Intel® Xeon® Processor E5 v3 Family Thermal Guide

Transcription

Intel® Xeon® Processor E5-1600 /
2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide
October 2015
Order No.: 330786-003US
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
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Revision History—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Revision History
Revision
Number
Description
Date
001
Initial release
September 2014
002
Added Intel® Xeon® processor E5-4600 v3 product families.
June 2015
003
Updated a socket part number on Table 25.
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Contents
Contents
Revision History..................................................................................................................3
1.0 Introduction................................................................................................................10
1.1 Definition of Terms............................................................................................... 10
2.0 LGA2011-3 Socket Overview....................................................................................... 12
2.1 Socket Components.............................................................................................. 13
2.2 Socket Land Pattern Guidance................................................................................ 17
2.3 Socket Loading Requirements.................................................................................20
2.3.1 Socket Loading Specifications.................................................................... 21
2.4 Socket Maximum temperature................................................................................ 21
2.5 Strain Guidance for Socket....................................................................................22
3.0 Independent Loading Mechanism (ILM) Specifications............................................... 23
3.1
3.2
3.3
3.4
3.5
3.6
ILM Load Specifications......................................................................................... 24
ILM Keepout Zones (KOZ)......................................................................................25
Independent Loading Mechanism (ILM).................................................................... 25
ILM Mechanical Design Considerations and Recommendations.....................................25
ILM Features........................................................................................................ 26
®
Intel ILM Reference Designs................................................................................. 28
3.6.1 Square ILM.............................................................................................. 28
3.6.2 Narrow ILM.............................................................................................. 30
3.7 ILM Cover............................................................................................................ 32
3.8 ILM Allowable Board Thickness............................................................................... 33
4.0 Processor Thermal Specifications and Features......................................................... 34
4.1 Tcase and DTS-Based Thermal Specification Implementation........................................34
4.1.1 Margin to Thermal Specification (M)............................................................ 34
4.2 Processor Thermal Features................................................................................... 36
4.2.1 Absolute Processor Temperature................................................................. 36
4.2.2 Short Duration TCC Activation .................................................................. 36
4.3 Processor Thermal Specifications............................................................................ 36
4.3.1 Thermal Specifications...............................................................................37
4.3.2 TCASE and DTS Based Thermal Specifications.................................................37
4.3.3 Server Processor Thermal Profiles and Form Factors..................................... 38
4.3.4 Server 4S Processor Thermal Profiles and Form Factors.................................40
4.3.5 Workstation Processor Thermal Profiles and Form Factors..............................41
4.3.6 Embedded Server Processor Thermal Profiles............................................... 42
4.3.7 Thermal Metrology.................................................................................... 44
5.0 Processor Thermal Solutions.......................................................................................47
5.1 Processor Boundary Conditions for Shadowed and Spread Core Layouts....................... 47
5.2 Heatsink Design Considerations.............................................................................. 49
5.3 Thermal Design Guidelines..................................................................................... 50
5.3.1 Intel® Turbo Boost Technology................................................................... 50
5.3.2 Thermal Excursion Power........................................................................... 50
5.3.3 Thermal Characterization Parameters.......................................................... 51
5.4 Thermal Interface Material (TIM) Considerations....................................................... 52
5.5 Mechanical Recommendations and Targets............................................................... 53
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5.5.1 Processor / Socket Stackup Height.............................................................. 53
5.5.2 Processor Heatsink Mechanical Targets........................................................ 54
5.6 Heatsink Mechanical and Structural Considerations....................................................55
5.7 Intel Reference Design Heat Sink............................................................................ 55
5.7.1 2U Square Heatsink Performance................................................................ 57
5.7.2 1U Square Heatsink Performance................................................................ 58
5.7.3 1U Narrow Heatsink Performance................................................................ 59
5.7.4 Workstation Tower Active Heatsink Performance........................................... 60
5.7.5 Mechanical Load Range..............................................................................61
5.7.6 Thermal Interface Material (TIM).................................................................61
6.0 Processor Mechanical Specifications........................................................................... 62
6.1
6.2
6.3
6.4
6.5
6.6
Package Size........................................................................................................62
Package Loading Specifications............................................................................... 63
Processor Mass Specification.................................................................................. 64
Processor Materials............................................................................................... 64
Processor Markings............................................................................................... 64
Package Handling Guidelines.................................................................................. 66
7.0 Boxed Processor Specifications...................................................................................67
7.1 Boxed Processor Thermal Solutions......................................................................... 67
7.1.1 Available Boxed Thermal Solution Configurations...........................................67
7.1.2 Intel® Thermal Solution STS200C (Passive/Active Combination Heat Sink
Solution)................................................................................................ 67
7.1.3 Intel® Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall
Passive Heat Sink Solutions)......................................................................68
7.1.4 Thermal Interface Material (TIM).................................................................68
7.2 Boxed Processor Cooling Requirements.................................................................... 69
7.3 Mechanical Specifications...................................................................................... 69
7.4 Fan Power Supply [STS200C]................................................................................. 70
7.5 Boxed Processor Contents...................................................................................... 71
8.0 Quality Reliability and Ecological Requirements..........................................................72
8.1 Use Conditions..................................................................................................... 72
®
8.2 Intel Reference Component Validation....................................................................73
8.2.1 Board Functional Test Sequence..................................................................73
8.2.2 Post-Test Pass Criteria Examples.................................................................73
8.2.3 Recommended BIOS/Processor/Memory Test Procedures................................74
8.3 Material and Recycling Requirements.......................................................................74
Appendix A Component Suppliers..................................................................................... 76
Appendix B Mechanical Drawings......................................................................................78
B.1 Large Package Mechanical Drawing Page 1............................................................... 79
B.2 Large Package Mechanical Drawing Page 2............................................................... 80
B.3 Package Mechanical Drawing Page 1........................................................................81
B.4 Package Mechanical Drawing Page 2........................................................................82
B.5 ILM Backplate Keep Out Zone.................................................................................83
B.6 ILM Mounting Hole Keep Out Zone.......................................................................... 84
B.7 Narrow ILM Keep Out Zone.................................................................................... 85
B.8 Narrow ILM 3D Keep Out Zone............................................................................... 86
B.9 ILM Keep Out Zone............................................................................................... 87
B.10 3D Keep Out Zone.............................................................................................. 88
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Contents
B.11
B.12
B.13
B.14
B.15
B.16
B.17
B.18
B.19
B.20
B.21
B.22
B.23
B.24
B.25
Heat Sink Retaining Ring......................................................................................89
Heat Sink Spring.................................................................................................90
Heat Sink Spring Cup.......................................................................................... 91
1U Narrow Heat Sink Geometry (Page 1)............................................................... 92
1U Narrow Heat Sink Geometry (Page 2)............................................................... 93
1U Narrow Heat Sink Assembly (Page 1)................................................................ 94
1U Narrow Heat Sink Assembly (Page 2)................................................................ 95
1U Square Heat Sink Geometry (Page 1)................................................................96
1U Square Heat Sink Geometry (Page 2)................................................................97
1U Square Heat Sink Assembly (Page 1)................................................................ 98
1U Square Heat Sink Assembly (Page 2)................................................................ 99
2U Square Heat Sink Geometry (Page 1).............................................................. 100
2U Square Heat Sink Geometry (Page 2).............................................................. 101
2U Square Heat Sink Assembly (Page 1).............................................................. 102
2U Square Heat Sink Assembly (Page 2).............................................................. 103
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Figures—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Figures
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Hexagonal Array in LGA2011-3..................................................................................12
Socket with Labeled Features.................................................................................... 13
Contact Wiping Direction.......................................................................................... 14
Contact Tip Offset with Respect to Solder Ball..............................................................15
Processor Socket Stack Up........................................................................................16
Pick and Place Cover with Labeled Features.................................................................16
PnP Cover and Socket Assembly................................................................................ 17
Socket 2011-3 Land Pattern......................................................................................18
Socket 2011-3 Pad Types and Locations..................................................................... 20
Socket Temperature Measurement ............................................................................ 22
Processor Stack.......................................................................................................23
ILM Load Plate........................................................................................................ 27
ILM Backplate......................................................................................................... 28
Exploded Square ILM............................................................................................... 29
Assembled Square ILM............................................................................................. 30
Exploded Narrow ILM............................................................................................... 31
Assembled Narrow ILM.............................................................................................32
ILM cover............................................................................................................... 33
Margin to Thermal Spec (M)...................................................................................... 35
Typical Thermal Profile Graph (Illustration Only).......................................................... 38
Case Temperature (TCASE) Measurement Location for Large Package ..............................45
Case Temperature (TCASE) Measurement Location for Small Package.............................. 46
Typical Shadowed Layout......................................................................................... 47
Typical Spread Core Layout.......................................................................................48
Thermal Characterization Parameters......................................................................... 52
Integrated Stack Up Height.......................................................................................53
Available Cooling Area for Top of Large and Small IHS..................................................54
1U Form Factor Heat Sinks....................................................................................... 56
2U Form Factor Heat Sinks....................................................................................... 56
Workstation Form Factor Heat Sink............................................................................ 57
Processor Package Assembly Sketch...........................................................................62
Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small
Form Factor............................................................................................................ 63
Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large
Form Factor............................................................................................................ 63
Small Package Labeling............................................................................................ 65
Large Package Labeling............................................................................................ 66
STS200C Active / Passive Combination Heat Sink (with Removable Fan) ........................ 68
STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks ....................................... 68
Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution...................................... 71
Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 1.... 79
Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 2.... 80
Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 1.... 81
Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 2.... 82
ILM Backplate Keep Out Zone................................................................................... 83
ILM Mounting Hole Keep Out Zone............................................................................. 84
Narrow ILM Keep Out Zone....................................................................................... 85
Narrow ILM 3D Keep Out Zone.................................................................................. 86
Square ILM Keep Out Zone....................................................................................... 87
Square 3D Keep Out Zone........................................................................................ 88
Heat Sink Retaining Ring.......................................................................................... 89
Heat Sink Spring..................................................................................................... 90
Heat Sink Spring Cup............................................................................................... 91
1U Narrow Heat Sink Geometry (Page 1).................................................................... 92
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Figures
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1U
1U
1U
1U
1U
1U
1U
2U
2U
2U
2U
Narrow Heat Sink Geometry (Page 2).................................................................... 93
Narrow Heat Sink Assembly (Page 1).....................................................................94
Narrow Heat Sink Assembly (Page 2).....................................................................95
Square Heat Sink Geometry (Page 1).................................................................... 96
Square Heat Sink Geometry (Page 2).................................................................... 97
Square Heat Sink Assembly (Page 1).....................................................................98
Square Heat Sink Assembly (Page 2).....................................................................99
Square Heat Sink Geometry (Page 1)...................................................................100
Square Heat Sink Geometry (Page 2)...................................................................101
Square Heat Sink Assembly (Page 1)................................................................... 102
Square Heat Sink Assembly (Page 2)................................................................... 103
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Tables—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Tables
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16
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22
23
24
25
26
Terms and Descriptions............................................................................................ 10
LGA2011-3 Socket Attributes.................................................................................... 12
PIN Count By Pad Definition...................................................................................... 19
Socket Load Values..................................................................................................21
LGA 2011-3 Maximum Allowable Loads.......................................................................24
LGA 2011-3 Minimum Allowable Loads....................................................................... 24
LGA 2011-3 Minimum End of Life Loads...................................................................... 25
LGA 2011-3 ILM General Keepout Dimensions ............................................................ 25
Square ILM Component Thickness and materials..........................................................30
Narrow ILM Component Thickness and materials..........................................................32
DTS 2.0 Margin From PECI........................................................................................35
DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN ................ 36
Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families Stack Tcase and
DTS Thermal Profiles and Correction Factors............................................................... 38
Intel® Xeon® Processor E5-4600 v3 Product Families Stack Product Family Tcase and
DTS Thermal Profiles and Correction Factors............................................................... 40
Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families 1S Workstation
Stack Tcase and DTS Thermal Profiles and Correction Factors......................................... 41
Embedded Server Processor Thermal Profiles.............................................................. 43
Processor Boundary Conditions for Shadowed and Spread Core Layouts.......................... 48
Target Stackup Heights From Top of Board to Top of IHS.............................................. 53
Available Cooling Area for Large and Small IHS........................................................... 54
Heatsink Mechanical Targets..................................................................................... 54
Processor Loading Specifications................................................................................64
Processor Materials.................................................................................................. 64
Load Limits for Package Handling...............................................................................66
®
Intel Reference or Collaboration Thermal Solutions..................................................... 76
LGA2011-3 Socket and ILM Components ....................................................................76
List of Mechanical Drawings...................................................................................... 78
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Introduction
1.0
Introduction
This document provides specifications and guidelines for the design of thermal and
mechanical solutions for the Intel® Xeon® processor E5-1600, E5-2600, and E5-4600
v3 product families.
The components and information described in this document include:
•
Thermal profiles and other processor specifications and recommendations
•
Processor Mechanical load limits
The goals of this document are:
•
To assist board and system thermal mechanical designers
•
To assist designers and suppliers of processor heatsinks
1.1
Definition of Terms
Table 1.
Terms and Descriptions
Term
Description
Bypass
Bypass is the area between a passive heatsink and
any object that can act to form a duct. For this
example, it can be expressed as a dimension away
from the outside dimension of the fins to the nearest
surface.
DTS
Digital Thermal Sensor reports a relative die
temperature as an offset from TCC activation
temperature.
FSC
Fan Speed Control
IHS
Integrated Heat Spreader: a component of the
processor package used to enhance the thermal
performance of the package. Component thermal
solutions interface with the processor at the IHS
surface.
Square ILM
Independent Loading Mechanism provides the force
needed to seat the 2011-LGA package onto the
socket contacts and has 56 × 94mm heatsink
mounting hole pattern
Narrow ILM
Independent Loading Mechanism provides the force
needed to seat the 2011-LGA package onto the
socket contacts and has 56 × 94mm heatsink
mounting hole pattern
LGA2011-3 Socket
The processor mates with the system board through
this surface mount, 2011-contact socket.
PECI
The Platform Environment Control Interface (PECI) is
a one-wire interface that provides a communication
channel between Intel processor and chipset
components to external monitoring devices.
continued...
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Introduction—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Term
Description
ΨCA
Case-to-ambient thermal characterization parameter
(psi). A measure of thermal solution performance
using total package power. Defined as (TCASE – TLA) /
Total Package Power. Heat source should always be
specified for Ψ measurements.
ΨCS
Case-to-sink thermal characterization parameter. A
measure of thermal interface material performance
using total package power. Defined as (TCASE – TS) /
Total Package Power.
ΨSA
Sink-to-ambient thermal characterization parameter.
A measure of heatsink thermal performance using
total package power. Defined as (TS – TLA) / Total
Package Power.
Tcase
The case temperature of the processor measured at
the geometric center of the topside of the IHS.
Tcase-Max
The maximum case temperature as specified in a
component specification.
TCC
Thermal Control Circuit: Thermal monitor uses the
TCC to reduce the die temperature by using clock
modulation and/or operating frequency and input
voltage adjustment when the die temperature is very
near its operating limits.
TCONTROL
TCONTROL is a static value below TCC activation used
as a trigger point for fan speed control. When DTS >
TCONTROL, the processor must comply to the thermal
profile.
TDP
Thermal Design Power: Thermal solution should be
designed to dissipate this target power level. TDP is
not the maximum power that the processor can
dissipate.
Thermal Monitor
A power reduction feature designed to decrease
temperature after the processor has reached its
maximum operating temperature.
Thermal Profile
Line that defines case temperature specification of a
processor at a given power level.
TIM
Thermal Interface Material: The thermally conductive
compound between the heatsink and the processor
case. This material fills the air gaps and voids, and
enhances the transfer of the heat from the processor
case to the heatsink.
TLA
The measured ambient temperature locally
surrounding the processor. The ambient temperature
should be measured just upstream of a passive
heatsink or at the fan inlet for an active heatsink.
TSA
The system ambient air temperature external to a
system chassis. This temperature is usually
measured at the chassis air inlets.
U
A unit of measure used to define server rack spacing
height. 1U is equal to 1.75 in, 2U equals 3.50 in, and
so forth.
LCC
Low Core Count, refers to silicon die size
MCC
Mid Core Count, refers to silicon die size
HCC
High Core Count, refers to silicon die size
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Overview
2.0
LGA2011-3 Socket Overview
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
Intel® Xeon® processor E5-1600 and E5-2600 v3 product families processor-based
platform. The socket provides I/O, power and ground contacts for processor operation.
The socket contains 2011 contacts arrayed about a cavity in the center of the socket
with lead-free solder balls for surface mounting on the motherboard.
The LGA2011-3 uses a hexagonal area array ball-out which provides many benefits:
•
Socket contact density increased by 12% while maintaining 40 mil minimum via
pitch requirements. as compared to a linear array
•
Corresponding square pitch array’s would require a 38mil via pitch for the same
package size.
LGA2011-3 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16
grid depopulation in the center of the array and selective depopulation elsewhere.
Figure 1.
Hexagonal Array in LGA2011-3
Table 2.
LGA2011-3 Socket Attributes
LGA2011-3 Socket
Attributes
Component Size
58.5 mm (L) X 51 mm (W)
Pitch
1.016 mm (Hex Array)
Ball Count
2011
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LGA2011-3 Socket Overview—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Families
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). Internal keying posts ensure socket processor
compatibility. An external socket key ensures ILM and socket compatibility. The ILM
reference design includes a back plate; an integral feature for uniform loading on the
socket solder joints and contacts.
2.1
Socket Components
The socket has two main components, the socket body: composed of a housing solder
balls, and processor contacts, and Pick and Place (PnP) cover. The socket is delivered
as a single integral assembly. Below are descriptions of the integral parts of the
socket.
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating
capable of withstanding 260°C for 40 seconds (typical reflow/rework). The socket
coefficient of thermal expansion (in the XY plane), and creep properties, are such that
the integrity of the socket is maintained for the environmental conditions listed in the
TMSDG.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems. A labeled representation of the
socket can be seen in the figure below.
Figure 2.
Socket with Labeled Features
Solder Balls
A total of 2011 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
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Overview
•
Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper
(Cu) 0.5%, tin (Sn) 96.5% and a melting temperature of approximately 217°C.
The immersion silver (ImAg) motherboard surface finish and solder paste alloy
must be compatible with the SAC305 alloy solder paste.
Contacts
The base material for the contacts is high strength copper alloy. For the area on
socket contacts where processor lands will mate, there is a 0.381 mm [0.015 inches]
minimum gold plating over 1.27 mm [0.05 inches] minimum nickel underplate. No
contamination by solder in the contact area is allowed during solder reflow. All socket
contacts are designed such that the contact tip lands within the substrate pad
boundary before any actuation load is applied and remain within the pad boundary at
final installation, after actuation load is applied.
The contacts are laid out in two L-shaped arrays as shown in the figure below. The
detailed view of the contacts indicate the wiping orientation of the contacts in the two
regions to be 29.6°.
Figure 3.
Contact Wiping Direction
The contact between substrate land and socket contact are offset. The following
diagram shows contact offset from solder ball location and orientation of contact tip.
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Figure 4.
Contact Tip Offset with Respect to Solder Ball
Socket Standoffs
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow. The following diagram highlights each feature of the socket-processor
stack up.
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Overview
Figure 5.
Processor Socket Stack Up
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The proceeding diagram
labels key features of the Pick and Place cover.
Figure 6.
Pick and Place Cover with Labeled Features
The cover remains on the socket during reflow to help prevent contamination during
reflow. The cover can withstand 260°C for 40 seconds (typical reflow/rework profile)
and the environmental conditions listed in the TMSDG.
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The following figure diagrams the PnP and socket assembly. To reduce risk of damage
to socket contacts the pick and place (PnP) cover remains on the socket during ILM
installation.
Figure 7.
PnP Cover and Socket Assembly
Once the ILM with its cover is installed Intel is recommending the PnP cover be
removed to help prevent damage to the socket contacts. To reduce the risk of bent
contacts the PnP Cover and ILM Cover were designed to not be compatible. Covers
can be removed without tools.
The pick and place covers are designed to be interchangeable between socket
suppliers.
2.2
Socket Land Pattern Guidance
The land pattern guidance provided in this section applies to printed circuit board
design. Recommendation for Printed Circuit Board (PCB) Land Patterns is to ensure
solder joint reliability during dynamic stresses, often encountered during shipping and
handling and hence to increase socket reliability.
LGA 2011-3 Land Pattern
The land pattern for the LGA2011-3 socket is 40 mils hexagonal array see the
following figure for detailed location and land pattern type.
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Overview
Note:
There is no round-off (conversion) error between socket pitch (1.016 mm) and board
pitch (40 mil) as these values are equivalent.
Figure 8.
Socket 2011-3 Land Pattern
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Table 3.
PIN Count By Pad Definition
Pad Definition / Padstack
Color
Quantity
20 X 17 Oblong Partially SMD / O17X20
RED Pins
43
20 X 17 Oblong Partially SMD / O17X20
LIGHT BLUE Pins
123
17 mil Ø MD / C17
GREY Pins
1845
Notes: 1. RED Pins: Corner nCTF pads (43 total) are all designed as 20 X 17 mil oblong partially
soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is
oriented at 45° from the center of the socket. All nCTF pads require thick traces ideally oriented
at 45° toward the package corner.
2. LIGHT BLUE Pins: Edge CTF pads (total) are all designed as 20 X 17 mil oblong partially
soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is
oriented at 90° to the socket edge.
3. GREY Pins: Critical to function pins are all designed as 17 mil circular MD (Metal Defined) pads.
Pad Type Recommendations
Intel defines two types of pad types based on how they are constructed. A metal
defined (MD) pad is one where a pad is individually etched into the PCB with a
minimum width trace exiting it. The solder mask defined (SMD) pad is typically a pad
in a flood plane where the solder mask opening defines the pad size for soldering to
the component. In thermal cycling a MD pad is more robust than a SMD pad type. The
solder mask that defines the SMD pad can create a sharp edge on the solder joint as
the solder ball / paste conforms to the window created by the solder mask. For certain
failure modes the MD pad may not be as robust in shock and vibration (S&V). During
S&V, the predominant failure mode for a MD pad in the corner of the BGA layout is
pad craters and solder joint cracks. A corner MD pad can be made more robust and
behave like a SMD pad by having a wide trace enter the pad. This trace should be 10
mil minimum wide but not to exceed the pad diameter and exit the pad at a 45 degree
angle (parallel to the diagonal of the socket). During board flexure that results from
shock & vibration, a SMD pad is less susceptible to a crack initiating due to the larger
surface area. Intel has defined selected solder joints of the socket as non-critical to
function (NCTF) when evaluating package solder joints post environmental testing.
The signals at NCTF locations are typically redundant ground or non-critical reserved,
so the loss of the solder joint continuity at end of life conditions will not affect the
overall product functionality.
The following figure diagrams shape and location of solder pad types for socket
2011-3.
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Overview
Figure 9.
Socket 2011-3 Pad Types and Locations
Notes:
1.
When ordering PCBs with the Socket R (LGA2011) footprint, it is important to
specify the following verbiage on the FAB drawing as well as within the purchase
requisition: All BGA pads, Soldermask or Metal defined, min/max size tolerance,
should comply with Intel PCB specification, current revision. Nominal BGA pad
size, Soldermask or Metal defined, is Ø +/- 1 mil. This pad size is critical to
function on socket locations.
2.
The solder paste stencil aperture recommendation for Socket R (LGA2011) is: 24
mil Ø circular aperture opening with a stencil thickness of 5 mils.
2.3
Socket Loading Requirements
The socket must meet the mechanical loading and strain requirements outlined in the
table below. All dynamic requirements are under room temperature conditions while
all static requirements are under product use condition temperature. Specifically, ILM
and HS load range may vary for different LGA 2011 derivatives (e.g. 2011-0, 2011-1)
due to the package form factor, and the design of loading mechanism and thermal
solution (e.g., HS mass).
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Families
2.3.1
Socket Loading Specifications
The table below provides load specifications for the socket. These mechanical limits
should not be exceeded during component assembly, mechanical stress testing, or
standard drop and shipping conditions. All dynamic requirements are under room
temperature conditions while all static requirements are under 100 °C conditions.
Table 4.
Socket Load Values
Parameter
Load Limits,
SI Units
Min
Max
Load Limits,
Imperial Units
Min
Definition
Max
Static Compressive
per Contact
15 (gf)
38 (gf)
0.53
(ozf)
1.34 (ozf)
The compressive load applied by the package on the
LGA contacts to meet electrical performance. This
condition must be satisfied throughout the life of the
product
Static Compressive
(ILM)
445 (N)
712 (N)
100 (lbf)
160 (lbf)
The total load applied by the enabling mechanism onto
the socket as transferred through the package, contacts
and socket seating plane.
Static Compressive
Beginning of Life
(HS)
222 (N)
400 (N)
50 (lbf)
90 (lbf)
The total load applied by the heatsink mechanism onto
and socket seating plane. Measured at Beginning of Life
Static Compressive
End of Life
(HS)
178 (N)
400 (N)
40 (lbf)
90 (lbf)
The total load applied by the heatsink mechanism onto
and socket seating plane. Measured at End of Life
Static Total
Compressive
667 (N)
1068 (N )
150 (lbf)
240 (lbf)
The total load applied by enabling mechanism and heat
sink onto the socket as transferred through the
package, contacts and socket seating plane.
Dynamic
Compressive
NA
588 (N)
NA
132 (lbf)
Quasi-static equivalent compressive load applied during
the mechanical shock from heatsink, calculated using a
reference 600g heatsink with a 25G shock input and an
amplification factor of 3 (600g x 25G x 3 =441N=99
lbf). This specification can have flexibility in specific
values, but the ultimate product of mass times
acceleration should not exceed this value. Intel
reference system shock requirement for this product
family is 25G input as measured at the chassis
mounting location.
Board Transient
Bend Strain
NA
500 (ue)
for 62
(mil);
400 (ue)
for 100
(mil)
NA
500 (ue)
for 62
(mil);
400 (ue)
for 100
(mil)
This is the strain on boards near to socket BGA corners
during transient loading events through manufacturing
flow or testing. The test guidance can be found in Board
Flexure Initiative (BFI) strain guidance from your local
CQE.
2.4
Socket Maximum temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding
the temperature guidance may result in socket body deformation, or increases in
thermal and electrical resistance which can cause a thermal runaway and eventual
electrical failure. The guidance for socket maximum temperature is listed below:
•
Via temperature under socket <78 °C
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Overview
•
The specific via used for temperature measurement is located on the bottom of
the motherboard between pins BC1 and BE1.
•
The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions must be met
to limit power dissipation through the socket.
To measure via temperature:
1.
Drill a hole through the back plate corresponding to the location of pins BC1 and
BE1.
2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into
the specific measurement via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature
Figure 10.
Socket Temperature Measurement
2.5
Strain Guidance for Socket
Intel provides manufacturing strain guidance commonly referred to as Board Flexure
Initiative or BFI Strain Guidance. The BFI strain guidance apply only to transient bend
conditions seen in board manufacturing assembly environment with no ILM, for
example during In Circuit Test. BFI strain guidance limits do not apply once ILM is
installed. It should be noted that any strain metrology is sensitive to boundary
conditions. Intel recommends the use of BFI to prevent solder joint defects from
occurring in the test process. For additional guidance on BFI, see Manufacturing With
Intel® Components - Strain Measurement for Circuit Board Assembly, also referred as
BFI MAS ( Manufacturing Advantage Services) and BFI STRAIN GUIDANCE SHEET
(LGA2011-3 socket). Consult your Intel Customer Quality Engineer for additional
guidance in setting up a BFI program in your factory.
Note:
When the ILM is attached to the board, the boundary conditions change and the BFI
strain limits are not applicable. The ILM, by design, increases stiffness in and around
the socket and places the solder joints in compression. Intel does not support strain
metrology with the ILM assembled.
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Independent Loading Mechanism (ILM) Specifications—Intel® Xeon® Processor E5-1600 /
3.0
Independent Loading Mechanism (ILM)
Specifications
The Independent Loading Mechanism (ILM) provides the force needed to seat the land
LGA package onto the socket contacts. See image below for total processor stack
consisting of all relevant mechanical components.
Figure 11.
Processor Stack
The ILM is physically separate from the socket body. The assembly of the ILM is
expected to occur after attaching the socket to the board. The exact assembly location
is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the
socket. Intel performs detailed studies on integration of processor package, socket
and ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be "built to print" from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
The ILM has two critical functions: evenly deliver and distribute the force to seat the
processor onto the socket contacts and ultimately through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and
package.
Socket LGA2011-3 has two POR (Plan of Record) ILMs:
3.1
1.
Square ILM - This ILM has 80x80mm heatsink mounting hole pattern.
2.
Narrow ILM - This ILM has 56x94mm heatsink mounting hole pattern.
ILM Load Specifications
The Independent Loading Mechanism (ILM) provides the force needed to seat the
package onto the socket contacts.
Maximum Allowable Loads
The table below provides load specifications for the processor package. These
maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure or other damage to the system. The processor substrate should not
be used as a mechanical reference or load bearing surface for thermal solutions.
Table 5.
LGA 2011-3 Maximum Allowable Loads
Item
Maximum
Static Pre-Load Compressive (ILM load)
712N (160 lbf)
Static Pre-Load Compressive (HS load)
400N (90 lbf)
Total Socket Static Compressive (ILM+HS=Socket)
1068N (240 lbf)
Minimum Allowable Loads
The ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load
specification. The thermal solution (heatsink) should apply additional load. The
combination of an ILM and HS will be used to achieve the load targets shown in the
table below.
Table 6.
LGA 2011-3 Minimum Allowable Loads
Item
Minimum
445N (100 lbf)
222N (50 lbf)
667N (150 lbf)
End of Life Load Targets
The ILM is designed to achieve the minimum end of life loads for the socket. The
thermal solution (heatsink) should apply a portion of the end of life load. The
combination of an ILM and HS will be used to achieve the load targets shown in the
table below.
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Table 7.
LGA 2011-3 Minimum End of Life Loads
Item
3.2
End of Life Minimum
311N (70 lbf)
178N (40 lbf)
490N (110 lbf)
ILM Keepout Zones (KOZ)
The table below lists envelope dimensions for ILM KOZ , both topside and backplate.
For detailed views, refer to dimensioned drawings in Mechanical Drawings on page
78.
Table 8.
LGA 2011-3 ILM General Keepout Dimensions
Keepout Type
Topside envelope
ILM Hole Location
Backplate Envelope
3.3
Square ILM
Narrow ILM
93x93 mm (3.6x3.7in)
80x107.5 mm (3.15x4.2in)
46x69.2 mm (1.8x2.7 in)
78x84 mm (3.1x3.3 in)
Independent Loading Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
package onto the socket contacts. The ILM is a mechanical assembly that is physically
separate from the socket body. The assembly of the ILM to the motherboard is
expected to occur after attaching the socket to the board. The exact assembly location
is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the
socket. Intel performs detailed studies on integration of processor package, socket
and ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be "built to print" from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts resulting in even load transfer through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and
package.
3.4
ILM Mechanical Design Considerations and
Recommendations
An retention/loading mechanism must be designed to support the processor heatsink
and to ensure processor interface with the socket contact is maintained since there
are no features on the socket for direct attachment of the heatsink or retaining the
processor. In addition to supporting the processor heatsink over the processor, this
mechanism plays a significant role in the robustness of the system in which it is
implemented, in particular:
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•
Ensuring that thermal performance of the TIM applied between the IHS and the
heatsink is achievable. TIMs, especially those based on phase change materials,
are very sensitive to applied pressure: the higher the pressure, the better the
initial performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Designs should consider the impact of shock and vibration events on
TIM performance as well as possible decrease in applied pressure over time due to
potential structural relaxation in enabled components.
•
Ensuring that system electrical, thermal, and structural integrity is maintained
under shock and vibration events. The mechanical requirements of the attach
mechanism depend on the weight of the heatsink, as well as the level of shock
and vibration that the system must support. The overall structural design of the
baseboard and system must be considered when designing the heatsink and ILM
attach mechanism. Their design should provide a means for protecting the socket
solder joints as well as preventing package pullout from the socket.
•
The load applied by the attachment mechanism and the heatsink must comply
with the package specifications, along with the dynamic load added by the
mechanical shock and vibration requirements of the package and socket.
•
Load induced onto the package and socket by the ILM may be influenced with
heatsink installed. Determining the performance for any thermal/mechanical
solution is the responsibility of the customer.
A potential mechanical solution for heavy heatsink is the use of a supporting
mechanism such as a backer plate or the utilization of a direct attachment of the
heatsink to the chassis pan. In these cases, the strength of the supporting component
can be utilized rather than solely relying on the baseboard strength. In addition to the
general guidelines given above, contact with the baseboard surfaces should be
minimized during installation in order to avoid any damage to the baseboard.
Placement of board-to-chassis mounting holes also impacts board deflection and
resultant socket solder ball stress. Customers need to assess the shock for their
designs as heatsink retention (back plate), heatsink mass and chassis mounting holes
may vary.
3.5
ILM Features
The ILM is defined by four basic features
1. ILM Loadplate: Formed sheet metal that when closed applies four point loads onto
the IHS seating the processor into the socket
2. ILM Frame: Single piece or assembly that mounts to PCB board and provides the
hinge locations for the levers the ILM frame also contains captive mounts for
heatsink attach. An insulator is pre applied by the vendor to the bottom side of
the ILM frame.
3.
ILM Actuation levers: Formed loading levers designed to place equal force on both
ends of the ILM load plate. Some of the load is passed through the socket body to
the board inducing a slight compression on the solder joints
4. ILM Backplate: A flat steel back plate with threaded studs to attach to the ILM
frame. A clearance hole is located at the center of the plate to allow access to test
points and backside capacitors. Two additional cut-outs on the backplate provide
clearance for backside voltage regulator components. An insulator is pre applied
by the vendor to the side with the threaded studs.
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Heatsink mounting studs on ILM frame allow for topside thermal solution attach to a
rigid structure. This eliminates the motherboard thickness dependency from the
heatsink mechanical stackup. ILM assembly provides a clamping force between the
ILM frame, backplate and board, resulting in reduced board bending leading to higher
solder joint reliability. ILM lever design provides an interlocking mechanism to ensure
proper opening or closing sequence for the operator. This has been implemented in
both square and narrow ILM.
ILM Load Plate Design
Four point loading contributes to minimizing package and socket warpage under non
uniformly distributed load. The reaction force from closing the load plate is transmitted
to the frame and through the captive fasteners to the back plate. Some of the load is
passed through the socket body to the board inducing a slight compression on the
solder joints. The load plate design is common between the two POR ILMS and is
shown in the figure below.
Figure 12.
ILM Load Plate
Lever Actuation/Release Forces
Maximum allowable force to actuate the levers not to exceed 4.7 lbf (21 N) at the
point of typical finger placement.
ILM Back Plate Design
The backplate assembly consists of a supporting plate and captive standoffs. It
provides rigidity to the system to ensure minimal board and socket deflection. Four
externally threaded (male) inserts which are press fit into the back plate are for ILM
attachment. Three cavities are located at the center of the plate to allow access to the
baseboard test points and backside capacitors. An insulator is pre-applied to prevent
shorting the board.
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Figure 13.
ILM Backplate
3.6
Intel ILM Reference Designs
®
Intel has designed and validated two ILMs compatible with Socket LGA2011-3 :
1. Square ILM - 80x80 mm heat sink mounting hole pattern.
2. Narrow ILM - 56x94 mm heat sink mounting hole pattern.
The two POR ILMs share most components, only the top plate and active lever differ
between the two assemblies.
3.6.1
Square ILM
The square ILM consists of two sub assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate. The
square ILM assembly consists of several pieces as shown and labeled in the following
diagram. The hinge lever, active lever, load plate, top plate,clevises, and the captive
fasteners. For clarity the ILM cover is not shown in this view.
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Figure 14.
Exploded Square ILM
An assembled view is shown in the following figure.
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Figure 15.
Assembled Square ILM
Table 9.
Square ILM Component Thickness and materials
Component
Thickness
Material
ILM Frame
1.20 mm
310 Stainless Steel
ILM Load Plate
1.50 mm
310 Stainless Steel
ILM Back Plate
2.20 mm
S50C low Carbon Steel
The square ILM supports the legacy 80x80 mm heat sink mounting patterns used in
some form factors.
3.6.2
Narrow ILM
The narrow ILM consists of two sub assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate. The
ILM assembly is shown in the following figure.
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Figure 16.
Exploded Narrow ILM
The narrow ILM assembly consists of several pieces as shown and labeled above. The
hinge lever, active lever, load plate, top plate, clevises, ILM cover, and the captive
fasteners. For clarity the ILM cover is not shown in this view. An assembled view is
shown in the following figure. The Narrow ILM maintains the structure and function of
the square ILM but utilizes separate clevises riveted onto the ILM frame.
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Figure 17.
Assembled Narrow ILM
Table 10.
Narrow ILM Component Thickness and materials
Component
Thickness
Material
ILM Frame
1.50 mm
310 Stainless Steel
ILM Clevis
0.80 mm
301 Stainless Steel
ILM Load Plate
1.50 mm
310 Stainless Steel
ILM Back Plate
2.20 mm
S50C low Carbon Steel
The narrow ILM supports a smaller east west dimension constraint conducive for use
in space constrained form factors.
3.7
ILM Cover
Intel has developed a cover that will snap on to the ILM for the LGA2011 socket
family.
The ILM cover is intended to reduce the potential for socket contact damage from the
operator / customer fingers being close to the socket contacts to remove or install the
pick and place cover. By design the ILM cover and pick and place covers can not be
installed simultaneously. This cover is intended to be used in place of the pick and
place cover once the ILM is assembled to the board. The ILM will be offered with the
ILM cover pre assembled as well as a discrete part.
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Figure 18.
Note:
ILM cover
•
Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as
a discrete component.
•
The ILM cover will pop off if a processor is installed in the socket.
•
Maintain inter-changeability between validated ILM vendors for LGA2011-3 socket.
•
The ILM cover for the LGA2011-3 socket will have a flammability rating of V-0 per
UL 60950-1.
Intel recommends removing the Pick and Place cover (PnP) of the socket body in
manufacturing as soon as possible at the time when ILM is being installed.
ILM Cover Attach/Removal Force
The required force to remove the ILM cover shall not exceed 7.6 N when the load is
applied by finger at the center of cover.
3.8
ILM Allowable Board Thickness
The ILM components described in this document will support board thickness in the
range of 1.5748 - 2.54 mm (0.062" - 0.100"). Boards (PCBs) not within this range
may require modifications to the back plate or other ILM components retention.
Contact the component suppliers (Component Suppliers on page 76) for
modifications.
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families— Processor Thermal
Specifications and Features
4.0
Processor Thermal Specifications and Features
4.1
Tcase and DTS-Based Thermal Specification
Implementation
Thermal solutions should be sized such that the processor complies to the TCASE
thermal profile all the way up to TDP, because, when all cores are active, a thermal
solution sized as such will have the capacity to meet the DTS thermal profile, by
design. When all cores are not active or when Intel Turbo Boost Technology is active,
attempting to comply with the DTS thermal profile may drive system fans to speeds
higher than the fan speed required to comply with the TCASE thermal profile at TDP.
In cases where thermal solutions are undersized, and the processor does not comply
with the TCASE thermal profile at TDP, compliance can occur when the processor power
is kept lower than TDP, AND the actual TCASE is below the TCASE thermal profile at that
lower power.
In most situations, implementation of DTS thermal profile can reduce average fan
power and improve acoustics, as compared to TCONTROL-based fan speed control. When
DTS < TCONTROL, the processor is compliant, and TCASE and DTS thermal profiles can
be ignored.
4.1.1
Margin to Thermal Specification (M)
To simplify processor thermal specification compliance, the processor calculates and
reports margin to DTS thermal profile (M) using the following method.
Processor reads firmware programmable values:
1. TCC_OFFSET: In-band: TEMPERATURE_TARGET[27:24]. BIOS must write in a
value before CPL3.
Processor gathers information about itself:
1.
Processor stores the intercept and slope terms (TLA and ΨPA) from the DTS
Thermal Profile for that particular SKU (one-time read only)
2.
Processor reads its own energy consumption and calculates power, P
3.
Processor reads its own temperature, DTS
Finally, processor calculates the margin value (M) to the specification (solid black line
in the graph below). The PECI command for reading margin (M) is RdPkgConfig(),
Index 10.
M < 0 indicates gap to spec, processor needs more cooling (for example, increase fan
speed)
M > 0 this indicates margin to spec, processor is sufficiently cooled
Graphically, this is represented below. TCONTROL_OFFSET is not writable to a register.
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Processor Thermal Specifications and Features—Intel® Xeon® Processor E5-1600 / 2600 / 4600
v3 Product Families
Figure 19.
Margin to Thermal Spec (M)
DTS 2.0 processor Margin values can be obtained via PECI or Processor register see
documentation below as well as Intel® Xeon® Processor E5-1600 and E5-2600 v3
Product Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor
E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet
Table 11.
DTS 2.0 Margin From PECI
Service
Thermal Margin
Index
Value
(IV)
(decimal)
10
Parameter
Value
(word)
0x0000
RdPkgConfig()
Data
(dword)
15:0--Package
Temperature
margin in 8.8
format, 32:16-Reserved
WrPkgConfi
g()
Data
(dword)
N/A
Description
Package temperature
margin with regards to
DTS Thermal Profile.
Positive indicates
thermal margin, and
package is less than DTS
thermal profile
Note: Refer to Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and
Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for further
details
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Thermal
Table 12.
DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN
Bus:1
Device:30
Bit
Attr
Function:0
Default
Offset:E0
Description
31:16
RSVD-P
0000h
Reserved--Protected
15:0
R0-V
0000h
THERM_MARGIN--This field provides Platform
Firmware with running average of the instantaneous
temperature margin above Tspec in 2's complement
8.8 format. This is the recommended field for
Platform firmware to use for fan control. When this
value is negative, it indicates a firmware must
increase the fan speed. With a positive value,
firmware may decrease the speed of the fan
Note: •
Refer to Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and
Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for full
documentation of registers and field descriptions
4.2
Processor Thermal Features
4.2.1
Absolute Processor Temperature
The processor has a software readable field in the TEMPERATURE_TARGET register
that contains the minimum temperature at which the Thermal Control Circuit (TCC)
will be activated and PROCHOT_N will be asserted.
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature could be
misleading.
4.2.2
Short Duration TCC Activation
Systems designed to meet thermal capacity may encounter short durations of
throttling, also known as TCC activation, especially when running nonsteady processor
stress applications. This is acceptable and is functionally within the intended
temperature control parameters of the processor. Such short duration TCC activation
is not expected to provide noticeable reductions in application performance, and is
typically within the normal range of processor to processor performance variation.
4.3
Processor Thermal Specifications
The processor requires a thermal solution to maintain temperatures within operating
limits. Any attempt to operate the processor outside these limits may result in
permanent damage to the processor and potentially other components within the
system. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level
thermal solutions may consist of system fans combined with ducting and venting.
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v3 Product Families
For more information on designing a component level thermal solution, refer to
Processor Thermal Solutions on page 47.
4.3.1
Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain between the minimum and maximum case temperature
(TCASE) specifications as defined in the tables in the following sub-sections. Thermal
solutions that do not provide sufficient thermal cooling may affect the long-term
reliability of the processor and system.
Thermal profiles ensure adherence to Intel reliability requirements.
Intel assumes specific system boundary conditions (system ambient, airflow, heatsink
performance / pressure drop, preheat, etc.) for each processor SKU to develop Tcase
and DTS thermal specifications. For servers each processor will be aligned to either 1U
or 2U system boundary conditions. Customers can use other boundary conditions (for
example a better thermal solution with higher ambient) providing they are compliant
to those specifications. Furthermore, implementing a thermal solution that violates the
thermal profile for extended periods of time may result in permanent damage to the
processor or reduced life. The upper point of the thermal profile consists of the
Thermal Design Power (TDP) and the corresponding TCASE_MAX value (x = TDP and y =
TCASE_MAX) represents a thermal solution design point.
For embedded servers, communications and storage markets, Intel has SKUs that
support thermal profiles with nominal and short-term conditions designed to meet
NEBS level 3 compliance. For these SKUs, operation at either the nominal or shortterm thermal profiles should result in virtually no TCC activation. Thermal profiles for
these SKUs are found in this chapter as well.
Intel recommends that thermal solution designs target the Thermal Design Power
(TDP). The Adaptive Thermal Monitor feature is intended to help protect the processor
in the event that an application exceeds the TDP recommendation for a sustained time
period. The Adaptive Thermal Monitor feature must be enabled for the processor to
remain within its specifications.
4.3.2
TCASE and DTS Based Thermal Specifications
To simplify compliance to thermal specifications at processor run time, the processor
has a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal
Sensor outputs a relative die temperature from TCC activation temperature. TCASEbased specifications are used for heatsink sizing while DTS-based specs are used for
acoustic and fan speed optimizations while the server is operating. Some SKUs may
share the same TCASE thermal profiles but have distinct DTS thermal profiles.
All thermal profiles, whether based on TCASE or DTS, follow the straight-line equation
format namely, y = mx + b. Where,
y = temperature (T) in °C
m = slope (Ψ)
x = power (P) in Watts
b = y-intercept (TLA) (LA = local ambient)
October 2015
Order No.: 330786-003
37
Figure 20.
Typical Thermal Profile Graph (Illustration Only)
4.3.3
Server Processor Thermal Profiles and Form Factors
Table 13.
Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families Stack Tcase
and DTS Thermal Profiles and Correction Factors
Category
Processor
Number
Package Form
Factor (die)
TDP (W)
Core Count
Assumed Heatsink
Form Factor
C1E
Disable Offset (°C)
Tcontrol
E5-2690 v3
Small
(MCC)
135
12
1U
Square
0
18
TC=[0.235*P]
+58.2
TDTS=[0.299
*P]+58.2
99
E5-2680 v3
Small
(MCC)
120
12
1U
Square
0
10
TC=[0.235*P]
+56.3
TDTS=[0.311
*P]+56.3
95
E5-2670 v3
Small
(MCC)
120
12
1U
Square
0
10
TC=[0.235*P]
+56.3
TDTS=[0.310
*P]+56.3
95
E5-2660 v3
Small
(MCC)
105
10
1U
Square
0
10
TC=[0.236*P]
+54.2
TDTS=[0.329
*P]+54.2
90
E5-2650 v3
Small
(MCC)
105
10
1U
Square
0
10
TC=[0.235*P]
+54.2
TDTS=[0.324
*P]+54.2
90
E5-2640 v3
Small
(LCC)
90
8
1U
Square
0
10
TC=[0.246*P]
+52.2
TDTS=[0.363
*P]+52.2
86
E5-2630 v3
Small
(LCC)
85
8
1U
Square
0
10
TC=[0.243*P]
+51.4
TDTS=[0.392
*P]+51.4
86
E5-2620 v3
Small
(LCC)
85
6
1U
Square
0
10
TC=[0.248*P]
+51.5
TDTS=[0.371
*P]+51.5
85
Standard
Advanced
Thermal Profiles
T CASE
(°C)
DTS
(°C)
DTS max
at TDP
Note: 5
continued...
38
October 2015
Order No.: 330786-003
v3 Product Families
Category
Processor
Number
Package Form
Factor (die)
TDP (W)
Core Count
Assumed Heatsink
Form Factor
C1E
Tcontrol
Basic
Small
(MCC)
85
6
1U
Square
2
10
TC=[0.231*P]
+51.3
TDTS=[0.325
*P]+51.3
80
E5-2603 v3
Small
(LCC)
85
6
1U
Square
0
10
TC=[0.250*P]
+51.5
TDTS=[0.353
*P]+51.5
83
E5-2699 v3
Large
(HCC)
145
18
2U
Square
0
18
TC=[0.175*P ]
+51.0
TDTS=[0.243
*P]+51.0
88
E5-2698 v3
Large
(HCC)
135
16
1U
Square
4
18
TC=[0.221*P]+
58.2
TDTS=[0.277
*P]+58.2
97
E5-2697 v3
Large
(HCC)
145
14
2U
Square
0
18
TC=[0.177*P]
+51.0
TDTS=[0.276
*P]+51.0
93
E5-2695 v3
Large
(HCC)
120
14
1U
Square
0
10
TC=[0.221*P]+
56.1
TDTS=[0.314
*P]+56.1
95
E5-2683 v3
Large
(HCC)
120
14
1U
Square
0
10
TC=[0.220*P]
+56.1
TDTS=[0.285
*P]+56.1
92
E5-2685 v3
Small
(MCC)
120
12
1U
Square
0
10
TC=[0.235*P]
+56.3
TDTS=[0.304
*P]+56.3
94
E5-2667 v3
Small
(LCC)
135
8
2U
Square
3
18
TC=[0.202*P]
+50.5
TDTS=[0.336
*P]+50.5
97
E5-2643 v3
Small
(LCC)
135
6
2U
Square
2
18
TC=[0.205*P]
+49.6
TDTS=[0.369
*P]+49.6
97
E5-2637 v3
Small
(LCC)
135
4
2U
Square
2
18
TC=[0.205*P]
+48.9
TDTS=[0.402
*P]+48.9
97
E5-2623 v3
Small
(LCC)
105
4
1U Square
0
10
TC=[0.250*P]
+53.9
TDTS=[0.433
*P]+53.9
101
Workstation Only
E5-2687W
v3
Small
(MCC)
160
10
WS
Passive
Tower
0
10
TC=[0.190*P]
+44.3
TDTS=
[0.299*P]
+44.3
94
E5-2650L
v3
Small
(MCC)
65
12
1U Square
0
10
TC=[0.232*P]
+48.5
TDTS=[0.320
*P]+48.5
71
E5-2630L
v3
Small
55
8
1U Square
0
10
TC=[0.240*P]
+47.2
TDTS=[0.372
*P]+47.2
69
Frequency Optimized
Segment Optimized
E5-2609 v3
Low Power
Thermal Profiles
Note: 3
T CASE
(°C)
DTS
(°C)
DTS max
at TDP
Note: 5
continued...
October 2015
Order No.: 330786-003
39
Tcontrol
C1E
Assumed Heatsink
Form Factor
Core Count
TDP (W)
Package Form
Factor (die)
Processor
Number
Category
Thermal Profiles
T CASE
(°C)
DTS
(°C)
DTS max
at TDP
Note: 5
(LCC)
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the
processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power
may exceed TDP for short durations. Please see Intel® Turbo Boost Technology on page 50
3. This SKU is intended for dual processor workstations only and uses workstation specific use conditions for reliability
assumptions.
4. Disabling C1E will result in an automatic reduction of DTSmax so that reliability is still protected. DTSmax will be
reduced by the value shown 'C1E Disable Offset’. If thermal design has not been optimized to the reduced DTSmax
value, throttling may result. Tcontrol is already an offset to DTSmax, therefore the absolute temp at which the
Tcontrol threshold is reached will shift by the same amount.
5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal
design power and is installed in a system using microcode update 0x25 or later.
6. Tcase Minimum is 0°C
Server 4S Processor Thermal Profiles and Form Factors
Table 14.
Intel® Xeon® Processor E5-4600 v3 Product Families Stack Product Family
Tcase and DTS Thermal Profiles and Correction Factors
C1E Disable
Offset (°C)
Tcontrol
Lukeville
TTV
Looneyville
TTV
E5-4669
v3
Large
(HCC)
135
18
1U
Square
0
10
TC=[0.219*P
]+58.1
TDTS=[0.280
*P]+58.1
97
-0.007
-0.014
E5-4667
v3
Large
(HCC)
135
16
1U
Square
0
10
TC=[0.219*P
]+58.1
TDTS=[0.276
*P]+58.1
97
-0.007
-0.014
E5-4655
v3
Small
(MCC
)
135
6
1U
Square
0
10
TC=[0.233*P
] + 56.3
TDTS=[0.352
*P] + 56.3
100
0.009
0.002
E5-4627
v3
Small
(MCC
)
135
10
1U
Square
0
10
TC=[0.237*P
] + 56.9
TDTS=[0.332
*P] + 56.9
100
0.013
0.006
Processor
Number
Assumed Heatsink
Form Factor
Correction
Factors
Core Count
DTS
max at
TDP
TDP (W)
Thermal Profiles
Package Form
Factor (Die)
Frequency Optimized Dense
4S Glueless
High Performance Dense
4S Glueless
Category
4.3.4
T CASE
(°C)
DTS
(°C)
Note: 5
continued...
40
October 2015
Order No.: 330786-003
Core Count
Assumed Heatsink
Form Factor
C1E Disable
Offset (°C)
Tcontrol
Lukeville
TTV
Looneyville
TTV
Correction
Factors
TDP (W)
DTS
max at
TDP
Package Form
Factor (Die)
Advanced
Standard
Basic
Thermal Profiles
E5-4660
v3
Large
(HCC)
120
14
1U
Square
0
10
TC=[0.221*P
]+56.1
TDTS=[0.312
*P]+56.1
95
-0.005
-0.012
E5-4650
v3
Large
(HCC)
105
12
1U
Square
0
10
TC=[0.224*P
]+54.0
TDTS=[0.288
*P]+54.0
86
-0.001
-0.008
E5-4640
v3
Large
(HCC)
105
12
1U
Square
0
10
TC=[0.224*P
]+54.0
TDTS=[0.280
*P]+54.0
85
-0.001
-0.008
E5-4620
v3
Large
(HCC)
105
10
1U
Square
0
10
TC=[0.225*P
]+54.0
TDTS=[0.289
*P]+54.0
86
0.000
-0.007
E5-4610
v3
Large
(HCC)
105
10
1U
Square
0
10
TC=[0.224*P
]+54.0
TDTS=[0.283
*P]+54.0
85
0.000
-0.007
8
Processor
Number
Category
v3 Product Families
T CASE
(°C)
DTS
(°C)
Note: 5
3. These specifications may be updated as further characterization data becomes available.
4. Minimum T case Specification is 0°C
design power and is installed in a system using microcode update 0x25 or later. See doc 550666 for further details
Workstation Processor Thermal Profiles and Form Factors
Table 15.
Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families 1S
Workstation Stack Tcase and DTS Thermal Profiles and Correction Factors
C1E Disable Offset (°C)
Tcontrol
Small
(LCC)
140
8
WS Active
Tower
3
10
T C=[0.175*P]+
41.7
TDTS = [0.321*P]
+ 41.7
88
E5-1660 v3
Small
(LCC)
140
8
WS Active
Tower
0
10
TC=[0.173*P]+
41.7
TDTS = [0.352*P]
+ 41.7
92
E5-1650 v3
Small
(LCC)
140
6
WS Active
Tower
2
10
TC=[0.178*P]+
41.8
TDTS = [0.364*P]
+ 41.8
94
E5-1630 v3
Small
(LCC)
140
4
WS Active
Tower
5
10
TC=[0.177*P]+
41.4
TDTS = [0.428*P]
+ 41.4
103
Package Form
Factor (Die SIze)
E5-1680 v3
Processor Number
Assumed Heatsink
Form Factor
DTS
max at
TDP
Core Count
Thermal Profiles
TDP (W)
1S Workstation
Category
4.3.5
TCASE
(°C)
DTS
(°C)
Note: 5
continued...
October 2015
Order No.: 330786-003
41
Assumed Heatsink
Form Factor
C1E Disable Offset (°C)
Tcontrol
Small
(LCC)
140
4
WS Active
Tower
5
10
TC=[0.177*P]+
41.4
TDTS = [0.428*P]
+ 41.4
103
E5-1607 v3
Small
(LCC)
140
4
WS Active
Tower
2
10
TC=[0.176*P]
+41.4
TDTS=[0.423*P]
+41.4
102
E5-1603 v3
Small
(LCC)
140
4
WS Active
Tower
0
10
TC=[0.181*P]
+41.8
TDTS=[0.336*P]
+41.8
90
Package Form
Factor (Die SIze)
Core Count
DTS
max at
TDP
TDP (W)
Thermal Profiles
E5-1620 v3
Processor Number
Category
TCASE
(°C)
DTS
(°C)
Note: 5
3. This SKU is intended for single processor workstations only and uses workstation specific use conditions for
reliability assumptions.
4. Minimum Tcase Specification is 0°C
4.3.6
Embedded Server Processor Thermal Profiles
Embedded Server processor SKUs target higher case temperatures and/or Network
Equipment Building System (NEBS) thermal profiles for embedded communications
server and storage form factors. The following thermal profiles pertain only to those
specific SKUs. Network Equipment Building System is the most common set of
environmental design guidelines applied to telecommunications equipment in the
United States.
42
October 2015
Order No.: 330786-003
v3 Product Families
Maximum TCASE (°C)
Tcontrol
C1E Disable
Offset (°C)
Core Count
TDP (W)
Embedded Server Processor Thermal Profiles
Package Form Factor
Processor Number
Category
Table 16.
TCASE
Thermal
Profile
TCASE
(°C)
(Nominal)
TCASE
(°C)
(Short
Term)
DTS Thermal
Profile
TDTS
(°C)
(Nominal
)
DTS
max
at
TDP
(nomi
nal)
TDTS (°C)
(Short
Term)
Small
105
12
0
18
91
TC=[0.228
*P] + 52.0
TC=[0.22
8 *P] +
67.0
TDTS=[0.2
96 *P] +
52.0
85
TDTS=[0.2
96 *P] +
67.0
100
Small
105
12
0
18
87
TC =[0.190
* P] + 52.0
TC
=[0.190 *
P] + 67.0
TDTS =
[0.258 *
P] + 52.0
81
TDTS =
[0.258 *
P] + 67.0
96
Small
Note: 7
75
12
0
18
87
TC = [0.267
* P] + 52.0
TC =
[0.267 *
P] + 67.0
TDTS =
[0.350 *
P] + 52.0
80
TDTS =
[0.350 *
P] + 67.0
95
Small
E5-2658A v3
E5-2628L v3
Standard
E5-2648L v3
E5-2658 v3
Advanced
Note: 7
DTS
max
at
TDP
(Short
Term)
75
10
0
18
87
TC = [0.267
* P] + 52.0
TC =
[0.267 *
P] + 67.0
TDTS =
[0.352 *
P] + 52.0
80
TDTS
=[0.352 *
P] + 67.0
95
continued...
October 2015
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43
Maximum TCASE (°C)
Tcontrol
C1E Disable
Offset (°C)
Core Count
TDP (W)
Package Form Factor
Processor Number
Category
TCASE
Thermal
Profile
TCASE
(°C)
(Nominal)
TCASE
(°C)
(Short
Term)
DTS Thermal
Profile
TDTS
(°C)
(Nominal
)
DTS
max
at
TDP
(nomi
nal)
TDTS (°C)
(Short
Term)
Small
Note: 7
75
8
0
18
87
TC = [0.267
* P] + 52.0
TC =
[0.267 *
P] + 67.0
TDTS =
[0.378 *
P] + 52.0
82
TDTS =
[0.378 *
P] + 67.0
97
Small
E5-2608L v3
Basic
E5-2618L v3
Note: 7
DTS
max
at
TDP
(Short
Term)
52
6
0
18
88
TC = [0.404
* P] + 52.0
TC =
[0.404 *
P] + 67.0
TDTS
=[0.509 *
P] + 52.0
81
TDTS
=[0.509 *
P] + 67.0
96
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design at maximum TCASE.
Processor power may exceed TDP for short durations. Please see Intel® Turbo Boost Technology on page 50.
3. Power specifications are defined at all VIDs found in the Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product
Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product
Families, Volume 1 of 2, Electrical Datasheet . Processors may be delivered under multiple VIDs for each frequency.
4. The Nominal Thermal Profile must be used for all normal operating conditions or for products that do not require
NEBS Level 3 compliance.
5. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year,
as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations exceeding 360 hours
per year violate the processor thermal specifications and may result in permanent damage to the processor.
6. Minimum T case Specification is 0°C
4.3.7
Thermal Metrology
The minimum and maximum case temperatures (TCASE) specified are measured at the
geometric top center of the processor integrated heat spreader (IHS). The following
figures illustrate the location where TCASE temperature measurements should be
made. The figures also include geometry guidance for modifying the IHS to accept a
thermocouple probe.
44
October 2015
Order No.: 330786-003
v3 Product Families
Figure 21.
Case Temperature (TCASE) Measurement Location for Large Package
Grantley Large Package
Units are mm
B
0.790 ±0.150
0.380 ±0.030
1.020 ±0.250
A
Package Center
DETAIL A
26.250
0.381 ±0.038
0.510 ±0.080
SECTION B
B
Pin 1 Indicator
25.500
Note:
Figure is not to scale and is for reference only.
October 2015
Order No.: 330786-003
45
Figure 22.
Case Temperature (TCASE) Measurement Location for Small Package
Grantley Small Package
Units are mm
B
0.790 ±0.150
0.380 ±0.030
1.020 ±0.250
A
25.230
PACKAGE CENTER
DETAIL A
0.381 ±0.038
0.510 ±0.080
PIN 1 INDICATOR
SECTION B
B
22.500
Note:
Figure is not to scale and is for reference only.
46
October 2015
Order No.: 330786-003
Processor Thermal Solutions—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Families
5.0
Processor Thermal Solutions
5.1
Processor Boundary Conditions for Shadowed and Spread
Core Layouts
Intel's processors go into a variety of board layouts and form factors. Boundary
conditions for the SSI EEB layout (sometimes referred to as "shadowed layout") are
included in the table below for 1U, 2U and Workstation systems. A typical shadowed
layout with a 1U heat sink is shown below.
Figure 23.
Typical Shadowed Layout
Airflow Direction
Another approach is the "spread core" layout, where neither processor is "shadowed"
by the other, as shown below.
October 2015
Order No.: 330786-003
47
Solutions
Figure 24.
Typical Spread Core Layout
Table 17.
Processor Boundary Conditions for Shadowed and Spread Core Layouts
Board
Layout 2
Heatsink
Form
Factor 3
Heatsink
Description
Airflow4
(CFM) / RPM
ΔP 4
(in H20)
Ψ CA_TTV
(°C/W)5
70W
80W
85W
105W
120W
135W
140W
145W
160W
6
System1
TLA for each TDP SKU (°C)
1U
Spread
core,
24
DIMMs
70 x 106 x
25.5mm
(Narrow)
[STS200PNR]
Copper
base
Aluminum
fin
(Passive)
10.2
0.233
0.256
41.5
41.5
41.5
41.5
41.5
41.5
N/A
N/A
N/A
1U
SSI
EEB,
16
DIMMs
91.5 x 91.5 x
25.5mm
(Square)
[STS200P]
Copper
base
Aluminum
fin
(Passive)
15.2
0.382
0.250
47.4
48.6
49.1
51.4
53.1
54.8
N/A
N/A
N/A
2U
SSI
EEB,
16
DIMMs
91.5 x 91.5 x
64mm
(Square)
[STS200C]
Copper
base
Aluminum
fin with
Heatpipe
(Passive)
26.0
0.138
0.201
42.8
43.5
43.9
45.3
46.4
47.5
47.9
48.2
N/A
WS
SSI
EEB,
16
DIMMs
100 x 70 x
123.2mm
(Tower)
Copper
base
Aluminum
fin with
Heatpipe
(Active)
2600
RPM
Not
meaningful
for Active
Heatsink
0.197
38.2
38.5
38.7
39.3
39.7
40.1
40.3
40.5
40.9
Note:
1. 1U = 1.75" which is the outside-to-outside dimension of the server enclosure.
2. SSI Specification is found at https://ssiforum.org/.
continued...
48
October 2015
Order No.: 330786-003
160W
6
145W
140W
135W
120W
105W
85W
80W
TLA for each TDP SKU (°C)
70W
Ψ CA_TTV
(°C/W)5
ΔP 4
(in H20)
Airflow4
(CFM) / RPM
Heatsink
Description
Heatsink
Form
Factor 3
Board
Layout 2
System1
Families
3. Refer to Intel Reference Design Heat Sink on page 55. Dimensions of heat sink do not include socket or processor.
4. Airflow through the heat sink fins with zero bypass. Max target for pressure drop (ΔP) measured in inches H2O.
5. Mean + 3σ performance for a heat sink on top of the Thermal Test Vehicle (TTV). These estimates are not necessarily the
thermal performance targets needed to meet processor thermal specifications. Includes thermal performance of Honeywell*
PCM45F.
6. System ambient TSA = 35°C. Increase in air temperature inside the chassis (from the front grill to the downstream, or
shadowed, processor heatsink). Includes preheat from hard drives, VRs, front processor, etc. as shown below.
5.2
Heatsink Design Considerations
To remove the heat from the processor, three basic parameters should be considered:
•
The area of the surface on which the heat transfer takes place - Without any
enhancements, this is the surface of the processor package IHS. One method used
to improve thermal performance is to attach a heatsink to the IHS. A heatsink can
increase the effective heat transfer surface area by conducting heat out of the IHS
and into the surrounding air through fins attached to the heatsink base.
•
The conduction path from the heat source to the heatsink fins - Providing a direct
conduction path from the heat source to the heatsink fins and selecting materials
with higher thermal conductivity typically improves heatsink performance. The
length, thickness, and conductivity of the conduction path from the heat source to
the fins directly impact the thermal performance of the heatsink. In particular, the
quality of the contact between the package IHS and the heatsink base has a
higher impact on the overall thermal solution performance as processor cooling
requirements become strict. Thermal interface material (TIM) is used to fill in the
gap between the IHS and the bottom surface of the heatsink, and thereby
improves the overall performance of the thermal stackup (IHS-TIM-Heatsink).
With extremely poor heatsink interface flatness or roughness, TIM may not
adequately fill the gap. The TIM thermal performance depends on its thermal
conductivity as well as the pressure load applied to it.
•
The heat transfer conditions on the surface upon which heat transfer takes place Convective heat transfer occurs between the airflow and the surface exposed to
the flow. It is characterized by the local ambient temperature of the air, TLA, and
the local air velocity over the surface. The higher the air velocity over the surface,
the more efficient the resulting cooling. The nature of the airflow can also enhance
heat transfer via convection. Turbulent flow can provide improvement over
laminar flow. In the case of a heatsink, the surface exposed to the flow includes
the fin faces and the heatsink base.
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An active heatsink typically incorporates a fan that helps manage the airflow through
the heatsink.
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis.
Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are
typically larger (and heavier) than active heatsinks due to the increase in fin surface
necessary to meet a required performance. As the heatsink fin density (the number of
fins in a given cross-section) increases, the resistance to the airflow increases; it is
more likely that the air will travel around the heatsink instead of through it, unless air
bypass is carefully managed. Using air-ducting techniques to manage bypass area is
an effective method for maximizing airflow through the heatsink fins.
5.3
Thermal Design Guidelines
5.3.1
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology is a feature available on certain Intel® Xeon®
processor E5-1600 and E5-2600 v3 product families SKUs that opportunistically, and
automatically allows the processor to run faster than the marked frequency if the part
is operating below certain power and temperature limits. With Turbo Boost enabled,
the instantaneous processor power can exceed TDP for short durations resulting in
increased performance.
System thermal design should consider the following important parameters (set via
BIOS):
•
POWER_LIMIT_1 (PL1) = average processor power over a long time window
(default setting is TDP)
•
POWER_LIMIT_2 (PL2) = average processor power over a short time window
above TDP (short excursions). Maximum allowed by the processor is 20% above
TDP for all SKUs (1.2 * TDP). Note that actual power will include IMON inaccuracy.
•
POWER_LIMIT_1_TIME (Tau) = time constant for the exponential weighted
moving average (EWMA) which optimizes performance while reducing thermal
risk. (dictates how quickly power decays from its peak)
Please note that although the processor can exceed PL1 (default TDP) for a certain
amount of time, the exponential weighted moving average (EWMA) power will never
exceed PL1.
A properly designed processor thermal solution is important to maximizing Turbo
Boost performance. However, heatsink performance (thermal resistance, Ψ CA) is only
one of several factors that can impact the amount of benefit. Other factors are
operating environment, workload and system design. With Turbo Mode enabled, the
processor may run more consistently at higher power levels, and be more likely to
operate above TCONTROL, as compared to when Turbo Mode is disabled. This may result
in higher acoustics.
5.3.2
Thermal Excursion Power
Under fan failure or other anomalous thermal excursions, processor temperature
(either TCASE or DTS) may exceed the thermal profile for a duration totaling less than
360 hours per year without affecting long term reliability (life) of the processor. For
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more typical thermal excursions, Thermal Monitor is expected to control the processor
power level as long as conditions do not allow the processor to exceed the
temperature at which Thermal Control Circuit (TCC) activation initially occurred.
Under more severe anomalous thermal excursions when the processor temperature
cannot be controlled at or below thermal profile by TCC activation, then data integrity
is not assured. At some higher thresholds, THERMTRIP_N will enable a shut down in
an attempt to prevent permanent damage to the processor.
A designer can check anomalous power ratio of an individual part by reading register
PWR_LIMIT_MISC_INFO and dividing the value of PN_POWER_OF_SKU by the sku
TDP. Please refer to Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product
Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600
and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet
5.3.3
Thermal Characterization Parameters
The case-to-local ambient Thermal Characterization Parameter ( Ψ
Ψ
CA
CA
) is defined by:
= (Tcase - TLA) / TDP
Where:
T
CASE
T
LA
= Processor case temperature (°C)
= Local ambient temperature before the air enters the processor heatsink (°C)
TDP = TDP (W) assumes all power dissipates through the integrated heat spreader.
This inexact assumption is convenient for heatsink design.
Ψ CA = Ψ CS + Ψ SA
Where:
Ψ CS = Thermal characterization parameter of the TIM (°C/W) is dependent on the
thermal conductivity and thickness of the TIM.
Ψ SA = Thermal characterization parameter from heatsink-to-local ambient (°C/W) is
dependent on the thermal conductivity and geometry of the heatsink and dependent
on the air velocity through the heatsink fins.
The following figure illustrates the thermal characterization parameters.
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Figure 25.
Thermal Characterization Parameters
5.4
Thermal Interface Material (TIM) Considerations
Thermal Interface Material between the processor IHS and the heatsink base is
necessary to improve thermal conduction from the IHS to the heatsink. Many thermal
interface materials can be pre-applied to the heatsink base prior to shipment from the
heatsink supplier without the need for a separate TIM dispense or attachment process
in the final assembly factory.
All thermal interface materials should be sized and positioned on the heatsink base in
a way that ensures that the entire area is covered. It is important to compensate for
heatsink-to-processor positional alignment when selecting the proper TIM size.
When pre-applied material is used, it is recommended to have a protective cover.
Protective tape is not recommended as the TIM could be damaged during its removal
step.
Thermal performance usually degrades over the life of the assembly and this
degradation needs to be accounted for in the thermal performance. Degradation can
be caused by shipping and handling, environmental temperature, humidity conditions,
load relaxation over time, temperature cycling or material changes (most notably in
the TIM) over time. For this reason, the measured TCASE value of a given processor
may increase over time, depending on the type of TIM material.
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5.5
Mechanical Recommendations and Targets
Thermal solutions should be designed to meet the mechanical requirements described
in this section.
Keep in mind that the heatsink retention will need to apply additional load in order to
achieve the minimum Socket Static Total Compressive load. This load should be
distributed over the IHS (Integrated Heat Spreader). The dual-loading approach is
represented by the following equation.
FILM + FHEATSINK = FSOCKET
5.5.1
Processor / Socket Stackup Height
The table below provides the stackup height of a processor and LGA2011-3 socket
with processor fully seated. This value is the root sum of squares summation of: (a)
the height of the socket seating plane above the motherboard after reflow, (b) the
height of the package, from the package seating plane to the top of the IHS, and
accounting for its nominal variation and tolerances given in the processor, socket and
ILM drawings
Table 18.
Target Stackup Heights From Top of Board to Top of IHS
Intel® Xeon® Processor E5-1600 and
E5-2600 v3 Product Families1,2,4
Integrated Stackup Height From Top of Board to Top of ILM
Stud (Dimension A)
4.678 (+0.367)/(-0.231mm )
Integrated Stackup Height From Top of Board to Top of IHS
Load Lip (Dimension B)
6.581±0.289
Integrated Stackup Height From Top of Board to Top of IHS
(Dimension C)
8.481±0.279
Notes: 1. Tolerance Stackus are a Root Sum of Squares (RSS) of all components in stack calculation using
mother board surface as the reference point
2. Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Stackup targets are inclusive
of all package sizes (large and small)
3. All packages are compatible with reference retention solutions and will meet mechanical
specifications
Figure 26.
Integrated Stack Up Height
Note:
ILM components removed for clarity
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The table below provides the available surface dimensions for cooling the processor
when fully seated in LGA2011-3 socket. This value is the X and Y dimensions for the
flat top of the IHS.
Table 19.
Available Cooling Area for Large and Small IHS
Available Area
Large package
45.5 mm x 36.74 mm (1.791 in x 1.446 in)
Small package
40.5 mm x 36.74 mm (1.594 in x 1.446 in)
Figure 27.
Available Cooling Area for Top of Large and Small IHS
5.5.2
Processor Heatsink Mechanical Targets
Table 20.
Heatsink Mechanical Targets
Parameter
Min
Heatsink Mass (includes
retention)
Heatsink Applied Static
Compressive Load
222 N (50 lbf)
Heatsink Applied Dynamic only
Compressive load
Max
Notes
600 g (1.32 lbm)
3
400 N (90 lbf)
1,2
445 N (100 lbf)
1,4,5
Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the
processor top surface (IHS).
2. This is the minimum and maximum static force that can be applied by the heatsink retention to
the processor top surface (IHS).
3. This specification prevents excessive baseboard deflection during dynamic events.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
5. An experimentally validated test condition used a heatsink mass of 1.32 lbm (600g) with 25 G
acceleration measured on a shock table with a dynamic amplification factor of 3. This
specification can have flexibility in specific values, but the ultimate product of mass times
acceleration should not exceed this validated dynamic load (1.32 lbm x 25 G x 3= 100 lbf).
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5.6
Heatsink Mechanical and Structural Considerations
An attachment mechanism must be designed to support the heatsink because there
are no features on the socket on which to directly attach a heatsink. In addition to
holding the heatsink in place on top of the IHS, this mechanism plays a significant role
in the performance of the system, in particular:
•
Ensuring thermal performance of the TIM applied between the IHS and the
heatsink. TIMs, especially those based on phase change materials, are very
sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Designs should consider the possible decrease in applied pressure over
time due to potential structural relaxation in enabled components.
•
Ensuring system electrical, thermal, and structural integrity under shock and
vibration events, particularly the socket solder joints. The mechanical
requirements of the attachment mechanism depend on the weight of the heatsink
and the level of shock and vibration that the system must support. The overall
structural design of the baseboard and system must be considered when designing
the heatsink attachment mechanism. Their design should provide a means for
protecting socket solder joints, as well as preventing package pullout from the
socket.
Please note that the load applied by the attachment mechanism must comply with the
processor mechanical specifications, along with the dynamic load added by the
mechanical shock and vibration requirements, as discussed in Package Loading
Specifications on page 63.
A potential mechanical solution for heavy heatsinks is the use of a supporting
mechanism such as a backer plate or the utilization of a direct attachment of the
heatsink to the chassis pan. In these cases, the strength of the supporting component
can be utilized rather than solely relying on the baseboard strength. In addition to the
general guidelines given above, contact with the baseboard surfaces should be
minimized during installation in order to avoid any damage to the baseboard.
5.7
Intel Reference Design Heat Sink
Intel has several reference heat sinks for the Grantley platform. This section details
the design targets and performance of each. These heat sinks are also productized as
part of Intel's Boxed Processors retail program (product codes shown in parentheses).
For more information please goto Boxed Processor Specifications on page 67.
Below are the 1U Square and 1U Narrow heatsinks (STS200P and STS200PNRW
respectively).
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Figure 28.
1U Form Factor Heat Sinks
Below are the 2U Square active and passive heatsinks (STS200C).
Figure 29.
2U Form Factor Heat Sinks
Below is the Tower Active heatsink.
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Figure 30.
Workstation Form Factor Heat Sink
Heat Sink Performance
The graphs below show mean thermal resistance (ΨCA) and pressure drop (ΔP) as a
function of airflow. Best-fit equations are also provided. The sample calculations
match the boundary conditions given in the Processor Boundary Conditions for
Shadowed and Spread Core Layouts on page 47.
5.7.1
2U Square Heatsink Performance
The following performance curves are based on the Intel® Xeon® processor E5-1600
and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV).
Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note
for details.
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•
ΨCA(mean), µ = 0.127 + (1.3901)*(CFM)-0.9862 (°C/W). This is based on Lukeville
TTV
•
ΨCA(mean), µ = 0.134 + (1.3901)*(CFM)-0.9862 (°C/W). This is based on
Looneyville TTV
•
ΨCA(variance), σ = 0.0062 (°C/W)
•
ΔP = (6.91E-05)*(CFM)2 + (3.50E-3)*(CFM) (in. H2O)
Sample calculation when airflow = 26 CFM
•
•
•
5.7.2
ΨCA Based on Lukeville TTV
—
ΨCA(µ) = 0.127 + (1.3901)*(26)-0.9862 = 0.183 (°C/W)
—
ΨCA(µ + 3σ) = 0.183 + 3 * (0.0062) = 0.202 (°C/W)
ΨCA Based on Looneyville TTV
—
ΨCA(µ) = 0.134 + (1.3901)*(26)-0.9862 = 0.190 (°C/W)
—
ΨCA(µ + 3σ) = 0.190 + 3 * (0.0062) = 0.209 (°C/W)
ΔP = (6.91E-05)*(26)2 + (3.50E-3)*(26) = 0.138 (in. H2O)
1U Square Heatsink Performance
for details.
•
Lukeville TTV
•
Looneyville TTV
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•
•
ΔP = (2.41E-04)*(CFM)2 + (2.15E-02)*(CFM) (in. H2O)
Sample calculation when airflow = 15.2 CFM.
•
•
•
5.7.3
—
ΨCA(µ) = 0.147 + (1.60914)*(15.2)-1.03664 = 0.243 (°C/W)
—
ΨCA(µ + 3σ) = 0.243 + 3 (0.0024) = 0.250 (°C/W)
—
ΨCA(µ) = 0.154 + (1.60914)*(15.2)-1.03664 = 0.250 (°C/W)
—
ΨCA(µ + 3σ) = 0.250 + 3 (0.0024) = 0.257 (°C/W)
ΔP = (2.41E-04)*(15.2)2 + (2.15E-02)*(15.2) = 0.382 (in. H2O)
1U Narrow Heatsink Performance
for details.
•
TTV
•
ΨCA(mean), µ = 0.158 + (1.254)*(CFM)-0.874 (°C/W). This is based on Looneyville
TTV
•
•
ΔP = (5.12E-04)*(CFM)2 + (1.76E-02)*(CFM) (in. H2O)
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•
•
•
5.7.4
—
ΨCA(µ) =0.151 + (1.254)*(10.2)-0.874 = 0.316 (°C/W)
—
ΨCA(µ + 3σ) = 0.316 + 3 (0.0056) = 0.333 (°C/W)
—
ΨCA(µ) =0.158 + (1.254)*(10.2)-0.874 = 0.323 (°C/W)
—
ΨCA(µ + 3σ) = 0.323 + 3 (0.0056) = 0.340 (°C/W)
ΔP = (5.12E-04)*(10.2)2 + (1.76E-02)*(10.2) = 0.233 (in. H2O)
Workstation Tower Active Heatsink Performance
for details.
•
TTV
•
ΨCA(mean), µ = 0.109 + (1.559)*(CFM)-1.011 (°C/W). This is based on Looneyville
TTV
•
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•
•
5.7.5
—
ΨCA(µ) =0.102 + (1.559)*(23.2)-1.011 = 0.167 (°C/W)
—
ΨCA(µ + 3σ) = 0.167 + 3 (0.0101) = 0.197 (°C/W)
—
ΨCA(µ) =0.109 + (1.254)*(23.2-0.874 = 0.174 (°C/W)
—
ΨCA(µ + 3σ) = 0.174 + 3 (0.0101) = 0.204 (°C/W)
Mechanical Load Range
Intel's reference heat sinks are thermally validated for the load range described in the
Processor Heatsink Mechanical Targets on page 54.
5.7.6
Thermal Interface Material (TIM)
Honeywell PCM45F material was chosen as the interface material for analyzing
boundary conditions and processor specifications. The recommended minimum
activation load for PCM45F is ~15 PSI [103 kPA]. Meeting the minimum heat sink load
targets described in Processor Heatsink Mechanical Targets on page 54 ensures that
this is accomplished. The largest package has a usable area of ~ 2.6 in2 which
translates to a pressure of 19 PSI [131 kPA] at minimum load of 50 lbf [222 N].
Please refer to Thermal Interface Material (TIM) on page 68 which outlines the TIM
for Boxed Heat Sinks which may be different.
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Processor Mechanical
Specifications
6.0
Processor Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that
interfaces with the baseboard via an LGA2011-3 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Diagram below shows a
sketch of the processor package components and how they are assembled together.
The package components shown below include the following:
1.
Integrated Heat Spreader (IHS)
2.
3.
Processor core (die)
4.
Package substrate
5.
Capacitors
Figure 31.
Processor Package Assembly Sketch
Notes:
•
Socket and baseboard are included for reference and are not part of processor
package.
•
Processor package land count may be greater than socket contact count
6.1
Package Size
The processor has two different form factors Small and Large. Both form factors are
compatible with socket 2011-3 (R3) and the reference ILMs. Size of IHS and
dimensions of package substrate vary between the two form factors. For detailed
drawings see Mechanical Drawings on page 78. For Sku specific identification of
package for factors see Processor Thermal Specifications on page 36. All Low Core
Count (LCC) and Mid Core Count (MCC) SKUs are Intel® Xeon® processor E5-1600
and E5-2600 v3 product families Small form factor. All High Core Count (HCC) SKUs
are Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large form
factor.
Substrate X-Y geometries for each package are:
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•
Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small: 52.5mm
x 45mm
•
Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large: 52.5mm
x 51mm
Figure 32.
Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product
families Small Form Factor
Figure 33.
Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product
families Large Form Factor
6.2
Package Loading Specifications
The following table provides load specifications for the processor package. These
maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The processor substrate should not be used as a mechanical
reference or load bearing surface for thermal solutions.
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Specifications
Table 21.
Processor Loading Specifications
Parameter
Maximum
Static Compressive Load
1068 N (240 lbf)
This is the maximum static force that can be applied by the
heatsink and Independent Loading Mechanism (ILM).
Dynamic Load
540 N (121 lbf)
Dynamic loading is defined as an 11 ms duration average load
superimposed on the static load requirement. This load will be
a function of the geometry and mass of the enabling
components used.
Note: •
6.3
Notes
These specifications apply to uniform compressive loading in a direction normal to the processor
IHS.
Processor Mass Specification
The typical mass of the processor is currently 45 grams. This mass [weight] includes
all the components that are included in the package.
6.4
Processor Materials
The table below lists some of the package components and associated materials.
Table 22.
Processor Materials
Component
6.5
Material
Integrated heat Spreader
Nickel Plated Copper
Substrate
Halogen Free, Fiber Reinforced Resin
Substrate lands
Gold Plated Copper
Processor Markings
Labeling locations and information are shown for Intel® Xeon® processor v3 product
families Small and Large packages in the diagrams below.
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Figure 34.
Small Package Labeling
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Specifications
Figure 35.
Large Package Labeling
6.6
Package Handling Guidelines
The processor can be inserted into and removed from a socket 15 times. The following
table includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 23.
Load Limits for Package Handling
Parameter
Maximum Recommended
Shear
356 N (80 lbf)
Tensile
156 N (35 lbf)
Torque
3.6 N-m (31.5 in-lbf)
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Families
7.0
Boxed Processor Specifications
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Intel®Xeon® processor
E5-1600 and E5-2600 v3 product families will be offered as Intel boxed processors.
Thermal solutions, however, will be sold separately.
7.1
Boxed Processor Thermal Solutions
7.1.1
Available Boxed Thermal Solution Configurations
Intel will offer three different Boxed Heat Sink solutions to support LGA2011-3 Boxed
Processors
1. Boxed Intel Thermal Solution STS200C (Order Code BXSTS200C): A Passive /
Active Combination Heat Sink Solution that is intended for processors with a 160W
TDP or lower in a pedestal or 145W in 2U+ chassis with appropriate ducting.
2. Boxed Intel Thermal Solution STS200P (Order Code BXSTS100P): A 25.5 mm Tall
Passive Heat Sink Solution that is intended for processors with a 135W TDP or
lower in 1U, or 2U chassis with appropriate ducting. This heat sink is compatible
with the square integrated load mechanism (Square ILM). Check with Blade
manufacturer for compatibility.
3. Boxed Intel Thermal Solution STS200PNRW (Order Code BXSTS200PNRW): A 25.5
mm Tall Passive Heat Sink Solution that is intended for processors with a 135W
TDP or lower in 1U, or 2U chassis with appropriate ducting. This heat sink is
compatible with the narrow integrated load mechanism (Narrow ILM). Check with
Blade manufacturer for compatibility.
7.1.2
Intel® Thermal Solution STS200C (Passive/Active Combination
Heat Sink Solution)
The STS200C, based on a 2U passive heat sink with a removable fan, is intended for a
160W TDP or lower in active configuration and 145W TDP in passive configuration.
This heat pipe-based solution is intended to be used as either a passive heat sink in a
2U or larger chassis, or as an active heat sink for pedestal chassis. Although the active
combination solution with the fan installed mechanically fits into a 2U keepout, its use
has not been validated in that configuration. The active fan configuration is primarily
designed to be used in a pedestal chassis where sufficient air inlet space is present.
The STS200C with the fan removed, as with any passive thermal solution, will require
the use of chassis ducting and is targeted for use in rack mount or ducted-pedestal
servers. The recommended retention for these heat sinks is the Square ILM. Refer to
Intel® ILM Reference Designs on page 28 for more info.
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Boxed Processor
Specifications
Figure 36.
STS200C Active / Passive Combination Heat Sink (with Removable Fan)
7.1.3
Intel® Thermal Solution STS200P and STS200PNRW (Boxed
25.5 mm Tall Passive Heat Sink Solutions)
The STS200P and STS200PNRW are available for use with boxed processors that have
a 135W TDP and lower. These 25.5 mm tall passive solutions are designed to be used
in SSI Blades, 1U, and 2U chassis where ducting is present. The use of a 25.5 mm tall
heatsink in a 2U chassis is recommended to achieve a lower heatsink TLA and more
flexibility in system design optimization. The recommended retention for the STS200P
is the Square ILM. The recommended retention for the STS200PNRW is the Narrow
ILM. Refer to Intel® ILM Reference Designs on page 28 for more info.
Figure 37.
STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks
7.1.4
These heat sinks will come pre-applied with Dow Corning TC-1996. Please consult
your Intel representative or Dow Corning for more information.
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7.2
Boxed Processor Cooling Requirements
Meeting the processor's temperature specifications is a function of the thermal design
of the entire system. The processor temperature specifications are found in Processor
Thermal Specifications on page 36 of this document. Meeting the processor's
temperature specification is the responsibility of the system integrator.
STS200C (Passive/Active Combination Heat Sink Solution)
The active configuration should help meet the thermal processor requirements
particularly for pedestal chassis designs. Some form of ducting is recommended to
meet memory cooling and processor TLA temperature requirements. Use of the active
configuration in a 2U rack mount chassis is not recommended, however.
In the passive configuration a chassis duct should be implemented.
The active solution can be used with a 160W TDP or lower. The passive solution can
be used with a 145W TDP or lower.
STS200P and STS200PNRW (25.5 mm Tall Passive Heat Sink Solution)
These passive solutions are intended for use in SSI Blade, 1U or 2U rack
configurations. It is assumed that a chassis duct will be implemented in all
configurations.
These thermal solutions should be used with a 135W TDP or lower.
For a list of processor and thermal solution boundary conditions for common layouts,
such as Ψca, TLA, airflow, flow impedance, please refer to the section on Processor
Boundary Conditions for Shadowed and Spread Core Layouts on page 47.
7.3
Mechanical Specifications
Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones
The boxed heat sink (thermal solution) is sold separately from the boxed processor.
Clearance is required around the thermal solution to ensure unimpeded airflow for
proper cooling. Baseboard keepout zones are shown in Mechanical Drawings on page
78 which detail the physical space requirements for each of the boxed heat sinks.
None of the heat sink solutions exceed a mass of 550 grams. See Package Loading
Specifications on page 63 for processor loading specifications.
Boxed Heat Sink Support with ILM
Baseboards designed for Intel® Xeon® processor E5-1600 and E5-2600 v3 product
families processors should include holes that are aligned with the ILM. Please refer to
Independent Loading Mechanism (ILM) Specifications on page 23 chapter for more
information.
Boxed heat sinks will require a #2 Phillips screwdriver to attach to the ILM. The
screws should be tightened until they no longer turn easily. This is approximately 8
inch-pounds [0.90 N-m]. Exceeding this recommendation may damage the screw or
other components.
Please refer the Grantley Manufacturing Advantage Service Document.
October 2015
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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Boxed Processor
Specifications
7.4
Fan Power Supply [STS200C]
The 4-pin PWM controlled thermal solution is offered to help provide better control
over pedestal chassis acoustics. Fan RPM is modulated through the use of an ASIC
located on the baseboard that sends out a PWM control signal to the 4th pin of the
connector labeled as Control. This thermal solution requires a constant +12 V supplied
to pin 2 of the active thermal solution and does not support variable voltage control or
3‑pin PWM control.
The fan power header on the baseboard must be positioned to allow the fan heat sink
power cable to reach it. The fan power header identification and location must be
documented in the suppliers platform documentation, or on the baseboard itself. The
baseboard fan power header should be positioned within 7 in. [177.8 mm ] from the
center of the processor socket.
Description
Min
Frequency
PWM Control Frequency Range
Description
21,000
Nominal
Frequency
Max
Frequency
25,000
Min
Typical
Steady
28,000
Max
Steady
Unit
Hz
Max
Startup
Unit
+12 V: 12 volt fan power supply
10.8
12
12
13.2
V
IC: Fan Current Draw
N/A
1.25
1.5
2.2
A
SENSE: SENSE frequency
2
2
2
2
Pulses per
fan revolution
70
October 2015
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Families
Figure 38.
Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution
Pin Number
7.5
Signal
Color
1
Ground
Black
2
Power: (+12 V)
Yellow
3
SENSE: 2 pulses per revolution
Green
4
Control: 21 - 28 KHz
Blue
Boxed Processor Contents
The Boxed Processor and Boxed Thermal Solution contents are outlined below.
Boxed Processor
•
Intel®Xeon® processor E5-1600 and E5-2600 v3 product families
•
Installation and warranty manual
•
Intel Inside® Logo
Boxed Thermal Solution
•
Thermal solution assembly
•
Thermal interface material (pre-applied)
•
Installation and warranty manual
October 2015
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71
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Quality Reliability and
Ecological Requirements
8.0
Quality Reliability and Ecological Requirements
8.1
Use Conditions
Intel evaluates reliability performance based on the use conditions (operating
environment) of the end product by using acceleration models.
The use condition environment definitions provided in the tables below are based on
speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can
vary and needs to be comprehended for reliability assessment.
Use
Environment
Speculative
Stress
Condition
Example
Use
Condition
Slow small internal gradient changes due to
external ambient (temperature cycle or
externally heated) Fast, large gradient on/off to
max operating temp. (power cycle or internally
heated including power save features)
Temperature
Cycle
High ambient moisture during low-power state
(operating voltage)
High Operating temperature and short duration
high temperature exposures
Use
Environment
Shipping
and
Handling
Example
7 yr.
Stress
Equivalent
Example
10 yr.
Stress
Equivalent
D T = 35 - 44°C
(solder joint)
550-930 cycles
Temp Cycle
(-25°C to 100°C)
780-1345 cycles
Temp Cycle
(-25°C to 100°C)
THB/HAST
T = 25 -30°C 85%RH
(ambient)
110-220 hrs
at 110°C 85%RH
145-240 hrs
at 110°C 85%RH
Bake
T = 95 - 105°C
(contact)
700 - 2500 hrs
at 125°C
800 - 3300 hrs
at 125°C
Speculative Stress Condition
Mechanical Shock
• System-level
• Unpackaged
• Trapezoidal
• 25 g
• velocity change is based on packaged weight
Product Weight (lbs)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥120
Example Use
Condition
Total of 12 drops
per system:
• 2 drops per
axis
• ± direction
Non-palletized Product Velocity
Change (in/sec)
250
225
205
175
145
125
Change in velocity is based upon a 0.5 coefficient of restitution.
Shipping
and
Random Vibration
• System Level
Total per system:
• 10 minutes per axis
continued...
72
October 2015
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Quality Reliability and Ecological Requirements—Intel® Xeon® Processor E5-1600 / 2600 / 4600
v3 Product Families
Use
Environment
Handling
Speculative Stress Condition
•
•
•
•
•
•
8.2
Unpackaged
5 Hz to 500 Hz
2.20 g RMS random
5 Hz @ 0.001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope
up)
20 Hz to 500 Hz @ 0.01 g2/Hz (flat)
Random control limit tolerance is ± 3 dB
•
Example Use
Condition
3 axes
®
Intel Reference Component Validation
Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.
While component validation shows a reference design is tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
8.2.1
Board Functional Test Sequence
Each test sequence should start with components (baseboard, heatsink assembly, and
so on) that have not previously endured any reliability testing.
Prior to the mechanical shock and vibration test, the units under test should be
preconditioned for 72 hours at 45°C. The purpose is to account for load relaxation
during burn-in stage.
The test sequence should always start with a visual inspection after assembly, and
BIOS/processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/processor/memory test.
8.2.2
Post-Test Pass Criteria Examples
The post-test pass criteria examples are:
1.
No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flat against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible
tilt of the heatsink with respect to the retention hardware.
3.
No signs of physical damage on baseboard surface due to impact of heatsink.
4.
No visible physical damage to the processor package.
5.
Successful BIOS/Processor/memory test of post-test samples.
6.
Thermal compliance testing to demonstrate that the case temperature
specification can be met.
October 2015
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73
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Quality Reliability and
Ecological Requirements
8.2.3
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational baseboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
•
Appropriate system baseboard.
•
Processor and memory.
•
All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors. Intel PC
Diags is an example of software that can be utilized for this test.
8.3
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal and vegetable based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (for example, polyester and some polyethers), plastics
which contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance.
Cadmium shall not be used in the painting or plating of the socket. CFCs and HFCs
shall not be used in manufacturing the socket.
Any plastic component exceeding 25 gm should be recyclable per the European Blue
Angel recycling standards.
Supplier is responsible for complying with industry standards regarding environmental
care as well as with the specific standards required per supplier's region. More
specifically, supplier is responsible for compliance with the European regulations
related to restrictions on the use of Lead and Bromine containing flame-retardants.
Legislation varies by geography, European Union (RoHS/WEEE), China, California, and
so forth.
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS
compliant.
Halogen flame retardant free (HFR-Free) PCB: Current guidance for the socket
pad layout supports FR4 and HFR-Free designs. In future revisions of this document,
Intel will be providing guidance on the mechanical impact to using a HFR-free laminate
in the PCB. This will be limited to workstations.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either (1)
below all applicable substance thresholds as proposed by the EU or (2) an approved/
pending exemption applies.
74
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Quality Reliability and Ecological Requirements—Intel® Xeon® Processor E5-1600 / 2600 / 4600
v3 Product Families
Note:
RoHS implementation details are not fully defined and may change.
October 2015
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75
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Component Suppliers
Appendix A Component Suppliers
Customers can purchase the Intel reference or collaboration thermal solutions from
the suppliers listed in the following table.
Table 24.
®
Intel Reference or Collaboration Thermal Solutions
Item
Intel Part Number
Supplier PN
1U Square Heatsink
Assy with TIM
(91.5x91.5x25.5)
E89205-001
contact supplier
1U Narrow Heatsink
Assy with TIM
(70x106x25.5)
G16539-001
contact supplier
2U Active/Combo
Heatsink Assy w/TIM,
Fan Guard
E62452-004
contact supplier
Delrin eRing retainer
G13624-001
Thermal Interface
Material (TIM)
N/A
Delta Supplier
Contact Info
Foxconn Supplier
Contact Info
Jason Tsai
Delta Products Corp
Portland, Oregon
[email protected]
971-205-7074
Cary Huang 黃寬裕
Foxconn Technology
Co, Inc.
2525 Brockton Dr.,
Suite 300
Austin, TX 78758
Phone: 512-670-2638
[email protected]
om
FT1008-A
ITW Electronics
Business Asia Co., Ltd.
Chak Chakir
[email protected]
m
512-989-7771
PCM45F
Honeywell
Judy Oles
[email protected]
om
+1-509-252-8605
TC-5022
Dow Corning
Ed Benson
e.benson@dowcorning.
com
+1-617-803-6174
Customers can purchase the Intel LGA2011-3 sockets and reference LGA2011-3 ILMs
from the suppliers listed in the following table.
Table 25.
Item
LGA2011-3 Socket and ILM Components
Intel PN
Foxconn (Hon
Hai)
Tyco
Lotes
Amtek
Molex
LGA 2011-3
Socket POR
G64443-001
PE201127-435
5-01H
2201838-1
AZIF0001P004C
NA
NA
LGA 2011-3
Square ILM
G63449-005
PT44L11-4711
2229339-2
AZIF0018P001C
ITLG63449001
105274-2000
LGA 2011-3
Narrow ILM
G43051-006
PT44L12-4711
2229339-1
AZIF0019P001C
ITLG43051002
105274-1000
LGA 2011-3
Backplate
E91834-001
PT44P41-4401
2134440-1
DCA-HSK-182T02
ITLE91834001
105142-7000
Eric Ling
Alex Yeh
Cathy Yang
Alvin Yap
Edmund Poh
Supplier
Contact Info
continued...
76
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Component Suppliers—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Item
Intel PN
October 2015
Order No.: 330786-003
Foxconn (Hon
Hai)
Tyco
Lotes
Amtek
Molex
eric.ling@foxco
nn.com
503-693-3509
x225
[email protected]
m
Tel:
+886-2-21715
280
[email protected]
m.cn
Tel:
+1-86-20-8468
6519 x219
alvinyap@amte
k.com.cn
Tel
+(86)752-2634
562
Cathy Yu
cathy_yu@amt
ek.com.cn
Tel
+(86)752-2616
809
edmund.poh@mol
ex.com
Tel
+1-630-718-5416
77
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings
Appendix B Mechanical Drawings
The following sections contain mechanical drawings of reference retention designs,
processor package geometry and reference heat sink designs.
Table 26.
List of Mechanical Drawings
Package Mechanical Drawing Page 1 on page 81
Large Package Mechanical Drawing Page 2 on page 80
ILM Backplate Keep Out Zone on page 83
ILM Mounting Hole Keep Out Zone on page 84
Narrow ILM Keep Out Zone on page 85
Narrow ILM 3D Keep Out Zone on page 86
ILM Keep Out Zone on page 87
3D Keep Out Zone on page 88
Heat Sink Retaining Ring on page 89
Heat Sink Spring on page 90
1U Narrow Heat Sink Geometry (Page 1) on page 92
1U Narrow Heat Sink Geometry (Page 2) on page 93
1U Narrow Heat Sink Assembly (Page 1) on page 94
1U Narrow Heat Sink Assembly (Page 2) on page 95
1U Square Heat Sink Geometry (Page 1) on page 96
1U Square Heat Sink Assembly (Page 1) on page 98
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Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
B.1
Large Package Mechanical Drawing Page 1
Figure 39.
Intel® Xeon® Processor v3 Product Families Large Package Mechanical
Drawing Page 1
8
H
7
6
5
4
3
2
DWG. NO
SHT.
G57902
REV
1
3
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
H
NOTES:
1
SUBSTRATE MARK AREA.
2
COMPONENT ALLOWABLE AREA.
B
(B )
1
(B )
3
G
1
SEE DETAIL
C
B
SYMBOL
B
B
B
B
FIDUCIAL
C
C
F
C
C
F
G
(B )
4
(B )
2
F
2
G
(C )
1
G
H
(C )
5
H
E
J
H
J
2
J
J
J
M
2
M
3
M
M
M
M
A
D
PIN 1
G
PIN 1
(C )
2
M
SECTION
(C )
3
J
B-B
FIDUCIAL
1
H
MILLIMETERS
1
52.5 0.07
2
51 0.07
3
45 0.3
45 0.1
4
1
47.5 0.1
j
1 C B
2
38.14 0.1
j
1 C A
3
49.2 0.1
5
49.9
2
3.181 0.202
4
5.081 0.208
1
50.24
2
43.18
1
25.12
2
21.59
1
0.881
2
1.016
3
0.508
1
0.231
G
0.125
C
E
j
j
0.2 C B-A
0.15 C G-B
0.553
2
0.104
3
4
0.13
5
0.875 0.04
6
0.574 0.04
D
60 $
7
1
2X M
2X M
0.245 C
3
1
0.125
A
F
1
0.203 C
SEE DETAIL
G
COMMENTS
2X M
IHS LID
M
2
C
7
IHS SEALANT
PACKAGE SUBSTRATE
F
F
SECTION
C
A-A
B
M
4
2
M
TBD C
ALL LGA LANDS
0.021 SOLDER RESIST
DETAIL
SCALE
A
DATE
7
6
5
4
3
DATE
MATERIAL
FINISH
R
TITLE
DATE
APPROVED BY
B
DEPARTMENT
DATE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PACKAGE MECHANICAL DRAWING
THIRD ANGLE PROJECTION
8
6
B
8
A
4
DETAIL
2011X
SCALE 60
C
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DRAWN BY
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ± 0
CHECKED BY
ANGLES ±0.5
October 2015
Order No.: 330786-003
6X RM
5
SIZE
A1
SCALE:
2
DRAWING NUMBER
4
G57902
DO NOT SCALE DRAWING
REV
SHEET
1
OF
3
3
A
1
79
B.2
Large Package Mechanical Drawing Page 2
Figure 40.
Intel® Xeon® Processor v3 Product Families Large Package Mechanical
Drawing Page 2
8
H
7
6
5
4
3
2
DWG. NO
G57902
SHT.
2
REV
G
K
R
3
H
G
1
18.2
0.23 C E A
J
2
9.1
J
F
F
V
T
E
DETAIL
SCALE
E
12.8
8
R
E
6.4
T
D
1
2
C
1
N
2
M
D
0.23 C E A
M
E
SEE DETAIL
C
SEE DETAIL
C
SYMBOL
R
R
V
T
2
DETAIL
SCALE
D
T
D
V
8
V
MILLIMETERS
1
1.09
2
1.09
1
13
2
0.2
1
14
2
0.2
D
D
C
1.5 MAX ALLOWABLE
COMPONENT HEIGHT
C
COMMENTS
B
B
A
DEPARTMENT
R
8
7
6
5
80
4
3
P.O. BOX 58119
2
SIZE
A1
SCALE:
DRAWING NUMBER
4
G57902
REV
SHEET
2
OF
3
3
A
1
October 2015
Order No.: 330786-003
B.3
Package Mechanical Drawing Page 1
Figure 41.
Intel® Xeon® Processor v3 Product Families Small Package Mechanical
Drawing Page 1
8
H
7
6
5
4
3
G63360
SHT.
1
REV
2
H
COMPONENT ALLOWABLE AREA. 1.5 mm MAX ALLOWABLE COMPONENT HEIGHT.
B
D
1
2X C
C
1
3
G
E
G
SEE DETAIL
DF
DD
DB
CY
CV
CT
CP
CM
CK
CH
CF
CD
CB
F
C
BY
BV
2
BT
BP
BM
B
C
BK
BH
2
BF
BD
BB
4
AY
AV
AT
AP
H
2
AM
AK
42X
J
E
3
AH
AF
AD
AB
Y
85X
J
V
T
P
2
M
K
H
F
D
B
FIDUCIAL X3
D
TOP VIEW
(SOME DRAWING GEOMETRY
REMOVED FOR VISUAL CLARITY)
SEE DETAIL
SYMBOL
A
B
C
C
C
SECTION
C
C
A-A
C
G
0.245 C
G
0.203 C
0.125
H
0.125
IHS SEALANT
H
IHS LID
J
PACKAGE SUBSTRATE
J
J
F
F
MILLIMETERS
CN
CL
CJ
CG
CE
CC
CA
BW
BR
BN
BL
BJ
BE
BC
BA
AW
AR
AN
AL
AJ
AG
AE
AC
E
AA
W
U
R
N
L
J
G
E
C
A
1
2
3
4
5
6
7
9 11 13 15 17 19 21 23 25 27 29 31
8 10 12 14 16 18 20 22 24 26 28 30 32
J
1
1 C E
3
1 C D
4
28.5 0.1
1
50.24
2
43.18
1
25.12
2
21.59
1
0.881
2
0.508
3
1.016
2X (M )
1
SYMBOL
6
5
M
M
7
M
M
M
6X R(M )
4
5
M
M
M
MILLIMETERS
1
0.231
2
0.553
D
COMMENTS
C
0.104
3
4
0.13
5
0.875 0.04
6
0.574 0.04
0.15 C E D
60 $
7
6
B
DETAIL B
SCALE 60
MILLIMETERS
PACKAGE A
PACKAGE B
2
3.181 0.202
3.101 # 0.186
4
5.081 0.194
5.001 # 0.177
DESIGNED BY
DRAWN BY
ALL UNTOLERANCED LINEAR
DIMENSIONS ± 0
CHECKED BY
ANGLES ±0.5
-
APPROVED BY
-
MATERIAL
7
M
2X (M )
2
M
0.15 C E D
FIDUCIAL X2
BOTTOM VIEW
SEE NOTES
8
34 36 38 40 42 44 46 48 50 52 54 56 58
1
2X (M )
3
42.5 0.1
38.14 0.1
33 35 37 39 41 43 45 47 49 51 53 55 57
1
H
COMMENTS
2
2
AU
49.2 0.1
1
F
C
G
BG
45 0.07
2
F
DETAIL A
SCALE 12
F
BU
52.5 0.07
1
SYMBOL
A
CU
CR
57X
4
2
G
DC
DA
CW
PIN 1
C
1
B
DE
PIN 1
B
October 2015
Order No.: 330786-003
DWG. NO
NOTES:
1
B
2
4
3
DEPARTMENT
DATE
-
R
-
DATE
TITLE
-
DATE
P.O. BOX 58119
PACKAGE MECHANICAL DRAWING
-
DATE
SIZE
-
A1
FINISH
SEE NOTES
SCALE:
2
DRAWING NUMBER
4
G63360
REV
SHEET
1
OF
3
2
A
1
81
B.4
Package Mechanical Drawing Page 2
Figure 42.
Intel® Xeon® Processor v3 Product Families Small Package Mechanical
Drawing Page 2
8
H
7
6
5
4
3
2
DWG. NO
G63360
SHT.
2
REV
2
H
(18.2 )
2X
G
V
(9.1 )
2
G
DF
DE
DD
DC
DB
DA
CY
CW
CV
CU
CT
CR
CP
CN
CM
CL
CK
CJ
CH
CG
CF
CE
CD
CC
CB
2X
F
V
CA
BY
BW
1
F
BV
BU
BT
BR
BP
BN
BM
BL
BK
BJ
BH
BG
BF
(12.8 )
BE
BD
BC
BB
BA
AY
(6.4 )
AW
AV
AU
AT
AR
2X
T
AP
AN
AM
1
AL
AK
AJ
AH
AG
AF
AE
AD
AC
E
E
AB
Y
V
T
P
M
K
H
F
D
B
AA
W
U
R
N
L
J
G
E
C
A
1
PIN #1
2X
D
K
C
R
T
2
3
4
5
6
7
9 11 13 15 17 19 21 23 25 27 29 31
8 10 12 14 16 18 20 22 24 26 28 30 32
SEE DETAIL
2
33 35 37 39 41 43 45 47 49 51 53 55 57
34 36 38 40 42 44 46 48 50 52 54 56 58
C
SEE DETAIL
F
D
C
G
1
SYMBOL
R
J b K
R
T
J
T
V
V
MILLIMETERS
1
1.09
2
1.09
1
13
2
0.2
1
14
2
0.2
R
COMMENTS
1.5 MAX ALLOWABLE
COMPONENT HEIGHT
D
N
2
C
M b N
M
B
B
F
G
DETAIL D
2X
SCALE 8
DETAIL C
2X
SCALE 8
A
DEPARTMENT
R
-
8
7
6
5
82
4
3
P.O. BOX 58119
2
SIZE
A1
SCALE:
DRAWING NUMBER
4
G63360
REV
SHEET
2
OF
3
2
A
1
October 2015
Order No.: 330786-003
B.5
ILM Backplate Keep Out Zone
Figure 43.
ILM Backplate Keep Out Zone
D
C
B
A
8
7
.196
[4.98 ]
7
6
6
2.854
[72.5 ]
.920
[23.38 ]
.550
[13.98 ]
5
5
3.248
[82.5 ]
ILM RETENTION HOLES
LOCATIONS SHOWN FOR REFERENCE ONLY
FOR DETAILS SEE DOCUMENT G63999
.880
[22.35 ]
8
4
4
NOTES:
3
DWG. NO
SHT.
1
REV
DESCRIPTION
E
1
DATE
9/30/11
APPR
E.B.
E.B.
E.B.
P.O. BOX 58119
REV
E.B.
2/2/12
3/27/12
10/8/11
DIMENSIONS AND
FOR PROPER
TOLERANCES ASSOCIATED
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
R
DESCRIPTION
KOZ, SKT-R3 ILM, BACKPLATE
SIZE DRAWING NUMBER
SCALE: 2:1
1
D KOZ_G63998_SKT-R3_BACKPLATE E
SHEET 1 OF 1
KOZ, SKT-R3 ILM, BACKPLATE
TITLE
PMCI
DEPARTMENT
PARTS LIST
9-27-11
DATE
9-27-11
E.B.
UPDATED NOTES
UPDATED KOZ
PART NUMBER
E.BUDDRIUS
-
2
SEE NOTES
5/1/13
ADDED PART # TO FILE NAME
PRELIMINARY RELEASE
REVISION HISTORY
KOZ_G63998_SKT-R3_BACKPLATE
A
D
C
B
ZONE REV
-
REDUCED KOZ WIDTH BY 5MM
-
6B
E
2C
C6
AND DEFINE ZONES, THEY HAVE NO
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. DIMENSIONS STATED IN INCHES (MILLIMETERS)
WITH THEM.
ITEM NO
E.BUDDRIUS
DESIGNED BY
DRAWN BY
DATE
9/30/11
9-27-11
-
FINISH
SEE NOTES
DATE
E. BUDDRIUS
APPROVED BY
MATERIAL
T. AULAKH
CHECKED BY
DATE
TOP KOZ_G63998_SKT-R3_BACKPLATE
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
STIFFENING PLATE CONTACT ZONE
LEGEND
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF
AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON
THE
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE
HEIGHT
DEFINED BY THAT ZONE.
3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN
ILM AND SOCKET FUNCTION.
4
QTY
DIMENSIONS ARE IN INCHES (MM)
3
D
C
B
A
83
October 2015
Order No.: 330786-003
B.6
ILM Mounting Hole Keep Out Zone
Figure 44.
ILM Mounting Hole Keep Out Zone
D
C
B
A
8
7
SOCKET OUTLINE
FOR REFERENCE ONLY
7
1.811
[46]
.504
[12.8]
6
6
.717
[18.2]
A
2.724
[69.2]
SEE DETAIL
TOP SIDE HOLE DETAIL A
4 PLACES SCALE 15:1
5
5
8
.276
ROUTE KEEPOUT, TOP LAYER
[7.01]
4
.256
[6.5]
OD COPPER WEAR PAD: NON-GROUNDED, SOLDER MASKED
0.0" HEIGHT PACKAGE KEEPOUT
.180
[4.57]
THROUGH ALL ROUTE KEEPOUT
ID COPPER WEAR PAD
.150
NPTH
[3.81]
4
QTY
3
NOTES:
DWG. NO
KOZ_G63999_SKT-R3_MTG-HOLES
SHT.
1
REV
E
REVISION HISTORY
DESCRIPTION
PRELIMINARY RELEASE
REV
A
ZONE
C
MODIFIED KOZ HOLE SIZES
D
B
-
A5
B4
C7,A5
E
UPDATED HOLE PATTERN AND KEEP-OUT AREAS
ADDED "TOP LAYER" TO RKO DIMENSION
CORRECTED SOCKET KEYING, NO KOZ CHANGES
B6
WITH THEM.
FOR ADDITIONAL DETAILS.
E.BUDDRIUS
5
R
4
1
E.B.
E.B.
APPR
E.B.
REV
E.B.
2/2/12
9/27/11
DATE
3/28/12
E.B.
10/7/11
8/6/12
DIMENSIONS AND
FOR PROPER
HEIGHT.
P.O. BOX 58119
DESCRIPTION
SIZE DRAWING NUMBER
SCALE: 3:1
1
D KOZ_G63999_SKT-R3_MTG-HOLES E
SHEET 1 OF 1
KOZ, SKT-R3 ILM, MTG HOLES
TITLE
PMCI
DEPARTMENT
PARTS LIST
9-27-11
DATE
9-27-11
-
2
SEE NOTES
6
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
THE
HEIGHT
DEFINED BY THAT ZONE AFTER REFLOW.
4
5
SEE NOTE
ASSUMES PLACEMENT OF A 0805 CAPACITOR WITH DIMENSIONS:
- CAP NOMINAL HEIGHT = 1.25MM (0.049")
- COMPONENT MAX MATERIAL CONDITION HEIGHT NOT TO EXCEED 1.50MM.
5 ASSUMING A GENERIC A MAXIMUM COMPONENT HEIGHT ZONE.
CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
- COMPONENT NOMINAL HEIGHT
- COMPONENT TOLERANCES
- COMPONENT PLACEMENT TILT
- SOLDER REFLOW THICKNESS
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THIS MAXIMUM COMPONENT
6
LEGEND
4
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT
ZONE 2:
1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW
1.50 MM MAX (MMC) COMPONENT HEIGHT BEFORE REFLOW
ZONE 3:
NO ROUTE ZONE THROUGH ALL LAYERS
ZONE 4:
NO ROUTE ZONE
PART NUMBER
E.BUDDRIUS
DESIGNED BY
DRAWN BY
DATE
9/30/11
9-27-11
-
FINISH
SEE NOTES
DATE
E. BUDDRIUS
APPROVED BY
MATERIAL
T. AULAKH
CHECKED BY
DATE
TOP KOZ_G63999_SKT-R3_MTG-HOLES KOZ, SKT-R3 ILM, MTG HOLES
ITEM NO
TOLERANCES:
3
D
C
B
A
October 2015
Order No.: 330786-003
84
B.7
Narrow ILM Keep Out Zone
Figure 45.
Narrow ILM Keep Out Zone
D
C
B
A
8
(4.169 )
[105.9]
3.701
[94]
1.299
[33]
7
7
7
6
3.150
[80]
2.205
[56]
3.091
[78.5]
(1.542 )
[39.16]
SOCKET OUTLINE FOR
REFERENCE ONLY
FOR SOCKET CAVITY
COMPONENT DETAILS
SEE DOCUMENT G63999
4X 115.8
ILM RETENTION HOLES
FOR DETAILS SEE
DOCUMENT G63999
4X R.234
[5.95]
THERMAL RETENTION MOUNTING HOLE
LOCATIONS SHOWN FOR REFERENCE ONLY,
NO THROUGH HOLES ARE REQUIRED IN PCB
6
7
5
5
.984
[25]
4X 18.6
8
3.346
[85]
3.406
[86.5]
4
4
NOTES:
3
SHT.
1
REV
F
-
ZONE
D
C
B
A
REV
REDUCED DIMENSIONS, UPDATED SOCKET KEYING
REDEFINED DIMENSIONS, NO GEOMETRY CHANGED
UPDATED KOZ
ADDED ASSEMBLY ZONE
PRELIMINARY RELEASE
8/28/12
4/12/12
3/28/12
2/2/12
10/7/11
9/30/11
DATE
E.B.
E.B.
E.B.
E.B.
E.B.
E.B.
APPR
1
-
E
DWG. NO
KOZ_G64001_SKT-R3_ILM-NARROW
-
F
DESCRIPTION
-
REVISION HISTORY
B6
FOR PROPER
DIMENSIONS AND
B6
WITH THEM.
4
5
5
OF FINGER
HEIGHT.
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
THE
HEIGHT
4
5 FOR ADDITIONAL DETAILS.
SEE NOTE
6 THIS DRAWING DEFINES THE ILM COMPONENT MECHANICAL CLEARANCE REQUIREMENT ONLY.
4
P.O. BOX 58119
F
REV
TITLE
PMCI
DEPARTMENT
ZONE 2:
1.40MM MAX COMPONENT HEIGHT
DATE
DATE
1
SHEET 1 OF 1
9-27-11
DATE
9-27-11
ZONE 3:
DESIGNED BY
E.BUDDRIUS
E.BUDDRIUS
DRAWN BY
CHECKED BY
SIZE DRAWING NUMBER
SCALE: 2:1
KOZ_G64001_SKT-R3_ILM-NARROW
KOZ, SKT-R3 ILM, TOPSIDE, NARROW
-
2
SEE NOTES
D
9-27-11
9/30/11
DATE
-
FINISH
T. AULAKH
E. BUDDRIUS
APPROVED BY
MATERIAL
SEE NOTES
R
ZONE 1:
SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
LEGEND
7 ASSEMBLY AND SERVICEABILITY ZONE SHOWN FOR REFERENCE. SIZE, SHAPE AND HEIGHT
OR ASSEMBLY TOOL ACCESS IS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT.
TOLERANCES:
3
D
C
B
A
85
October 2015
Order No.: 330786-003
B.8
Narrow ILM 3D Keep Out Zone
Figure 46.
Narrow ILM 3D Keep Out Zone
D
C
B
A
8
.159
[4.03]
7
2.520
[64]
3.150
[80]
2.362
[60]
7
MB-TOP
6
6
5
5
60.0
125.0
R3.715
[94.35]
R3.016
[76.6]
4
4
1.565
[39.75]
3D HEIGHT RESTRICTIVE
KEEP-OUT-VOLUME ONLY
KOZ'S NOT SHOWN FOR CLARITY
8
A
1.565
[39.75]
3
VOLUMETRIC SWEEPS FOR
LOADPLATE AND LEVERS
DURING OPENING AND CLOSING
R3.119
[79.23]
MB-TOP
DEPARTMENT
3
PMCI
125.0
R
DWG. NO
P.O. BOX 58119
2
G66105
SHT.
4
REV
C
G66105
SIZE DRAWING NUMBER
D
SCALE: 1.000
1
1
SHEET 4 OF 4
C
REV
D
C
B
A
October 2015
Order No.: 330786-003
86
B.9
ILM Keep Out Zone
Figure 47.
Square ILM Keep Out Zone
D
C
B
A
8
(3.622)
[92]
3.150
[80]
7
7
7
2X 140.0
4X 154.3
4X 168.2
6
(3.622)
[92]
3.150
[80]
3.091
[78.5]
SOCKET OUTLINE FOR
REFERENCE ONLY
FOR SOCKET CAVITY
COMPONENT DETAILS
SEE DOCUMENT G63999
ILM RETENTION
HOLES, FOR
DETAILS SEE
DOCUMENT G63999
THERMAL RETENTION MOUNTING HOLE
LOCATIONS SHOWN FOR REFERENCE ONLY,
NO THROUGH HOLES ARE REQUIRED IN PCB
6
5
7
5
2X 1.406
[35.72]
4X R.236
[6]
8
3.346
[85]
3.394
[86.2]
4
4
NOTES:
3
SHT.
REV
D
PRELIMINARY RELEASE
3/28/12
12/29/11
DATE
E.B.
E.B.
APPR
1
REDUCED KOZ SIZE IN THE Y-DIRECTION, INCREASED
SIZE OF ZONE 2, ADDED PART # TO FILE NAME
DWG. NO
1
A
REVISION HISTORY
KOZ_G64000_SKT-R3_ILM-SQUARE
B
REV
C
UPDATED SOCKET KEYING, ADDED 1.6MM ZONE
REDEFINED DIMENSIONS, NO GEOMETRY CHANGED
8/29/12
4/12/12
E.B.
E.B.
DESCRIPTION
-
D
-
ZONE
B6
FOR PROPER
DIMENSIONS AND
B6
WITH THEM.
5
5
P.O. BOX 58119
OF FINGER
HEIGHT.
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
THE
HEIGHT
4
5 FOR ADDITIONAL DETAILS.
SEE NOTE
6 THIS DRAWING DEFINES THE ILM COMPONENT MECHANICAL CLEARANCE REQUIREMENT ONLY.
7 ASSEMBLY AND SERVICEABILITY ZONE SHOWN FOR REFERENCE. SIZE, SHAPE AND HEIGHT
OR ASSEMBLY TOOL ACCESS IS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT.
LEGEND
4
R
1
D
REV
TITLE
PMCI
DEPARTMENT
ZONE 1:
SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
4
DATE
SIZE DRAWING NUMBER
SCALE: 2:1
SHEET 1 OF 1
12/29/11
DATE
12/29/11
ZONE 2:
DESIGNED BY
DATE
-
2
SEE NOTES
KOZ_G64000_SKT-R3_ILM-SQUARE
KOZ, SKT-R3 ILM, TOPSIDE, SQUARE
12/29/11
D
-
FINISH
SEE NOTES
DATE
E. BUDDRIUS
APPROVED BY
MATERIAL
-
CHECKED BY
E.BUDDRIUS
DRAWN BY
E.BUDDRIUS
ZONE 3:
3
D
C
B
A
87
October 2015
Order No.: 330786-003
B.10
3D Keep Out Zone
Figure 48.
Square 3D Keep Out Zone
D
C
B
A
8
.159
[4.03]
7
2.520
[64]
3.622
[92]
.630
[16]
7
MB_TOP
6
6
60.0
5
125.0
5
R3.011
[76.47]
125.0
R3.024
[76.82]
1.565
[39.75]
4
4
A
1.565
[39.75]
MB_TOP
R3.124
[79.36]
3D HEIGHT RESTRICTIVE
KEEP-OUT-VOLUME ONLY
KOZ'S NOT SHOWN FOR CLARITY
8
3
VOLUMETRIC SWPPES FOR
LOADPLATE AND LEVERS
DURING OPENING AND CLOSING
DEPARTMENT
3
PMCI
R
DWG. NO
P.O. BOX 58119
2
G66106
SHT.
4
REV
C
G66106
SIZE DRAWING NUMBER
D
SCALE: 1.000
1
1
SHEET 4 OF 4
C
REV
D
C
B
A
October 2015
Order No.: 330786-003
88
B.11
Heat Sink Retaining Ring
Figure 49.
Heat Sink Retaining Ring
D
C
B
A
8
7
7
4X R0.50
[0.020]
MIN.
[
0.126
3.20
5
6
6
0
-0.12
+0.000
-0.004
]
]
5
5
5
5.20 0.10
[ 0.205 0.003
7.00 0.20
[ 0.276 0.007
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
8
]
MAX.
4
4
0.60 0.04
[ 0.0236 0.0015
]
5
3
IN ACCORDANCE WITH ASME Y14.5-1994
TOLERANCES:
1.0
.X .5 Angles
.XX 0.25
.XXX 0.127
3
SHT.
1
REV
A
REV
O.D. TOLERANCE +/-0.10 TO +/-0.20
SNAP DIAMETER 3.175 TO 3.20, PLUS TOLS
I.D. 5.18 TO 5.20
THICKNESS 0.64 +/-.05 TO 0.60 +/- .04
RELEASE FOR THERMAL TARGET SPECIFICATION
DWG. NO
E75155
ZONE
B
B
REVISION HISTORY
-
DESCRIPTION
C5
B6
C5
B4
NOTES:
06/19/09
DATE
06/19/09
DATE
EASD / PTMI
DEPARTMENT
TITLE
-
APPROVED
1
DATE
07/07/09
06/19/09
5
P.O. BOX 58119
E75155
1
DO NOT SCALE DRAWING SHEET 1 OF 1
SIZE DRAWING NUMBER
SCALE: 1
D
B
REV
ROMLEY/GRANTLEY HS RETAINING RING
R
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
3. MATERIAL: SPRING STEEL OR STAINLESS STEEL
YIELD STRENGTH >= 90000 PSI (620 MPA)
5
DESIGNED BY
MODULUS OF ELASTICITY >= 28000 KSI (193 GPA)
4. FINISH: NI PLATED IF NOT STAINLESS
5 CRITICAL TO FUNCTION DIMENSION
N. ULEN
DATE
N. ULEN
CHECKED BY
06/19/09
DRAWN BY
C. HO
2
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
D
C
B
A
89
October 2015
Order No.: 330786-003
B.12
Heat Sink Spring
Figure 50.
Heat Sink Spring
D
C
B
A
8
SOLID HEIGHT
7
7
+0.30
4
0
+0.011
-0.000
0.217
5.50
[
]
A
A
6
6
FREE HEIGHT
5
5
12.70
4
[0.500]
FREE HEIGHT
8
1.100
[0.0433]
WIRE DIA.
4
SECTION A-A
4
[
I.D. 5.42
+0.08
4
-0.13
+0.003
-0.005
3
]
+0.08
4
-0.13
+0.003
-0.005
0.300
0.213
[
O.D. 7.62
]
TOLERANCES:
1.0
.X .5 Angles
.XX 0.25
.XXX 0.127
3
DWG. NO
E86113
SHT.
1
REV
C
REVISION HISTORY
01/14/10
12/08/09
DATE
11/15/09
DATE
EASD / PTMI
DEPARTMENT
R
P.O. BOX 58119
E86113
1
SIZE DRAWING NUMBER
SCALE: 1
D
C
REV
SPRING, COMPRESSION, PRE-LOAD
TITLE
1
-
SUPPLIER FEEDBACK
APPROVED
ALL SPRING SPECIFICATIONS UPATED. SEE NOTE 3.
DATE
UPDATED SPRING STIFFNESS AND COIL INFO
11/15/09
4
11/15/09
A
DESCRIPTION
B
REV
C
-
ZONE
NOTE 3
NOTES:
DESIGNED BY
3. SPRING RATE: K=15.80 +/- 1.5 N/MM [K=90.2 +/- 9.0 LBF/IN]
FREE HEIGHT: 12.7 MM [0.500 IN]
SOLID HEIGHT: 5.5 MM [0.217 IN]
WIRE DIAMETER: 1.1 MM [0.043 IN]
TOTAL COILS: 5.0 (ONLY TOTAL COILS SHOWN IN THIS DRAWING)
ACTIVE COILS: 3.0
ENDS: GROUND & CLOSED
TURN: LEFT HAND (AS SHOWN IN VIEWS)
MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522
FINISH: ZINC PLATED
OTHER GEOMETRY: PER THIS DRAWING
N. ULEN
DATE
N. ULEN
CHECKED BY
11/16/09
DRAWN BY
D. LLAPITAN
2
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
D
C
B
A
October 2015
Order No.: 330786-003
90
B.13
Heat Sink Spring Cup
Figure 51.
Heat Sink Spring Cup
D
C
B
A
8
1.000
[ 0.0394 ]
0.000
[ 0.0000 ]
4.500
[ 0.1772 ]
A
A
7
7
6
6
5
5
5.50
[ 0.217 ]
4.50
[ 0.177 ]
0.000
[ 0.000 ]
4
8
4
+0.06
0
+0.002
-0.000
0.213
4
4
+0.13
0
+0.005
-0.000
0.313
+0.13
0
+0.005
-0.000
0.411
10.45
[
[
7.95
[
5.40
4
+0.002
-0.000
+0.06
0
0.372
9.45
[
SECTION A-A
4
]
]
]
]
3
0.5 x 45 TYP.
TOLERANCES:
1.0
.X .5 Angles
.XX 0.25
.XXX 0.127
3
SHT.
ROLLED PART TO -002
REMOVED SKIRT AND MADE SHORTER
INITIAL SUPPLIER RELEASE
DWG. NO
E97837
A
1
REV
B
REVISION HISTORY
B
REV
DESCRIPTION
-
ZONE
NOTES:
DESIGNED BY
5/5/10
DATE
5/5/10
DATE
TITLE
SCALE: 1
R
1
-
APPROVED
B
DATE
1
REV
5/5/10
8/12/10
P.O. BOX 58119
E97837
SIZE DRAWING NUMBER
D
CUP, SPRING RETENTION
EASD / PTMI
DEPARTMENT
3. MATERIAL: SUS301, 304, 430
N. ULEN
DATE
N. ULEN
CHECKED BY
5/5/10
DRAWN BY
D. LLAPITAN
2
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
D
C
B
A
91
October 2015
Order No.: 330786-003
B.14
1U Narrow Heat Sink Geometry (Page 1)
Figure 52.
D
C
B
A
8
0
-0.25
+0.000
-0.009
4.173
106.00
[
SEE DETAIL A
]
C
7
7
[
+1.00
0
+0.039
-0.000
0.538
0
-0.25
+0.000
-0.009
]
]
TOP VIEW
2.756
70.00
[
4X 13.66
6
6
25.50 MAX.
[1.00]
[
+1.00
0
+0.039
-0.000
]
AIRFLOW DIRECTION
0.472
4X 12.00
8
5
46x 1.32
[0.052]
47x 21.00
[0.827]
47x 0.20
[0.008]
5
DETAIL A
SCALE 6.000
4
4
3
TOLERANCES:
1.0
.X .5 Angles
.XX 0.25
.XXX 0.127
3
A
REV
DWG. NO
-
ZONE
NOTES:
SHT.
DESCRIPTION
1
REV
A
REVISION HISTORY
E95465
RELEASE FOR SUPPLIER FEEDBACK
DATE
03/23/10
DATE
R
-
APPROVED
1
DATE
A
REV
03/23/10
P.O. BOX 58119
1
E95465
ROMLEY/GRANTLEY 1U NARROW
HS GEOMETRY
SCALE: 1
SIZE DRAWING NUMBER
D
TITLE
EASD / PTMI
DEPARTMENT
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. PRIMARY DIMENSIONS STATED IN MILLIMETERS,
CRITICAL TO FUNCTION DIMENSION.
3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
4. BASE: COPPER, K=380 W/M-K MIN
FINS: QTY 47X 0.2 MM, ALUMINUM, K=220 W/M-K MIN
6. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER MACHINING AND FIN ASSEMBLY.
7. LOCAL FLATNESS ZONE .076 MM [0.003"] CENTERED ON
HEAT SINK BASE.
8. MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE
OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY.
OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.
9 CRITICAL TO FUNCTION DIMENSION.
03/23/10
DATE
DESIGNED BY
03/23/10
N. ULEN
CHECKED BY
-
N. ULEN
C. HO
DRAWN BY
-
2
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
D
C
B
A
October 2015
Order No.: 330786-003
92
B.15
Figure 53.
D
C
B
A
8
56.00
[2.205]
9
0
-0.06
+0.000
-0.002
0.368
9.35
[
]
A
A B C
38.00±0.50
[1.496±0.019]
0.10 [0.003]
9
7
7
SECTION A-A
38.00±0.50
[1.496±0.019]
94.00
[3.701]
9
6
6
5
SEE DETAIL B
0.077 [0.0030]
5
AIRFLOW DIRECTION
BOTTOM VIEW
FLATNESS ZONE,
SEE NOTE 7
A
3.0 X 45 CHAMFER
ALL FINS
AIRFLOW DIRECTION
TOP VIEW
8
4
4
3
DEPARTMENT
3
PTMI
R
DWG. NO
DETAIL B
SCALE 6.000
P.O. BOX 58119
2
E95465
SHT.
2
REV
A
4.50 0.13
[ 0.177 0.005 ]
9
BASE THICKNESS
E95465
1
1
SIZE DRAWING NUMBER
D
SCALE: 1.500
A
REV
D
C
B
A
93
October 2015
Order No.: 330786-003
B.16
1U Narrow Heat Sink Assembly (Page 1)
Figure 54.
D
C
B
A
8
7
7
5
6
6
1
4
2
5
3
8
5
5
4
4
DWG. NO
A
REV
SHT.
DESCRIPTION
1
REV
A
REVISION HISTORY
E95474
RELEASE FOR SUPPLIER FEEDBACK
4
5
E86113-001
E86111-001
E75155-001
ROMLEY/GRANTLEY 1U NARROW HS GEOMETRY
CUP, SPRING RETENTION
SPRING, COMPRESSION, PRELOADED
ROMLEY/GRANTLEY HS SCREW, M4 X 0.7
3
-
4
3
-
APPROVED
1
DATE
A
REV
03/23/10
INSTALL E-RING SO THAT BURR/PUNCH DIRECTION/SHARP EDGE
IS AWAY FROM BASE CUP SURFACE
MINIMUM PUSH OUT FORCE = 30 LBF PER CUP.
THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK
OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X
MAGNIFICATION.
PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK.
"RECOMMENDED SCREW TORQUE: 8 IN-LBF"
THIS DRAWING TO BE USED IN CORRELATION WITH
PRIMARY DIMENSIONS STATED IN MILLIMETERS,
ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.
REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR
SOLVENTS AFTER FINAL ASSEMBLY.
PART NUMBER AND TORQUE SPEC MARK.
PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,
EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER
CALLOUT, PLACE THE FOLLOWING TEXT:
NOTES:
ZONE
1.
2.
3.
4.
5
6
7
8
4
ROMLEY/GRANTLEY 1U NARROW HS ASSEMBLY
9
4
E86334-001
DESCRIPTION
P.O. BOX 58119
E95465-001
PTMI
DEPARTMENT
TITLE
1
E95474
ROMLEY/GRANTLEY 1U NARROW
HS ASSEMBLY
SCALE: 1.500
SIZE DRAWING NUMBER
D
R
E95474-001
2
SEE NOTES
FINISH
PARTS LIST
2
DATE
1
03/23/10
TOP
DATE
4
PART NUMBER
03/23/10
DATE
DESIGNED BY
03/23/10
N. ULEN
CHECKED BY
-
N. ULEN
C. HO
SEE NOTES
MATERIAL
APPROVED BY DATE
-
DRAWN BY
1
QTY ITEM NO
TOLERANCES:
1.0
.X 0.5 Angles
.XX 0.25
.XXX 0.127
3
D
C
B
A
October 2015
Order No.: 330786-003
94
B.17
Figure 55.
D
C
B
A
8
A
SEE DETAIL A
7
7
SECTION A-A
6
6
SEE DETAIL B
A
8
5
5
4
(4X 8.06
)
[0.317]
SPRING PRELOAD
ASSEMBLY HEIGHT
1
PRESS FIT DETAILS
4
3
5
3
DETAIL B
SCALE 6.000
2
4
DEPARTMENT
3
PTMI
DWG. NO
[
+0.20
-0.25
+0.007
-0.009
8
6 &
E95474
]
1
SHT.
7
2
0.039
A
]
E95474
1
1
SIZE DRAWING NUMBER
SCALE: 1.500
D
REV
+0.13
1.00
0
+0.005
-0.000
[
ASSEMBLY DETAILS
0.059
4X 1.50
2
2
9 E-RING PUNCH DIRECTION
AWAY FROM THIS SURFACE
P.O. BOX 58119
DETAIL A
SCALE 6.000
R
A
REV
D
C
B
A
95
October 2015
Order No.: 330786-003
B.18
1U Square Heat Sink Geometry (Page 1)
Figure 56.
D
C
B
A
8
0
-0.25
+0.000
-0.009
3.602
B
]
C
7
7
[
]
+1.00
4X 13.22
0
+0.039
0.520
-0.000
[
0
-0.25
+0.000
-0.009
3.602
91.50
TOP VIEW
]
6
A
[
]
SEE DETAIL A
AIRFLOW DIRECTION
+1.00
4X 12.00
0
+0.039
0.472
-0.000
6
5
5
21.00 0.25
[ 0.827 0.009
[
91.50
8
]
71X 1.272
[0.0501]
FIN PITCH
9
DETAIL A
SCALE 5.000
4
71X 1.072
[0.0422]
FIN GAP
4
72X 0.200
[0.0079]
FIN THICKNESS
0.500 0.250
[ 0.0197 0.0098 ]
END GAP
BOTH SIDES OF HEATSINK
10
3
TOLERANCES:
1.0
.X .5 Angles
.XX 0.25
.XXX 0.127
3
SHT.
ADDED NOTE 10, CENTER FIN ARRAY
DWG. NO
E97838
A
1
REV
B
REVISION HISTORY
B
REV
DESCRIPTION
-
ZONE
DATE
TITLE
EASD / PTMI
DEPARTMENT
CENTER FIN ARRAY ON HEAT SINK BASE.
5/5/10
DATE
-
APPROVED
1
5/5/10
8/12/10
P.O. BOX 58119
E97838
1
SIZE DRAWING NUMBER
SCALE: 1
D
B
REV
ROMLEY/GRANTLEY 1U HS GEOMETRY
R
THIS DRAWING TO BE USED IN CONJUNCTION WITH
BASE: COPPER, K=380 W/M-K MIN
FINS: QTY 72X 0.2 MM, ALUMINUM, K=220 W/M-K MIN
NA
LOCAL FLATNESS ZONE .077 MM [0.003"] CENTERED ON
HEAT SINK BASE.
MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE
OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY,
OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9
10
DATE
SEE NOTE 8
5/5/10
DATE
DESIGNED BY
5/5/10
N. ULEN
CHECKED BY
-
N. ULEN
D. LLAPITAN
DRAWN BY
-
2
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
D
C
B
A
October 2015
Order No.: 330786-003
96
B.19
Figure 57.
D
C
B
A
8
80.00
[3.150]
9
9
]
A
A B C
0
-0.06
+0.000
-0.002
0.368
9.35
[
0.10 [0.003]
38.00
[1.496]
7
7
SECTION A-A
38.00
[1.496]
80.00
[3.150]
9
6
6
5
SEE DETAIL B
A B
0.077 [0.0030]
FLATNESS ZONE,
SEE NOTE 7
1.00 [0.039]
5
AIRFLOW DIRECTION
BOTTOM VIEW
A
SEE DETAIL D
AIRFLOW DIRECTION
TOP VIEW
8
4
4
3
DEPARTMENT
3
PTMI
DETAIL D
SCALE 6.000
DWG. NO
3.0 [0.118] X 45
ALL FINS
P.O. BOX 58119
DETAIL B
SCALE 6.000
R
2
E97838
SHT.
2
4.50 0.13
[ 0.177 0.005 ]
BASE THICKNESS
REV
9
B
E97838
1
1
SIZE DRAWING NUMBER
D
SCALE: 1.500
B
REV
D
C
B
A
97
October 2015
Order No.: 330786-003
B.20
1U Square Heat Sink Assembly (Page 1)
Figure 58.
D
C
B
A
8
7
7
9
5
6
6
6
4
1
2
5
3
8
5
5
4
4
SHT.
DWG. NO
REV
ROLLED ASSEMBLY TO -002
UPDATED CUP TO -002
UPDATED SCREW TO CLIENT VERSION
ADDED DELRIN SPACER TO ASSEMBLY
1
REV
B
4
4
5
6
E86113-001
E91775-001
E75155-001
G13624-001
ROMLEY/GRANTLEY 1U HS GEOMETRY
CUP, SPRING RETENTION, WITH SKIRT
DELRIN RETAINER/SPACER
3
E97839
A
REVISION HISTORY
ZONE
B
DESCRIPTION
-
MINIMUM PUSH OUT FORCE = 30 LBF PER CUP.
4
3
ROMLEY/GRANTLEY 1U HS ASSEMBLY
DATE
-
APPROVED
1
5/5/10
8/12/10
P.O. BOX 58119
MAGNIFICATION.
PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK.
THIS DRAWING TO BE USED IN CORRELATION WITH
NOTES:
1.
2.
3.
4.
5
6
7
8
9 INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP
EDGE IS AWAY FROM BASE CUP SURFACE.
ALLOWABLE PROTRUSION OF CUP FROM BASE.
4
E97837-002
10
4
E97838-001
R
E97839
1
SIZE DRAWING NUMBER
SCALE: 1.500
D
B
REV
TITLE
PTMI
DEPARTMENT
DESCRIPTION
E97839-002
2
SEE NOTES
FINISH
PARTS LIST
2
DATE
1
5/5/10
TOP
DATE
4
PART NUMBER
5/5/10
DATE
DESIGNED BY
5/5/10
N. ULEN
CHECKED BY
-
N. ULEN
D. LLAPITAN
SEE NOTES
MATERIAL
APPROVED BY DATE
-
DRAWN BY
1
QTY ITEM NO
TOLERANCES:
1.0
.X 0.5 Angles
.XX 0.25
.XXX 0.127
3
D
C
B
A
October 2015
Order No.: 330786-003
98
B.21
Figure 59.
D
C
B
A
8
7
SECTION A-A
7
6
A
SEE DETAIL B
6
5
5
(4X 9.36
)
[0.369]
SPRING PRELOAD
ASSEMBLY HEIGHT
A
SEE DETAIL A
8
6
DETAIL B
SCALE 6.000
4
2
SEE DETAIL C
ASSEMBLY DETAILS
PRESS FIT DETAILS
3
5
4
4
3
DETAIL A
SCALE 6.000
1
DEPARTMENT
3
PTMI
DWG. NO
]
10
6 &
[
7
]
E97839
+0.13
0
+0.005
-0.000
0.039
1.00
2
SHT.
8
2
REV
B
DETAIL C
SCALE 30.000
SCALE: 1.500
E97839
1
1
SIZE DRAWING NUMBER
D
E-RING ORIENTATION DETAILS
P.O. BOX 58119
0.00 0.35
[ 0.000 0.013
R
B
REV
D
C
B
A
99
October 2015
Order No.: 330786-003
B.22
Figure 60.
D
C
B
A
8
0
-0.25
+0.000
-0.009
3.602
B
]
C
7
7
[
[
+1.00
0
+0.039
-0.000
]
0.472
4X 12.00
0
-0.25
+0.000
-0.009
TOP VIEW
3.602
91.50
]
6
+1.00
0
+0.039
-0.000
0.472
64.00 MAX.
[2.520]
]
AIRFLOW DIRECTION
[
4X 12.00
6
A
[
91.50
8
5
5
4
4
E95132-002
3
TOP
PART NUMBER
SEE NOTE 4
QTY ITEM NO
TOLERANCES:
1.0
.X .5 Angles
.XX 0.25
.XXX 0.127
3
SHT.
REV
B
VOLUME FOR DIE CAST GEOMETRY
INTEGRATED SPRING/SCREW CUP FEATURE IN TO
CAST GEOMETRY
7/21/10
3/29/10
DATE
-
APPROVED
1
REV
ROLLED PART TO -002
CHANGED SPRING CUP GEOMETRY TO FIT DELRIN SPACER
DWG. NO
1
A
REVISION HISTORY
E95132
ZONE
B
DESCRIPTION
2B2
NOTES:
3/29/10
DATE
DESCRIPTION
EASD / PTMI
DEPARTMENT
PARTS LIST
TITLE
P.O. BOX 58119
E95132
1
SIZE DRAWING NUMBER
SCALE: 1
D
B
REV
ROMLEY/GRANTLEY 2U HS VOLUMETRIC,
DIE CAST BASES ONLY
R
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH
4. HEAT SINK VOLUMETRIC. ALL HEAT SINK GEOMETRY
MUST FIT WITHIN THE SPACE DEFINED BY THIS DRAWING..
7. LOCAL FLATNESS ZONE .076 MM [0.003"] CENTERED ON
HEAT SINK BASE.
8. NO EXPOSED CORNER FINS ALLOWED. CHAMFER ALL
EXPOSED FIN CORNERS TO THE VALUE SPECIFIED.
9 CRITICAL TO FUNCTION DIMENSION.
SEE NOTE 8
DATE
ROMLEY 2U HS VOLUMETRIC
3/29/10
DATE
DESIGNED BY
3/29/10
N. ULEN
CHECKED BY
-
N. ULEN
D. LLAPITAN
DRAWN BY
-
2
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
D
C
B
A
October 2015
Order No.: 330786-003
100
B.23
Figure 61.
D
C
B
A
8
80.00
[3.150]
9
38.00±0.50
[1.496±0.019]
A
7
7
SECTION A-A
38.00±0.50
[1.496±0.019]
80.00
[3.150]
9
6
6
5
SEE DETAIL C
SEE DETAIL B
0.077 [0.0030]
FLATNESS ZONE,
SEE NOTE 7
5
AIRFLOW DIRECTION
BOTTOM VIEW
A
AIRFLOW DIRECTION
TOP VIEW
8
4
4
DETAIL B
SCALE 10.000
3
[
10.450
[0.4114]
9
+0.13
0
+0.005
-0.000
0.313
]
DWG. NO
E95132
SHT.
SCALE: 1.500
2
REV
B
5.50
[ 0.217 ]
1.00
[ 0.039 ]
4.50 0.13
[ 0.177 0.005 ]
BASE THICKNESS
9
1
0.00 ORDINATE BASELINE
[0.000]
E95132
1
SIZE DRAWING NUMBER
A B C
2
D
3.0 [0.118] X 45 TYP
SEE NOTE 8
0.1 [0.00]
P.O. BOX 58119
]
0.5 x 45
ALL AROUND
9
R
+0.13
0
+0.005
-0.000
0.213
5.40
[
7.95
DETAIL C
SCALE 6.000
DEPARTMENT
3
PTMI
B
REV
D
C
B
A
101
October 2015
Order No.: 330786-003
B.24
Figure 62.
D
C
B
A
8
7
7
4
6
6
9
1
3
5
2
8
5
5
4
4
DWG. NO
A
REV
SHT.
DESCRIPTION
1
REV
A
REVISION HISTORY
E95133
RELEASE FOR SUPPLIER FEEDBACK, DIE CAST VER ONLY
E86111-001
E75155-001
ROMLEY/GRANTLEY 2U HS VOLUMETRIC
3
-
ZONE
NOTES:
4
INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP
EDGE IS AWAY FROM BASE CUP SURFACE.
3
DATE
-
APPROVED
1
3/29/10
P.O. BOX 58119
MAGNIFICATION.
1. THIS DRAWING TO BE USED IN CORRELATION WITH
5
8
4
E86113-001
9
4
E95132-001
R
E95133
1
SIZE DRAWING NUMBER
SCALE: 1.500
D
A
REV
ROMLEY/GRANTLEY 2U HS ASSEMBLY,
DIE CAST BASES ONLY
TITLE
PTMI
DEPARTMENT
DESCRIPTION
E95133-001
2
SEE NOTES
FINISH
PARTS LIST
2
DATE
1
3/29/10
TOP
DATE
4
PART NUMBER
3/29/10
DATE
DESIGNED BY
3/29/10
N. ULEN
CHECKED BY
-
N. ULEN
D. LLAPITAN
SEE NOTES
MATERIAL
APPROVED BY DATE
-
DRAWN BY
1
QTY ITEM NO
TOLERANCES:
1.0
.X 0.5 Angles
.XX 0.25
.XXX 0.127
3
D
C
B
A
October 2015
Order No.: 330786-003
102
B.25
Figure 63.
D
C
B
A
8
A
SEE DETAIL A
7
7
SECTION A-A
6
6
A
8
5
5
4
(8.56
)
[0.337]
SPRING PRELOAD
ASSEMBLY HEIGHT
4
2
4
3
3
DEPARTMENT
3
PTMI
R
DWG. NO
E95133
SHT.
2
REV
A
DETAIL A
SCALE 10.000
1
E95133
1
1
SIZE DRAWING NUMBER
SCALE: 1.500
D
2
ASSEMBLY DETAILS
P.O. BOX 58119
A
REV
D
C
B
A
103
October 2015
Order No.: 330786-003

Intel® Xeon® Processor E5 v3 Family Thermal Guide

Transcription

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