HOW TO SUCCEED IN TELIT MODULES INTEGRATIONS Telit @ M2M Platforms Seminar e-mail:
Transcription
HOW TO SUCCEED IN TELIT MODULES INTEGRATIONS Telit @ M2M Platforms Seminar e-mail:
HOW TO SUCCEED IN TELIT MODULES INTEGRATIONS Telit @ M2M Platforms Seminar www.m2m-platforms.com e-mail: [email protected] HOW TO SUCCEED IN TELIT MODULES INTEGRATIONS Overview 1- Technical Support Center presentation 2- How to succeed in Telit module integration 3- How to use our services properl xxxxx 2007/1 2 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Telit Technical Support Center • Three specific dedicated Teams for customer support: • Technical Sales Team • Customer Support Team • After Sales Team xxxxx 2007/1 3 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Telit Technical Support Center • Technical Sales Team members – Manager Technical Sales (Max Lonzar) – 2 Technical Sales Engineer (Stefano Radetich, Daniele Scalembra) • Customer Support Team members – Manager Customer Support (Andrea Ghezzo) – 3 Customer Support Engineer (Alessandro Rossi, Fabio Bernardi, Luca Tomasi) Technical Support Team coordinates the RF and BB Telit R&D engineers to give the best support to system integrator xxxxx 2007/1 4 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Technical Support Team Targets • FAE support • Troubleshooting on customers’ problems (BB & RF) • Design review of customers’ applications (schematics & layout) xxxxx 2007/1 5 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Hardware support requirements To give the customer the best support the following information are required: – Characteristics of application • Field of application, temperature range, low power, SIM design, special environment, type of power supply – Hardware information • All the information concerning schematics and PCB description (files, datasheet) – Global environment • Mechanical connection between Telit module and mother board • Description of Mechanical housing if exists xxxxx 2007/1 6 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Overview 1- Technical Support Team presentation 2- How to succeed in Telit module integration a) Schematic b) Placement c) Layout 3- How to use properly our services xxxxx 2007/1 7 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS SCHEMATIC REVIEW • BB schematic review target is to check : – Power supply features – Compatibility of analog/digital levels between Telit module and customer hardware functions – Speed and timing of Telit peripheral components • RF schematic review target is : – Checking of connections in relation with RF behaviour – VBATT ,Telit/antenna path, characteristics of antenna xxxxx 2007/1 8 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Application review Main points to check : • • • • • • • xxxxx Power supply Serial link SIM ON/OFF Reset Audio RF Interface RF INTERFACE AUDIO INTERFACE POWER SUPPLY SIM CARD SERIAL INTERFACE UART HARDWARE INTERFACE IO/AD 2007/1 9 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Power Supply – The power supply is one of the key issue in the design of a GSM terminal – A weak power supply design could affect phase and frequency error, spurious emission, EMC performances – Voltage range for VBATT : 3.4V – 4.2V. Nominal 3.8V – When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. – Power consumption in idle mode: • 17 mA – Beware to the current provided ! • 2A peak during Tx bursts xxxxx 2007/1 10 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Serial Link • Serial link – Main serial link • RXD,TXD,RTS,CTS,DSR, DTR,DCD,RI – 2.8V pads with clamping diodes (Vforward=0.3V) • Need a RS232 transceiver to comply with RS232 standard (-12V /+12V) DCD-dcd_uart RXD-tx_uart TXD-rx_uart DTR-dtr_uart DTE Telit Main serial link DSR-dsr_uart RTS-rts_uart CTS-cts_uart RI-ri_uart • Flow control signals (RTS-CTS) are mandatory for data transmission xxxxx 2007/1 11 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS SIM Interface – Only 3V SIM supported (new platform 1.8V) – SIM interface voltage level is 2.8V – Add capacitor of 33pF ( on SIM_CLK, SIM_DATA and SIM_RST). It must be closed to SIM holder – Ceramic capacitor placed near VSIM should not exceed 47nF – Length of (Wire + Track) should not exceed 10 cm xxxxx 2007/1 12 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS ON/OFF – To turn on the module the pad ON must be tied low for at least 1 second and then released. – The maximum current that can be drained from the ON pad is 0,1 mA. – Don't use any pull up resistor on the ON line, it is internally pulled up. – The line ON must be connected only in open collector configuration. xxxxx 2007/1 13 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS RESET – Active low – To unconditionally reboot the module, the pad RESET# must be tied low for at least 200 milliseconds and then released. – The maximum current that can be drained from the ON# pad is 0,15 mA. xxxxx 2007/1 14 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS AUDIO • 2 MICROPHONES – 4 lines MIC_MT+, MIC_MT- , MIC_HF+ , MIC_HF– Can be used in differential or single ended mode but differential mode is preferable to have better acoustic performances – Audio filters are present inside the module • 2 SPEAKER – 4 lines EAR_HF+, EAR_HF- , EAR_MT+ , EAR_HF+ xxxxx 2007/1 15 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Overview 1- Technical Support Team presentation 2- How to succeed in Telit module integration a) Schematic b) Placement c) Layout 3- How to use properly our services xxxxx 2007/1 16 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS PCB placement and layout Advises Placement phase is as important as the layout phase : a bad placement lead to a bad layout and inevitably to EMC problems. Placement must be done by function (power upply,SIM,audio,RF,…) Specific constraints must be applied to the placement: – Electrical • E.g. :Power supply part must not be placed too close to the audio one – Mechanical – … xxxxx 2007/1 17 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Overview 1- Technical Support Team presentation 2- How to succeed in Telit module integration a) Schematic b) Placement c) Layout 3- How to use properly our services xxxxx 2007/1 18 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW - BASEBAND & RF • Baseband and radio layout Review targets are : – Check all sensitive signal tracks for all PCB layers • VBATT ,audio tracks, SIM tracks • EMC approach in PCB analysis – Check ground planes • Ground plane present on top close to module • Great number of via in GND layer xxxxx 2007/1 19 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW - BASEBAND & RF • Layout checked by signal type – Power – Digital very fast – Digital fairly fast – Digital slow – Analog (Audio, ADC) – RF • Ground separation between each signal type verified • Recommendation: 4 layers mini with ground plane xxxxx 2007/1 20 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW - POWER SUPPLY • Recommendations – +VBATT 2.5mm typical width. – Ground plane on the Main board is strongly recommended. – Ground separation is recommended between each signal type. – Micro via are used to connect each layer of ground – The use of a good common ground plane is suggested. – The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. xxxxx 2007/1 21 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW - AUDIO • Basic recommendations to have better acoustic performances – The speaker lines must be routed in parallel and shielded , without any wire in between these lines – The microphone lines must be routed in parallel and shielded , without any wire in between these lines – All the filtering components (RLC) must be placed as close as possible to the associated MIC and EAR pins – A specific audio-ground can be used to reduce TDMA noise – The recommended traces width is 0,3mm xxxxx 2007/1 22 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW – ANTENNA PATH • Needs: – Description of the link between the module and the antenna • Connector type • Coaxial cable (type, length) • Environnement impact – Antenna location – Application housing xxxxx 2007/1 23 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW – ANTENNA PATH Four possible ways to connect the antenna (coaxial cable MMCX GSC, soldered, design the antenna directly on PCB [GE modules] ) xxxxx 2007/1 24 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS LAYOUT REVIEW – ANTENNA On GE863 and GE864 it is possible to design the antenna directly on application boar. xxxxx 2007/1 25 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS Overview 1- Technical Support Center presentation 2- How to succeed in Telit module integration 3- How to use our services properl xxxxx 2007/1 26 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS TELIT SERVICES Generally, Most of the time problems in a design are detected too late (after layout phase and sometimes after manufacturing beginning). The sooner we are involved in a customer design , the better the final result will be. Advise to system integrator to perform a schematic review as soon as his schematics are completed. Advise to system integrator to perform a layout review before application manufacturing. HW support experts group is dedicated to answer any HW related questions/open points customers may have during the integration project or during field support. xxxxx 2007/1 27 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS APPROVAL Telit modules are assessed to be conform to the R&TTE Directive as stand-alone product, so if the module is installed in conformance with Telit installation instructions require no further evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement of a R&TTE Directive Notified Body for the final product. In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating the radio module must be assessed against Article 3.2 of the R&TTE Directive. In all cases assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3 requirements. xxxxx 2007/1 28 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS FAMILY PRODUCTS CERTIFICATIONS GE864 • R&TTE / CE GC864 • GCF • FCC GE863-GPS GM862-GPS xxxxx • IC Canada • PTCRB 2007/1 29 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS FAMILY PRODUCT DELTA CERTIFICATION FOR APPLICATION R&TTE / CE DELTA TEST GM862 based GC864 based SAFETY EMC RF SPECTRUM *(IF NEEDED) R&TTE / CE DELTA TEST GE864 based GE863 based SAFETY NO SIM test if : Path from SIM pins to the SIM holder is less than 20cm and not active components are added xxxxx EMC RF SPECTRUM * * i.e. Radiated spurious emissions 2007/1 30 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS INTERNAL TESTS CAPABILITY • RF TEST CAPABILITIES • EMC TEST CAPABILITIES • VALIDATION TEST CAPABILITIES ON APPLICATION PRODUCTS • VALIDATION TEST ON MANUFACTORY PROCESS • VALIDATION TEST ON PRODUCT xxxxx 2007/1 31 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS INTERNAL TESTS FACILITY • 8 METERS ANECHOIC CHAMBER • 3 METERS DISTANCE MEASUREMENT • 30 MHz TO 4 GHz MEASUREMENT • SHIELD ROOM • ACHOUSTIC CHAMBER • PHYSICAL TEST LAB xxxxx 2007/1 32 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS RF TEST CAPABILITIES Conducted RF TEST ( TS 51.10-1 ) Conducted RF spurious emissions ( test cases 12..1.1 – 12.1.2 ) Transmitter Frequency error under multipath/ interference (test cases 13.2 ) Transmitter Frequency error and phase error ( test cases 13.1 ) Transmitter output power ( test cases 13.3 ) Transmitter- Output RF spectrum ( test cases 13.4 ) Receiver Blocking and spurious response ( test cases 14.7.1 ) Radiate RF TEST ( TS 51.10-1 ) Radiated RF spurious emissions ( test cases 12.2.1 - 12.2.2 ) xxxxx 2007/1 33 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS EMC TEST CAPABILITIES EMC Emission test ( EN 301 489-11 EN 301 489-7) • Radiate emission (30MHz-1GHz in Anechoic chamber) - EN 55022 • Conducted emission at AC port (150KHz - 30MHz) - EN 55022 • Conducted emission at DC port (150KHz - 30MHz) - EN 55022 EMC Immunity test ( EN 301 489-1 EN 301 489-7) • Immunity to RF electromagnetic field (80-2000 MHz 3V/m) – EN 61000-4-3 • Immunity to conducted RF disturbance (0.15-80MH) – EN 61000-4-6 • Electrostatic discharge – EN 61000-4-2 • Fast transient - EN 61000-4-4 • Transient and surge – ISO 7637-1/2 • Voltage dips and interruptions - EN 61000-411 • Surges – EN 61000-4-5 xxxxx 2007/1 34 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS VALIDATION TEST CAPABILITIES Radiated power Measurement of the radiated power in free space condition (Measure in anechoic chamber) Radiated Receiver sensitivity Measurement of the receiver static sensitivity in free space conditions (Measure in anechoic chamber) Telit ANECHOIC CHAMBER aligned with TILAB laboratory in TORINO xxxxx 2007/1 35 HOW TO SUCCEED IN TELIT MODULES NTEGRATIONS EXTERNAL TESTS CAPABILITY EXTERNAL LABORATORY USED BY TELIT CETECOM SPAIN ( Malaga WWW.CETECOM.ES ) • EXPERT IN GSM/GPRS TEST CAPABILITY • EXPERT IN SHORT RANGE DEVICE TEST SICOM TEST S.r.l. ( ITALY – Trieste WWW.SICOMTESTING.COM ) • TEST CAPABILITY SHARED WITH DAI TELECOM • FULL SERVICE FOR CERTIFICATION PROCESS ON GSM/GPRS xxxxx 2007/1 36 Join Telit wireless solutions! xxxxx 2007/1 37