eGRAF® Electronics Thermal Solutions

Transcription

eGRAF® Electronics Thermal Solutions
Introduction
eGRAF® Thermal Management Solutions
Non-Structural Engineered Graphite Foils
Graftech has developed a family of thermal interface materials named eGRAF® based upon
the science of engineered foil graphite.
The graphite foils are engineered to control the thermal conductivity both in the plane of
the material as well as through the plane.
Through-Plane
Thermal Conductivity
In-Plane
2
Business Confidential
© 2012 GrafTech International Holdings Inc. All Rights Reserved.
eGRAF® Flexible Graphite Interface Materials
Environmentally Friendly
RoHS, REACH compliant
– Contains no hazardous materials
UL94V-0 flammability rated
– Non-flammable
Chemically inert to almost any substance
Easy disposal of waste
3
eGRAF® Reliability
eGRAF® Not Affected by Electronics Operating Environment
eGRAF graphite foils retain thermal
performance over time and temperature
extremes
– eGRAF is stable up to 400 C
– Demonstrated over 50 years of graphite
gasket experience
eGRAF is chemically inert
– Will not react with other material or fluids
Adhesives and coatings need to be
carefully selected to meet environmental
requirements
Weight Loss in eGRAF Flexible Graphite Material due to Oxidation in Air at High Temperatures Report dated May 2012
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eGRAF® HITHERM™
Value Proposition
Increases reliability of mission critical, long life electronics designs
Differentiating Feature
Carbon Based Material
Value to Customer
and/or End User
- Thermal conductivity up to 16W/mK
- No outgassing
- Environmentally Friendly
Foil Form Factor
- Die-cut parts enabling lower cost.
- Pick and place manufacturing.
Material thickness between
125 μm (0.005”) & 500 μm (0.020”)
- Fills thicker bond lines.
- Greases degrade with bond line
thickness over 50 μm (0.002”.)
Increases reliability and manufacturability of
mission critical, long life electronics designs
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eGRAF® HITHERM™ Grades
Design Options
Product grades to meet design requirements
– Adhesive coating for “peel & stick” manufacturing
– PET coating for electrical isolation
General purpose
- Low intensity LEDs
HT-700
Improved performance
- High Brightness LEDs
- “Under the Hood” Applications
HT-1200
Polymer enhanced performance
- Inverters
- Mission critical applications
HT-2500
0
5
10
15
20
Thermal Conductivity (W/m-K)
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eGRAF® SPREADERSHIELD™
Value Proposition
Unique passive thermal shielding and spreading solution
Differentiating Feature
Carbon Based Material
Value to Customer
and/or End User
- Thermal conductivity up to 1500W/mK
- Anisotropic: Spreads heat in-plane
- Environmentally Friendly
Flexible Foil Form Factor
- Contours to shaped housings
- Die-cut parts enabling lower cost
- Pick and place manufacturing
Lightweight material with
Thickness as thin as
0.025mm
- Integrates into any existing design
- System weight reduction
- Non-structural
Increases reliability of electronics designs
by eliminating active thermal solutions
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eGRAF® SPREADERSHIELD™ Grades
Design Options
Product grades to meet design requirements
– Thermal conductivity grades to match thermal demands
– Multiple adhesive and coating options available
General purpose
•
•
Thicker form factors
Power cooling applications
SS300
SS400
SS500
High Performance
•
•
Thin form factors
High thermal conductivity
SS600
SS1500
0 Mg Al Cu 500
1000
1500
Thermal Conductivity (W/m-K)
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Designing with eGRAF® SPREADERSHIELD™
Case study of an 18 cm2 heat spreader
Aluminum
Copper
0.3 g
0.9 g (200% Heavier)
2.0 g (560% Heavier)
eGRAF-SS600
Aluminum
Copper
0.003”
0.007” (100% Thicker)
0.005” (50% Thicker)
Thinner
Lighter
eGRAF-SS600
Same design, SS600 wins. SS600 is lighter and thinner than conventional
metal
18 cm part. Similar
thermal spreaders
conductance.
2
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Typical Applications
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Market Application: Lighting
Ideal for Indoor and Outdoor Lighting Applications
Advantages
– Foil form factor
– Consistent thermal performance over time
Lighting applications include downlights, track lighting, and outdoor spot lights
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Market Application: Inverters
Unparalleled through plane thermal conductivity
Advantages
– Thermal conductivity up to 16W/m-K
thru-plane (z-plane)
– Consistent performance across entire
temperature range
– Reliable thermal interface for both
switches and capacitors
Inverter applications include automotive, solar, and industrial motor controllers
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Designing with eGRAF® HITHERM™
When Does HITHERM™ Fit?
Characteristic
Guideline
Interface pressure and additional factors
contribute to performance
Electrical Isolation
Balance between electrical and thermal
conductance.
Bond Line Thickness/Surface
Compromise between ideal surfaces and
manufacturing costs.
Reliability
Environmental characteristics have
significant impact on most TIMs
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Market Application: Displays
Advantages
– LED light-bar thermal management.
Heat efficiently spread to chassis
– Corner light mura reduced
– Heat from power supply board
shielded from display
55” LED LCD TV
Advanced displays improved image quality
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Market Application: Displays
Advantages
– Reduced heat of LEDs bright
enough to enable daytime viewing
of display
– Spread heat from LED lights to
aluminum frame
– Improved overall image quality
relative to other thermal designs.
– Enabled operating range between
-20 C and +65 C
Ruggedized aftermarket
LCD monitor
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Market Application: Computing
Tablet Devices
Smartphones
SPREADERSHIELD™ has enabled latest generation of advanced devices
Market Application: Computing
Advantages
– Eliminated heat pipes and fans from
thermal solution which improves
system reliability and simplifies FMEA
analysis
– Improves thermal conductivity of full
magnesium alloy chassis
– Outperformed copper solution at
20% of the weight
– Extended battery life by eliminating
fans and heat pipes
– Conducts ~15 W of heat from the
CPU to keyboard underside
Ruggedized Laptop
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Market Application: LED Lighting
Performance Advantages
– Uniform thermal gradient
resulting in higher
luminance uniformity
– Reduces hotspot temperatures
which extends LED lifetime
over expected life of troffer
Ownership Advantages
– Lighter weight by reducing
gauge of aluminum housing
– Enables field replaceable
LED panels
LED Lighting Troffer
Lighter weight, longer life, better light quality troffer
Market Application: LED Lighting
Advantages
– Spread heat captured on top side of
headlight housing
– Reduced temperature of hot spot
below melting temperature of
plastic housing.
– Lower cost solution relative to
complete housing replacement
with alternative, higher
temperature housing.
Headlight Retrofit Program
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Market Application: Li-Ion Battery Cooling
Technology based on
Prototype Automotive Solutions
Advantages
– Thinner section optimizes volumetric constraints
– Lighter weight impacts overall vehicle efficiency
– Higher thermal conductivity moves more heat out of (and in to) the battery
– Flexibility allows for common design configuration
Flexible Graphite Heat Transfer “Plates” enable battery Performance, Durability and Safety
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Designing with eGRAF® SPREADERSHIELD™
When Does SPREADERSHIELD™ Fit?
Characteristic
Guideline
Multiple factors contribute to determine
required performance
Weight
Provides weight reduction options to
systems engineering team
Reliability
Thermal requirements can be addressed
with passive cooling solution
Available Thickness
Fits into most existing design tolerances.
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eGRAF® Electronics Thermal Solutions

Transcription

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