ME810A-HV35R module

Transcription

ME810A-HV35R module
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
Future Technology
Devices International
Datasheet
ME810A-HV35R Display
Module
General Purpose Multi Media Controller
1
Introduction
1.1 Features
The ME810A-HV35R is a development module for
FTDI’s FT810, Embedded Video Engine (EVE)
graphics controller IC. This module behaves as an
SPI slave, and requires a SPI Master for proper
micro-controller interface and system integration.
The ME810A-HV35R module includes a 3.5 inch
320*480, portrait TFT LCD panel with resistive
touch screen and buzzer for audio output. Users
can also connect to different LCD screens which
meet the FT810 technical specification and fit
with the ME810A-HV35R LCD interface connector.
The ME810A-HV35R utilises the FTDI FT810
Embedded Video Engine. Graphic, audio and touch
features of the FT810 can be accessed with the
ME810A-HV35R. For a full list of the FT810’s
features, please see the FT81x datasheet.
The ME810A-HV35R has the following features:

Ready to use LCD module.

Supports resistive touch with pressure sensing.

Supports portrait and landscape display mode.

Supports mono audio output.

On board LCD backlight LED driver.

On board buzzer with a transistor control.

+3.3V single power supply.

Supports configurable LCD with 4-line SPI.

Direct connect with MM900EV module series as a
display module.

Bezel with four mounting holes for system
assembly.
N either the whole nor any part of the information c ontained in, or the product desc ribed in this manual, may be adapted or reproduced
in any material or electronic form without the prior written cons ent of the copyright holder. This product and its documentat ion are
s upplied on an as-is basis and no warranty as to their s uitability for any partic ular purpose is either made or implied. Future T ec hnology
D evices International L td will not accept any claim for damages hows oever aris ing as a res ult of us e or failure of this produ c t. Y our
s tatutory rights are not affec ted. T his produc t or any varian t of it is not intended for use in any medical appliance, device or sys tem in
whic h the failure of the produc t might reasonably be expec ted to res ult in personal injury. T his doc ument provides preliminar y
information that may be s ubjec t to c hange without n otice. N o freedom to us e patents or other intellec tual property rights is implied by
the public ation of this document. Future Tec hnology Devic es I nternational Ltd, U nit 1 , 2 Seaward P lace, C enturion Business Pa rk,
G las gow G 4 1 1 HH U nited Kingdom. Sc otland R egistered Company N umber: SC136640
Copyright © Future Technology Devices International Limited
1
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
2 Ordering Information
Part No.
Description
ME810A-HV35R-BK
FT810 module, with FPC/FFC 50 LCD connector, 3.5 inch TFT LCD display
panel preinstalled with resistive touch. Black bezel.
ME810A-HV35R-PL
FT810 module, with FPC/FFC 50 LCD connector, 3.5 inch TFT LCD display
panel preinstalled with resistive touch. Pearl bezel.
Table 2-1 – Ordering information
Note: This module is recommended as an accessory to the MM900EV series (due Nov 2015) for
development
purposes.
For
more
information
on
the
MM900EV
series,
refer
to:
http://www.ftdichip.com/Products/ICs/FT90x.html.
Copyright © Future Technology Devices International Limited
2
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
Table of Contents
1 Introduction ................................................................. 1
1.1
Features ................................................................................ 1
2 Ordering Information .................................................... 2
3 Board Interface Description .......................................... 4
3.1
Board Profile .......................................................................... 4
3.2
J1- SPI interface and control signals ....................................... 5
3.3
JP1- On board buzzer enable .................................................. 5
4 Application Example...................................................... 6
4.1
Getting Start With an MM900EV Module .................................. 6
4.2
Hardware Setup ..................................................................... 6
4.3
Software Setup ...................................................................... 7
5 Mechanical Dimensions ................................................. 8
5.1
J1 Pin Header Dimensions ...................................................... 8
5.2
Bezel Mechanical Drawing ...................................................... 9
5.3
Board Schematics .................................................................10
6 Specifications ............................................................. 11
6.1
Electrical Specification ..........................................................11
6.2
Display Specification .............................................................11
6.3
Optical Specification..............................................................12
7 Contact Information .................................................... 13
Appendix A - References .................................................. 14
Document References ...................................................................14
Acronyms and Abbreviations .........................................................14
Appendix B - List of Figures and Tables ............................ 15
List of Figures ...............................................................................15
List of Tables ................................................................................15
Appendix C – Revision History.......................................... 16
Copyright © Future Technology Devices International Limited
3
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
3
C learance N o.: FT DI# 468
Board Interface Description
The ME810A-HV35R module is intended for direct use into existing applications that require a display.
This module is suitable for interfacing with an external microcontroller (e.g. MM900EV series ) that has a
SPI Master channel.
3.1 Board Profile
Figure 3-1 – ME810A-HV35R board bottom view
Copyright © Future Technology Devices International Limited
4
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
3.2 J1- SPI interface and control signals
Pin No.
Name
Type
Description
1
J1_SC K
I
SPI clock input
2
J1_C S0#
I
FT810 SPI chip select, active low
3
J1_MISO
I/O
SPI master input, slave output or QSPI IO1
4
J1_MOSI
I/O
SPI master output, slave input or QSPI IO0
5
J1_IO3
I/O
FT810 GPIO1 or QSPI IO3
6
J1_IO2
I/O
FT810 GPIO0 or QSPI IO2
LC D panel data / command selection pin
7
J1_DC X
I
Low: C ommand
High: Parameter
8
J1_C S1#
I
LC D panel SPI chip select, active low
9
J1_3V3
P
3.3V power supply input
10
J1_5V
P
NC
11
GND
P
Ground
12
GND
P
Ground
13
J1_PD#
I
FT810 powers down input, active low.
C onnect to 3.3V if not used.
14
J1_INT#
O
FT810 interrupts output, active low. On
board 10kΩ pull-up to 3.3V.
15
J1_AUDL
O
FT810 PWM audio output
16
J1_DISP
I
LC D display reset. C onnect to GND if not
used.
Table 3-1 – J1 Pinout
3.3 JP1- On board buzzer enable
Jumper fitted by default. Remove the jumper to disable the buzzer.
Copyright © Future Technology Devices International Limited
5
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
4
C learance N o.: FT DI# 468
Application Example
4.1 Getting Start With an MM900EV Module
As a quick start with the ME810A-HV35R development board, connecting to an MM900EV module
development platform is recommended. Demo applications are provided for users to experiment and
experience the FT810 in the ME810A system. The following paragraphs provide a short description for
development procedures.
The MM900EV series of FT900 MCU evaluation platforms allows user to develop various applications with
rich peripheral interfaces. The following MM900EV modules are compatible:


MM900EV1A: with a 32-bit high performance FT900 MCU, 10/100Mbps Ethernet, USB2.0
Host, USB2.0 Device, SD3.0, Audio Codec, SPI Master Quad Interface, and 40-pin external
GPIOs.
MM900EV-Lite: Tiny board with a 32-bit high performance FT900 MCU, USB2.0 Device,
SD3.0, SPI Master Quad Interface, and 40-pin external GPIOs.
Detailed information of MM900EV module can be found at:
http://www.ftdichip.com/Products/ICs/FT90x.html
4.2 Hardware Setup
Figure 4-1 shows the ME810A-HV35R module connected to an MM900EV-Lite module.
Figure 4-1 – ME810A-HV35R connects to MM900EV Module
Copyright © Future Technology Devices International Limited
6
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
The ME810A-HV35R J1 pin header connects to the MM900EV module J2 dual-enter socket (See
Table 4-1 for pin mapping).

Connect a USB cable or Power Supply to the MM900EV module to power the system.
Pin number
J1 Signal
J2 Signal
1
J1_SCK
SPIM_SCK
2
J1_CS0#
SPIM_SS0
3
J1_MISO
SPIM_MISO
4
J1_MOSI
SPIM_MOSI
5
J1_IO3
SPIM_IO3
6
J1_IO2
SPIM_IO2
7
J1_DCX
DCX
8
J1_CS1#
CS1#
9
J1_3V3
VDD_3V3
10
NC
VDD_5V
11
GND
GND
12
GND
GND
13
J1_PD#
PWD#
14
J1_INT#
INT#
15
J1_AUDL
AUD_LIN
16
J1_DISP
DISP
Table 4-1 – ME810A-HV35R J1 and MM900EV module J2 connection
4.3 Software Setup

Download the FT90x toolchain and sample application for ME810A-HV35R from the FTDI website at
http://www.ftdichip.com/Products/ICs/FT90x.html.

Install the FT90x toolchain on a Windows PC.

Download the sample application binary file to the MM900EV module.
The sample applications will demonstrate display, touch and audio functions of the ME810A-HV35R
module. Refer to AN_381_ME810A_HV35R_Sample_Application for more details.
Copyright © Future Technology Devices International Limited
7
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
5
C learance N o.: FT DI# 468
Mechanical Dimensions
5.1 J1 Pin Header Dimensions
J1 pin header is a 2x8 way, 2.54mm pitch vertical pin. The Figure 6-2 illustrates the first pin dimensions and
pin header parameters (in millimeters).
Figure 5-1 – J1 Pin Header Dimensions
Copyright © Future Technology Devices International Limited
8
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
5.2 Bezel Mechanical Drawing
Figure 5-2 – Bezel dimensions
Copyright © Future Technology Devices International Limited
9
ME810A-HV35R module Datasheet
Version 1.1
SP1
[BUZZER]
JP1
1
2
EVE_3V3
Q1
D1
1N4148
T_NPN
C2
C3
0.1uF
EVE_3V3
U2
4
OE
GND
2
1
2
4
6
8
10
12
14
16
33R
J1_5V
AUDIO_L
R13
10K
EVE_SCK
EVE_MISO
EVE_MOSI
EVE_CS0#
EVE_IO2
EVE_IO3
EVE_INT#
EVE_PD#
[CS0]
[DATA0]
[DATA2]
[CS1]
J1_INT# [Interrupt output]
J1_DISP [Display]
J1_CS0#
J1_MOSI
J1_IO2
J1_CS1#
R17
SN74LVC1G125DBVR
J1_3V3
J1
EVE_AUDL
GND
4.7uF
R16
2.55K
J1_SCK
J1_MISO
J1_IO3
J1_DCX
2
4
6
8
10
12
14
16
R14
10K
1
2
3
4
5
6
7
8
9
10
11
12
C8
18pF
EVE_3V3
R29
100k
U1
AUDIO_L
GND
SCK
MISO/IO1
MOSI/IO0
CS_N
GPIO0/IO2
GPIO1/IO3
VCCIO1
GPIO2
INT_N
PD_N
Y1
12MHz
C7
18pF
GND
R37
R15
33R
33R
33R
33R
EVE_IO2
EVE_CS0#
EVE_MOSI
EVE_MISO
EVE_SCK
EVE_DISP
600R/0.5A
FB2
EVE_3V3
C13
GND
C14
C16
EVE_3V3
C11
FT810
GND
B2
B3
B4
B5
B6
B7
DCLK
DISP
HSYNC
VSYNC
DE
C12
C18
4.7uF 0.1uF
LCD_3V3
GND
C17
GND
0.1uF 0.1uF
C15
GND
4.7uF 0.1uF
36
35
34
33
32
31
30
29
28
27
26
25
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
1
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R18
R20
R21
R22
R23
R24
R25
R19
R26
R27
R28
BCKL
YM
XM
YP
XP
330R
330R
330R
330R
330R
330R
330R
330R
330R
330R
330R
330R
C4
330R
330R
330R
330R
330R
330R
330R
330R
330R
330R
330R
LCD_B2
LCD_B3
LCD_B4
LCD_B5
LCD_B6
LCD_B7
LCD_G2
LCD_G3
LCD_G4
LCD_G5
LCD_G6
LCD_G7
C6
LCD_R2
LCD_R3
LCD_R4
LCD_R5
LCD_R6
LCD_R7
DCLK
C5
U3
EN
0.1uF
C1
LCD_3V3
1
2
U4
600R/0.5A
FB1
EVE_3V3 GND
OE
LCD_3V3
4
GND
LEDK
LEDK
LEDA
LCD_3V3
LCD_RST
EVE_CS1#
EVE_DCX
EVE_SCK
33R
33R
33R
33R
EVE_MOSI
LCD_SDO
LCD_B2
LCD_B3
LCD_B4
LCD_B5
LCD_B6
LCD_B7
LCD_G2
LCD_G3
LCD_G4
LCD_G5
LCD_G6
LCD_G7
LCD_R2
LCD_R3
LCD_R4
LCD_R5
LCD_R6
LCD_R7
DE
DCLK
HSYNC
VSYNC
R30
10K
R31
10K
R32
10K
R33
R34
R35
R36
1
exposed copper
exposed copper
PAD2
1
PAD1
YP
XM
YM
XP
LCD_3V3
SN74LVC1G125DBVR
LCD_RST
EVE_MISO
U5
4
4
5
6
74V1G32
LED3
LED2
LED1
GND
DS9300A
LED4
GND
EVE_3V3
DISP
HSYNC
VSYNC
DE
1
2
GNDGNDGND
3
2
1
U6
SN74LVC1G08DBVR
4
EVE_3V3
[FT900 GPIO] EVE_DISP
[FT810 GPIO]
DISP
LCD_RST
2
GND
BCKL
GND
5
3
SMD
XL1
Shunt 2.0mm
GND
[CLK]
[DATA1]
[DATA3]
[Data/Cmd]
1
3
5
7
9
11
13
15
1
3
5
7
9
11
13
15
8x2 Male SMD Pin Header
GND
J1_DISP
R38
33R
EVE_IO3
GND
J1_SCK
R39
33R
EVE_CS1#
GND
J1_MISO
R40
33R
EVE_DCX
I/O Daughter
J1_MOSI
R41
33R
EVE_PD#
GND
0.1uF 0.1uF
5
3
[Power down] J1_PD#
[Audio ouput] J1_AUDL
GND
J1_CS0#
R42
33R
EVE_INT#
VCORE_1V2
J1_IO2
R43
33R
J1_3V3
J1_IO3
R44
33R
C10
J1_CS1#
R45
C9
J1_DCX
R46
EVE_AUDL
0.1uF
J1_PD#
33R
4.7uF
J1_INT#
R47
VCORE_1V2
J1_AUDL
5
3
49
48
47
46
45
44
43
42
41
40
39
38
37
EP
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
X1/CLK
X2
GND
VCC
VOUT1V2
VCC
XP
YP
XM
YM
GND
BACKLIGHT
13
14
15
16
17
18
19
20
21
22
23
24
5
3
YU
XL
YD
XR
GND
GND
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
GND
LEDA
LEDK1
LEDK2
LEDK3
LEDK4
LEDK5
LEDK6
GND
GND
VCC
VCC
REST
CSX
RS
WRX(SCL)
RDX
SPI-SDA
SDO
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
DB9
DB10
DB11
DB12
DB13
DB14
DB15
DB16
DB17
DE
PCLK
HSYNC
VSYNC
IM2
IM1
IM0
GND
YU [Top]
XL [Left]
YD [Bottom]
XR [Right]
GND
CN1 DISP1 KD035C-11-TP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
CN_50Pin_FPC/FFC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
10
Copyright © Future Technology Devices International Limited
C learance N o.: FT DI# 468
D oc ument Reference N o.: FT _001232
5.3 Board Schematics
Figure 5-3 – Board Schematic
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
6
C learance N o.: FT DI# 468
Specifications
6.1 Electrical Specification
Parameter
Description
Minimum
Typical
Maximum
Units
VCC
VCC operating supply
voltage
3.0
3.3
3.6
V
Icc
VCC operating current
Voh
Output Voltage High
VCC-0.4
-
-
V
Vol
Output Voltage Low
-
-
0.4
V
Vih
Input High Voltage
2.0
-
-
V
Vil
Input Low Voltage
-
-
0.8
V
T
Operating
temperature
-20
-
+70
℃
110
mA
Notes
J1 pin 9
Backlight LED on
Table 6-1 - Operating Voltage and Current
6.2 Display Specification
Item
Spec
Units
Display area(AA)
49.0(H) * 73.4(V)
mm
Driver Element
TFT active matrix
mA
Display Colors
262K
-
Number of Pixels
320(RGB)*480
dots
Pixel pitch
0.051(H) * 0.051(V)
mm
Viewing Angle
6:00
o’clock
Display mode
Transmissive/ Normally White
-
LCD Luminance
100
cd/m2
Touch screen
resistive
Table 6-2 - LCD and Touch Information
Notes
3.5 inch diagonal
-
Copyright © Future Technology Devices International Limited
11
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
6.3 Optical Specification
Table 6-3 - 3.5” TFT Optical specification
Copyright © Future Technology Devices International Limited
12
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
7
C learance N o.: FT DI# 468
Contact Information
Head Office – Glasgow, UK
Branch Office – Tigard, Oregon, USA
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
7130 SW Fir Loop
Tigard, OR 97223
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
Branch Office – Taipei, Taiwan
Branch Office – Shanghai, China
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan , R.O.C.
Tel: +886 (0) 2 8797 1330
Fax: +886 (0) 2 8751 9737
Room 1103, No. 666 West Huaihai Road,
Shanghai, 200052
C hina
Tel: +86 (0)21 6235 1596
Fax: +86 (0)21 6235 1595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
Web Site
http://ftdichip.com
Distributor and Sales Representatives
Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales
representative(s) in your country.
System and equipment manufac turers and des igners are res pons ible to ens ure that their sys tems , and any Future T ec hnology Devices
I nternational Ltd (FTDI ) devic es incorporated in their s ystems , meet all applicable safety, regulatory and sys tem-level performanc e
requirements . All application- related information in this doc ument (including applic ation desc riptions , s uggested FTDI devic es and other
materials ) is provided for reference only. While FTDI has taken c are to ass ure it is acc urate, this information is s ubjec t to c us tomer
c onfirmation, and FTDI disclaims all liability for sys tem designs and for any applic ations assis tanc e provided by FTDI . Us e o f FTDI
devic es in life s upport and/or safety applications is entirely at the us er’s risk, and the us er agrees to defend, indemnify and hold
harmless FTDI from any and all damages , claims , s uits or expens e resulting from s uch use. T his doc ument is s ubject to change without
notice. N o freedom to use patents or other intellec tual property rights is implied by the publication of this doc u ment. N either the whole
nor any part of the information c ontained in, or the product desc ribed in this document, may be adapted or reproduced in any material
or elec tronic form without the prior written c onsent of the c opyright holder. Future Tec hnology D e vices I nternational L td, U nit 1 , 2
Seaward P lac e, C enturion Business P ark, G lasgow G 4 1 1HH, U nited Kingdom. Sc otland Registered Company N umber: SC136640
Copyright © Future Technology Devices International Limited
13
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
Appendix A - References
Document References
For module documentations, please refer to URL below:
FT81x datasheet: DS_FT81x
FT81x software programming guide: FT81x_Programmer_Guide
Acronyms and Abbreviations
Terms
EVE
IC
Description
Embedded Video Engine
Integrated Circuit
LCD
Liquid Crystal Display
LED
Light Emitting Diode
PC
Personal Computer
SPI
Serial Peripheral Interface
TFT
Thin Film Transistor
Copyright © Future Technology Devices International Limited
14
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
Appendix B - List of Figures and Tables
List of Figures
Figure 3-1 – ME810A-HV35R board bottom view ..................................................................................... 4
Figure 4-1 – ME810A-HV35R connects to MM900EV Module .................................................................... 6
Figure 5-1 – J1 Pin Header Dimensions ................................................................................................... 8
Figure 5-2 – Bezel dimensions ................................................................................................................ 9
Figure 5-3 – Board Schematic............................................................................................................... 10
List of Tables
Table 2-1 – Ordering information............................................................................................................ 2
Table 3-1 – J1 Pinout ............................................................................................................................. 5
Table 4-1 – ME810A-HV35R J1 and MM900EV module J2 connection ....................................................... 7
Table 6-1 - Operating Voltage and Current ........................................................................................... 11
Table 6-2 - LCD and Touch Information ................................................................................................ 11
Table 6-3 - 3.5” TFT Optical specification .............................................................................................. 12
Copyright © Future Technology Devices International Limited
15
ME810A-HV35R module Datasheet
Version 1.1
D oc ument Reference N o.: FT _001232
C learance N o.: FT DI# 468
Appendix C – Revision History
Document Title:
ME810A-HV35R module
Document Reference No.:
FT_001232
Clearance No.:
FTDI# 468
Product Page:
http://www.ftdichip.com/eve.htm
Document Feedback:
Send Feedback
Revision
Changes
Date
1.0
Initial Release
2015-09-29
1.1
Updated Release
2016-03-11
Copyright © Future Technology Devices International Limited
16