WUT ISE project (prof.R. Jachowicz group):
Transcription
WUT ISE project (prof.R. Jachowicz group):
WUT ISE project (prof.R. Jachowicz group): Integrated MEMS detector for dynamic humidity measurement in medical applications The device is composed of a capacitive interdigitated, the thermoresistor and a heater. This construction allows to reach up to 40 detections per second which is some 100 to 1000 times faster than conventional dew point hygrometers. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 IPiB project (prof. T. Pałko group) BSC ISFET for blood capnometry sensor Construction of an electrochemical sensor head for non- invasive measurements of CO2 tension in arterial blood , where BSC ISFET is the main element of the sensor. pCO2 sensor consist of: pH sensitive ISFET (BSC ISFET), reference electrode (Ag/AgCl), a resistive heater (32 ), thermistor (KTY83-122), electrolyte solution (sodium bicarbonate water solution with HCO3-, concentration between 20 to 100 mmolls) hydrophobic membrane (teflon), sensor case (plastic) Average BSC ISFET sensitivity: 49.3 mV/pH Front side Back side MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 5 WrUT project (prof.R.Gotszalk group): Micromechanics-based biochemical analyzer Optical Beam Deflection measurement setup APC MIRRORS Avg LASER I/U ADC FFT PHOTODETECTOR MICROCANTILEVER MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 FIT MAvg ITE – Who we are MNS-DIAG project – a joint effort of the Polish MEMS/Sensor research community Process technology R&D for microsystem fabrication New equipment. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Deep plasma etching of silicon: The silicon elements are etched to a depth comparable to the thickness of the substrate part of preconcentrator channel containing blockers for sorbent microgranules (manufactured for IBiB) channel etched in the structure designed for classification of bovine embryos (manufactured for WEMiF PWr) MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Examples of wafer bonding process: (Si - Si bonding) direct bonding Silicon direct bonding technology can be easily formed in low temperature, if the wafer surfaces are highly flat and very clean. For structured MEMS devices, wafer bow and local roughness may be not sufficient to achieve a sufficient direct bond. eutectic bonding MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Examples of wafer bonding process: anodic bonding (Si- glass bonding) ALIGNER WAFER BONDER, (AML AWB-04) Available types of bond processes: anodic, eutectic, adhesive, glass frit, direct fusion bonding, low temperature bonding, triple stack bonding. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Fabrication process of gas preconcentrators Deep plasma etching of silicon: SEM image of sidewall of the channel etched in Si substrate using the Bosch process reveals the scallops on the sidewalls. The close-up view shows the microroughness on the sidewalls. Glass cover and silicon wafer assembled by anodic bonding Gas inlets fabricated in the glass cover by laser ablation process MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Fabrication process of gas preconcentrators Polyimide tubings were filled with the grains of adsorbents forced in by the inlet pressure. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Examples of metal electroplating process Platinum Gold Silver Silver chloride Three-electrode test structures for amperometric measurements (manufactured for CSRG-WCh PW) MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Fabrication of capacitive dew point temperature detectors WUT ISE project (prof.R. Jachowicz group) Example of detector manufactured for ISE PW A. oxidation and Si3N4 deposition, B. deposition and photolithography of Pt/Cr, C. deposition of Si3N4, D. deposition and photolithography of Pt/Cr, E. deposition of Si3N4 and SiO2 layers, F. deposition and photolithography of Pt/Cr, G. photolithography of contacts, H.photolithography of bonding pads and Pt lift-off MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Fabrication of capacitive dew point temperature detectors WUT ISE project (prof.R. Jachowicz group) Sensor with three level Pt metallization Sensor with two level Pt (or Au) metallization MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Patterning and removing of polymer layers Silicone polymer post-etch residues visible on the surface of Pt substrate: SEM graph showing the surface of the Pt electrode after the polysiloxane removal in SF6+O2 plasma and polymer post-etch residues taken with an optical microscope plasma etched silicone rubber Polymer morphology after SF6 plasma exposure at 5mTorr pressure, 800W power, 100W bias power and substrate holder temperature of 20ºC or 40ºC Al mask on silicone layer silicone etched in SF6 plasma (high density of post-etch residues) MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Al mask on silicone layer silicone etched in SF6 plasma R&D for technology improvement Si pillars produced during deep plasma etching due to the micromasking effect Deformation and breaking of thin dielectric membrane MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 R&D for technology improvement Polymer post-etch residues on Pt surface plasma etching of polymers and dielectrics from Pt surface: polyimide (left) and silicon nitride with photoresist mask (top right) MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 ITE – Who we are MNS-DIAG project – a joint effort of the Polish MEMS/Sensor research community Process technology R&D for microsystem fabrication New equipment. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 New equipment Plasma bay modernised in 2011 MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 New equipment Sentech SI 500 RIE cluster Si3N4, SiO2, polySi and Al etching 2 x Oxford System 100 ICP Si3N4, SiO2, polySi, polymers, Al, noble metals etching MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 New equipment Oxford System 80 Plus PECVD SiNx and SiO2 deposition MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 New equipment EVG 101 spray coater PR deposition onto 3d surfaces, edge masking MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 New equipment Napson CRESBOX Semi-automatic four point probe for resistance/resistivity measurements. Zygo NewView 7100 Optical white light profilometer for non – contact, three dimensional surface topography measurements as well as for dynamic measurements of MEMS structures. Dektak XT Stylus profiler for surface topography contact measurements. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 New equipment Equipment put into operation during the last month: EVG 620TB double side mask aligner (including large gap alignment optics for 3d patterned surfaces) 2 x Plasma Parylene System Resist ashers (PR including SU8 removal) Equipment being installed or tested: Thermco diffusion furnace x 3 Si wet and dry oxidation, P diffusion, Al sintering, annealing processes 2 x Oxford Instruments magnetron sputtering system (Al and noble metals deposition) IBS plasma immerse ion implanter (B, P, As, Si, C ion species; S/D doping, Trench doping, Backside wafer doping, High dose poly-silicon doping, Contact doping, Shallow junction forming, 3D element doping, Nano precipitates and nano structure forming, Hydrogenation, Gettering, Resist curing) Thermco LPCVD reactor (polySi, Si3N4 deposition) MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 SUMMARY Micro/nanoelectronic technology provides a powerful tools to develop innovative diagnostic devices and systems. Polish research teams offers a competent and reliable partnership in the micro/nanosensor research domain. MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 EUROSENSORS 2012, Kraków 24-27.06.2012 MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013 Thank you for your attention [email protected] [email protected] MNSDIAG/SMART FRAME conference on „Micro- and nano- systems technology for modern industrial applications” Warsaw 20-21, February 2013