How to succeed in Telit Modules integration Telit M2M Seminar M2M Platforms

Transcription

How to succeed in Telit Modules integration
Telit M2M Seminar
7 feb 2008 Helsinki
M2M Platforms
www.m2m-platforms.com
Overview – TTSC presentation
1 -
TTSC Telit Technical Support Teams presentation
2 -
How to succeed in Telit modules’ integration
a) Schematics
b) Placement
c) Layout
3 -
How to use our services properly
M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com
2
TTSC - Teams
Three specific dedicated Teams for customer
support:
Technical Sales Team
Customer Support Team
After Sales Team
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TTSC - Members
Technical Sales Team members:

Manager Technical Sales (Max Lonzar)
2 Technical Sales Engineer (Stefano Radetich, Daniele Scalembra)
Customer Support Team members:

Manager Customer Support (Andrea Ghezzo)
3 Customer Support Engineer (Alessandro Rossi, Fabio Bernardi,
Luca Tomasi)
Technical Support Team coordinates the RF and BB Telit R&D
Engineers to give the best support to system integrator.
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TTSC - Targets
TTSC targets:
FAE (Field Application Engineer) support
Troubleshooting on customers’ problems (Base Band
& Radio Frequency)
Design review of customers’ applications (schematics
& layout)
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Hardware support requirements
To give the customer the best support the following information are
required:
Characteristics of the application - Field of application, temperature
range, low power, SIM design, special environment, type of power
supply
Hardware information - All the information concerning schematics and
PCB description (files, datasheet)
Global environment - Mechanical connection between Telit module
and mother board; description of mechanical housing if exists
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Overview - Schematics
1 -
2 -
How to succeed in Telit module integration
a) Schematics
b) Placement
c) Layout
3 -
How to use properly our services
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Schematics review
BB schematics review target is to check:
Power supply features
Compatibility of analog/digital levels between Telit module and
customer hardware functions
Speed and timing of Telit peripheral components
RF schematics review target is:
Checking of connections in relation with RF behaviour
VBATT ,Telit/antenna path, characteristics of antenna
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Schematics review
Main points to check:

RF
INTERFACE
Power
supply
Serial link
SIM
ON/OFF
Reset
Audio
RF Interface
AUDIO
INTERFACE
POWER
SUPPLY
SIM
CARD
SERIAL
INTERFACE
UART
HARDWARE
INTERFACE
IO/AD
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Power Supply

The power supply is one of the key issue in the design of a
GSM terminal

A weak power supply design could affect phase and frequency
error, spurious emission, EMC performances

Voltage range for VBATT: 3.4V – 4.2V. Nominal 3.8V

When using a switching regulator, a 500kHz or more switching
frequency regulator is preferable because of its smaller inductor
size and its faster transient response.

Power consumption in idle mode: 17 mA

Beware to the current provided:
2A peak during TX bursts
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Serial Link

Serial link (Main serial link)
RXD,TXD,RTS,
CTS,DSR,DTR,
DCD,RI
DCD-dcd_uart
RXD-tx_uart
TXD-rx_uart
DTR-dtr_uart
DTE
DSR-dsr_uart
2.8V pads with clamping
diodes (Vforward=0.3V)
Telit
Main
serial
link
RTS-rts_uart
CTS-cts_uart
RI-ri_uart

Need a RS232 transceiver
to comply with RS232 standard
(-12V /+12V)

Flow control signals (RTS-CTS) are mandatory
for data transmission
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SIM Interface

1.8V - 3V SIM supported
SIM interface voltage level is 2.8V
Add capacitor of 33pF
( on SIM_CLK, SIM_DATA
and SIM_RST).
It must be closed to SIM holder
Ceramic capacitor placed near VSIM
(should not exceed 10nF)
Length of (Wire + Track)
should not exceed 10 cm
10nF
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On/Off
To turn on the module the pad ON must be tied low
for at least 1 second and then released.
The maximum current that can be drained
from the ON pad is 0,1 mA.
Don't use any pull up resistor
on the ON line,
it is internally pulled up.
The line ON
must be connected
only in open collector
configuration.
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Reset
Active low
To unconditionally reboot the module, the pad RESET# must be
tied low for at least 200 milliseconds and then released.
The maximum current that can be drained
from the ON# pad is
0,15 mA.
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Audio
2 Microphones
4 lines MIC_MT+, MIC_MT- , MIC_HF+ , MIC_HF Can be used in differential or single ended mode but differential
mode is preferable to have better acoustic performances
Audio filters are present inside the module
2 Speakers
4 lines EAR_HF+, EAR_HF- , EAR_MT+ , EAR_HF+
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Overview - Placement
1 -
2 -
a) Schematics
b) Placement
c) Layout
3 -
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Overview - Placement
Placement phase is as important as the layout phase:
A bad placement leads to a bad layout and inevitably to EMC
problems.
Placement must be done by function (power supply, SIM,
audio, RF,…)
Specific constraints must be applied to the placement:
Electrical. E.g. :Power supply part must not be placed too close
to the audio one
Mechanical
…
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Overview - Layout
1 -
2 -
a) Schematics
b) Placement
c) Layout
3 -
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Layout review – BB & RF
Base Band and Radio layout review targets are:
Check all sensitive signal tracks for all PCB layer
VBATT ,audio tracks, SIM tracks
EMC approach in PCB analysis
Check ground planes
Ground plane present on top close to module
Great number of via in GND layer
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Layout review – BB & RF
Base Band and Radio layout checked by signal type:
Power
Digital very fast
Digital fairly fast
Digital slow
Analog (Audio, ADC)
RF
Note: ground separation between each signal type verified; 4 layers mini
with ground plane recommended.
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Layout review – Power Supply
Power Supply recommendations:
+VBATT 2.5mm typical width
Ground plane on the Main board is strongly recommended
Ground separation is recommended between each signal type
Micro via are used to connect each layer of ground
The use of a good common ground plane is suggested
The power supply input cables should be kept separate
from noise sensitive lines such as microphone/earphone cables.
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Layout review – Audio
Basic recommendations to have better acoustic performances:
The speaker lines must be routed in parallel and shielded , without
any wire in between these lines
The microphone lines must be routed in parallel and shielded ,
without any wire in between these lines
All the filtering components (RLC) must be placed as close as
possible to the associated MIC and EAR pins
A specific audio-ground can be used to reduce TDMA noise
The recommended traces width is 0,3mm
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Layout review – Antenna Path
Needed:
Description of the link between the module and the antenna
Connector type
Coaxial cable (type, length)
Environment impact:
Antenna location
Application housing
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Four possible ways to connect the antenna (coaxial cable MMCX GSC,
soldered, design the antenna directly on PCB [GE modules].
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On GE863 and GE864 it is possible to design the antenna directly on
application board.
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Overview - Layout
1 -
2 -
a) Schematics
b) Placement
c) Layout
3 -
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Telit services
Generally, most of the time problems in a design are detected too late
(after layout phase and sometimes after manufacturing beginning).
The sooner we are involved in a customer design , the better the
final result will be.
Advise to system integrator to perform a schematic review as soon as
his schematics are completed.
Advise to system integrator to perform a layout review before application
manufacturing. HW support experts group is dedicated to answer any
HW related questions/open points customers may have during the
integration project or during field support.
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Telit services – Approval
Telit modules are assessed to be conform to the R&TTE Directive as
stand-alone product, so if the module is installed in conformance with
Telit installation instructions require no further evaluation under
Article 3.2 of the R&TTE Directive and do not require further
involvement of a R&TTE Directive Notified Body for the final product.
In all other cases, or if the manufacturer of the final product is in doubt
then the equipment integrating the radio module must be assessed
against Article 3.2 of the R&TTE Directive.
In all cases assessment of the final product must be made against the
Essential requirements of the R&TTE Directive Articles 3.1(a) and (b),
safety and EMC respectively, and any relevant Article 3.3 requirements.
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FAMILY PRODUCTS
CERTIFICATIONS
GE864
• R&TTE / CE
GC864
• GCF
• FCC
GE863-GPS
GM862-GPS
• IC Canada
• PTCRB
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FAMILY PRODUCT
DELTA CERTIFICATION
FOR APPLICATION
R&TTE / CE
DELTA TEST
GM862 based
GC864 based
SAFETY
EMC
RF SPECTRUM
*(IF NEEDED)
R&TTE / CE
DELTA TEST
GE864 based
GE863 based
SAFETY
NO SIM test if : Path from SIM pins to the SIM holder is
less than 20cm and not active components are added
EMC
RF SPECTRUM *
* i.e. Radiated spurious emissions
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Telit services – Tests
Tests capabilities:
RF test capabilities
EMC test capabilities
Validation test capabilities on application products
Validation test on manufactory process
Validation test on product
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Internal tests facility:
8 Meters Anechoic chamber
3 Meters distance measurement
30MHz to 4GHz measurement
Shield room
Acoustic chamber
Physical test laboratory
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RF test capabilities:
Conducted RF test (TS 51.10-1)
Conducted RF spurious emissions (test cases 12..1.1 – 12.1.2)
Transmitter frequency error under multipath/ interference (test cases
13.2)
Transmitter frequency error and phase error (test cases 13.1)
Transmitter output power (test cases 13.3)
Transmitter output RF spectrum (test cases 13.4)
Receiver Blocking and spurious response (test cases 14.7.1)
Radiate RF test (TS 51.10-1)
Radiated RF spurious emissions (test cases 12.2.1 - 12.2.2)
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EMC test capabilities:
EMC Emission test ( EN 301 489-11 EN 301 489-7)
Radiate emission (30MHz-1GHz in Anechoic chamber) - EN 55022
Conducted emission at AC port (150KHz - 30MHz) - EN 55022
Conducted emission at DC port (150KHz - 30MHz) - EN 55022
EMC Immunity test ( EN 301 489-1 EN 301 489-7)
Immunity to RF electromagnetic field (80-2000 MHz 3V/m) – EN 61000-4-3
Immunity to conducted RF disturbance (0.15-80MH) – EN 61000-4-6
Electrostatic discharge – EN 61000-4-2
Fast transient - EN 61000-4-4
Transient and surge – ISO 7637-1/2
Voltage dips and interruptions - EN 61000-411
Surges – EN 61000-4-5
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Validation test capabilities:
Radiated power
Measurement of the radiated power in free space condition (Measure
in anechoic chamber)
Radiated Receiver sensitivity
Measurement of the receiver static sensitivity in free space conditions
(Measure in anechoic chamber)
Telit ANECHOIC CHAMBER aligned with TILAB laboratory in
TORINO
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External tests capabilities; external laboratories used by Telit:
CETECOM SPAIN (Malaga, www.cetecom.es)
EXPERT IN GSM/GPRS TEST CAPABILITY
EXPERT IN SHORT RANGE DEVICE TEST
SICOM TEST S.r.l. (ITALY – Trieste, www.sicomtesting.com)
TEST CAPABILITY SHARED WITH DAI TELECO
FULL SERVICE FOR CERTIFICATION PROCESS ON GSM/GPRS
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Join Telit wireless solutions!
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