AURIX MultiCore_Lauterbach_handout.pptx

Transcription

AURIX™
MultiCore Microcontroller
Dirk Geiger | 葛德克
Director Automotive Marketing, China (IFX CN ATV SMD AP M) | 市场总监
Infineon Technologies (China) Co. Ltd., Automotive Electronics | 英飞凌科技(中国)有限公司,汽车电子
Lauterbach Experts′ Forum, 19. Aug. 2015, Beijing
Agenda
› “AURIX™ Multicore”
– Trends in Automotive
– IFX company introduction
– AURIX™ product overview
– AURIX™ MultiCore
– Lauterbach and Infineon
set date
Copyright © Infineon Technologies AG 2015. All rights reserved.
2
Infineon
Company Presentation, 2015
Car Production Growth is driven by China,
South-East Asia and European recovery
Global car production (cars ≤ 6t)
Semiconductor Value per Car
[USD per car – 2019 vs. 2014]
[units m]
CAGR(14-19) = 3.2%
Others
+3.5%
93.8
97.2
CAGR14-19 1.3% 234
219
100.3102.3
404
362
S. Korea
CAGR14-19 2.3%
Japan
CAGR14-19 1.6%
N. America
CAGR14-19 2.0%
481
435
22.4 22.6
20.8 21.6
20.3
19.5 20.0
Europe
CAGR14-19 2.4%
481
28.1 29.2 30.0
23.1 24.9 26.7
21.3
18.6
17.1 17.6
China
CAGR14-19 4.6%
74.4
76.9
13.0 13.4
4.6
4.2
7.9
9.1
81.5
14.3
4.5
9.4
15.4
11.9 13.1
19.0 20.2 19.3
84.7
14.3
4.5
9.0
16.2
87.6
90.4
13.8 14.8
4.5
9.2
17.0
4.4
8.5
17.4
15.9
4.4
8.0
16.9
4.2
8.0
17.9 18.9
4.2
7.8
4.0
7.9
18.7 18.9
18.4
17.9
498
461
428
287
229
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
China
CAGR14-19
5.3%
Europe
N. America
CAGR14-19
2.8%
Source: IHS, September 2014
2015-Q1
CAGR14-19
1.6%
Japan
CAGR14-19
-3.0%
S. Korea
CAGR14-19
-1.5%
Others
Worldwide
CAGR14-19
6.6%
2014
2019
CAGR
334
363
1.64%
Source: Strategy Analytics, July 2014
Page 4
Market Growth Fuelled by Car Production Growth
and Increasing Functions Enabled by Semiconductors
Global car production (cars ≤ 6t)
Semiconductor value per car
[USD]
[units m]
2019
+3.5%
81.5
84.7
6.0
74.4 76.9 6.0
9.0
6.6
6.4
9.4
7.9
9.1
12.7
12.8
11.5
10.8
21.3
17.6 18.6
17.1
11.9
13.1
19.0
20.2
15.4 16.2
19.3 19.5
87.6
5.7
9.2
12.6
90.4
5.9
8.5
13.3
23.1 24.9
17.0 17.4
20.0 20.3
363
334
324
World
CAGR14-19 = 3.2%
93.8
6.3
8.0
14.0
97.2
6.5
8.0
14.6
6.8
7.8
7.1
15.3
15.8
7.9
20.8
[USD bn]
8.9
6.5
28.1 29.2
30.0
18.4 18.7
21.6 22.4
CAGR14-19
+2.8%
North America
CAGR14-19
+1.6%
Source: IHS, September 2014
2015-Q1
China
CAGR14-19
+5.3%
CAGR14-19
+4.6%
Japan
18.9
Body**
CAGR14-19
-3.0%
CAGR14-19
+5.6%
+6.4%
CAGR14-19
8.6
CAGR14-19
6.0
2019
CAGR14-19
9.3
7.4
22.6
ROW
+6.4%
9.4
Infotainment
APAC ex China
CAGR14-19
12.9
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Europe
2013
Semiconductor market by segment
Safety*
17.9
+1.64%
100.3 102.3
Powertrain
26.7
2014
CAGR14-19
+4.5%
+7.6%
2014
* Safety = “Safety” + “Chassis” according to SA definition.
** Body = “Body” + “Security” according to SA definition.
Source: Strategy Analytics, July 2014
Page 5
We Focus on Future Trends
Making Cars Clean
Market Trends
■
■
■
■
Dwindling energy resources
Urbanization
Stricter CO2 emission legislations
Growing environmental awareness
Infineon's Opportunities
n Infineon components are key enabler for
car manufacturers to meet challenging
targets for CO2 emission reduction, e.g. in
the EU 95g CO2/km in 2021
n We offer Hybrid and electric drivetrain
products (HybridPACK™/HybridPACK™
DSC)
n No electric vehicle without semiconductors:
electric drive and control, battery
management, on-board battery charging
and power grid communication
May 5, 2015
Page 6
Semiconductors Are Indispensable in
Reaching CO2 Emissions Targets
Historical national fleet emissions
performance and future targets
Grams CO2 /km normalized to NEDC Test Cycle
200
historical performance
enacted targets
proposed targets
180
160
USA[2]:
133
140
120
China[1] : USA[2]:
103
117
Japan: 105
100
EU: 95
80
60
2010
2015
2020
2025
Two main trends drive reaching the
CO2 emission goals – enabled by
semiconductors
Higher efficiency of the
‘classic’ ICE:
n EPS
n TPMS
n Start-stop
n Dual Clutch
n Alternator
Electrification of the
Drivetrain:
n Main Inverter
n Auxiliary Inverter
n Onboard Charger
n Battery Management
Source: The International Council for Clean Transportation
2015-Q1
Page 7
Smart Mobility
Infineon provides Mobility
solutions for Smart Cars/CCAVs,
Electro-Mobility and Transportation
Infrastructure
Electrification of Power train
for Cars & Auxiliary Drives
Leadership in Autonomous
Driving
Smart Traffic Management &
Improved Road Safety
Automotive Safety & Security
solutions
NEV Electric Drive Train &
Charging
Contactless Payment
1/20/2015
Copyright © Infineon Technologies AG 2015. All rights reserved
Page 8
We Focus on Future Trends
Making Cars Safe
Market trends
Key system requirements
Accident avoidance
Reliability
Autonomous driving
High Availability
Cyber-networked car
Functional Safety (ISO26262)
Infineon's Opportunities
Cybersecurity
Infineon components covers the overall needs
of the autonomous vehicle:
n AURIXTM microcontroller family enables
dependable and secure processing
n Sensing technologies (e.g. Radar, Hall, 3D
Imager) increase performance of ADAS
systems
n Safe actuation solution (e.g. 3 phase
Bridge Driver IC) and safe power supply
enable dependable vehicle dynamics and
control
May 5, 2015
Courtesy: Bosch
Page 9
Automotive Cyber-Security
13.08.2015
Page 10
Infineon Technologies is leading the
security industry for over 25 years
Market Leadership
with Broadest Security Offering
Innovation Leadership
with Pioneering Innovation
Leading in Smart Card Microcontrollers
CC EAL5+ PBOC 3.0
EMVCo CIPURSE™
Mobile
Government
Payment Communication
Transport
ID
Highest security
standardscompliant
Leading in Embedded Security
Authentication
TPM
Mobile Security
>20bn
security
chips
shipped
Awardwinning digital
security
Enable world’s
fastest
contactless
ePassport
1/20/2015
First 32
bit multiapplication
security µC
Secure Flexible
Fast Mask
Best combination
of Security,
Performance and
Multi-Function
Most
innovative
packaging
technology
Page 11
Infineon is the right partner for addressing
security in automotive
Forecast for cars with eCall
[units m]
56
34
3
2010
11
2013
2016
Infineon's system offering
Threat & Attack
Scenario
Analysis
Security-Certified Production
Secure Personalization
Scalable HW &
SW Security
Solution
Large Portfolio
of Common
Criteria Certified
Products
2019
Source: Strategy Analytics; active and inactive systems, cumulative
Applications subject to hacker attacks
Security-Certified
Concept, Design
and Development
Process
E-Call
Navigation
Internet
Local-based
services &
advertisement
Maintenance
updates
2015-Q1
Automatic
toll collection
Power on
demand
Traffic alerts / V2V
Microcontrollers with
Integrated Security
Trust Anchor
AUDOMAX
AURIXTM
Secure Elements for
Telematics & V2x
SLI 76
SLI 97
Page 12
Next Level of Zero Defect: A Continuous and
Sustainable Approach of Quality Improvement
P
L
A
N
Pareto analysis of systemic root
causes based on FARs, audit findings,
severe incidents and internal spills
The IFX houses of quality match the
systemic root causes
FE Operations
Maintenance
ATV Division
BE Operations
Equipment Stability
Lifecycle Stability
Unit Process Stability
NLoZD @ BE
Supplier Stability
Common BE SRC Projects
Top Defect Modes
Risk management
Gaps in:
Quality Leadership
Wire Problem (Team 1)
Pipeline management
OJTI with TWI
Wire Problem (Team 2)
Equipment Excellence
Package Crack/Chipped
Zero Defect Culture
Design for Green Line
Quality Firewall
Cu@BE
Supplier Excellence
(L/F)
Design for
Manufacturability
Manufacturing in a
Green Line
Die Crack
D
O
Robust Pre-assembly
Incomplete Mould
Deviation management
Mixed Device
Methodology and Tools, Organization
Firewall
Deviation Culture
Zero Defect Culture and Leadership
Deviation Handling
Detectability
Villach
Regensburg
Dresden
KPI
Kulim
Measure 1
Measure 2
BE
Power
Batam
DS
SENS
Logic
High
Power
BE
ATV
PMM
IPC
Number of returns
(FAR)
Measure 1
Measure 2
ATV
ASIC
BP
SENS
STD
µC
EDT
Measure 1
Measure 2
Corrective actions are systematically
rolled out and rollout is verified
100%
No spils
stability
A
C
T
Power
MAL
FE
Customer
Satisfaction
# 1 Partner
FE
Spills
Internal Stability
Indicators
CCS
C
H
E
C
K
The Quality KPI system controls
the progress of the program
Basis: Leadership and Motivated People
2015-Q1
Page
Page 13
13
We focus on three major areas relevant to
today’s societal needs
Energy Efficiency
Mobility
Security
Automotive
Industrial Power Control
Power Management & Multimarket
Chip Card & Security
1/20/2015
Page 14
Automotive
Overview
Product Range
n Sensors: pressure, magnetic, radar
n Microcontrollers: 32-bit for Powertrain, Safety and
ADAS
n Power: MOSFETs, IGBTs, smart power ICs: voltage
regulators, bridges, driver ICs, CAN / LIN / FlexRay™
transceiver**, DC-DC converters, power system ICs,
system-on chip, embedded power ICs
n Hybrid & Electric Vehicle: IGBT HybridPACK™,
HybridPACK™ Double Sided Cooling (DSC) modules,
gate driver ICs
Core Competencies/
Value Proposition
n Automotive commitment: More than 40 years of
automotive system and application expertise
n Complete automotive system provider
n Hybrid and Electro mobility: industry leading
expertise and product portfolio
n Functional Safety (ISO26262) and Security
enabling car solutions
n Worldwide development, production and support
sites for automotive semiconductors
n Next Level of Zero Defect: most comprehensive
quality program of the industry
May 5, 2015
Market Positions*
2
1
3
1
n
n
n No. 4
n
n
n
n
No.
No.
No.
No.
in Automotive semiconductors worldwide
Europe
North America
APAC & RoW
No. 1 Korea
No. 3 China
Japan
n No. 1 in automotive power semiconductors
(24.8%)
Source: Strategy Analytics (April 2015)
*incl. International Rectifier
**FlexRay is a trademark licensed by FlexRay Consortium GbR
Page 15
Infineon Automotive Makes Cars:
Clean, Safe and Smart
Clean
Safe
n Clean Combustion
Engines
n Occupant and
Pedestrian Protection
n Efficient Energy
Management
n Collision Avoidance
n Electrified Drivetrain
n Advanced driver
assistance
Smart
n Individual Convenience
n Secure Connectivity,
Data Integrity and
Privacy
n Autonomous Driving
With innovative products for the highest growth applications in:
Powertrain
Safety
Body
2015-Q1
Page 16
Infineon Automotive Division
Broad and Competitive Product Portfolio
Total Revenue: € 1’’965 for FY1314
High-End (32-bit)
Mid-Range (16-bit)
Low-End (8-bit)
AutoSAR Software
Microcontroller
Sense &
Control
High
Power
Magnetics Sensors
Pressure/TPMS Sensors
Radar
HybridPACK™- Inverter Modules
EiceDRIVER™ - IGBT Driver IC
EasyPack
Bare Die IGBT, Diodes
Automotive MOSFETs
2015-Q1
Transceivers
DC&DC Converters
Industrial products
Voltage Regulators
Standard
Power
Airbag ICs
EPS - ICs
Li/Ion BMS ICs
Alternator ICs
Multichannel Switches
Engine Management ICs
Transmission ICs
Powertrain
Safety & ASICs
Body Power
SPOCTM - SPI Power Controller
PROFETTM – Smart High Side Switch
HITFET™ – Smart Low Side Switch
Power PROFETTM/Connect FET –
Smart High Side Power Switch
SPI Driver for Relay Control
Infineon® Auto LED Driver
Motor Control - Bridges
System Basis Chips
Embedded Power IC
Page 17
ATV focuses on powertrain, safety and
body applications
Revenue split FY2014 by application
Safety
I
Body
Powertrain
2015-Q1
Page 18
Infineon is global #2, #1 in Europe & Korea,
#5 in China with strongest regional growth
World
($25.1bn)
1.
2.
3.
4.
5.
Renesas
13.3%
Infineon (+0.5%) 9.6%
STMicro
7.9%
Freescale
7.4%
NXP
6.5%
North America
($4.8bn)
1
Europe
($8.7bn)
APAC & others
($6.7bn)
1. Infineon (+0.1%)13.1%
2.
3.
4.
5.
1.
2. Infineon (+0.3%) 9.7%
3.
4.
5.
Japan
($4.9bn)
China
($3.5bn)
Korea
($2.0bn)
1.
1.
1.
1.Infineon 13.3%
2.Infineon
8.6%
(+0.2%)
2.
2.
2.
3.
3.
4.
3.Infineon
4.3%
(+0.6%)
4.
4.
4.
5.
5.Infineon
3.
5.
8.2%
(+1.2%)
(-0.4%)
5.
Source: Strategy Analytics, April 2014.
The main vehicle production markets driving "others"/ROW for 2013 are Brazil, India, Taiwan, and Indonesia.
2015-Q1
Page 19
Europe accounts for half of Infineon Automotive
Revenue. Importance of APAC is Growing
Revenue Split FY2014 by Region
Japan
Germany
Europe, Middle
East and
Africa
Americas
(w/o Germany)
I
APAC
2015-Q1
Page 20
Infineon’s Footprints in China
Changchun
Xi’an
Beijing
Chongqing
Wuxi
Shanghai
Headquarter of Infineon
China
Chengdu
Wuhu
Wuhan
Xiamen
Hongkong
Shenzhen
*w/o International Rectifier
1/20/2015
Page 21
Infineon China at a Glance
12
>10
LOCATIONS
APPLICATION
& SYSTEM ENG
JOINT LABS
>2000
868
IP/PATENTS
Filings
REVENUE mio €
>1700
PEOPLE
1
2
2
LOGISTIC
HUB
TECHNICAL
CENTER
MANUFACTURING
*w/o International Rectifier
1/20/2015
~100
Page 22
Key Customers in China (by Segment)
Application
Key accounts
Power Management &
Multimarket
Industrial Power
Control
Automotive
Chip Card &
Security
1/20/2015 *w/o
International Rectifier
Page 23
AURIX™
AUtomotive Realtime Integrated neXt Generation
Introduction and MultiCore
August 2015
Safety& advanced connectivity MCU Roadmap
future proof roadmap guarantees joint success story
Entry
Basic
Full feature
Premium
Typ. Applications
Production
90
2014
›
›
›
›
›
›
›
4-6 cyl. GDI/DDI/MPI
Full feature ESC
Hybrid Ctrl. / E-Drive
Chassis Domain Ctrl.
Sensor Fusion Box
RADAR
Camera (front)
›
›
4 cyl. GDI/DDI
Transmission
›
›
›
›
›
›
›
›
E-Drive
Integrated Airbag
Vehicle Stability Ctr.
Connected Gateway
Truck BCM
4 cyl. MPI
Battery Management
Airbag with Sensor
›
›
›
›
›
›
›
›
›
›
›
›
›
›
›
›
&
Active Power Steering
MAX
130
ESC premium
XC20x0 H/I
Suspension Systems
100/120MHz, 1.6/1M
BCM premium
1-2 cyl. MPI
XC20x0 M/N
66/80MHz, 0.5/0.8M
Starter-Generator
DC/DC Converter
XC20x0 U/L
40/66MHz, 0.1/0.3M XC2000
Airbag
ESC basic
ABS
(X)C164/7
Power Steering (EPS)
40MHz,0.2M
24GHz RADAR
BCM/Gateway
CIC310
Airbag basic
FlexRay IC XC8xx HOT
8-32k
Steering lock
Park brake
CIC61508
Safety IC
Companion ICs
(DCT/ECAT)
Clusters
TC1793/98
300MHz, 4M
TC1796/97
2015
65
TC1791
240MHz, 4M
150/180MHz, 1-3M
TC1782/84
180MHz, 2.5M
TC1746
TC1766/67180MHz, 2.5M
Transmission
80/133MHz, 1.5-2M
2019
AURIX™
PLUS
TC27xT
200MHz, 4M
TC270T
200MHz, 4M
Bare Die
TC26xD
200MHz, 2.5M
AUDO
AURIX™ TC3x
TC260D
200MHz, 2.5M
Bare Die
TC23xL
200MHz, 2M
TC24xS
180MHz, 2M
TC22xL
133MHz, 1M
TC21xL
133MHz, 0.5M
Technology
2014-12-15
40
2018
TC290T
300MHz, 8M
TC1724/28
133MHz, 1.5M
66/80MHz, 1M
2017
Bare Die
TC1387/67/37
TC1762/36
AURIX
™
TC29xT
300MHz, 8M
180MHz, 2-4M
2016
xx
Production
Development
Concept
Idea
25
›
›
›
›
›
›
›
›
Power Steering
Vehicle Stability Control, Braking
Chassis/Safety Domain Control
Airbag
Suspension
Sensor Fusion Box
RADAR
Vision
ADVANCED CONNECTIVITY
Connected Gateway
Full Feature BCM
V2V / V2X
›
›
›
POWERTRAIN
›
›
›
›
›
›
›
2014-12-15
Engine Management (GDI/DDI/MPI)
Transmission (DCT/ECAT/AMT)
Hybrid & Electric Vehicle Inverter
DC/DC Converter
Battery Management
Starter-Generator
48V
SAFETY: Complete Solution for Safety up to ASIL-D
CHASSIS, SAFETY, ADAS
SECURITY: Integrated hardware support for Security
Infineon Microcontroller focus areas
Leading in key automotive innovation areas
26
One Family - scalable across application
Most scalable 32-bit MCU portfolio on the market
2014-12-15
27
One Family - scalable across application
Most scalable 32-bit MCU portfolio on the market
2014-12-15
28
AURIXTM scalable family - next generation µC
One family supporting multiple applications
9x Series
up to 8 MB
TC297T
300 MHz
7x Series
up to 4 MB
TC275T
200 MHz
6x Series
up to 2.5 MB
TC264D
200 MHz
4x Series
up to 2 MB
TC244S
180 MHz
3x Series
up to 2 MB
2x Series
up to 1 MB
TC222L/S
133 MHz
TC233S/L
200 MHz
TC234S/L
200 MHz
TC223L/S
133 MHz
TC224L/S
133 MHz
TC265D
200 MHz
TC298T
300 MHz
TC299T
300 MHz
TC277T
200 MHz
TC212L/S
133 MHz
TC213L/S
133 MHz
TC214L/S
133 MHz
TQFP-80
TQFP-100
LQFP-144
TQFP-144
§
Clock rate 133-300MHz
§
Up to 2.7MB SRAM
§
Package/Pin
compatibility
TC267D
200 MHz
Power Consumption
§
On-chip DC/DC highefficiency power supply
TC237S/L
200 MHz
Hardware security enabled
1x Series
up to 512 KB
MCU Scalablility
§
# of TricoreTM 1.6 cores
LQFP-176 LFBGA-292
BGA-416
LFBGA-516
Support of ISO26262 ASIL-D and related safety
standards across the entire AURIXTM family
§
Standby control unit
§
Pretended networking
Safety/Security Concept
§
HW/SW safety features
§
ISO26262 compliance
§
Programmable 32bit
hardware security
module
Latest connectivity
§
6x CAN/CAN FD
§
Ethernet (AVB support)
§
FlexRay
AURIX™ ™
The Automotive Microcontroller for Tomorrow
Performance
With up to 1300DMips, 8MB flash and
640kB SRAM, AURIX™ matches the most
performance hungry applications
Safety
Innovative multicore safety concepts following
ISO26262 standard, enabling ASIL-D level
Networking
Rich set of peripherals to address the
growing demands of in-vehicle networking
Scalability
Broad portfolio of fully compatible devices
ranging from 512kB to 8MB flash and
from TQFP80 to LFBGA516 packages
Security
2nd generation Hardware supported security
functions
Supply
Security
Best-in-class supply security concept, 2nd Fab
concept
2014-12-15
30
AURIX™ Core Architectures
from single core to triple core lockstep w/ clock delay
Triple Core Lockstep
„T“ Marking
Flash
Core
Lockstep
„L“ Marking
Main bus
Flash
Main bus
Checker
Core
Checker
Core *
Checker
Core
Core
Core
Core
* 2nd checker core only in TC27x
Dual Core
Lockstep
„D“ Marking
Peripheral bus
Flash
Peripheral bus
Single Core
„S“ Marking
Main bus
Flash
Main bus
Checker
Core
Core
Core
Core
Peripheral bus
2014-12-15
Peripheral bus
31
7x Series – Umbrella Device
SAK-TC27xTP-64F200
7x Series
TriCore
1.6P
# Cores / Checker
2/1
Frequency
200 MHz
TriCore
1.6E
# Cores / Checker
1/1
Frequency
200 MHz
Flash
Program Flash
4 MB
EEProm @ w/e
cycles
64 KB @ 500k
FPU
2)
SRAM
Total
DMA
Channels
64
ADC
Modules 12bit / DS
8/6
Channels 12bit / DS
60 / 6 diff
GTM Input / Output
32 / 88 channels
CCU / GPT modules
2/1
FlexRay (#/ch.)
1/2
CAN-FD3)
(nodes/obj)
4 / 256
QSPI / ASCLIN / I2C
4/4/1
SENT / PSI5 / PSI5S
10 / 3 / 1
HSCT / MSC / EBU
1 / 2 diff LVDS / -
Other
Ethernet MAC
Safety
SIL Level
ASIL-D
Security
HSM
Optional
Power
EVR
Yes
Standby Control
Unit
Support
1)
2)
3)
HOT option available with limited functionality >Ta=125°C
not available on TC29x/TC26x – to be considered in SW family concept
Option: CAN-FD
2014-12-03
Overlay
Data Flash
BROM
HSM DFlash
RAM
Checker Core
Checker Core
FPU
PMI
Progr.
Flash
Progr.
Flash
2)
FPU
DMI
TriCore™
1.6P
Overlay
PMI
TriCore™
1.6E
OCDS
Bridge
DMI
SDMA
Standby
Overlay
HSM
PLL &
PLL ERAY
HSCT
BCU
SCU
STM
GTM
GPT12x
CCU6x
Ports
DS-ADCx
ADCx
IOM
FCE
EVR
I²C
PSI5(S)
SENT
QSPIx
ASCLINx
MSCx
MultiCAN+FD
System Peripheral Bus
FlexRay
Interfaces
472 KB
PMU
DMI
SRI Cross Bar
Ethernet
Timer
(DMI , PMI)
LMU
TriCore™
1.6P
PMI
Feature Set
5V or 3.3V
single supply
Package Variants
LFBGA-292
-40°C to +125°C
60 ADC inputs
Bare Die
LQFP-176
0.8mm
0.5mm
1)
-40°C to +125°C
48 ADC inputs
1)
Tjmax 170°C
60 ADC inputs
32
7x Series – Umbrella Device
SAK-TC27xTP-64F200
FPU
3x TriCore™ 1.6
Application and I/O processing
Up to 2x Lockstep cores
ISO26262 ASIL D support
Progr.
Flash
Progr.
Flash
Checker Core
PMI
2)
FPU
DMI
TriCore™
1.6P
Overlay
PMI
TriCore™
1.6E
OCDS
Bridge
DMI
SDMA
Standby
Overlay
Ports
Hardware acclerators
HSCT
BCU
SCU
STM
DS-ADCx
ADCx
1x 8bit Standby controller
Low power standby functions
IOM
FCE
EVR
I²C
PSI5(S)
SENT
QSPIx
ASCLINx
MSCx
FlexRay
FFT and windowing hardware support
Ethernet
1x 32bit FFT Engine
5V or 3.3V
single supply
Package Variants
LFBGA-292
9 user-programmble Cores
-40°C to +125°C
Bare Die
LQFP-176
0.8mm
60 ADC inputs
2014-12-03
HSM
PLL &
PLL ERAY
›
GTM
GPT12x
Programmable security functions
CCU6x
Realtime timed I/O processing
›
›
HSM DFlash
M-JPEG/CIF
RAM
FPU
1x 32bit security processor
›
BROM
RAM
FFT engine
Checker Core
4x programmable GTM sequencer
›
Data Flash
Overlay
SRI Cross Bar
MultiCAN+FD
›
PMU
DMI
TriCore™
1.6P
PMI
›
LMU
0.5mm
1)
-40°C to +125°C
48 ADC inputs
1)
Tjmax 170°C
60 ADC inputs
33
Why Multi-Core?
Address the challenges of tomorrow
›
Total power limit - Flash single-core processors have
peaked at appr. 300MHz@90nm
- more power would add system cost (e.g. cooling)
›
Further performance enhancements mainly enabled
by additional cores
– with less power and more flexibility, enabling
advanced applications (e.g. safety dedicated tasks)
›
Functional standardization allows introduction of
highly efficient dedicated accelerator blocks
– enabling more optimized devices to save on BOM.
›
Microcontroller power modes and power
management become more important
- only use the performance that is required to enable
energy efficient automotive systems.
10/04/2013
Set date
Copyright © Infineon Technologies 2013. All rights reserved.
Page 34
The Task
›
›
›
Provide 1.5 times the application performance compared to previous generation
Increase performance-power ratio by
more than 30%
Provide means for stronger software
encapsulation
Power Dissipation Pd
AURIX™ TriCoreTM based Multi-Core architecture
for Efficient Performance
Single Core
Controller
Pd~C∙U2∙f
Dual/Multi Core
Controller
Performance
Solution
›
›
›
›
Introduction of TriCore™ 1.6 multicore
architecture
Efficiency and performance CPU variant
1000 DMIPS and more application
performance
Advanced power management
technologies, e.g. integrated DC/DC
converter, clock gating, low power modes,
standby controller
2014-12-15
300MHz
300MHz 300MHz 200MHz
TC16P
TC16P TC16P TC16E
RAM
PD trend: flat
RAM
RAM
RAM
Cross
bar
Crossbar
TC1798
AURIX™ High End
35
TriCore™ Overview
TC 1.3
TC 1.3.1
TC 1.6
TC 1.6Performance
TC 1.6Efficiency
Architecture
32-bit superscalar
Harvard
32-bit superscalar
Harvard
32-bit superscalar
Harvard
32-bit superscalar
Harvard
32-bit scalar
Harvard
Max. Frequency
150 MHz
180 MHz
300 MHz
300 MHz
200 MHz
Pipeline stages
4
4
6
6
4
DMIPS / MHz
1,55
1,68
1,7
1,7 – 2,3
1.4 – 1,7
Instruction cache
Two way set associative,
256-bit cache line length
Four way set
associative, 256-bit
cache line length
Two way set
associative, 256-bit
cache line length
Data cache
Not in Automotive
Products
Two way set associative
128-bit cache line
length
128-bit cache line
length
4 line read buffer or
HW int. division
unit
No
No
Yes
Yes
Yes
MAC units
dual 16x16 multipliers
FPU
Single precision (32-bit)
FPU performance
0,66 FLOPs/cycle
0,66 FLOPs/cycle
2 FLOPs/cycle
(pipelined)
2 FLOPs/cycle
(pipelined)
2 FLOPs/cycle (pipelined)
User modes
Supervisor, user 1, user
0
0
0
0
0
Memory
protection
2 protection sets
(overlaid HW
breakpoints)
4 protection sets
(overlaid HW
breakpoints)
4 protection sets
(separate HW
breakpoints)
4 protection sets
(separate HW
breakpoints)
4 protection sets
(separate HW
breakpoints)
Instruction set
16/32 bit instructions
Compatibility
TC1.2 compatible
TC1.3 compatible
TC1.3.1 compatible
TC1.6 compatible
TC1.6 compatible
Other features
n static branch predictor
n dynamic branch
predictor
n Enhanced branch
pre-diction (branch
history and target
buffers)
n Dual core support
n Dual core capable
n Safety support
n Power consumption
optimized
Production (AUDO MAX)
Production (AURIX)
Status
2014-12-15
Production (Audo-NG)
Production (AudoFuture)
(version TC 1.6.1)
(version TC 1.6 Scalar)
n Safety support
Production (AURIX)
Page 36
Exceptional Performance
Performance benchmark based on the application code for a
4 cylinder direct injection engine management system
Freescale
Renesas
228%
Infineon
170%
113%
113%
81%
80%
TC27xT
100%
74%
TC29xT
152%
46%
45%
28%
Monaco
Andorra
Mamba
e200z335
@80Mhz
e200z4
@150MHz
e200z7
@266Mhz
2014-12-15
SH7286
Estimation
SH2A
SH2A
@100Mhz @200Mhz
TC1767/24 TC1767/28 TC1797/82
TC1.3.1
@80Mhz
TC1.3.1
@133Mhz
TC179x
TC1.3.1
TC1.6
@180Mhz @200Mhz
TC179x
TC1.6
@300Mhz
Estimation
1.5x
TC1.6P
@200Mhz
Estimation
1.5x
TC1.6P
@300Mhz
37
AURIX™ safety system architecture example
EPS (electric power steering)
Supply
TLF35584
Safety Power Supply
Sense
Compute
VBAT
VBAT
Actuate
VSens VLogic VTx
VMCU
Torque Sensor
TLE 4998
OptiMOS™-T2 40V
7x IPB180N04S4-01
3-Phase
Driver
IC
32-bit
Lockstep
MCU
TLE
9180
AURIX™
М
Rotor Position
iGMR Sensor
TLE 5009/12
TC233L
Motor
Current
Communicate
Failure Protection
2014-12-03
CAN Transceiver
TLE 6251D / TLE7250G
FlexRay
Transceiver (opt.)
Failure Diagnosis
Redundancy
Diverse Implementation
38
AURIX™ safety system architecture example
EPS (electric power steering)
Supply
TLF35584
Safety Power Supply
Sense
Compute
VBAT
VBAT
Actuate
VSens VLogic VTx
VMCU
Torque Sensor
TLE 4998
OptiMOS™-T2 40V
7x IPB180N04S4-01
3-Phase
Driver
IC
32-bit
Lockstep
MCU
TLE
9180
AURIX™
М
Rotor Position
iGMR Sensor
TLE 5009/12
TC233L
Motor
Current
Communicate
Failure Protection
2014-12-03
CAN Transceiver
TLE 6251D / TLE7250G
FlexRay
Transceiver (opt.)
Failure Diagnosis
Redundancy
Diverse Implementation
39
AURIX™ –HW measures supporting safety
Microcontroller
H
F
G
H
N
H
N
E
N
E
E
E
A
Redundant, spatially separated
peripherals
B
Bus Monitoring Unit
C
Safe DMA
D
Safe SRI
D
E
L
K
J
C
I
I
I
F
Interrupt
controller
M
I
B
I
I
I
I
I
I
I
I
I
I
GTM
I
A
System
2014-12-15
A
A
E
A
A
I
SRAM ECC (DECTED with enhancements
to detect multi bit failures)
Flash ECC (SECDED with enhancements
to detect multi bit failures)
G
Lockstep core
H
Memory protection core
I
Memory protection peripherals
J
Safe Interrupt Processing
K
Flexible CRC Engine (FCE)
L
IO Monitor
M
Clock Monitoring
N
CPU self tests (90% Latent Fault Metric)
I
40
Exemplary processing of a safety critical task
Microcontroller
5
4
6
1
Analog to digital conversion
2
Sensor data pre-conditioning
3
Data transfer to SRAM
4
Fetching of data and/or code
from flash
5
Data processing
6
Derived data transfer to timer
7
Timer data processing
8
Timer data transfer to
communication interface
9
Communication to actuator
Lockstep core
domain
3
GTM
8
7
9
System
2014-12-15
Actuator
2
1
Sensor
Lockstep cores support the safe
processing of data, but many
additional features are required to
build a safe system!
41
Embedded µC Security - AURIX™
Security Hardware
Secure Platform
Sec
þ
APP
Security
CPU
Sec
Sec
ECC
RSA
APP
AES
RNG
sec
APP
Ï
APP
HSM
HSM: 32 bit CPU
AES Accelerator
Hardware Security Module (HSM)
• A highly flexible and
programmable solution
• AES128 HW accelerator matching
performance for automotive protocols
• Crypto- and Algorithm Agility by
Software
• AIS31 compliant True Random
Number Generator (TRNG) with high
Random Entropie over Lifetime
2014-12-15
Page 42
AURIX™ kits and tools
available
http://free-entry-toolchain.hightec-rt.com
2014-12-15
43
TLF35584QVVS1/VS2 plus AURIX™ TriBoard
Evaluation Environment
› TLF35584-Evaluation-Boards (Green)
– Equipped either with 3V3- or 5V-variant
– Can be adapted to high- and low-switching
frequency
› AURIX™ TriBoard (Red)
– For TLF35584-configuration
– Stack-concept
– GUI
– Parameter setting
– Monitoring functions
– SPI-communication logging
– Register modification
– Flag control
2014-12-15
44
Infineon AUTOSAR offering
Low level driver (MCAL) ISO26262 compliant
2014-12-15
45
AURIX™ Tool Chain
Embedded Software Solutions
AUTOSAR suites
elektrobit
Simulation/
Virtual Prototyping
Synopsys
Integrated Compiler
Environments
Diab Compiler
Auto Code
Generation Tools
dSPACE
Etas
Timing/
Scheduling Analysis
AbsInt
GLIWA
Symtavision
Timing Architects
Operating
Systems
elektrobit
Etas
Hightec
Vector
Emulators/Debugger
Development Systems
Hitex
iSYSTEM
Lauterbach
PLS
Data Measurement, Calibration
& Rapid Prototyping
Accurate
Technologies
dSPACE
Etas
Vector
Programmer /Flash Tools
Data IO
Hitex
AbsInt
BTC
GAIO
Göpel
Hitex
HTV
Software Verification
Training /Services
2014-12-15
Vector
Informatic
GNU GCC
KPIT
Etas
TASKING
PLS
Promik
SMH
The Mathworks
MicroConsult
46
Checker Core
FPU
FPU
1xTriCore™
32bitDMI
FPU
1xTriCore™
32bitDMI
PMI
1xTriCore™
32bitDMI
PMI
1.6P
PMI
1.6P
1.6P
Performance
AURIXTM Product Features - Summary
MultiCore - Making the difference
3x TriCore™ 1.6
Application and I/O processing
Floating Point Unit
Up to 3 instructions/cycle
Crossbar
Flash
Flash
RAM
Bridge
FFT
SDMA
HSSL
BCU
SCU
STM
GTM
GPT12x
CCU6x
1xHSM
32bit
Safety/Security
Sys
Safety Management (SCU)
Connectivity
Data
1x Fast Ethernet (AVB supported)
Power
TriCore™ 1.6 Lockstep
Program
1x Single Supply EVR DC/DC
DS-ADC
Safe DMA (SDMA)
I/O Monitor (IOM)
CRC unit (FCE)
Hardware Security Module (HSM)
ADC
Peripheral Bus
IOM
FCE
EVR
I²C
PSI5(S)
SENT
QSPI
ASCLIN
MSC
MultiCAN+
FlexRay
Ethernet
SCR
5V or 3.3V
single supply
Samples and kits available for the TC27x: June 2014
Early sampling already on request
10/04/2013
Page 47
1x Flexray
4x MultiCAN + FD
1x HSSL
Copyright © Infineon Technologies 2013. All rights reserved.
Set date
AURIXTM useful links
Product home page AURIXTM:
www.infineon.com\AURIX
AURIXTM forum for technical information exchange:
www.infineon.com\tricore-forum
AURIXTM Documentation access:
www.myinfineon.com
Free tool chain AURIXTM:
http://free-entry-toolchain.hightec-rt.com/
2014-12-15
48
Infineon in China
Infineon Official Website
www.infineon.com/cn
Infineon
China
Official
Wechat
Wechat Account：
InfineonChina
Wechat QR Code：
Infineon
Tech
Community
(Chinese)
Infineon
power
management
and RF tech
community
Infineon
Automotive
ecosystem
official
website
http://www.infine
http://www.infine
http://www.infine
onic.org/
onon-power-rf.org
ecosystem.org/
Infineon
Automotive
ecosystem
Wechat QR
Code
Weibo
http://weibo.com/inf
ineonecosystem
2014年6月27日
© 英飞凌科技股份公司版权所有，2014年。保留所有权利。
Page 49
Lauterbach
Infineon
Debug Tools
Support infineon targets
set date
51
Trace32 for TriCore™
OCDS-L1/DAP Interface
Onchip Trace for
TriCore™ ED
set date
Support for
PXB4260, TC10GP, TC1100, TC1115,TC1124,
TC1128, TC1130, TC1161, TC1162, TC1163,
TC1164, TC1165, TC1166, TC1167, TC1182,
TC1184, TC1191, TC1193, TC1197, TC1198,
TC11IA, TC11IB, TC11IC, TC1337, TC1367,
TC1387, TC1724, TC1728, TC1736, TC1746,
TC1762, TC1764, TC1765, TC1766,TC1767,
TC1768, TC1775, TC1782, TC1784, TC1791,
TC1792, TC1793, TC1796, TC1796L, TC1797,
TC1798, TC1910, TC1912, TC1920
Support for
TC1287ED, TC1736ED,
TC1728ED, TC1766ED,
TC1782ED, TC1784ED,
TC1793ED, TC1796ED,
TC1798ED
TC1724ED,
TC1767ED,
TC1791ED,
TC1797ED,
52
Debug Tools
› AURIX™ Family
2014-02
All supported
2013-02
2012-02 First
Aurix support
set date
53
Multi-Core Debugging and Tracing
› Multicore debugging for up to three
TriCore™ cores, HSM core and GTM
› Ready-to-use FLASH programming
scripts
› On-chip trace as well as serial off-chip
trace
› Start and stop synchronisation
set date
54
AMP Multi-Core Debugging
set date
55
Thank You!
set date
56

AURIX MultiCore_Lauterbach_handout.pptx

Transcription

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