Adapting Press-Fit Connection Technology for Electronic

Adapting
Press-Fit Connection
Technology
for Electronic Modules
in Harsh Environments.
By
Joseph Lynch – Director of Advanced Product Engineering
– Interplex Industries Inc, USA.
Andy Longford – Consultant – PandA Europe, UK
& Business Development - Interplex Engineered Products
HiTEN 2009 - Oxford
Introduction

Interplex

Press-fit basics

Connections in HE

Testing

Approvals

Module development

Applications
HiTEN 2009 - Oxford
Press fit basics ...
 Function of Press-Fit Technology
 Telecom to Automotive Adoption
 Core design types
- 0.25mm, 0.64mm, 0.80mm
 Plating Types, & options
 Applications
HiTEN 2009 - Oxford
Press fit technology ...
Solder Less Interconnect System to Printed Circuit Cards
Interconnection Force
Interconnection Force
*Grams *
* Kilograms *
HiTEN 2009 - Oxford
Press fit connections …….
Require:
• Complex Plastics--------------------------------------• Press fit Terminals
• IDC
• Eyelet
• Tuning Fork
EYE OF THE NEEDLE
• Clamp
• PCB Hole Construction Controls------•Application Knowledge
HiTEN 2009 - Oxford
Telecom to Automotive
Telecom
Automotive
Temp to 85 °C
Temp to 150 °C
Vibration –None
Vibration- 12G-three Axis( In Temp)
Retention Force- 8N
Retention -20N to 40N
Rework –Yes
Rework - no
Plating-2 to3 Microns
Plating- 0.4 to 1.2 Microns
Contact Resistance- 4.0mΩ Max
Contact Resistance- 0.5mΩ Max
HiTEN 2009 - Oxford
Press fit connections ...
Complex Press fit Stampings
Complex Plastic holders
HiTEN 2009 - Oxford
Harsh Environment
interconnections ...
 Mechanical Requirements- Kilograms
 Temperature Requirements vs. Material Selections
- ( 125°C, 150°C, @ 175 °C)
 Electrical requirements
- Milliohm resistance (0.5MΩ)
- Typical current requirements
- per eye & thickness
- Per Application Size
Capacitor Holders
 Application requirements
- Energy
- Transport
 Testing requirements
- resulting example data will shown in the Testing
 PCB Constructions and Types
- Hole size, plating PCB copper
 Applications Failure Modes- ( Printed Circuit Card )
HiTEN 2009 - Oxford
Inverters
HE interconnections
0.64m Thick
0.80m Thick
Press-Fit Style- Eye of the needle
• Solderless Technology design to meet the Automotive/
Transportation Requirements
• Qualified to 125° C and 150° C Operational temperatures and moving to 175° C
• Requirements defined by IEC, EIA and SAE.
• Designs validated for both 0.64mm and 0.80mm thick press-fit sections - Other
sizes being Introduced ( .4mm,1.0mm,1.5mm)
• High conductive material options - Power Applications 30%,40% & 80% IACS
• Compatible with Various PCB Plating Types
HiTEN 2009 - Oxford
HE interconnections
• . PCB hole sizes:
• 0.64mm & 0.80mm press-fit to fit into
(Nominal) 1.016mm and 1.486mm respectively.
•PCB Types :
• Tg > 150 º C
• Plated Through Holes (PTH)- Single & Multilayer
• PCB Platings: Tin, Silver, Gold, OSP
• PCB Construction FR-4 1.57mm thick & up
•Terminal Plating: 1 Micron-Tin plating in Press-Fit Zone
HiTEN 2009 - Oxford
HE interconnections
Primary Drivers for Materials & Options:
Temperature  Conductivity  Bend Radius
.64mm Thick:
•125 °C Primary Alloy: CuSn5 15% IACS
•150 °C alloy : 7025 CuNiSi- 40% IACS
• Conductive Alloy: Special Brass:(CuZnSnNiFeP) 30%
IACS
0.64mm Thick
.80mm Thick:
• 125 °C Primary Alloy: Special Brass:(CuZnSnNiFeP)
30% IACS
• 150 °C alloy : 7025 CuNiSi – 40% IACS
• Conductive Alloy:(CuCrAgFeTiSi) 80% IACS
0.8mm Thick
HiTEN 2009 - Oxford
Testing ....
 Tests criteria
 Test sequence & requirements
 Data and results
HiTEN 2009 - Oxford
Test Criteria
 Insertion force and retention force
 Vibration in Temperature
 Thermal shock
200.0
180.0
160.0
140.0
120.0
100.0
Force (N)
 High temperature exposure
80.0
 Mixed flowing 4 Gas test
 Current carrying capacity
 Plated through hole integrity
HiTEN 2009 - Oxford
Press-in 0.8 PF in Ø1.35 PTH
60.0
Push-out 0.8 PF in Ø1.35
PTH
40.0
20.0
0.0
0.000
0.042
0.083
0.125
0.167
0.208
0.250
0.292
0.333
0.375
0.417
0.458
0.500
0.542
0.583
0.625
0.667
0.708
0.750
0.792
0.833
0.875
0.917
0.958
1.000
1.042
1.083
1.125
1.167
1.208
1.250
 Temperature and humidity cycling
Distance (mm)
Test Sequence & Requirements
•Contact Resistance.5mΩ Max
•20N retention for .64mm
•60N retention for .80mm
•IEC–60352-5 Plated Through Hole Integrity
•No Visual Damage
HiTEN 2009 - Oxford
Thermal requirements
• Materials and testing up to 150 °C
• Testing Continuing to 175 °C
• Random Vibration in Temperature- For Chassis mount
Cabin  Underhood  Near Engine  On Engine
OEM Automotive Temperature classes
Temperature range
Temperature class
Tlo
Tup
1
-40 °C
+105 °C
2
-40 °C
+125 °C
3
-40 °C
+150 °C
4
-40 °C
+175 °C
HiTEN 2009 - Oxford
Summary of Interplex 0.64mm Press-Fit
IF/RF Testing –Sn PCB’s
HiTEN 2009 - Oxford
Summary of Interplex 0.64mm Press-Fit
IF/RF Testing –Ag PCB’s
HiTEN 2009 - Oxford
Summary of Interplex 0.80mm Press-Fit
IF/RF Testing –Sn PCB’s
HiTEN 2009 - Oxford
Summary of Interplex 0.80mm Press-Fit
IF/RF Testing –Sn PCB’s
200.0
180.0
160.0
140.0
Force (N)
120.0
100.0
80.0
Press-in 0.8 PF in Ø1.35 PTH
Push-out 0.8 PF in Ø1.35 PTH
60.0
Press-in 0.8 PF in Ø1.45 PTH
Push-out 0.8 PF in Ø1.45 PTH
40.0
20.0
Distance (mm)
HiTEN 2009 - Oxford
1.250
1.208
1.167
1.125
1.083
1.042
1.000
0.958
0.917
0.875
0.833
0.792
0.750
0.708
0.667
0.625
0.583
0.542
0.500
0.458
0.417
0.375
0.333
0.292
0.250
0.208
0.167
0.125
0.083
0.042
0.000
0.0
Summary of Interplex 0.80mm Press-Fit
IF/RF Testing –Ag PCB’s
HiTEN 2009 - Oxford
Testing Results Plated Through Hole Integrity
IEC -60352-5 Requirements
IF
Verified
HiTEN 2009 - Oxford
Contact Resistance
Verified
X-Sections
Plated Through
Hole Integrity
IEC-60352-5
21
Testing Results Plated Through Hole Integrity
IEC -60352-5 Requirements
Horizontal
Vertical Single Layer
Vertical Four Layer
b
c
c
a
b= Plating Thickness
a= Drill Hole Contour Deformation
HiTEN 2009 - Oxford
c= Trace Deformation
0.64 mm Plated Through Hole Integrity
Cross Section Dimensional Data in Immersion Tin PCB
Drill Hole Contour
Deformation "a" [µm]
PTH size
Lower Limit Hole
Remaining Plating
Thickness "b" [µm]
Vertical Trace
Deformation "c" [µm]
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Maximum value
19.3
14.7
34.0
30.0
18.8
6.1
Mean value
9.9
7.1
37.6
25.0
9.1
3.0
Minimum value
3.3
1.5
21.5
20.5
1.5
0.0
Requirement
50.8 maximum
8.0 minimum
50.0 maximum
Cross Section Dimensional Data in Immersion Silver PCB
Drill Hole Contour
Deformation "a" [µm]
PTH size
Upper Limit Hole
Vertical Trace
Deformation "c" [µm]
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Maximum value
31.8
30.2
58.4
61.1
17.8
12.7
Mean value
22.5
26.8
51.0
44.0
9.7
6.4
Minimum value
14.6
22.9
44.5
27.8
3.8
3.2
Requirement
HiTEN 2009 - Oxford
Remaining Plating
Thickness "b" [µm]
50.8 maximum
8.0 minimum
50.0 maximum
23
0.80 mm Plated Through Hole Integrity
Cross Section Dimensional Data in Immersion Tin PCB
Lower Limit Hole
Cross Section Dimensional Data in Immersion Silver PCB
Upper Limit Hole
HiTEN 2009 - Oxford
24
Approvals ...
Standards applicable
IEC, EIA, SAE
Tier 1 Automotive OEM,
OEM Qualifications
Hella, Conti, Bosch, TRW, Volkswagen, GM & Omron etc.
HiTEN 2009 - Oxford
Module development
 Design Drivers
1)
1.) Operational Temperature & Mounting Location
2)
2.) Sealed or unsealed requirements
3)
3.) PCB Plating and PCB Thickness
4)
4.) Power Requirements and Lead Interface
5)
5.) Operational frequency
Options & features Effected by Design Drivers
1.) Raw Material- 4 core options +
2.) Plating Lead Interface- Various interconnect and wire bondable options
3.) Press-Fit Gauge Thickness
4.) Plastic material- Multiple options
5.) Bend Radius
HiTEN 2009 - Oxford
Integrated Connector Package
Modules
 Plug & Play philosophy ....
 Complex Engineering:
- Stamp
- Plate
- Mold
HiTEN 2009 - Oxford
Customer Specific Application Testing
HiTEN 2009 - Oxford
Automotive Applications …
Bus Bar
Interconnects
&
Fuse Receptacles
Motor & Flapper Controls
Molded Sensor & Control
Modules
Junction Boxes
Tire Pressure Monitors
Engine & Transmission Controllers
Component Holders
HiTEN 2009 - Oxford
Solder Less Circuit Stacking Applications
Other Applications…
 Telecomms
 Telecom- Backplane
 Automotive
 MAP, Pressure & Position Sensors
 Inverters & Power Module
 Transport
 IGBT Power modules
 Energy
 Solar Interconnects
 Future ....
 DC to DC power Conversions
 Transportation, Energy-Oil & Gas, Wind energy
 IDC to press-fit applications
HiTEN 2009 - Oxford
Picture courtesy Infineon
Direct Insert Press-fit Applications…
HiTEN 2009 - Oxford
Conclusions
 Automotive Electronics is a primary “Harsh Environment” for electronic
connectors...
 Motor and Power control equipment will be the next major development
area for electronic interconnection issues
 Press-Fit interconnects are an enabler for more reliable and robust
connections in Harsh Environments
 Adaption to Integrated Connector Package Modules (ICPM) will
contribute to greener, more sustainable electronics
HiTEN 2009 - Oxford
Thank you for your attention
 The Authors would like to Acknowledge the help and assistance of :
 Interplex Engineered Products- East Providence RI
 Interplex Soprec, Besancon
 France
 Test Authorities
- Contech Research, Attleboro, MA
- SGS Germany GmbH , München
- Intertek Labs, Livonia, MI
For their assistance and permission to publish this information.
HiTEN 2009 - Oxford