics-based design accuracy not only at
the component level, but also at the circuit and system levels.
Efficient modeling for linear and nonlinear circuits with
EM/physics oriented accuracy but much faster than direct
EM/physics simulations is necessary. Recent advances in application of Artificial Neural Networks (ANN) and fuzzy logic for
microwave design lead to new developments in efficient and automated modeling and CAD at both component and circuit levels. Applications are being made in modeling and design of microstrip and CPW circuits, multilayer interconnects, embedded
passives, printed antennas, LTCC circuits, semiconductor devices, measurement standards, filters, amplifiers, mixers and so
on. New CAD methods for optimization, statistical design, global
modeling, and computational electromagnetics exploiting computational intelligence concepts are being developed. Knowledge
based engineering concepts exploiting existing microwave
knowledge and information, are being formalized into advanced
microwave CAD methodologies such as knowledge-aided design,
Organizers:
58
FRIDAY WORKSHOPS
WFE: RECENT ADVANCES IN RF MEMS
Date & Time: Friday, June 17, 8:00 AM - 12:00 PM
knowledge-based neural networks, and space mapping. This
leads to new opportunities combining equivalent circuit/empirical models, EM/physics simulation, behavioral modeling, ANN
and optimization algorithms for fast and accurate design of microwave circuits and systems.
This workshop presents a tutorial review of the state of the art
in these emerging directions. The presentations highlight implementable methodologies for automated modeling and design of
microwave components, circuits and systems. The workshop
covers fundamental concepts and methodologies, industrial applications, and future trends in R&D.
Location:
Topics & Speakers:
✗ IBM Applications of RF MEMS, N. Hoivik, IBM Research
and Development
✗ RF MEMS for Consumer Handset Applications, A. Morris,
WiSpry
✗ RF MEMS Variable Capacitors for Consumer Wireless,
T.B.A. (unconfirmed), Philips
✗ Miniature MEMS Switched Capacitors for RF Applications,
D. Mercier, Univ. of Michigan
✗ Delivering RF MEMS Relays to Industry, T.B.A.
(unconfirmed), MagFusion
✗ High-Lifetime RF MEMS Relays, J. Maciel (unconfirmed),
RADANT MEMS
✗ RF MEMS Packaging, Testing, and Application, J. Ebel
(unconfirmed), AFRL Wright Labs
✗ Reliability Testing of RF MEMS Capacitive Switches at
THALES Research & Technology” A. Zaei, Thales
✗ High Reliability Low-Voltage Capacitive RF MEMS Switch,
C. Omahony, NMRC
✗ Advances in Phased Array Technologies, J. Rock, US Army
AM COM/AMRDEC
WFD: ADVANCES IN HIGH-EFFICIENCY POWER DEVICE
AND CIRCUIT TECHNOLOGIES
Date & Time: Friday, June 17, 8:00 AM - 5:00 PM
Location:
Topics & Speakers:
✗ High-Efficiency Power Amplifiers: An Overview,
J. Schellenberg, Schellenberg Associates
✗ Advances in Device Technology (HFET, LDMOS, GaN) for
Base Station Applications, C. Weitzel, W. Burger,
Freescale
✗ Advances in Device Technology (GaAs/InP, HBTs, pHEMTs,
etc.) for Microwave/Millimeter-wave Applications, R. Lai,
Northrop-Grumman
✗ High-Efficiency PAs for Base Station Applications,
S. Cripps, Hywave Assoc.
✗ 350W PA for 3G Base Stations, R. Ranson, Filtronic
✗ High-Efficiency Techniques for Wide Dynamic Range
Applications (Handsets), P. Asbeck, UCSD
✗ Advances in High-Efficiency PAs For Millimeter-wave
Applications, J. Komiak, BAE Systems
Organizers:
J. Schellenberg, Schellenberg Associates
B. Geller, iTerra Communications
Sponsors:
MTT-5, Microwave High-Power Techniques
Organizers:
D. Hyman, XCom Wireless, Inc.
G. Rebeiz, University of Michigan
Sponsor:
MTT-21, RF MEMS and Micromachining
RF MEMS developers have shown many dramatic technological advances in the last five years, including impressive performance, packaging, and lifetime testing. Many RF MEMS product
releases, however, have been lackluster, plagued by problems of
low yield, high cost, and lack of customer confidence. Some of
the big questions of 2000 to 2004 have been “Where are the RF
MEMS parts?” and “Why aren’t they being used?” Industry analysts have responded by scaling back expectations and market
penetration across all sectors. 2004 to 2005 has finally seen critical achievements regarding the leap to get RF MEMS out of
component laboratories and into the hands of eager (and patient) customers. These achievements are not about amazing
performance, or amazing cost reduction through amazing volumes. These achievements are about delivering parts and finally
establishing RF MEMS as an industry instead of a decades-long
science project.
The workshop is divided into two parts in one half day session.
Speakers in this workshop will discuss their problems and solutions to get RF MEMS parts shipped out the door. The first part
of the workshop will focus on testing and qualification stumbling
blocks and recent achievements. The second part of the workshop will focus on recent implementation of RF MEMS components into system-level demonstrations.
Current and projected commercial and military systems require microwave power amplifiers with ever increasing performance. Higher output power levels with even better linearity
and efficiency are required. All this, of course, must be achieved
at lower costs and higher reliability. Recent PA workshops have
generally focused on techniques to improve the linearity with little emphasis on efficiency. This workshop takes a somewhat different tack in that the primary focus is on efficiency, while examining the subsequent impact of efficiency on other performance parameters such as output power, linearity, gain,
bandwidth, stability and reliability. In general there is a definite
conflict between efficiency and linearity, and one of the objectives of this workshop is to explore this conflict and determine
cost-effective trade-offs.
With a focus on applications at microwave and millimeterwave frequencies (2 GHz on up), this workshop brings together
some of the leading experts in microwave device and circuit
technologies. The device topics include recent advances in
GaAs, InP and Si device technologies (HBT, pHEMT, HFET, LDMOS and large band-gap devices) with emphasis on techniques
(materials, gate length, breakdown voltage/leakage current, etc.)
to improve device efficiency. The circuit technology topics include biasing, class of operation, waveforming or input/output
tuning, etc. In addition, this workshop examines techniques to
improve the amplifier efficiency over a wide dynamic range, particularly important for cellular handset applications. Circuit configurations include Doherty, LINC, Envelope Elimination &
Restoration (Kahn) and Envelope Tracking. Practical commercial and military hardware examples will also be presented.
WFF: VERY LARGE MICROWAVE ARRAYS FOR RADIO
ASTRONOMY AND SPACE COMMUNICATIONS
Location:
Topics & Speakers:
✗ Introduction and Overview, S. Weinreb, Caltech/JPL
✗ Expansion of the Very Large Array (VLA), P. Napier,
NRAO
✗ Allen Telescope Array (ATA), D. DeBoer, SETI Institute
✗ Atacama Large Millimeter Array (ALMA), L. Daddario,
JPL
✗ An Array Based Deep Space Network (DSN), M. Gatti, JPL
59
FRIDAY WORKSHOPS
WFH: SEE THROUGH WALL RADARS
Date & Time: Friday, June 17, 1:00 PM–5:00 PM
✗ Large Array with Focal-Plane Array Feeds for the SKA,
P. Hall, CSIRO
✗ Phased-Array with All-Sky Imaging Capability,
J. Bi deVaate, Astron
✗ Very Low Noise Amplifiers for Very Large Arrays,
N. Wadefalk, Caltech
Organizer:
S. Weinreb, Caltech/JPL
Sponsors:
MTT-14, Microwave Low-Noise Techniques
Location:
Topics & Speakers:
✗ Time Domain Measurements – Foundations & Correlation
with Frequency Domain Measurements, S. Riad, Virginia
Tech
✗ Synthetic Aperture Radars – Fundamentals and
Applications, R. Avent, MIT Lincolin Lab
✗ SAR Sensor Technologies, K. Sorensen, Sandia National
Labs
✗ Image Construction Techniques, M. Abidi, University of
Tennessee
✗ See Through Walls, R. Paglione, Sarnoff Lab
✗ See Through Imaging, N. Enghata, University of
Pennsylvania
✗ See Through Walls Issues, J. Ross
Much greater sensitivity for reception of microwave signals
from space is needed to support the growth of the space exploration program and for astronomical observations concerning
fundamental questions about the formation of the universe. During the past decade the paradigm for increasing the microwave
sensitivity has shifted from the construction of increasingly larger parabolic reflectors to large arrays of smaller antennas. In effect electronics are replacing steel. The arrays have advantages
of lower cost per unit collecting area, higher angular resolution,
multiple beaming or imaging, and soft failure.
There are several new large arrays either under construction
or in design. This workshop is intended as a forum for the engineers working on these arrays to interact with each other and
with the suppliers of microwave components. It is anticipated
that on the order of $1B to $2B in antennas, microwave receivers, digital processing equipment, and software will be purchased for these arrays in the next decade.
Topics & Speakers:
✗ Introduction to EM/Circuit Codesign Flow, B. Brim,
Ansoft Corp.
✗ Application of Combined EM and Circuit Analysis
Techniques to Design a Dual Band Common Aperture
Antenna Array, R.L. Eisenhart, Eisenhart and Assoc.
✗ Co-Simulation Techniques Using 3D EM and Circuit
Simulators for Microwave Filter Implementations, S. Shin,
RS Microwave
✗ Combined Application of EM and Circuit Analysis to QuasiLumped Filter Design, D. Swanson, Tyco Electronics
✗ EM/Circuit Co-Design of Active Nonlinear Circuits,
Z. Popovic, University of Colorado
✗ An Overview of the Usage of EM and Circuit Analysis for RF
MEMS Design, G.M. Rebeiz, University of California,
San Diego
Organizers:
B. Brim, Ansoft Corp.
Z. Popovic, University of Colorado
Sponsor:
Organizers:
A.E. Fathy, University of Tennessee
N. Enghata, University of Pennsylvania
A. Hophar, Villinova University
M. Abidi, University of Tennessee
S. El-Ghazaly, University of Tennessee
Sponsor:
Today’s Army and especially the future Army must be prepared to fight in this new war zone with the same overmatching
operational capability that it has brought to the mobile battlefield. The challenge is to design, develop, and field advanced system concepts using the latest technologies that will give the soldier an advantage in this new “battlefield”: the urban terrain.
One such area is C4ISR technology and in particular synthetic
imaging technology to achieve success (psychological and physical defeat of the enemy) with minimum friendly casualties and
collateral damage. It is evident that successful tactical operations in Military Operations on Urban Terrain (MOUT) conditions will require a significant extension of C4ISR capabilities to
provide commanders with instantaneous, precise information
(measured in feet, not meters) on the 3D location and disposition of friendly, threat, and noncombatant personnel.
In an urban warfare scenario, door-to-door searches with possible enemy engagement are inevitable and if poorly planned or
executed could prove fatal. Ideally, in this tactical scenario, it is
desired to provide a new and enhanced situation awareness capability or knowledge for the soldier that would allow him/her to
know if and where people are located inside a building before
entering, therefore potentially preventing death and injury. During the search operation, revealing where people are hiding, e.g.
in a closet, without alerting them to the search is also required.
Basically, during Covert Operations & Urban Warfare the ability
to locate and assess an enemy position without risk while remaining undetected is mandatory.
“See-through-the-wall radar” would require developing more
than a fuzzy image or blob on the radar screen to identify targets. It is necessary to discriminate between a combatant or a
bystander, and even possibly identifying side arms or larger
weapons (i.e., wide RCS range of more than 20 dB). Therefore,
the required resolution, here for example, is in the range of centimeters (10 cm could be sufficient), and the developed radars
could range from being a simple fixed system (i.e., to estimate
target range), a 2D array for two-dimensional array (i.e., for a 2D
image), or even SAR radar for 2D or 3D images for a finer resolution. Current studies in this area will be presented from various
very active researchers including different points of views.
WFG: REDISCOVERING CIRCUIT DESIGN TECHNIQUES
FOR MICROWAVE COMPONENTS, CIRCUITS AND SUBSYSTEMS:
THE EFFICIENCY AND POWER OF EM/CIRCUIT CODESIGN
Date & Time: Friday, June 17, 1:00 PM–5:00 PM
Location:
This workshop will discuss microwave design procedures
which apply a combination of electromagnetic (EM) and circuit
analysis. Technical issues with the integration of EM and circuit
analysis will be reviewed and solutions presented via simple examples. A number of specific designs in which a combination of
EM and circuit analysis uniquely enabled the design or provided
significant efficiency of design will be reviewed. Applications
ranging from filters to amplifiers to MEMS, in both tube waveguide and multi-layered planar environments will be presented.
60
F
R
ARFTG 65th MICROWAVE MEASUREMENT CONFERENCE
T
A
G
Measurements for Millimeter-wave Applications
AUTOMATIC RF TECHNIQUES GROUP
65th
CONFERENCE ORGANIZATION
Conference Chair
Thomas G. Ruttan
Intel Corp.
T (503) 456-1245 F (503) 456-1223
[email protected]
Technical Program Chair
Nick Ridler
National Physical Lab
T +44-20-8943-7116 F +44-20-8943-7176
[email protected]
Exhibits Chair
Prof. Joe Tauritz
Universiteit Twente
+31-53-489-4330
[email protected]
EXECUTIVE COMMITTEE
Brian Pugh, President
Quorum Systems Inc.
J. Gregory Burns, Vice President, Publications
Northrop Grumman
Nick Ridler, Secretary
National Physical Lab
Ken Wong, Treasurer
Agilent Technologies Inc.
Joseph Tauritz, Exhibits
Universiteit Twente
David Walker, Education
NIST
Welcome to the
Automatic RF Techniques Group (ARFTG) Conference being
held at the Renaissance Hotel on Friday, June 17, 2005. The conference will include
technical presentations, an interactive forum, and an exhibition; all to give you ample
opportunity to interact with your colleagues in the automated RF and microwave test
community. The conference theme is “Measurements for Millimeter-wave Applications”
with papers focusing on measurements for point-to-point communications, line-of-sight
systems, automotive radar, differential measurements, traceability to national standards
laboratories, models for measurement verification, vector network analysis, large-signal
network analysis, power and noise including on-wafer measurements. Also, be sure to
check for any joint ARFTG/IMS workshop being held. This year ARFTG is co-sponsoring
two workshops: “On-wafer Microwave Measurement: State-of-the-Art and Future Directions” and “High Frequency Digital Backplane Interconnect Characterization and Design.” An important part of any ARFTG Conference is the opportunity to interact oneon-one with colleagues, experts and vendors in the RF and microwave test and measurement community. Whether your interests include high-throughput production or
one-of-a-kind metrology measurements, complex systems or simple circuit modeling,
small signal S-parameter or large-signal non-linear measurements, phase noise or noise
figure, dc or lightwave, you will find an interested party and most likely an expert. Starting with the continental breakfast in the exhibition area, continuing through the two exhibition/interactive forum sessions and the luncheon, there will be ample opportunity
for discussion with others facing similar challenges. You, along with the other attendees,
may find that these interactions are often the best source of ideas and information for
their current projects. So come and join us. You’ll find that the atmosphere is informal
and friendly.
LOCATION
The 65th ARFTG conference will be held in Ballrooms I–V and the Foyer of the Renaissance Hotel. You may reserve your hotel room using the IMS Conference Housing
Form. Visit www.ims2005.org for more information.
Leonard Hayden, Publicity
Cascade Microtech
Mohamed Sayed, Nominations
Consultant
SCHEDULE
William Eisenstadt, Standards
Univerity of Florida
Ronald Ginley, Electronic Communication
NIST
Raymond W. Tucker, Membership
Air Force Research Lab
Thomas G. Ruttan, Technical Coordinator
Intel Corp.
Dominique Schreurs, Workshops
Ku Leuven
Uwe Arz, Awards
PTB
Charles Wilker, MTT-S Liaison
DuPont Superconductivity
Friday, June 17
Activity
Renaissance Hotel
7:00 AM – 4:00 PM
7:00 AM – 8:00 AM
7:00 AM – 8:00 AM
8:00 AM – 9:45 AM
9:45 AM – 10:30 AM
10:30 AM – 12:00 NOON
12:00 NOON – 1:15 PM
1:15 PM – 3:00 PM
3:00 PM – 3:45 PM
3:45 PM – 5:00 PM
Exhibition and Interactive Forum
Continental Breakfast
Technical Session 1
Exhibition/Poster Session
Technical Session 2
Luncheon
Technical Session 3
Exhibition/Poster Session
Technical Session 4
Ballroom III & Foyer
Ballroom I & II
Ballroom I & II
Ballroom IV & V
Ballroom IV & V
Ballroom I & II
Ballroom IV & V
Ballroom IV & V
EX-OFFICIO MEMBERS
Chris Potter, ARMMS Liaison
P&H Technology Consultants
Jim L. Taylor, Executive Secretary
EXHIBITS
The 65th ARFTG Conference also offers an outstanding exhibition opportunity. Please contact our Exhibits Chair directly for further information.
www.arftg.org
61
µAPS
Microwave Application
& Product Seminars
MESSAGE FROM THE 2005 µAPS CHAIRMAN
The Microwave Application Seminars (µAPS), now in their 10th year,
serve as a forum for exhibitors at the International Mi-crowave Symposium to present the technology behind their commercial products and the special capabilities of
their products. The presentations are 20 minutes
in length and are open to all conference and exhibit attendees. Topics include CAD and Modeling Products and Technologies, Instrumentation
and Measurement Techniques, Passive and Active Components, Subassemblies — Packaging —
Interconnects and Manufacturing Processes.
Speakers will often provide additional literature
and information related to their products at the
presentations and each person who attends can
James Weiler receive a free CD-ROM with information from all
presentations. Sessions will run from Tuesday through Thursday, June
14–16, at the Long Beach Convention Center, inside the exhibit area.
We’re looking forward to seeing you in Long Beach!
2005 µAPS SCHEDULE
The 2005 Microwave Application & Product Seminars will be
held on Tuesday, Wednesday and Thursday, June 14–16, 2005 in
conjunction with the 2005 International Microwave Symposium
at the Long Beach Convention Center. The series of individual
presentations is open to any exhibition or conference attendee.
9:00 AM–4:30 PM
9:00 AM–4:50 PM
9:00 AM–12:00 PM
James Weiler, µAPS Chair
µAPS — MICROWAVE APPLICATION & PRODUCT SEMINARS — TECHNICAL PROGRAM
TUESDAY, June 14, 2005 — LBCC
SiGe BiCMOS Transceiver and SiGe Power Amplifier for 5.8 GHz WDCT Applications
REIMANN, KRIMMER, BOSCHOF, GERLACH, ATMEL
A 5–6 GHz High Gain SiGe Power Amplifier
BISCHOF, GERLACH, ATMEL
IMS Plenary Session (above Exhibit Hall)
Transient Protection of MMIC Amplifiers
M. MORDKOVICH, MINI-CIRCUITS
PA Plus
S. MARTIN, SKYWORKS
AlGaAs PIN Diode Switches
CURCIO, BROGLE, HOAG, M/A-COM
Heterolithic Microwave Integrated Circuits
T. BOLES, M/A-COM
Very High Power MMICs Using 24V HVMSAG GaAs Process
E. GRIFFIN, M/A-COM
High Linearity HBT Driver Amplifiers
MCINTOSH, DALTON, FOX, RIZZI, M/A-COM
Automotive Applications for GaAs MMIC Amplifiers
G. DELAVAL, P. LABASSE, UMS
9:00–9:20 AM
9:20–9:40 AM
SESSION IA • 9:00–9:40 AM
Active Components
9:40 AM–12:00 PM
12:00–12:20 PM
12:20–12:40 PM
12:40–12:50 PM
SESSION IB
12:00–1:40 PM
12:50–1:00 PM
Active Components
1:00–1:10 PM
1:10–1:20 PM
1:20–1:40 PM
Dual-band Filtered GPS Low-noise Amplifier
W.E. GORDON, SPECTRUM MICROWAVE
Low Phase Noise for Crystal Oscillators
DAVIS, PAINTER, CRANE AERO & ELECTRONICS
A New High Q Microwave Resonator Tech for Oscillator and Filter Applications
BATES, ZALOGLU, DIELECTRIC LABS
Miniature LTCC Passive VHF and UHF Components
DORAHELM, RADHA, SETTY, MINI-CIRCUITS
LTCC Mixer Amplifiers Provide S-of-A Performance
DAXIONG JI,SETTY, MINI-CIRCUITS
RFID Readers
REYNOLDS, WEIGAND, M/A-COM
New Chipscale Small-Footprint PIN Diodes
BROGLE, CARCIO, BUKOWSKI, M/A-COM
Optical Micro-Resonator Microwave or Optical Filters
D. FUNG, OEWAVES
High Performance Multi-Throw Switches for Handset Applications
GEORGE SAMIOTES, M/A-COM
Low Cost Power Amplifiers for WLAN/PHS Applications
DALTON, FOX, MCINTOSH, RIZZI, M/A-COM
Low Cost Power Amplifiers for Cordless Applications
STUDTMANN, ZHAO, MCINTOSH, RIZZI, M/A-COM
Difference Between CMOS and GaAs Switch Performance
R. BAKER, PEREGRINE SEMICONDUCTOR
Power Amplifiers
E. MAALOUF, FREESCALE
62
1:40–2:00 PM
2:00–2:20 PM
2:20–2:30 PM
2:30–2:40 PM
2:40–2:50 PM
2:50–3:00 PM
SESSION II
1:40–4:30 PM
3:00–3:20 PM
Components
3:00–3:10 PM
3:10–3:20 PM
3:20–3:30 PM
3:30–3:50 PM
3:50–4:10 PM
4:10–4:30 PM
WEDNESDAY, June 15, 2005 — LBCC
CAD and Modeling Products and Techniques
C. EMSON, VECTOR FIELDS
Mixer Synthesis
R. EHRICH, EAGLEWARE CORP.
IE3D EM Simulation and Optimization Package Ver. 11
J-X. ZHENG, ZELAND SOFTWARE
Accurate Models Accelerate Reference Designs for RFIC Amplifiers
CAPWELL, CLAUSEN, WELLER, DUNLEAVY, MODELITHICS
FEKO EM Structure Simulator
M. O’BRIEN, EMSS
Time Gated Statistical Analysis of Power
R. THEISS, BOONTON ELECTRONICS
Innovative Methods in Remcom Inc. Simulation Software
LUEBBERS, LANGDON, CARPENTER, REMCON
A Novel Software System for Hybrid Electromagnetic-thermodynamic Simulation
MALGORZATA CELUCH, QWED & WARSAW UNIV.
WASP-NET Fast Microwave Component and Antenna Design and Optimization
F. ARNDT, MIG MICROWAVE INNOVATION
WaveWizard CAD Solution for Passive Waveguide Components
R. BEYER, MICIAN
EMPiCASSO, EMLouge and EMTerrano: CAD Tools for EM Modeling
K. SABET, EMAG TECH
Neural Based Modeling of EM Structures and Microwave Devices
Q.J. ZHANG, CARLETON UNIVERSITY
Schematic-driven EM Extraction
MICHAEL HEIMLICH, APPLIED WAVE RESEARCH
Millimeter-wave Imaging-TADAR
D. VIZARD, J. FRANCO, FARRAN TECHNOLOGY
ELVA-1 Family of Broadband mm-wave Radios
D. KORNEEV, ELVA-1 MILLIMETER-WAVE
Enhanced Thin Film Technology for High Density Integration
D. KAGI, REINHARDT MICROTECH
Conductor Surface Profile (Rrms) on Total Circuit Attenuation in Microstrip
NORMYLE, MCCARTHY, WYNANTS, TACONIC
Ultra Stable Tuner
V. MALLETTE, FOCUS MICROWAVES INC.
Multi Purpose Tuner
C. TSIRONIS, FOCUS MICROWAVES INC.
High Power High Speed 100 MHz Mechanical Tuner
R. MEIERER, FOCUS MICROWAVES INC.
High Performance Silicon Based Passive Modulators
R. HOULILAN, M/A-COM
R-Pak High Power RF & Microwave Liquid Crystal Polymer Packages
J. ROMAN, RJR POLYMERS
Integrating Thermal Management Solutions in PWBs
JOHNSON, MCMASTER, MERIX CORP.
Organic Laminate Alternative to LTCC
J. CHAMBERLIN, JMD
Microwave Digital Receiver Design Technique
YI, YANG, HEFEI HTMICROWAVE CO. LTD.
9:00–9:20 AM
9:20–9:40 AM
9:40–10:00 AM
10:00–10:20 AM
10:20–10:40 AM
10:40–11:00 AM
SESSION III
9:00 AM–1:20 PM
11:00–11:20 AM
CAD
11:20–11:40 AM
11:40–12:00 PM
12:00–12:20 PM
12:20–12:40 PM
12:40–1:00 PM
1:00–1:20 PM
1:20–1:40 PM
1:40–2:00 PM
2:00–2:20 PM
2:20–2:40 PM
2:40–2:50 PM
SESSION IV
1:20–4:50 PM
2:50–3:00 PM
Packages & Materials
3:00–3:10 PM
3:10–3:30 PM
3:30–3:50 PM
3:50–4:10 PM
4:10–4:30 PM
4:30–4:50 PM
THURSDAY, June 16, 2005 — LBCC
Millimeter-wave Measurement of Complex Permittivity
H. SUZUKI, KEYCOM
Advances in Load-Pull Based Device Characterization
G. SIMPSON, MAURY MICROWAVE
Modern VNA Measurement Techniques for Mixers and Amplifiers
D. SAVAGE, AGILENT
9:00–9:20 AM
SESSION V
9:00–10:00 AM
9:20–9:40 AM
Test & Measurement
9:40–10:00 AM
Electroless and Electrolytic Au Plating for RoHS Compliant Packaging
PATEL, DYE, MCV TECHNOLOGIES INC.
Miniature Low Loss High Selectivity Microwave Planar Filters
BATES, ZAGLOGLU, DIELECTRIC LABS
Frequency Converters
T. LIU, FARRAN TECHNOLOGY
Direct Quadrature Modulator
S. MARTIN, SKYWORKS
45W/90W/180W GaN HEMT for Base Station Applications
S. NAKAJIMA, EUDYNA
200 kW RF Power Amplifier Using LDMOS Transistors
S.K. LEONG, POLYFET RF DEVICES
10:00–10:20 AM
10:20–10:40 AM
SESSION VI
10:00–11:40 AM
10:40–11:00 AM
Components & Processes
11:00–11:20 AM
11:20–11:40 AM
11:40 AM–12:00 PM
63
EXHIBITORS
The MTT-S Exhibition is an annual event that has taken place since 1970. It
comprises more than 450 microwave, subassembly, component, device, material, instrument and design software suppliers and each year draws approximately 10,000
microwave engineers involved in the design of systems, subsystems, components
3G Metalworx
A-Alpha Waveguide Co.
Accent Optical Technologies
Accu-Tech Laser Proessing Inc.
Accumet Engineering Corp.
Actipass Co. Ltd.
AdTech Ceramics
Advance Reproductions Corp.
Advanced Control Components Inc.
Advanced Modular Sputtering Inc.
Advanced Power Technology RF
Advanced Test Equipment
Aeroflex Inc.
Aerowave Inc.
Aethercomm Inc.
Agilent Technologies
Aimmet Industrial Co. Ltd.
Akon Inc.
ALC Microwave Inc.
Altair Technologies Inc.
American Microwave Corporation
American Technical Ceramics
AMETEK Specialty Metal Products
AML Communications Inc.
Amplifonix
AmpliTech Inc. – Gold Sponsor
Analog Devices Inc.
Anaren
Anatech Electronics Inc.
Anritsu Co.
Ansoft Corp. – Gold Sponsor
Antelope Valley Microwave
Antenna Systems Magazine
Applied Engineering Products
Applied Radar Inc.
Applied Thin-Film Products
Applied Wave Research Inc.
AR Worldwide
ARA/Seavey Engineering
ARC Technologies Inc.
Arlon Materials for Electronics
Artech House Publishers
Assemblies Inc.
Astrolab Inc.
Atmel Corp.
Auriga Measurement Systems LLC
Avalon Equipment Corp.
Avnet Electronics Marketing
AVX Corp.
Bandwidth Semiconductor LLC
Barry Industries Inc.
Besser Associates Inc.
Bird Technologies Group
BL Microwave Ltd.
Boonton Electronics
Bradley University
Bullen Ultrasonics Inc.
C-MAC MicroTechnology
C.E. Precision Assemblies Inc.
CAD Design Software
California Eastern Labs
Cambridge University Press
CAP Wireless Inc.
Carleton University
Cascade Microtech
Celeritek Inc.
Centellax Inc.
Century Seals Inc.
CeramTec North America
Cernex Inc.
Changzhou Wujin Fengshi Comm Equip
Channel Microwave Corp.
Charter Engineering Inc.
Chelton Microwave
Chin Nan Precision Electronics Co.
Ciao Wireless Inc.
Circuits Processing Technology
ClearComm Technologies LLC
Coilcraft Inc.
Coleman Microwave Co.
ComDev Ltd.
Commercial Microwave Technology
Compac Development Corp.
Compel Electronics Inc.
Compex Corp.
Component Distributors Inc.
Component Sources International
Connectronics Inc.
CoorsTek
Corning Gilbert Inc.
Corry Micronics
Cougar Components Corp.
CPI Canada Inc.
Crane Aerospace & Electronics
Cree Microwave Inc.
CST Of America Inc. – Gold Sponsor
CTT Inc.
Cuming Microwave Corp.
Custom Cable Assemblies Inc.
Cyber Technologies USA
DA-LightCom.Micronic
Daico Industries Inc.
DBm
Delta Electronics Mfg. Corp.
Delta Microwave
DeWeyl Tool Company
Dexter Magnetic Technologies Inc.
Diablo Industries Inc.
Diamond Antenna
Dielectric Laboratories Inc.
DiTom Microwave Inc.
Dorado Instrumentation
Dow Key Microwave
DRS-Signal Sulutions West (SSW)
Ducommun Technologies Inc.
DuPont Microcircuit Materials
Dynawave Inc.
Eagleware-Elanix
Eclipse Microwave Inc.
EDO Corp.
EE – Evaluation Engineering
Egide USA Inc.
Elcom Technologies Inc.
Electro Rent Corp.
Elisra Electronic Systems Ltd.
Elva-1 Ltd.
EM Research Inc.
EM Software & Systems
EMAG Technologies Inc.
Emerson & Cuming Microwave Products
Emerson Network Power
EMF Systems
Emhiser Micro-Tech
Empower RF Systems
EMS Technologies Inc.
Enon Microwave Inc.
ETS – Lindgren
Eudyna Devices USA Inc.
European Business Press/CMP
European Microwave Week
Excelics Semiconductor Inc.
EZ Form Cable Corp.
F&K Delvotec Inc.
Fairchild Semiconductor
Farran Technology Ltd.
Fastron Electronics Inc.
FCT Electronics LP
Ferdinand Braun Institut (FBH)
Ferrite Co., The
Filtel Microwave Inc.
Filtran Microcircuits Inc.
Filtronic Compound Semiconductors
Filtronic Sage Laboratories Inc.
First Technology
Flann Microwave Ltd.
Flexco Microwave Inc.
Flomerics Inc.
Florida RF Labs Inc.
Focus Microwaves Inc.
Freescale Semiconductor –
Platinum Sponsor
FTS Systems Inc.
G.T. Microwave Inc.
Gaiser Tool Co.
GGB Industries Inc.
Giga-Tronics
GigaLane Co. Ltd.
Global Communication Semiconductors
Gore, W.L., & Associates Inc.
Gowanda Electronics
Harbour Industries
Haverhill Cable & Mfg. Corp.
HCC Industries Inc.
Herley Industries Inc.
Herotek Inc.
Hesse & Knipps Inc.
High Frequency Electronics
Hittite Microwave Corp.
HoSung Technics Co. Ltd.
HT Microwave (HeFei) Co. Ltd.
Huber + Suhner Inc.
IEEE Microwave Magazine
IMST GmbH
Infineon Technologies – Silver Sponsor
InnoSent GmbH
Integra Technologies Inc.
International Manufacturing Svcs.
Interpoint, a Crane co.
Ion Beam Milling Inc.
and devices. The 2005 Exhibition will be held in the Long Beach Convention Center.
Exhibition hours are Tuesday, June 14 and Wednesday, June 15 from 9:00 AM to 5:00
PM, and Thursday, June 16 from 9:00 AM to 3:00 PM. Following is a list of exhibiting
companies. The list is complete as of press time, but may not include all companies.
IRC/TT Electronics
Isotec Corp.
iTerra Communications
ITF Co. Ltd.
ITT Industries
IW Inc.
J MicroTechnology Inc.
JCA, An Endwave Company
Jersey Microwave
JFW Industries Inc.
JMD
Johanson Manufacturing Corp.
Johanson Technology Inc.
Johnson Components
Johnstech International Inc.
JQL Electronics Inc.
JyeBao Co. Ltd.
K&L Microwave Inc.
Keithley Instruments Inc.
Keragis Corp.
Keycom Corporation
KMIC Technology Inc.
KP Microwave Components Inc.
Krytar Inc.
KW Microwave Corp.
Kyocera America Inc.
L-3 Electron Devices
Labtech Ltd.
Lark Engineering Co.
Litron Inc.
LNX Corp.
Locus Microwave
Logus Microwave Corp.
Lorch Microwave
LPKF Laser & Electronics
Lucas/Signatone Corp.
M/A-COM Inc.
M2 Global Technology Ltd.
Maury Microwave Corp.
McGeary, S.G. Co.
MCV Technologies Inc.
MECA Electronics Inc.
Mega Circuit Inc.
MegaPhase
Meggitt Safety Systems Inc.
Merix Corp.
Merrimac Industries Inc.
MICA Microwave
Mician GmbH
Micreo Limited
Micro Lambda Wireless Inc.
Micro Networks Corp.
Micro-Chem Inc.
Micro-Coax Inc.
Micro-Mode Products Inc.
MicroFab Inc.
Microfabrica Inc.
Micrometrics Inc.
Micronetics Inc.
Micronetics Noise & Products Group
Micronetics VCO Group
Microphase Corp.
Microsemi Corp.
Microtech Inc.
Microwave Applications Group
Microwave Communications Labs Inc.
Microwave Concepts Inc.
Microwave Development Co. Inc.
Microwave Development Labs Inc.
Microwave Device Technology Corp.
Microwave Dynamics
Microwave Engineering Europe
Microwave Journal
Microwave Product Digest
Microwave Resources Inc.
Microwave Technology Inc.
Microwaves & RF
Mid-Atlantic RF Systems
MiG Microwave Innovation Group
Millitech Inc.
Milmega Ltd.
Mimix Broadband Inc. – Silver Sponsor
Mini-Circuits – Gold Sponsor
Mini-Systems Inc.
Mission Telecom Co. (KWLI)
Mitel Srl
MITEQ Inc.
Mitsubishi Electric & Electronics
Modelithics Inc.
Modular Components National Inc.
Molex Inc.-RF/Microwave Connector
Morecom International
Morgan Advanced Ceramics, GBC
Morgan Electro Ceramics
MtronPTI
64
M.T. srl
Murata Electronics N.A. Inc. –
Silver Sponsor
Nagase
Narda An L-3 Communications Co.
Natel Engineering Co. Inc.
National Instruments
NDK America Inc.
NEC Microwave Tube Ltd.
Neltec
Netcom Inc.
Networks International Corp.
NICT (Nat’l. Inst. Info. & Comm. Tech.)
Noble Publishing
Noise Com
Northeast Electronics Corp.
Northrop Grumman
Novacap
NTK Technologies Inc.
Octagon Communications
OEwaves Inc.
OPHIR RF Inc.
P/M Industries Inc.
Palomar Technologies
Pascall Electronics Ltd.
Passive Microwave Technology
Penn Engineering Components Inc.
Penton Media Inc.
Peregrine Semiconductor Corp.
Philips Semiconductors
Piconics Inc.
Picosecond Pulse Labs
Plextek Ltd.
Polyfet RF Devices
Polyflon, A Crane Co.
Poseidon Scientific Instruments
Precision Photo-Fab Inc.
Presidio Components Inc.
Process Materials Inc.
Pulsar Microwave Corp.
Q Microwave Inc.
Q-Tech Corp.
Quantum Leap Packaging Inc.
Queens Plating Co. Inc.
QUEST Microwave Inc.
QuinStar Technology Inc.
QWED
R&F Products, Laird Technologies
R&K Company Ltd.
R-Theta Thermal Solutions Inc.
Racal Instruments
Rache Corp.
Radiall Inc.
Reactel Inc.
Reed Business Information
Reinhardt Microtech AG
RelComm Technologies
Remcom Inc.
REMEC Inc.
Remtec Inc.
Renaissance Electronics Corp.
Resin Systems Corp.
RF Depot.Com Inc.
RF Design
RF Globalnet
RF Industries
RF Integrated Corp.
RF Micro Devices – Gold Sponsor
RFHIC
Richardson Electronics
RJR Polymers Inc.
RLC Electronics Inc.
Rockwell Scientific
Rogers Corp.
Rohde & Schwarz Inc.
Roos Instruments Inc.
Rosenberger N.A. LLC
RTx Technology Co. Ltd.
San-Tron
Sandvik Osprey Ltd.
Sangshin Elecom Co. Ltd.
Sarnoff Corp.
SatCon Electronics
Sawcom Tech Inc.
Schleifring Und Apparatebau GmbH
Scientific Microwave Corp.
SDP Components Inc.
Semflex Inc.
Semi Dice Inc.
Semicon Associates
SG Technology
SGC Technologies Inc.
Shadow Technologies Inc.
Shenzhen Kingsignal Cable Tech Co.
Shoulder Electroniccs Limited
Sigma Systems Corp.
Simulation Technology & Applied Res
Sinclair Manufacturing
Sirenza Microdevices Inc.
Skyworks Solutions Inc.
Smart R&C Co. Ltd.
Sonnet Software Inc.
Sonoma Scientific Inc.
Sophia Wireless Inc.
Soshin Electronics
Sources East
Southwest Microwave Inc.
Spectra-Mat Inc.
Spectrum Elektrotechnik GmbH
Spectrum Microwave
Sprague-Goodman Electronics Inc.
SSI Cable Corp.
Stamping Technologies Inc.
State Of The Art Inc.
STC Microwave Systems, a Crane co.
STMicroelectronics Inc.
Storm Products Co.
StratEdge Corp.
SUSS MicroTec Inc.
SV Microwave Inc.
Swift, C.W. & Associates Inc.
Synergy Microwave Corp.
Sypris Test And Measurement
Taconic
Talley Communications Corp.
Tecdia Inc.
Technical Research & Manufacturing
Tektronix Inc.
Teledyne MEC
Teledyne Microwave
Teledyne Relays
Teledyne Reynolds
Teledyne Microelectronic Technologies
Telegartner Inc.
Telephus Inc.
Temptronic Corp.
Tensolite
Terabeam/HXI
Test Equity Inc.
Thales Components Corp.
Thin Film Concepts Inc.
Thin Film Technology
Thinfilms Inc.
Times Microwave Systems
TLC Precision Wafer Technology
Tokimec Inc.
Toshiba America Electronic Comp.
TRAK Microwave (a Smiths co.)
Trans-Tech Inc.
Transcom Inc.
Trilithic Inc.
TriQuint Semiconductor
Tronser Inc.
TRS-RenTelco
TRU Corp.
Tuck, A.J. Co.
Tyco Electronics/Printed Circuit Gr.
UltraSource Inc.
United Monolithic Semiconductors
Universal Circuits Inc.
Universal Microwave Corp.
Universal Switching Corp.
UTE Microwave Inc.
Valpey Fisher Corp.
Vector Fields Inc.
Vectron International
VIDA Products Inc.
Vishay Intertechnology Inc.
Wall, A.T. Co.
Wavestream Corp.
Wenzel Associates Inc.
Werlatone Inc.
West Bond Inc.
Wiley, John & Sons Inc.
Williams Advanced Materials
WIN Semiconductors Corp.
Winchester Electronics
Wireless Design & Development
Wireless Europe
WiseWave Technologies Inc.
WJ Communications Inc.
XCom Wireless Inc.
Xpedion Design Systems Inc.
Zeland Software Inc. – Silver Sponsor
Zentrix
Zifor Enterprise Co. Ltd.
IEEE MTT-S ADMINISTRATIVE COMMITTEE
2005 OFFICERS
President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .K.C. Gupta
Vice President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Karl Varian
Treasurer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mike Harris
Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Amir Mortazawi
ELECTED ADCOM MEMBERS
2005
2006
2007
M. DeLisio
S.M. El-Ghazaly
J. Hausner
K.C. Gupta
H.M. Harris
T. Lee
L. Katehi
D. Harvey
J. Modelski
S. Kawasaki
J.S. Kenney
V.K. Nair
D. Lovelace
N. Kolias
B.S. Perlman
R. Sorrentino
D. Rutledge
W.A. Shiroma
K.R. Varian
R. Weigel
R. Snyder
IMMEDIATE PAST PRESIDENTS
2004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.J. Trew
2003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .M.J. Schindler
2002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.T. Barr, IV
HONORARY LIFE MEMBERS
S.B. Cohn
A.A. Oliner
K. Tomiyasu
T. Itoh
T.S. Saad
L. Young
FUTURE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIA
2006 — SAN FRANCISCO, CA — JUNE 11–16, 2006
General Chairman
TPC Co-Chairman
John Barr
Tel (707) 577-2350
[email protected]
Paul Khanna
Celeritek
Tel (408) 330-1351
[email protected]
Finance
TPC Co-Chairman
Roger Pollard
The University of Leeds
Tel +44 (113) 3432002
[email protected]
Local Arrangements
Steve Rosenau
Tel (650) 485-3728
[email protected]
Publicity
Steve Brozovich
Snap-On Diagnostics
Tel (408) 292-2526 x359
[email protected]
Ken Wong
Tel (707) 577-2616
[email protected]
Secretary
Simon Wood
Cree Microwave
Tel (408) 962-7712
[email protected]
2007—HONOLULU, HI
2009—BOSTON, MA
2011—BALTIMORE, MD
June, 2007
Co-Chairmen
June 2009
Chairman
June 2011
Chairman
Wayne Shiroma
University of Hawaii
Tel (808) 956-7218
[email protected]
Mike DeLisio
Wavestream Corp.
Tel (909) 599-9080
[email protected]
Fred Schindler
RF Micro Devices
Tel (978) 670-2230
[email protected]
Jeffrey Pond
Naval Research Laboratory
Tel (202) 767-2862
[email protected]
2008—ATLANTA, GA
2010—ANAHEIM, CA
2012—MONTREAL, CAN
June, 2008
Chairman
June 2010
Chairman
June 2012
Chairman
Joy Laskar
Georgia Tech
Tel (404) 894-5268
[email protected]
J.K. McKinney
Dura Sales of Southern California Inc.
Tel (909) 612-1044
[email protected]
65
Ke Wu
Ecole Polytechnique
Tel (514) 340-4711 x5991
[email protected]
2005 IEEE MTT-S AWARDS
2005 MICROWAVE CAREER AWARD
This award recognizes an individual for a career of meritorious
achievement and outstanding technical contribution in the field of microwave theory and techniques.
This year’s recipient is David N. McQuiddy, Jr.
Citation
2005 MICROWAVE PRIZE
The Microwave Prize recognizes, on an annual basis, the most significant contribution by a published paper to the field of interest of the Microwave Theory and Techniques Society. Papers under consideration are
those published during the period January 1 to December 31 of the year
preceding the Fall Meeting of the Administrative Committee at which
the award is considered.
This year’s recipients are Milan M. Ilic and Branislav M. Notaros.
Each Citation reads:
“FOR A CAREER OF LEADERSHIP, MERITORIOUS ACHIEVEMENT,
CREATIVITY AND OUTSTANDING CONTRIBUTIONS IN THE FIELD
OF MICROWAVE THEORY AND TECHNIQUES.”
“FOR THEIR PAPER, ‘HIGHER ORDER HIERARCHICAL CURVED
HEXAHEDRAL VECTOR FINITE ELEMENTS FOR
ELECTROMAGNETIC MODELING’, PUBLISHED IN THE IEEE
TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES,
VOL. 51, NO. 3, MARCH 2003, PAGES
1026–1033.”
2005 DISTINGUISHED SERVICE AWARD
This award is given in recognition of significant contributions and outstanding service to the Microwave Theory and Techniques Society and
the microwave profession over a sustained period of time.
This year’s recipient is Harlan G. Howe, Jr.
Citation
2005 N. WALTER COX AWARD
The N. Walter Cox Award has been established in recognition of the
qualities of N. Walter Cox and his service to the MTT Society prior to his
untimely death in 1988. It is given to a Society volunteer whose efforts on
behalf of MTT-S best exemplify Walter’s spirit and dedication.
This year’s recipient is Jozef Modelski.
Citation
“FOR HIS OUTSTANDING AND DEDICATED SERVICE TO THE
SOCIETY.”
2005 DISTINGUISHED EDUCATOR AWARD
This award was inspired by the untimely death of Prof. F. J. Rosenbaum (1937–1992), an outstanding teacher of microwave science and a
dedicated Administrative Committee Member and contributor. The
award recognizes a distinguished educator in the field of microwave engineering and science who best exemplifies the special human qualities
of Fred Rosenbaum who considered teaching a high calling and demonstrated his dedication to the Society through tireless service.
This year’s recipient is Koji Mizuno.
Citation
“FOR EXEMPLARY SERVICE, GIVEN IN A SPIRIT OF SELFLESS
DEDICATION AND COOPERATION.”
2005 OUTSTANDING YOUNG ENGINEER AWARD
The Outstanding Young Engineer Award was established to recognize
an outstanding young MTT-S Member(s), who has distinguished
him/herself through achievement(s), which may be technical (within
the MTT-S Field of Interest), may be exemplary service to the MTT-S, or
may be a combination of both. Nominee must be no more than 38 years
of age (i.e., must not have reached their 39th birthday) and must be an
MTT member at time of nomination.
This year’s recipients are Joseph Pekarek and Thomas Weller.
Citation for J. Pekarek:
“FOR OUTSTANDING ACHIEVEMENTS AS AN EDUCATOR,
MENTOR AND ROLE MODEL OF MICROWAVE ENGINEERS AND
ENGINEERING STUDENTS.”
2005 MICROWAVE PIONEER AWARD
The Microwave Pioneer award recognizes an individual or a team not
exceeding three persons having made outstanding pioneering technical
contributions that advance microwave theory and techniques and described in an archival paper published at least 20 years prior to the year
of the award.
This year’s recipient is the team of Hermann Statz and Robert A. Pucel.
Citation
“FOR INNOVATION IN SOFTWARE DESIGN AND OUTSTANDING
ACHIEVEMENT IN ENTREPRENEURSHIP.”
Citation for T. Weller:
“FOR CONTRIBUTIONS MADE IN THE FIELD OF PLANAR CIRCUIT
DESIGN AND MODELING, AND TO IMPROVING THE QUALITY OF
MICROWAVE EDUCATION.”
“FOR DEVELOPMENT OF THE FIRST COMPREHENSIVE PHYSICSBASED MODEL OF THE SHORT-GATE FIELD EFFECT
TRANSISTOR AND A DESIGN TOOL WHICH HAS PLAYED A
SIGNIFICANT ROLE IN THE EMERGING FIELD OF MMICS.”
2005 MICROWAVE APPLICATION AWARD
The Microwave Application Award recognizes an individual or team
for outstanding application of microwave theory and techniques.
This year’s recipient is J. Stevenson Kenney.
Citation
“FOR THE DEVELOPMENT OF POWER AMPLIFIER
LINEARIZATION TECHNIQUES AND INSERTION INTO
CELLULAR/WIRELESS SYSTEMS.”
66
IEEE FELLOWS: CLASS OF 2005
The Member Grade of Fellow is conferred in recognition of unusual
and outstanding professional distinction. It is awarded at the initiative of
the IEEE Board of Directors following a rigorous nomination and evaluation process. Individuals receiving this distinction have demonstrated extraordinary contributions to one or more fields of electrical engineering,
electronics, computer engineering and related sciences. This Grade is
not conferred automatically on nomination; only a fraction of those nominated are elected. Eleven MTT-S Members who were evaluated by our
Society were elected to the Grade of Fellow, effective 1 January 2005:
NAME
CITATION
Henri Marius Baudrand
For contributions to the electromagnetic modeling
of microwave circuits and antennas.
Giuseppe Conciauro
For contributions to numerical modeling of
microwave passive components.
Janusz Andrzej Dobrowolski
For contributions to computer-aided design of
microwave networks.
Herbert Michael Harris
For contributions to the electrical and thermal
properties of wide bandgap semiconductors.
In addition seventeen other MTT-S Members were elected to the
Grade of Fellow in 2005 after their qualifications were evaluated by other IEEE Societies:
NAME
CITATION
Steven I. Franke (AP-S)
For contributions to wave propagation,
atmospheric sensing, and to engineering
education.
George L Heiter
For contributions to microwave circuits, including
linear amplifiers and space diversity combiners.
James Joseph Komiak
For contributions to monolithic microwave
integrated circuits, high power amplifiers, and
transmit/receive modules.
Joy Laskar
For contributions to the modeling and development
of high frequency communication modules.
Janina Elzbieta Mazierska
For contributions to measurements of high
temperature superconducting and dielectric
materials.
Cam Nguyen
For contributions to microwave integrated circuits
and systems.
Phillip Miles Smith
For contributions to microwave high electron
mobility transistors.
Kevin John Webb
For contributions to numerical modeling and
characterization techniques of passive and active
devices.
Frank Greta Olyslager (AP-S)
For contributions to theoretical and
computational electromagnetics.
Edward Joseph Rothwell (AP-S)
For contributions to the development of radar
target identification, discrimination, and
detection schemes.
Douglas H. Werner (AP-S)
For contributions to computational
electromagnetics in antenna theory.
Domine Leenaerts (CA-S)
For contributions to nonlinear circuit theory and
design.
Masaaki Kuzuhara (ED-S)
For contributions to Group III-V microwave power
devices.
Kurt R. Richter (Education)
For contributions to the theory and application of
computational electromagnetics.
Koichi Ito (AP-S)
For contributions to the development of antennas
for mobile communications and medical
applications.
Branko M. Kolundzija (AP-S)
For contributions to electromagnetic modeling of
composite metallic and dielectric structures.
Jin-Fa Lee (AP-S)
electromagnetics.
Yonhua Tzeng (IE-S)
Le-Wei Joshua Li (AP-S)
For contributions to dyadic Green’s functions,
spheroidal wave functions, and waves in complex
media.
For contributions to diamond manufacturing
processes.
Pavel J. D. Kabos (Magnetics)
electromagnetics and to subsurface sensing
applications.
For contributions to the metrology of high
frequency spin wave dynamics in bulk and thin
film magnetic structures.
Ken-ya Hashimoto (UFFC-S)
For contributions to simulation and design for
surface acoustic wave devices.
For contributions to the method of moments in
electromagnetics.
Jeffrey Hugh Reed (VT)
For contributions to software radio and
communications signal processing and for
leadership in engineering education.
Qing Huo Liu (AP-S)
Joseph R. Mautz (AP-S)
GENERAL INFORMATION
Information Booth: Pamphlets and information on the Long
Beach area will be available at a booth centrally located in the
registration area of the LBCC. The hospitality suite is located
in the Harbor Room of the Hyatt Hotel. Sign in and guest
badges will be required to insure exclusive guest use. The hospitality suite will be open for guest use as follows:
Sunday, June 12 11:30 AM–5:30 PM
Monday–Thursday, June 13–16 7:00 AM–4:30 PM
Friday, June 17 7:00 AM–12:30 PM
IEEE/MTT-S Memberships: Membership information is provided on page 8 of this program. Those who apply for IEEE
membership before registering for the Symposium will be eligible for IEEE member discounted registration fees. Membership applications and payments will be accepted at the IEEE
Booth in the registration area. IEEE members (or on-site applicants) who register for the full Symposium and have not
been MTT-S members in the past year will be offered a free
basic MTT-S membership, good until the end of the year.
Children: Children under the age of 14 will not be admitted to
the exhibition hall at any time.
Drinks and Refreshments: Free coffee and soft drinks will
be available during mid-morning and mid-afternoon breaks in
the refreshment areas in the exhibition hall.
Smoking: Smoking is not permitted in the LBCC. All restaurants in Long Beach are completely smoke-free but, generally,
if there is a lounge attached, some smoking may be permitted.
It is best to inquire when making reservations.
Recruiting: Businesses do not send their personnel to the IMS
to be recruited by other businesses. To ensure that these
meetings continue in the future, IEEE policy insists that recruiting does not occur at the Symposium.
Recording of Technical Presentations: The recording of
technical presentations by video or audio recorders or cameras is not allowed without the permission of the speaker and
notification of the session organizer.
67
2005 IEEE MTT-S TECHNICAL PROGRAM COMMITTEE
Mohamed Abouzahra
Douglas Adam
Barry Allen
Peter Asbeck
John S. Atherton
John Bandler
Rajeev Bansal
Zaher Bardai
Scott Barker
H. Clark Bell
Pierre Blondy
Georg Boeck
Luciano Boglione
Vicente Boria
Olga Boric-Lubecke
Jens Bornemann
Hermann Boss
Tom Brazil
Gailon Brehm
Klaus Breuer
Steve Brozovich
Eric Bryerton
Charles Buntschuh
Nick Buris
Edmar Camargo
Richard Campbell
Bob Caverly
Malgorzata Celuch
Kai Chang
Richard Chen
Yung Kai Chen
JC Chiao
Debabani Choudhury
Terry Cisco
James Crescenzi
Steve Cripps
Gilles Dambrine
Nirod Das
Lionel Davis
Paul Draxler
Rhonda Drayton
Dan Elad
Samir El-Ghazaly
Badawy Elsharawy
Rudy Emrick
Murat Eron
Aly Fathy
Andrea Ferrero
Bernard Geller
Spartak Gevorgian
Charles Goldsmith
Mike Golio
Anand Gopinath
Mark Gouker
Kavita Goverdhanam
Ian Gresham
K.C. Gupta
Madhu S. Gupta
Ramesh Gupta
Wojciech Gwarek
Leonard Hayden
John Heaton
Patric Heide
Wolfgang Heinrich
George Heiter
Rashaunda Henderson
Peter Herczfeld
Wolfgang J.R. Hoefer
Glenn Hopkins
Derry Hornbuckle
Ho C. Huang
Ian Hunter
Kenji Itoh
Tatsuo Itoh
David Jackson
Robert W. Jackson
Dieter Jaeger
Sridhar Kanamaluru
Linda Katehi
Allen Katz
Roger Kaul
Steve Kenney
Amarpal (Paul) Khanna
Reinhard Knöchel
Jim Komiak
Agnieszka Konczykowska
Bruce Kopp
H. John Kuno
Paolo Lampariello
Joy Laskar
Timothy Lee
Jenshan Lin
Olivier Llopis
Victor Lubecke
Gregory Lyons
Stephen (Steve) Maas
Mohammad Madihian
Raghu Mallavarpu
Gianfranco Manes
Raafat Mansour
Steve Marsh
Jon Martens
Bobby Matinpour
J.P. Mattia
David Meharry
Francisco Mesa
Ryan Miyamoto
Jozef Modelski
Mauro Mongiardo
Amir Mortazawi
Vijay Nair
Michel Nakhla
Julio Navarro
Cam Nguyen
Clark Ngyuen
Toshio Nishikawa
Edip Niver
Dalma Novak
Takashi Ohira
Arthur A. Oliner
Abbas S. Omar
John Owens
Dev Palmer
John Papapolymerou
Jose Carlos Pedro
Barry S. Perlman
Luca Perregrini
Anh-Vu Pham
Aryeh Platzker
Carl Pobanz
Roger D. Pollard
George Ponchak
Marian Pospieszalski
Joseph Pribetich
Frederick Raab
Lamberto Raffaelli
Richard Ranson
James Rautio
Jose Rayas-Sanchez
Gabriel Rebeiz
Kate Remley
Leonard D. Reynolds
Ali Rezazadeh
Edward Rezek
Alfy Riddle
Vittorio Rizzoli
David Root
Luca Roselli
Arye Rosen
Clemens Ruppel
Peter Russer
Tom Ruttan
Paul Saunier
James Schellenberg
Manfred (Fred) Schindler
Franco Sechi
68
Alwyn Seeds
John Sevic
Arvind Sharma
Wayne Shiroma
Peter Siegel
Phillip Smith
Chris Snowden
Richard Snyder
Roberto Sorrentino
Richard A. Sparks
Peter Staecker
Joe Staudinger
Eric Strid
Almudena Suarez
Roger W. Sudbury
Dan Swanson
Bela Szendrenyi
Yusuke Tajima
Jesse J Taub
Manos Tentzeris
Tsuneo Tokumitsu
Kiyo Tomiyasu
Robert J. Trew
Ching-Kuang Tzuang
Ruediger Vahldieck
André Vander Vorst
John Walker
Chi Wang
Keh-Chung (K.C.) Wang
Robert Weigel
Andreas Weisshaar
Charles (Chuck) Weitzel
Thomas (Tom) Weller
Cheng P. Wen
Scott Wetenkamp
James Whelehan
Ke Wu
HungYu (David) Yang
Hui-Wen Yao
Robert York
Ming Yu
Peter Zampardi
Jan Zehentner
Q.J. Zhang
2005 IEEE MTT-S IMS STEERING COMMITTEE
POSITION
NAME
POSITION
NAME
General Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Charlie Jackson
Vice Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tatsuo Itoh
TPC Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Dave Rutledge
TPC Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mike DeLisio
TPC Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bob York
Electronic Paper Submissions Manager . . . . . . . . . . . . . .Jon Hacker
Electronic Paper Submissions . . . . . . . . . . . . . . . . . .Blythe Deckman
Finance Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.K. McKinney
Finance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Dave Savage
Local Arrangements Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tim Lee
Local Arrangements Vice Chair . . . . . . . . . . . . . . . . . . .Peter Pusateri
Local Arrangements Conference Planner . . . . . . . . . . .Elsie Cabrera
Local Arrangements Day Book . . . . . . . . . . . . . . . . . . . .Cynthia Hang
Local Arrangements Transportation . . . . . . . . . . . . . . .Greg Surbeck
Local Arrangements AV . . . . . . . . . . . . . . . . . . . . . . . . . . .Mircea Metes
Local Arrangements Signs . . . . . . . . . . . . . . . . . . . . . . . . . . .K.C. Wang
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Louis Liu
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bob Eisenhart
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jitendra Goel
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Michael Aust
IEEE Conference Management . . . . . . . . . . . . . . . . . . . .Elsie Cabrera
Conference Services . . . . . . . . . . . . . . . . . . . . . . . . . . .LRW Associates
Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gary Guo
MicroAps (µAps) Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jim Weiler
MicroAps (µAps) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Odell Graham
Exhibition Manager . . . . . . . . . . . . . . . . . . . . . . . . . . .Harlan Howe, Jr.
Exhibition Manager . . . . . . . . . . . . . . . . . . . . . . . . . . .Howard Ellowitz
Guest Program Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mary Jacobs
Historical Exhibit Chair . . . . . . . . . . . . . . . . . . . . . . . . . . .Naresh Deo
Student Paper Contest Chair . . . . . . . . . . . . . . . . . . . . . . .Scott Wedge
Student Paper Contest . . . . . . . . . . . . . . . . . . . . . . . . . .Jim Rosenberg
Symposium Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Anne Lee
Web Team Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tim Lee
Publicity Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Steve Swift
Publicity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Terry Cisco
Symposium Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . .Arvind Sharma
Publications Chair . . . . . . . . . . . . . . . . . . . . . . . .Debabani Choudhury
Wireless Networking Support . . . . . . . . . . . . . . . . . . . . . . . . . .Dale Yee
Publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Siva Chebolu
Workshops & Tutorials Chair . . . . . . . . . . . . . . . . . . . . . . .Ethan Wang
Workshops & Tutorials Publicity . . . . . . . . . . . . . .Jonathan Fredrick
Workshops & Tutorials Publications . . . . . . . . . . . . .Younkyu Chung
Workshops & Tutorials (Sunday) . . . . . . . . . . . . . . . . . . . .Yi-Chi Shih
Workshops & Tutorials (Monday) . . . . . . . . . . . . . . . . . . . . . . .Paul Yu
Workshops & Tutorials (Friday) . . . . . . . . . . . . . . . . . . . .Kevin Leong
Workshops & Tutorials (Friday) . . . . . . . . . . . . . . . .Kevin Miyashiro
Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Harry Pomeranz
Focused Sessions Co-Chair . . . . . . . . . . . . . . . . . . .Alina Moussessian
Focused Sessions Co-Chair . . . . . . . . . . . . . . . . . . . . . . . .John Horton
Special Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Steve Maas
Panel Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Emilio Sovero
Registration Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .John Kuno
Registration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chic Shishido
Registration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Julie Maas
Interactive Forum Chair . . . . . . . . . . . . . . . . . .Hector De Los Santos
Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Larry Williams
Member at Large . . . . . . . . . . . . . . . . . . . . . . . . . . . .Reynold Kagiwada
Member at Large . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chuck Swift
Member at Large, AdCom Awards Chair . . . . . . . . . . . . . . .Ed Rezek
Ham Radio Social . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Clark Bell
Hospitality Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bev Pomeranz
Hospitality Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Susan Cisco
Banquet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Mary Jacobs
Wireless Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . .Chad Deckman
IP PDA Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tim Lee
TPMS Development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jeff Pond
RFIC2005 Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Joe Staudinger
IMS2006 Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .John Barr
IMS2006 TPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Roger Pollard
International Liaison . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Zaher Bardai
Legal Liaison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Robert Kasody
Long Beach Convention & Visitors Bureau . . . . . . . . . .Barbi Mason
Coastal LA Section Chair . . . . . . . . . . . . . . . . . . . . . . . .Michael Briggs
Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Madhu Gupta
ARFTG Liaison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Greg Maury
Women in Engineering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Anne Lee
University Liaison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bill Deal
University Liaison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Vesna Radisic
Golf Tournament . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Philip Arnold
Golf Tournament . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Harvey Olifson
69
HISTORICAL EXHIBIT
HISTORICAL ELECTRONICS MUSEUM
The Historical Electronics Museum is the permanent home of
the MTT-S Historical Collection between Symposia. The Museum holds many microwave-related items besides the MTT-S
Collection, including parts of
the SCR-270 (Pearl Harbor)
radar and a complete SCR-584
radar, which was used with the
proximity fuze in World War II.
It also contains an impressive
library of over 10,000 books and 11,000 journals. The Museum is
located near Baltimore-Washington International Airport, and is
approximately 20 minutes from downtown Baltimore. Additional
information on the Museum can be found on its Web site at
http://www.hem-usa.org/, or call (410) 765-2345.
The Microwave Theory and Techniques Society Historical Exhibit will be located in the Exhibit Hall of the Long Beach Convention Center. Symposium attendees are
encouraged to visit the Historical Exhibit
during the regular exhibition hours, Tuesday through Thursday. The Historical Exhibit includes the MTT-S library collection
of books and documents with descriptions
of early theoretical and experimental
achievements in microwaves. A collection of
historical artifacts will be on display chronicling the history of modern MMIC chips and
Naresh Deo microwave modules from their inception. It
is planned to include historical artifacts from local companies
such as Northrop Grumman, Raytheon, Hughes, Rockwell and
others. Also included will be exhibits from Jet Propulsion Laboratory and other local aerospace and defense organizations.
LONG BEACH INFORMATION
beach is perfect for families with young children. If you are coming with young children and have access to a car, head to Mother’s Beach. It is quiet, well protected, and patrolled by lifeguards. Along the coast is a bike path. You can rent bicycles several places nearby and enjoy riding along the coast or inland
along one of the river bikeways.
The Long Beach Museum of Art is mile or two from the convention and downtown area. It is housed in a large turn of the
century house on a bluff overlooking the Pacific Ocean. The exhibits change periodically. The museum café overlooks the
ocean, so you can enjoy the view over lunch.
Visitors can enjoy a variety of other activities in Long Beach.
The Museum of Latin American Art also hosts frequent visiting
exhibits. You can stroll among the canals of Naples Island, looking at the lovely homes, their gardens, the canals, and docks
with pleasure boats and gondolas. Second Street in Belmont
Shore is several blocks of restaurants and small shops. Acres of
Books, a fantastic used book store, has 6.5 miles of heavily
loaded bookshelves. It is within walking distance of the large hotels on Ocean Boulevard.
When you are strolling through the downtown area of Long
Beach, look up at the buildings. Long Beach is striving to preserve its architectural history, refurbishing its old buildings, and
converting some into lofts. There are some grand private homes
along Ocean Avenue in the California Craftsman, Bungalow, and
Art Deco styles. First Street through Bluff Park is virtually a museum of twentieth century residential styles. On the campus of
California State University at Long Beach is the pyramid, a behemoth sports facility, bright blue, and pyramid shaped. If you are
on campus, visit the Japanese gardens and enjoy a few moments
of peace and beauty.
Perhaps one of Long Beach’s greatest assets is its ethnic diversity. Long Beach is home to the world’s largest Cambodian
community outside of Cambodia itself. In addition, Long Beach
hosts people from Southeast Asia, Samoa, and many parts of
Latin America. Each group brings with it its customs and foods.
Ethnic restaurants abound.
Once you have covered Long Beach, you can get on the lightrail trolleys, called the Blue Line, and travel to downtown Los
Angeles. The Blue Line connects with other trolley and subway
lines, so by traveling the rails you can enlarge your horizons.
Other sights around the Los Angeles area, such as museums,
amusement parks, and the zoo are accessible by car.
Long Beach has much to offer its guests. The weather should
be warm and pleasant, but bring a sweater or light jacket for the
sometimes cool evenings. We look forward to seeing you in Long
Beach!
Julie Maas and Steve Maas
Welcome to Long Beach and the IMS 2005! We hope that you
enjoy your visit. The second largest city in the Los Angeles basin
(after LA itself), with almost a half million people, Long Beach
has much to offer attendees and their families. The city, a dusty
military town of a quarter century ago, has grown into a modern
center of culture, entertainment, and commerce. Much of that
growth has occurred in the past dozen years, and now the downtown sparkles with large, new hotels, office buildings, and entertainment complexes.
Long Beach has a long, rich history. In 1784 (yes, for Southern
California this is old!), the area that is now Long Beach was a
Spanish land grant. This was ranching country, with two ranchos
encompassing the area of the present city. The town, then
known as Wilmore City, was established in 1882; a few years later, it was renamed Long Beach. The railroad brought throngs of
visitors to Long Beach, and, at the turn of the century, the electric trolley caused the area to grow into a resort and a commercial center. The easy living and pleasant climate attracted Midwesterners, many of whom were retired farmers, an influx that
gave Long Beach the affectionate nickname, Iowa by the Sea.
From 1902 until 1910, Long Beach was the fastest growing city
in the US. In 1921, the discovery of oil in Long Beach and Signal
Hill (a small city completely encircled by Long Beach) brought
with it a building boom. The city grew enormously in area and
population. In 1933 a devastating earthquake hit Long Beach.
Much of the rebuilding was in the Art Deco style, which was in
vogue at the time. Even today, Long Beach has a large concentration of Art Deco architecture.
Long Beach has a port, which, together with the port of Los
Angeles, is the largest on the west coast. At one time it hosted a
major naval base, but in the 90s it closed its doors. In 1967 Long
Beach purchased the cruise liner, the Queen Mary. It is still a fixture in the harbor, open to the public for touring, for fine dining,
and as a hotel. The Queen Mary is the center of the newly revitalized harbor area. That area now boasts the Aquarium of the
Pacific, a delightful place to spend a half-day watching the diverse coastal land and sea creatures from the Pacific Rim,
restaurants, and a charming harborside for evening strolls.
The new Pike restaurant and entertainment area is next door
to the Long Beach Convention Center. (The name comes from
an amusement park on the same site in the 1920s.) A short walk
from the Pike is Shoreline Village. In addition to the Aquarium,
Shoreline Village has a variety of restaurants, both local and national chains, movie theaters, water taxis, docks for harbor cruises, and shops.
Long Beach, of course, is best known for its, well, long beach.
Wide expanses of sandy beach extend from the harbor, next to
Shoreline Village, south along the coast. A breakwater about a
mile offshore guarantees that there is virtually no surf, so the
70
LONG BEACH INFORMATION (CONT)
TRANSPORTATION
SOCIAL EVENTS
Long Beach is part of the greater Los Angeles metropolitan
area. It is located in Los Angeles county, about 25 miles south of
the heart of the city of Los Angeles. With three interstates running through Long Beach, it is very easy to get to and from the
city by car. Long Beach has its own airport and its own bus and
taxi services. It is also served by the Los Angeles Metro light rail
system. Downtown Long Beach is very friendly to pedestrians,
and traveling local streets is easy with a good map.
There are three nearby airports and a total of five airports
hosting all major domestic and international air carriers in the
LA area.
Long Beach Airport (airport code LGB): The Long Beach Convention Center and most conference hotels are located just 7
miles by ground transportation from the Long Beach airport. The
Long Beach airport is served by Alaska Airlines, American Airlines, America West Airlines, and Jet Blue Airways. The airport
offers taxi service and rental cars. www.longbeach.gov/airport/.
Los Angeles International Airport (LAX): The world’s fifth
largest passenger airport is 23 miles northwest of the convention
center by car. Over 50 commercial airlines fly in and out of LAX.
The airport offers taxi and van service to Long Beach, rental
cars, and Metro service via bus to light rail. www.lawa.org/lax/.
John Wayne Airport (SNA): John Wayne airport in Newport
Beach is 25 miles from the convention center. It is served by 12
commercial airlines. The airport offers taxi and van service as
well as rental cars. www.ocair.com. Burbank Bob Hope (BUR)
and Ontario (ONT) Airports are also located in the greater Los
Angeles metropolitan area.
The three closest airports offer van service to Long Beach.
Contact Prime Time Shuttles (www.primetimeshuttle.com/
SoCal.htm) at 800-733-8267 or Super Shuttle (www.super
shuttle.com/htm/cities/lax.htm) at 800-258-3826 for rates and
reservations. Service to Burbank and Ontario may be limited.
Long Beach Transit offers several different local bus services.
For attendees staying downtown or at the Queen Mary or West
Coast hotels, the Pine Avenue Link (www.lbtransit.com/pine_
avenue.html) and the Passport Service (www.lbtransit.com/
passport.html) offer comfortable, brightly colored busses for free
transportation around the downtown area. Busses typically offer
10–15 minute frequency to stops. There is a small fee to travel to
east Long Beach.
Taxis are available through the Long Beach Yellow Cab company (888-529-3556 or locally at 562-435-6111).
If you make your hotel arrangements directly through IEEE,
transportation will be provided to conference attendees staying
at hotels near the airport away from the downtown area.
You can reach Long Beach from outside the city using public
transportation via the Los Angeles Metro Rail system
(www.mta.net/riding_metro/riders_guide/rail_overview.htm).
There is Metro service to LAX via bus and light rail.
Auto Rentals: Long Beach and the Los Angeles area offer a
wide variety of rental car options, including all major airports
and through many downtown hotels. Rental car companies
among airports, hotels, and stand-alone branches will vary. A
sample of available rental car companies is listed below.
Alamo, www.alamo.com, 800-327-9633;
Avis, www.avis.com, 800-331-1212;
Beverly Hills Rent-A-Car, www.bhrentacar.com, 800-479-5996;
Budget, www.budget.com, 800-221-1203;
Dollar, www.dollarrentacar.com, 800-800-3665;
Enterprise, www.enterprise.com, 800-736-8222;
Hertz, www.hertz.com, 800-654-3131;
National, www.nationalcar.com, 800-227-7368;
Thrifty, www.thrifty.com, 800-847-4389
RFIC SYMPOSIUM RECEPTION: Sunday evening, June 12, is a highlight of RFIC technical activity and social festivities. The evening’s activities begin at 5:30 PM with the RFIC Plenary Session, officially opening the RFIC technical program. The Plenary is held in the Grand Ballroom of the Long Beach Convention Center. All attendees are invited
to the Plenary. Following the Plenary, the RFIC Steering Committee is
hosting a reception in the Grand Ballroom of the Long Beach Convention Center. All RFIC Symposium attendees are invited to attend the
reception from 7:00 to 9:00 PM. Admission tickets to the reception for
RFIC Symposium attendees will be included in the registration packets. Conference attendees who do not register for the RFIC Symposium can purchase reception tickets at the conference registration
desk.
MICROWAVE JOURNAL/MTT-S RECEPTION: All Microwave Week
attendees and exhibitors are invited to attend a reception hosted by
Microwave Journal and MTT-S on Monday, June 13 from 6:00 to 8:00
PM at the Aquarium of the Pacific on Shoreline Drive, two blocks from
the convention center.
IEEE MTT WOMEN IN ENGINEERING RECEPTION: The IEEE
MTT Women in Engineering (WIE) committee will host a meeting and
reception on Tuesday, June 14 from 5:30 to 7:00 PM in the Hyatt Hotel.
Meet and interact with professionals who share an interest in promoting the WIE forum.
HAM RADIO SOCIAL: All radio amateurs who are attending IMS2005
are cordially invited to a social gathering on Tuesday, June 14 from
6:00 to 9:00 PM in the Hyatt Hotel.
INDUSTRY-HOSTED COCKTAIL RECEPTION: Symposium exhibitors will host a cocktail reception on Wednesday, June 15 from
5:45 to 7:15 PM at the Hyatt Regency Hotel. Complimentary beverage
tickets will be included in the registration packages.
IEEE MTT-S AWARDS BANQUET: The annual Awards Banquet will
be held on Wednesday, June 15 from 7:30 to 10:00 PM at the Hyatt Hotel. This evening will consist of an elegant dinner, awards presentation
and entertainment. Major society awards will be presented at this
event. The banquet is free of charge to the awardees.
IEEE MTT-S STUDENT AWARDS LUNCHEON: Student Paper
Awards, MTT Graduate Fellowships and MTT Undergraduate Scholarships will be presented at the Student Awards Luncheon at noon,
Thursday, June 16. The Luncheon is free of charge for all IMS2005
student paper finalists and their advisors.
TECHNICAL ATTENDEES BREAKFAST: Monday–Thursday (June
13–16), at the LBCC from 7:00 to 9:00 AM. This breakfast is for all persons registered as technical participants in the IMS, RFIC or ARFTG
(not open to those registered only as exhibitors or guests).
IMS/RFIC/ARFTG badge required for admission.
71
GUEST PROGRAM
All Tours will be made or cancelled based on advance registration. We must have 30 advance registrations in order to
operate most tours. Some tours have limited space. Please
use advance registration if at all possible to avoid cancellation of the tours or the chance of missing a tour you want to
go on. There may be slight changes in tour times, so please
check the web page or at the hospitality suite.
Monday, June 13, 2005
Hours: 9:00 AM–3:30 PM
Guests will begin their day with a walking tour of San Juan
Capistrano. This tour offers guests a unique perspective of one
of Orange County’s legendary towns, covering over 200 years of
rich architectural history. Guests are invited to stroll down Los
Rios Street, the oldest residential neighborhood in California,
where adobe houses that date from 1794 still stand! There is
even time for shopping in the quaint stores.
Guests will then proceed to Cedar Creek Inn, where they will
enjoy a tasty lunch. The Inn is located directly adjacent to the
Mission.
The afternoon will begin with a self-guided tour of the Mission
San Juan Capistrano, perhaps most known for its “return of the
swallows” each year, and also known as the “Jewel of the Missions.” Perhaps nowhere else does the sheer tranquility and benign character of mission life and Old Spanish California come so
vividly to life. Containing precious and graphically intact testimonials, the mission serves as a living treasure house for a glorious chapter in early California history.
Following are additional Web sites you may wish to access for
viewing other activities and purchasing individual tickets to local
entertainment events in the Long Beach area.
Long Beach Convention and Visitors Bureau
http://www.visitlongbeach.com/
Disneyland http://disney.go.com/Disneyland/
Universal Studios http://www.universalstudios.com/
Knotts Berry Farm http://www.knotts.com/
Getty Museum http://www.getty.edu/
Huntington Library and Botanical Gardens
http://www.huntington.org
Aquarium of the Pacific http://www.aquariumofpacific.org/
LACMA – Los Angeles County Museum of Art
http://www.lacma.org/
Page Museum – La Brea Tar Pits http://www.tarpits.org/
Long Beach Museum of Art http://www.lbma.org/
Long Beach Museum of Latin American Art
http://www.molaa.com/
Cost of Tour: $75.00 pp (advance registration); $90.00 pp (on-site registration) Hosted by
Access California.
Pasadena is famous for the Rose Parade each New Year, but
you’ll find that this city celebrates much more! Our day will begin with a scenic drive along the tree-shaded streets of the City
of Roses, viewing the opulent homes in this beautiful area. Next
you will visit the beautiful Huntington Library, Art Collections
and Botanical Gardens. The 207 acre estate was formerly the
home of Henry E. Huntington, pioneer railroad tycoon and philanthropist. The art gallery collection emphasizes English and
French paintings of the 18th century and includes many famous
works such as Gainsborough’s “Blue Boy” and Lawrence’s
“Pinkie.”
The library houses extensive holdings of English and American first editions, manuscripts, maps, letters, and many famous
objects including a Gutenburg Bible, a first folio of Shakespeare
plays, and Benjamin Franklin’s autobiography in manuscript.
The botanical gardens cover 150 acres with more than 14,000
different kinds of plants.
As a special treat, guests will enjoy an English tea luncheon at
the Rose Garden Tea Room, where a buffet of finger sandwiches,
strawberries and cream, imported cheeses, and desserts awaits.
The English tea service also includes warm scones and jam, and
hot or iced tea.
The Hospitality Suite for IMS2005 attendee guests will be located in a private Concierge Lounge in the Hyatt Hotel. Guest
badges will be required. The suite will be open as follows:
Sunday, June 12, 2005 – 11:30 AM–5:30 PM
Monday–Thursday, June 13–16, 2005 – 7:00 AM–4:30 PM
Friday, June 17, 2005 – 7:00 AM–12:30 PM
IMS steering committee members will be available for guest
assistance in the suite. In the suite, guests may enjoy a daily continental breakfast and afternoon refreshment. Courtesy computers for EMAIL use will be available on site for adult guests. The
guided tours will be leaving from the Hyatt Lobby.
Sunday, June 12, 2005
Hours: NOON–5:00 PM
Getty Museum Tour
Set high on a dramatic hilltop overlooking Los Angeles, the
Getty Center unites the J. Paul Getty Trust’s Museum, Institutes
and Grant Program on one site. The Center, opened in 1997, sits
on 110 acres of the Santa Monica Mountains and is surrounded
by gardens and terraces that provide sweeping views of Los Angeles, the mountains, and the ocean.
Five two-story pavilions, interconnected around an open central courtyard, house the ever-changing exhibitions and the expanding permanent collections of pre-20th-century European
paintings, drawings, illuminated manuscripts, sculpture, decorative arts, and 19th- and 20th-century American and European
photographs.
Upon arrival at the museum, guests board a tram, which will
take them to the top of the hill and the museum buildings.
There, they will be greeted by a knowledgeable docent who will
guide them through an overview of the complex. Guests can
then wander through the exhibits at their leisure where they will
have the opportunity to view paintings in galleries with natural
skylights and be free to see works of art chronologically or enter
pavilions through the courtyard in any sequence they wish…the
choice is up to them.
A restaurant, cafeteria, and vendor stands allow guests to either have a leisurely lunch or grab a bite and get back to their art
appreciation.
Experience a wonderful day of art and culture…all on one
hilltop!
Access California.
Tucked neatly between Los Angeles and Orange County, Long
Beach is an easygoing beach city loaded with things to do and
see, blessed with a mild climate, lovely oceanfront views, marina
settings and major resort amenities.
The tour begins by passing through one of the greatest harbors in the world. Traveling high into the hills of San Pedro,
guests make their way to the Korean Friendship Bell. The bell
rests peacefully on a promontory above the Pacific Ocean in Angels Gate Park, and is a treasured gift in honor of the veterans of
the Korean War from the Republic of Korea to the people of Los
Angeles. The bell is set in an enchanting pagoda-like stone structure, with unsurpassed views of the Los Angeles harbor, the
Catalina Channel, and the sea terraces of San Pedro hill.
Your tour continues through historic downtown Long Beach
where you will see landmarks such as the First Congregational
Church, a magnificent Italian Gothic church with lavish stained
glass and decorative detailing. The tour winds through palatial
homes on Ocean Avenue and stops at one of the city’s most
prized cultural icons. Overlooking Long Beach Harbor and the
Access California.
72
GUEST PROGRAM
Pacific Ocean, the Long Beach Museum of Art’s grounds include
the beautifully restored 1912 Elizabeth Milbank Anderson craftsman mansion and an exhibition pavilion with two-story atrium
and ocean-view gallery. The museum, a designated historic landmark, has undergone a multimillion-dollar expansion and doubled its exhibit space. Its permanent collection spans over 300
years of American and European art, focusing on early 20th-century European painting, California Modernism, American decorative arts, and contemporary media and video art. There is a
café at the museum for guests to purchase snacks or lunch if
they like.
Next you will be strolling the grounds of the serene and beautiful Earl Burns Miller Japanese Garden. The Long Beach tour
finishes back in Belmont Shores. Long Beach is the last undiscovered city on the West Coast. People are starting to discover it
and talk about it. Find out why!
Guests will travel to Catalina Island on the Catalina Express
ferry and then take a 50 minute scenic tour of the resort city of
Avalon. The tour begins along the island’s only coastline road,
climbs to an elevation of 400 feet, passes Mount Ada, the original
Wrigley estate, continues through Avalon Canyon, and winds
through the city for a majestic view of the harbor and Avalon
Casino. Have lunch on your own in one of the city’s centrally located restaurants and then browse through quaint shops and
galleries, or visit the Catalina Island Museum in the world-famous Casino Building.
Cost of Tour: $65.00 pp (advance registration only) Hosted by the Steering Committee.
Friday June 17, 2005
Golf Outing
Only six miles from the Long Beach Convention Center lies
the Cal Olson designed Skylinks golf course. After many months
and over $6 M in renovations the course was re-opened in November 2004. Totally re-seeded Bermuda fairways, Pao Annua/
bent grass greens, 4 lakes and 80 bunkers; enough to last any
kitty a lifetime. Home of the Queen Mary Open this course can
be a challenge even for the pro. Plenty of shade and pine trees
enhance the fairways and greens offering lots of shade to golfers
and errant golf balls. This 6372 yard, par 72 is the perfect
dessert to finish off a week of technical papers and workshops.
Leave the transmission lines, Fourier Transforms and radar
equations at the hotel room. Bring your sticks and take some
time to enjoy driving your favorite golf ball down these beautiful
fairways. And even better yet, if you are leaving via the Long
Beach Airport, it’s just across the street.
This is a four person scramble. Players can sign up as a group
or be assigned a team. A morning shotgun start ensures a timely
finish for all and a chance to sit down to a great lunch with teammates and challengers to discuss Newton’s selective laws of
gravity and numerous other reasons why the putts didn’t drop.
Lunch and prizes are all included in the fee along with free range
balls to warm up in the morning. Don’t be left out. This program
is on a first-come, first-served basis to the first 40 registrants.
Metal spikes are not allowed.
Access California.
Catalina Island Trip
Long Beach Multi-Cultural Tour
The tour begins “Italian Style” at Naples Island where guests
board gondolas. There, able-bodied gondoliers, in the traditional
Venetian straw hats and striped shirts, ply the waterways and
canals. Your guests will enjoy the Italian romantic spirit as they
relax and enjoy the sights and sounds of life on the water.
Nearby, Belmont Shores Shopping District is filled with boutique shops and international cares for a perfect lunchtime exploration
The tour then makes its way to the now burgeoning East Village Arts District. Touted as the only institution in the western
US devoted exclusively to contemporary Latin American art, the
Museum of Latin American Art has a principal interest in representational pieces that reflect Latin American culture, traditions
and rituals. The museum opened in 1996, and occupies a building dating to the late 1920s that was occupied by the Balboa
Amusement Producing Company, one of the world’s most prolific silent film studios.
Access California.
Cost of Tour: $70.00 pp (advance registration only) (includes green fee, cart, range balls,
lunch and prizes) Hosted by the Steering Committee.
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75
2005 RFIC TECHNICAL PROGRAM — TUESDAY, JUNE 14, 2005
RTU1A Low Power Wireless Data Systems — LBCC 101
Chair: S. Lloyd, Beceem Communications Inc. • Co-chair: G. Chang, MaxLinear
8:00 AM: RTU1A-1: Invited: Challenges in the Design of CMOS Transceivers for the IEEE
802.11 Wireless LANs: Past, Present and Future
M. Zargari, S. Mehta, D. Su, Atheros Communications
8:20 AM: RTU1A-2: Invited: Low Power RF Design for Sensor Networks
B.W. Cook, A. Molnar, K.S.J. Pister, University of California-Berkeley
8:40 AM: RTU1A-3: A Long-Range RFID IC with On-chip ADC in 0.25 µm CMOS
F. Kocer, M.P. Flynn, Wireless Integrated Microsystems Engineering Research Center
(WIMS-ERC) , University of Michigan, Ann Arbor
9:00 AM: RTU1A-4: A CMOS 2.45 GHz Radio Frequency Identification Tag IC with Read/Write
Memory
W.G. Yeoh, Y.B. Choi, K.Y. Tham, Institute of Microelectronics; S.X. Diao, Y.S. Li, Toppan
Electronics Co.,(S) Pte. Ltd.
9:20 AM: RTU1A-5: Invited: A Fully Integrated SOC for 802.11b in 0.18 µm CMOS
H. Darabi S. Khorram Z. Zhou. T. Li, B. Marholev, J. Chiu, J. Castaneda, E. Chien, S. Anand, S.
Wu, M. Pan, R. Rofougaran, H. Kim, P. Lettieri, B. Ibrahim, J. Rael, L. Tran, E. Geronaga, H.
Yeh T, Frost J. Trachewsky, A. Rofougaran, Broadcom Corp.
RTU1B Advanced RFIC Device Technology — LBCC 102A/B
Chair: E. Reese, TriQuint Semiconductor
Co-chair: M. Kumar, Lockheed Martin
8:00 AM: RTU1B-1: High Power Density InGaP PHEMTs for 26 V Operation
E. Lan, B.M. Green, P. Li, O. Hartin, P. Fisher, D. Maurer, P.M. Piel, B. Knappenberger, M.Cde.
Baca, M. Miller, C.E. Weitzel, Freescale Semiconductor Inc.
8:20 AM: RTU1B-2: RF MEMS: Status of the Industry and Roadmaps
J. Bouchaud, H. Wicht, WTC-Wicht Technologie Consulting
8:40 AM: RTU1B-3: A Novel RF High-Q Metal-semiconductor-metal Planar Inter-digitated
Varactor Based on Double-channel AlGaN/GaN HEMT Structure
C.S. Chu, Y.G. Zhou, K.J. Chen, K.M. Lau, Hong Kong University of Science and Technology
9:00 AM: RTU1B-4: Low-distortion, Low-loss Varactor-based Adaptive Matching Networks,
Implemented in a Silicon-on-Glass Technology
K. Buisman, L.C.N. de Vreede, M. Spirito, A. Akhnoukh, Y. Lin, X. Liu, L.K. Nanver, DIMES,
Delft University of Technology; L.E. Larson, University of California, San Diego, Center for
Wireless Communications
RTU1C CMOS VCOs — LBCC 102C
Chair: S. Dow, ON Semiconductor
Co-chair: D. Nobbe, Peregrine Semiconductor
8:00 AM: RTU1C-1: Invited: Designing an Ultra Low Phase Noise 4.5 GHz VCO Using Multiple
Coupled Resonators and MOS Devices
U.L. Rohde, Synergy Microwave Corp. Inc.
8:20 AM: RTU1C-2: RF CMOS Differential Oscillator with Source Damping Resistors
C-Y. Cha, H-C. Choi, H-T. Kim, S-G. Lee, Samsung Advanced Institute of Technology,
Samsung Electronics, Information and Communications University
8:40 AM: RTU1C-3: Phase Noise Optimization of CMOS VCO through Harmonic Tuning
S. Ryu, H. Kim, J. Choi, B. Kim, Pohang University of Science and Technology; Y. Chung,
Samsung Electronics
9:00 AM: RTU1C-4: Noise Contributors in a Low Power VCO with Automatic Amplitude
Control
R. Murji, J. M. Deen, McMaster University
9:20 AM: RTU1C-5: A 9.953/10.7/12.5 GHz 0.13 µm CMOS LC Oscillator Using Capacitor
Calibration and a VGS/R Based Low Noise Regulator
A. Maxim, D. Lazlo, Integrated Products, Fiber Communications Div.
RTU1D Switching Class Power Amplifiers — LBCC 103A/B
Chair: F. van Straten, Philips Semiconductors
Co-chair: B. Thompson, Motorola Labs
8:00 AM: RTU1D-1: Invited: Next Generation Power Ampllifiers for Wireless
Communications - Squeezing More Bits from Fewer Joules
L.E. Larson, P.A. Asbeck, D. Kimball, University of California, San Diego
8:20 AM: RTU1D-2: GaAs HBT Class-E Amplifiers for 2 GHz Mobile Applications
E.A. Jarvinen, M.J. Alanen, Nokia Technology Platforms
8:40 AM: RTU1D-3: A 1.4-2 GHz Wideband CMOS Class-E Power Amplifier Delivering 23 dBm
Peak with 67% PAE
A. Mazzanti, DII University of Modena and –Reggio Emilia; L. Larcher, R. Brama, DISMI
University of Modena and Reggio Emilia;
F. Svelto, DIE University of Pavia
9:00 AM: RTU1D-4: Class E Amplifier with Inductive Clamp Circuit
A. Eroglu, D. Lincoln, MKS ENI Products
9:20 AM: RTU1D-5: An Adaptive Protection Circuit for Power Amplifier Ruggedness
Improvement
P. Riondet, Freescale Semiconductors; T. Parra, G. Montoriol, LAAS-CNRS; W. Karoui,
Freescale Semiconductors/LAAS-CNRS
RTU3A RF High Power Circuit Blocks — LBCC 101
Chair: D. Ngo, RF Micro Devices Inc
Co-chair: N. Suematsu, Mitsubishi Electric Corp.
1:20 PM: RTU3A-1: Invited: Fully Integrated CMOS RF Power Amplifiers - A Prelude to Full
Radio Integration
A. Hajimiri, California Institute of Technology
1:40 PM: RTU3A-2: Differential CMOS Linear Power Amplifier with Second Harmonic
Termination at Common Source Node
J. Kang, B. Kim, Pohang University of Science and Technology, Korea; Y. Chung, S. Hwang,
MagnaChip Semiconductor Ltd., Korea
2:00 PM: RTU3A-3: On the Optimum Second Harmonic Source and Load Impedances for the
Efficiency-linearity Trade-off of LDMOS Power Amplifiers
D.M.H. Hartskeerl, I. Volokhine, Philips Research Labs; M. Spirito, HiTEC Lab, Delft
2:20 PM: RTU3A-4: A Miniature Low-insertion-loss, High-power CMOS SPDT Switch Using
Floating-body Technique for 2.4 and 5.8 GHz Applications
M-C. Yeh, R-C. Liu, Z-M. Tsai, H. Wang, National Taiwan University
2:30 PM: RTU3A-5: An Ultra-low Distortion 3P2T Antenna Switch MMIC for Dual-band WCDMA Applications
E. Yasuda, K. Hidaka, T. Nakatsuka, A. Watanabe, K. Tara, RF-Semiconductor Development
Center, Matsushita Electric Industrial Co. Ltd.
RTU3B Frequency Gen. Circuits II:
New Concepts and Building Blocks — LBCC 102A/B
Chair: S. Raman, Virginia Tech • Co-chair: H. Wang, National Taiwan University
1:20 PM: RTU3B-1: A 40 GHz 2.1 V Static Frequency Divider in SiGe Using a Low Voltage
Latch Topology
D. Kucharski, K.T. Kornegay, Cornell University
1:40 PM: RTU3B-2: A Low Power 17 GHz 256/257 Dual-modulus Prescaler Fabricated in a
130 nm CMOS Process
Y. Ding, Dept. of Electrical and Computer Engineering, University of Florida
2:00 PM: RTU3B-3: Variable Division Ratio of a 20 GHz CMOS Injection-locked Frequency
Divider
F.H. Huang, D.M. Lin, H.P. Wang, W.Y. Chiu, Y.J. Chan, Dept. of Electrical Engineering,
National Central University
2:20 PM: RTU3B-4: Time-to-digital Converter for RF Frequency Synthesis in 90 nm CMOS
R.B. Staszewski, S. Vemulapalli, P. Vallur, J. Wallberg, P.T. Balsara, Wireless Analog
Technology Center, Texas Instruments Inc., Center for Integrated Circuits and Systems,
Univ. of Texas at Dallas
2:40 PM: RTU3B-5: Toward Wireless Receivers Without Crystals
F.L. Martin, P. Gorday, D. Taubenheim, Motorola Labs
RTU3C RF Trends — LBCC 102C
Chair: S. Heinen, RWTH Aachen University • Co-chair: L. Boglione, Filtronics
1:20 PM: RTU3C-1: Invited: Multi-mode, Multi-band RF Transceiver Circuits for Mobile
Terminals in Deep-submicron CMOS Processes
B. Bakkaloglu, P.A. Fontaine, Texas Instruments Inc.
1:40 PM: RTU3C-2: A Direct Up-conversion Transmitter with Integrated Prescaler for
Reconfigurable Multi-band/Multi-standard
J. Platz, G. Strasser, LCM Linz Center of Mechatronics GmbH; K. Feilkas, Infineon
Technologies AG; L. Maurer, DICE Danube Integrated Circuits Engineering; A. Springer, Inst.
for Com. and Inf. Eng. University/LCM Linz Center of Mechatronics GmbH
2:00 PM: RTU3C-3: Multiband Multi-standard Transmitter Using a Compact Power
Amplifier Driver
H. Magnusson, H. Olsson, Royal Institute of Technology (KTH)
2:20 PM: RTU3C-4: Temperature Effect on the Performance of a Traveling Wave Amplifier in
130 nm SOI Technology
M. Si Moussa, J.-P. Raskin, EMIC – UCL Belgium; D. Vanhoenacker-Janvier, F. Danneville,
IEMN – France; J. Russat, N. Fel,
CEA – France; C. Pavageau, IEMN – France/CEA – France
RTU3D Receiver Circuits — LBCC 103A/B
Chair: R. Kagiwada, Northrop Grumman • Co-chair: T. Nakagawa, NTT
1:20 PM: RTU3D-1: Invited: Low Voltage Techniques for Sub 100 nm CMOS, RF Transceivers
K. Soumyanath, Intel Corp.
1:40 PM: RTU3D-2: A 2 GHz Band Self Frequency Dividing Quadrature Mixer
E. Taniguchi, C. Kageyama, N. Suematsu, Information Technology R&D Center, Mitsubishi
Electric Corp.
2:00 PM: RTU3D-3: An Antenna Switch MMIC for GSM/UMTS Handsets Using E/D-Mode
JPHEMT Technology
K. Kohama, M. Nakamura, K. Onodera, S. Wada, S. Tamari, Y. Mizunuma, Sony Corp.
Semiconductor Solutions Network Co.
2:20 PM: RTU3D-4: Resistive Mixers for Reconfigurable Wireless Front-ends
R. Circa, D. Pienkowski, G. Boeck, Technische Universitat Berlin, Microwave Engineering
Group; R. Kakerow, M. Mueller,
R. Wittmann, Nokia Research Center
2:40 PM: RTU3D-5: A 45° CMOS Phase Shifter and Gain/Phase Imbalance Compensation for
Multi-band Transceivers
T. Nakagawa, M. Kawashima, M. Matsui, K. Araki, NTT Network Innovation Labs, NTT Corp.
76
2005 RFIC TECHNICAL PROGRAM — TUESDAY, JUNE 14, 2005
RTU4A Silicon Integrated VCOs — LBCC 101
Chair: T-P. Liu, Winbond Electronics • Co-chair: Y. Deval, IXL Lab
3:30 PM: RTU4A-1: The Effect of Substrate Noise on VCO Performance
N. Checka, D. Wentzloff, A. Chandrakasan, R. Reif, Microsystems Technology Labs, MIT
3:50 PM: RTU4A-2: Design and Optimization of a Linear Wide-band VCO for Multimode
Applications
A. Koukab, Y. Lei, M. Declercq, Ecole Polytechnique Fédéral de Lausanne (EPFL)
Laboratoire d’Electronique Générale (LEG-IMM)
4:10 PM: RTU4A-3: I/Q LC Oscillators with an Octave Tuning Range for TV on Mobile
Platforms
J. van der Tang, A. van Roermund, Eindhoven University of Technology; R. Amiot, H. Rumpt,
D. Kasperkovitz, Semiconductor Ideas to the Market (ItoM)
4:30 PM: RTU4A-4: Design of Quadrature CMOS VCO Using Source Degeneration Resistor
S-M. Moon, M-Q. Lee, University of Seoul; B-S. Kim, Sungkyunkwan University
4:50 PM: RTU4A-5: A Low-phase-noise Wide-band CMOS Quadratuer VCO for Multi-standard
RF Front-ends
A. Fard, P. Andreani, M‰lardalen University, Dept. of Electronics, Technical University of
Denmark, Center for Physical Electronics
RTUIFR Interactive Forum — LBCC Grand Ballroom — 1:30 PM
Chair: F. von Straten, Philips Semiconductor
Co-chair: A. Hanke, Infineon Technologies
RTUIFR-01: A 3–10 GHz SiGe Resistive Feedback Low Noise Amplifier for UWB Applications
J. Lee, J.D. Cressler, School of Electrical and Computer Engineering, Georgia Institute of
Technology
RTUIFR-02: Consideration of Age Degradation in the RF Performance of CMOS Radio Chips
for High Volume Manufacturing
M. Ruberto, T. Maimon, Y. Shemesh, Wireless Products Div., Intel Corp.; A.B. Desormeaux,
Cadence Design Systems SAS; W. Zhang, C. Yeh, Cadence Design Systems Inc.
RTUIFR-03: Modeling of Broadband Noise in Complementary (npn + pnp) SiGe HBTs
B. Banerjee, S. Venkataraman, E. Zhao, C.-H. Lee, J.D. Cressler, J. Laskar, Georgia Institute
of Technology; B.E. Kareh, S. Balster, H. Yasuda, Texas Instruments
RTUIFR-04: Fully Integrated Fractional PLL for Bluetooth Application
M. Marletta, P. Aliberti, M. Pulvirenti, A. Cavallaro, S. Terryn, P. Filoramo, R. Iardino, V.
Spalma, S. Cosentino, STMicroelectronics
RTUIFR-05: On-wafer Characterization De-embedding and Transmission Line Optimization
on Silicon for Millimeter-wave Applications
S.K. Rockwell, B.A. Bosco, Motorola Labs
RTUIFR-06: A Compact Low Noise Amplifier in SiGe:C BiCMOS Technology for 40GHz
Wireless Communications
I. Telliez, A. Chantre, P. Chevalier, STMicroelectronics; F. Danneville, G. Dambrine, S.
Lepilliet, IEMN; S. Pruvost, STMicroelectronics/IEMN
RTUIFR-07: Integrated Differential 2 GHz 2.7 V Low-noise Active Bandpass Filters on Silicon
Z. Sassi, S. Darfeuille, B. Barelaud, L. Billonnet, B. Jarry, IRCOM,University of Limoges; H.
Marie, N.T. Luan Le, P. Gamand, Innovation Centre RF, Philips Semiconductors.
RTUIFR-08: A Multi-phase 10 GHz VCO in CMOS/SOI for 40 Gbits/s SONET OC-768 Clock and
Data Recovery Circuits
D. Axelrad, E. de Foucauld, M. Boasis, P. Martin, P. Vincent, M. Belleville, CEA-LETI; F.
Gaffiot, LEOM/Ecole Centrale de Lyon
RTUIFR-09: Highly Linear, Varactor-less, 24 GHz IQ Oscillator
M.A. Sanduleanu, E. Stikvoort, Philips Research Eindhoven
RTUIFR-10: A Multi-standard Adaptive Image-reject Downconverter
A. Tasic, S-T. Lim, W.A. Serdijn, J.R. Long, Electronics Research Laboratory/DIMES, Delft
RTUIFR-11: High Frequency Noise Optimization of Sub-100 nm MOSFETs Utilizing Three
Dimensional TCAD Simulation
T. Tatsumi, Sony Corp.
RTUIFR-12: Low Frequency Spurs of VCO Due to Noise Propagation from Digital I/Os and
Their Effects on Performance of Bluetooth SoC
S. Kousai, K. Agawa, H. Ishikuro, H. Majima, H. Kobayashi, D. Miyashita, T. Yoshino, Y. Hama,
M. Hamada, SoC Research and Development Center, Toshiba Corp.
RTUIFR-13: A Broadband and Scalable Model for On-chip Inductors Incorporating Substrate
and Conductor Loss Effects
J.C. Guo, T.Y. Tan, Dept. of Electronics Engineering, National Chiao Tung Univ.
RTUIFR-14: The Transformer Characteristic Resistance and Its Application to the
Performance Analysis of Silicon Integrated Transformers
E. Ragonese, F. Carrara, A. Italia, A. Scuderi, G. Palmisano, Universite di Catania -– Facolte di
Ingegneria – DIEES; T. Biondi, STMicroelectronics
RTUIFR-15: CDMA2000 PCS/Cell SiGe HBT Load Insensitive Power Amplifiers
G. Berretta, D. Cristaudo, S. Scaccianoce, STMicroelectronics
RTUIFR-16: An ESD protected RFIC Power Amplifier Design
S. Muthukrishnan, S. Raman, Wireless Microsystems Lab, Bradley Dept. of ECE, Virginia
Tech; J. Zhao, G. Studtmann, M/A-COM, Integrated Products Business Unit
RTUIFR-17: High-linearity and Temperature-insensitive 2.4 GHz SiGe Power Amplifier with
Dynamic-bias Control
W.C. Hua, H.H. Lai, P.T. Lin, C.W. Liu, Dept of Elect Eng and Graduate Institute of
Electronics Engineering, National Taiwan University; T.Y. Yang, G.K. Ma, SoC Technology
Center, ITRI
RTUIFR-18: A 131 GHz Push-push VCO in 90 nm CMOS Technology
P-C. Huang, R-C. Liu, H-Y. Chang, C-S. Lin, M-F. Lei, H. Wang, National Taiwan University; CY. Su, C-L. Chang, Taiwan Semiconductor Manufacturing Co.
RTUIFR-19: A New Kind of CMOS High Frequency Oscillators
R. Kielbasa, Supeélec, Gif-sur-Yvette; V. Petit, Thales Airborne Systems; G. Petit, Supeélec,
Gif-sur-Yvette/Thales Airborne Systems
RTUIFR-20: An integrated 1.5 V 6 GHz Q-enhanced LC CMOS Filter with Automatic Quality
Factor Tuning Using Conductance Reference
S. Li, N. Stanic, Y. Tsividis, Columbia University; K. Soumyanath, Intel Corp.
RTUIFR-21: A 1.25 Gbps Burst-mode Receiver IC with Extended Dynamic Range
C.C. Chen, C.M. Tsai, D.U. Li, L.R. Huang, SoC Technology Center, Industrial Technology
Research Institute
RTUIFR-22: A Low Power SiGe HBT Merged LNA and Mixer for 5 GHz Wireless LAN Receivers
C. Carta, W. Baechtold, Electromagnetic Fields and Microwave Electronics Lab, Swiss
Federal Institute of Technology
RTUIFR-23: A 40 dBm OIP3, 2 GHz Silicon Bipolar LNA
C. Motta, G. Girlando, A. Castorina, STMicroelectronics; G. Palmisano, University of Catania
RTUIFR-24: Analytical Thermal Noise Model Suitable for Circuit Design Using Short Channel
MOSFETs
J.W. Jeon, S. Kim, I.M. Kang, K. Han, H. Shin, Seoul National University
RTUIFR-25: A Multiphase Phase/Frequency Detector-based Frequency Synthesizer
V. Lagareste, F. Badets, D. Belot, STMicroelectronics, DAIS, Central R&D; Y. Deval, J.B.
Begueret, IXL Lab, University Bordeaux
RTUIFR-26: Integrated 2.4 GHz Class-E CMOS Power Amplifier
V. Saari, P. Juurakko, J. Ryyn‰nen, K. Halonen, Helsinki University of Technology,
Electronic Circuit Design Lab
RTUIFR-27: A Low Phase Noise Quadrature LC VCO in CMOS Technology
B. Sze, C. Ho, VIA Technologies Inc.
RTUIFR-28: Non-intrusive Testing Methodology for CMOS RF LNAs
J. Liobe, Y. Xiang, M. Margala, University of Rochester
RTUIFR-29: A Circuit Sensitive Methodology for Evaluating Substrate Noise
J. Liobe, K. Jenkins, University of Rochester and IBM
RTUIFR-30: A 2.4 GHz ISM Transmitter IC with Novel Quadrature Clock Generation
Technique for a Localization Application
G. Popken, M. Hartmann, H. Milosiu, H. Neubauer, F. Oehler, M. Peter, Fraunhofer Institute
for Integrated Circuits; P. Baureis, University of Applied Sciences Worzburg-Schweinfurt
RTUIFR-31: A 2.5 GHz Constant Envelope Phase shift Modulator for Low Power Wireless
Applications
X. Yang, C. Cao, J. Lin, K.K. O, J. Brewer, Dept. of Electrical and Computer Engineering,
University of Florida
RTUIFR-32: Fifth-derivative Gaussian Pulse Generator for UWB System
H. Kim, Y. Joo, Electrical Engineering, Arizona State University
RTUIFR-33: Dynamic Output Phase to Adaptively Improve the Linearity of Power Amplifier
Under Antenna Mismatch
A. Keerti, A. Pham, Microwave Microsystems Lab, University of California
RTUIFR-34: A Fully Integrated Low Power Direct Conversion Transmitter with Fractional-N
PLL Using a Fast AFC Technique for CDMA Applications
J.C. Lee, S.H. Beck, S. Yoo, K.H Lim, H.S. Jung, T.H. Lee, K.L. Kim, S. Han, Future
Communications IC (FCI) Inc.; G.H. Cho, Korea Advanced Institute of Science and
Technology (KAIST); M.W. Hwang, Future Communications IC (FCI) Inc./Korea Advanced
Institute of Science and Technology (KAIST)
RTUIFR-35: A Low Voltage, Low Power, High dB Linear and All CMOS Exponential V-I
Conversion Circuit
Q-H. Duong, S-G. Lee, RFME Lab, Information and Communications University
RTUIFR-36: CMOS Circular Geometry VCOs for Microwave Magnetic Field Generation
T. Yalcin, G. Boero, R.S. Popovic, Ecole Polytechnique Federale de Lausanne; V. Sahin,
Decicon Inc.
RTUIFR-37: 1.8 V, Variable Gain Transimpedance Amplifiers with Constant Damping Factor
for Burst-Mode Optical Receiver
W-Z. Chen, Dept. of Electronics Engineering, National Chiao-Tung University; R-M. Gan, STC,
Industrial Technology Research Institute
RTUIFR-38: Design of CMOS Distributed Circuits for Multiband UWB Wireless Receivers
P. Heydari, D. Lin, A. Shameli, A. Yazdi, Dept. of Electrical Engineering and Computer
Science, University of California
Cover Photos: Destinations Long Beach Magazine
IEEE MTT-S
INTERNATIONAL MICROWAVE SYMPOSIUM
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2005 MTT-S FULL PROG.

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