JAZZFESTIVAL
Transcription
JAZZFESTIVAL
Center Of Reliable Power Electronics (CORPE) - Overview www.corpe.et.aau.dk by professor Frede Blaabjerg [email protected] www.et.aau.dk 1 30-04-2013 Energy Technology Power Electronics: Energy Production – Energy Distribution – Energy Consumption – Energy Control COMMUNICATION 3 REFRIGERATOR Energy Storages WIND TURBINE PRIMARY FUEL SOLAR CELLS TELEVISION DC AC SOLAR ENERGY LIGHT TRANSFORMER HEAT LOADS 3 3 1 -3 3 MOTOR TRANSFORMER POWER STATION PUMP FACTS/CUPS Energy Storages CHP ROBOTICS COMPEN SATOR INDUSTRY FUEL CELLS TRANSPORT TRANSPORT [ FUEL COMBUSTION ENGINE DC AC POWER SUPPLY ac ~ dc = 2 CORPE – achievements Industry collaboration Industry focus System integration Business integration Innovative Product development Research and Development of reliable Power electronics (CORPE) Innovative platform: Research and development of Intelligent power electronics (IEPE) Fundamental technology Devices, and physics University focus 3 CORPE – 2013 Workshop 09:00 – 09:30 Coffee 09:30 – 10:00 Introduction to the day and status on CORPE – by Frede Blaabjerg, Leader CORPE 10:00 – 10:20 Status on IEPE and test facilities– by Stig Munk-Nielsen, Leader IEPE 10:20 – 10:30 Break 10:30 – 11:30 Lifetime modeling of components – Chair: Kjeld Pedersen 10:30-10:40 “Discussion on Arnhenius Law for Capacitor Lifetime Prediction” by Post.Doc Huai Wang, Aalborg University 10:40-10:50 “Dielectric degradation in film capacitors” by PhD Dennis Acton Nielsen, Aalborg University 10:50-11:00 “Modeling and validation of press-pack IGBT models” by PhD Christian Busca, Aalborg University – Vestas Power Programme 11:00-11:30 Debate on how to do life-time modeling and validation of components 11:30 – 12:30 Failure Mechanism – Chair: Vladimir Popok 11:30-11:40 “Experimental study of wire lift-off” by Post.Doc Peter Kjær Kristensen, Aalborg University 11:40-11:50 “Understanding Moisture ingress in product-level electronic enclosures from a diffusion point-of-view” by Jens Peter Krog, Grundfos 4 CORPE – 2013 Workshop 11:50-12:00 “Humidity related problems in power electronics” by PhD, Morten Arnfeldt Hygum, Aalborg University 12:00-12:10 “DLTS on power diodes” by Post Doc Martin Petersen, Aarhus University 12:10-12:30 Debate based on how to describe failure mechanism with different stressors 12:30 – 13:00 Lunch 13:00 – 14:00 Robustness Validation – Chair: Marco Liserre 14:00– 15:00 Application of components and system models incl. simulation– Chair: Paul B. 15:00 13:00-13:20 “Robustness Validation – from Theory to Practice” by Tusitha Abeyasekera, Vestas Wind Systems 13:20-13:35 “Robustness Analysis of PV Inverters” by Alberto Pigazo, University of Cantabria, Spain 13:40-14:00 Debate on robustness validation and its implementation in CORPE Thøgersen 14:00-14:10 “Life time prediction methods for real time field operation” by PhD Pramod Ghimire, Aalborg University 14:10-14:20 “Emerging devices and circuit design” by PhD Nicolae-Cristian Sintamarean, Aalborg University 14:20 -14:30“Reliability and Control Strategies for Wind Turbine Systems”, by PhD Dao Zhou, Aalborg University 14:30-15:00 Debate on models and simulation tools End of day – by Frede Blaabjerg 5 CORPE – Goals Design for Reliability By obtaining high-reliability power electronic systems for use in all fields of electrical applications used both in design and operation where the main drivers are lower development cost, manufacturing cost, efficiency, reliability, predictability, lower operational and maintenance costs during the lifetime. Long term Designed reliability including efficiency and cost Predictive maintenance using prognostic methods Parts per million return rates of sold products An industrial initated Strategic Reseach Center 6 CORPE – Goals Our Benchmarks • Acknowledged center in “Design for Reliability” in power electronics • Moved science significantly in this field • Many companies are using tools and test facilities from Corpe • Corpe is actively taking part of standardization work • Continously run courses for students and industry • Guests are coming to Corpe for research • Established important alliances with research groups in “reliability” globally • “Better” products are based on work from Corpe • Hold one conference on reliability • Strong university-industry collaboration (Ph.D.’s, exchange, facilities) • International collaboration • ….. • Want to be self-running after four years based on industry and projects 7 CORPE – Partners Partners: 8 CORPE – Our approach R&D at Three Different levels System Design Tools Converter Component 9 De Re sign lia Mi bil for ss ity pr ion of n tio g ica rin rif ito n Ve on itio nd ing dM Co nitor an o d a te ler ce ng A c te s ti c t a ti St men uip eq tr o nic s CORPE – Our approach Continous Sampled data Control In 1974, William E. Newell defined power electronics as an emerging technology based on multi-disciplines. De s too ign ls ile Ci rcu its vic De Power Electronics Power Electronics Reliability m ing t n ta t Ro ipme u eq es Ele c r we Po CORPE Approach for Power Electronics Reliability Physics-offailure Component physics Analytical Physics Today, CORPE improves power electronics reliability based on multi-disciplinary approaches. 10 CORPE – Our approach Reliability-Oriented Product Development Process (Source: PV Powered Inc.) Concept · Mission profile · Topology and system architecture · Risk assessment (e.g. new technology, new components) · Existing database Design ? Validation · System level functionality testing · CALT · HALT · MEOST · Robustness validation Release Production · Process control · Process FMEA · Screening testing (e.g. HASS) · · · · Customer usage Condition monitoring Field data Root cause analysis data · Corrective action data (HALT – Highly Accelerated Limit Testing, CATL – Calibrated Accelerated lifetime testing, MEOST – Multi Environment Overstress Testing, FMEA – Failure Mode and Effect Analysis, HASS – Highly Accelerated Stress Screening) How to design for power electronic systems? 11 CORPE – Our approach Design Reliability Approach Initial Design Analysis Concept · Mission profile · Topology and system architecture · Risk assessment (e.g. new technology, new components) · Existing database · Circuit and system · Stress and strength · Failure Mode and Effect Analysis (FMEA) · Critical component list and critical failure mechanisms · Key manufacture process consideration · Multi-domain simulations (e.g. electrical, thermal,mechanical) · Fault tolerant design · Load management design · Virtual prototype · Initial reliability and durability analysis · Robustness analysis Re-design Optimized Design Verification · Prototype building · Accelerated Lifetime Testing (ALT) · Multi Environment Over Stress Testing (MEOST) · Testing data analysis · Degradation analysis · Reliability and durability analysis Validation · System level functionality testing · ALT · Highly Accelerated Limit Testing (HALT) · Robustness validation · · · · · · · · Life cycle cost Reliability Durability (i.e. lifetime) Availability Robustness Power efficiency Power density Control performance Production · Process control · Process FMEA · Screening testing (e.g. Highly Accelerated Stress Screening (HASS)) Release · · · · Customer usage Condition monitoring Field data Root cause analysis data · Corrective action data 12 Reliability Calculation Models Tool Box Data Input I · Mission profile · Component and circuit information · Critical component list and critical failure mechanisms · Stress and strength Input II … · · · · Calculation data Simulation data Testing data Field data Combined Models · Statistical models (e.g. Weibull distribution) · Physical models · Cumulative damage model (e.g. linear) Robustness margins Parameter Estimation · Available data analysis · Parameterization method (e.g. Maximum likelihood method) Output · Reliability (failure rate) · Durability (lifetime) · Robustness (margin) Lifetime Component level · Reliability prediction for each critical failure mechanism · Reliability prediction for each critical component System level · System reliability model · Analysis methods (e.g. block diagram analysis, fault tree analysis) Mean cumulative failure rate (MCF) Curve Center of Reliable Power Electronics 13 CORPE - Organisation •Thorkild Kvisgård, Grundfos • Jørn Landkildehus, Danfoss Power Electronics • Paul B. Thoegersen, KK-Electronic • Philip C. Kjær, Vestas Wind Systems • John K. Pedersen, Aalborg University • Arne Nylandsted, Aarhus University • Kjeld Pedersen, Nano, AAU • Frede Blaabjerg, Center chairman CORPE: Steering Committee Advisory Board • Leo Lorentz, Infinion Technologies, Germany • Dan Kinzer, Fairchild, US • Alex Huang, FREEDM, NCSU, US WP1: Analysis, understandi ng and modeling Tasks Centre Management Management Group WP 2: Life time prediction and design Tasks WP3: Accelerated test and verification Tasks WP4: Design tools Tasks WP5: Real time monitoring and prediction Tasks WP6: Application design Tasks 14 30-04-2013 CORPE – WP1 Analysis, understanding and modeling of failure mechanisms & field load (Assoc. Prof. Vladimir Popok, AAU) I : 2 Y WP1.1 Failure Mechanism in Power Modules, Physics & Nanotechnology, PhD Morten Hygum, WP1.2 Multi-Physics based modeling of power electronic components and circuits, Energy Technology, PhD Rui Wu WP1.3 Wear out failures mapping, Physics & Nanotechnology, PostDocs Peter Kristensen and Tobias Stær Status: 1. The wire lift-off problem is under experimental studies: - method of micro-sectioning and optical characterisation is developed to study wires and interfaces of power modules; - SEM is used to obtain high resolution images of the areas of interest; - electrical characterisation setup is developed to measure current-voltage dependences on diodes and transistors of the power modules. 2. Development of thermal-electrical models for failures in relation to the measurements using IR camera is initiated. 3. The role of environmental effects in failures under the study: -modelling and experiments on thermal diffusion of water vapour in closed boxes; -modelling of water diffusion through walls of closed boxes. Cross-sectional image of wire and substrate interface 15 CORPE – WP2 Life time prediction and design (Prof. Stig Munk-Nielsen, AAU) I : 2 Y WP2.1 A new life time prediction method for power modules (Christian Pedersen), Nano-KP WP2.2 Models of real world stresses on power devices, (Uimin Choi), Energi-SMN WP2.3 Modelling of life time (Student and Post.Doc) MsC long thesis student (Ovidiu Nicolae Faur): Modeling of temperature distribution on IGBT modulers during transient operation MsC student (6 month) Laura Nicola : Rainflow Counting Method, made report Status : WP2.1 Have a model of bond wire and 3 d structure ,done FEM simulations using model (ok) Investigate IGBT modules that have been subjected to accelerated test (on-going) Verify model simulations (need to do – Will with in few weeks receive aged modules so work can begin) Continue work on life time prediction method of power modules using accelerated tests (on-going: suggest a Modified Coffin-Manson method) WP2.2 Wating for Ph.d. to arrive – now arrived WP2.3 Further studies of mission profile and on rain flow analysis (Have contact with industry and they can supply detailed mission profile and failed modules – we have datasheet of P3 module ) Assist verification of model work using test systems (test system is being realized – measure 16 CORPE – WP3 Accelerated test and verification (Prof. Kjeld Pedersen, AAU-Nano) I : 3 Y WP3.1 Long term stability and failure mechanism in capacitors (Ph.D), ET-SMN, Tonny Christiansen WP3.2 Physical characterization of components for power electronics (Ph.D),Nano-KP, Dennis Acton Nielsen WP3.3 Test of selected model systems (Martin Petersen), AU -AN Status : •Focus on capacitors, both components from industry and model systems (thin films) with designed defects produced in the lab. Theoretical and experimental analysis of field distributions. •Schottky diodes on the NTD-Si produced. Defect mechanisms identified. Tests on Infinion diodes initiated Expected results (summer 2013): •Characterizations of model components: 1) PP dielectrics by Kelvin Probe Force Microscopy, 2) Introduction and investigation of high-voltage induced self-clearing events, 3) Material and damage examination by AFM, SEM, and OM •General model to simulate temperature distribution and other parameters inside film capacitor •Lifetime model: 1) Results from model components, 2)Theoretical modeling, 3)Accelerated testing of real components 17 CORPE – WP4 Design tools (Prof. Frede Blaabjerg, AAU) I : 3Y WP4.1 Multidisciplinary design tool for power circuits (Ph.D., Amir Bahman, November 2012),ET-FB WP4.2 Emerging devices and circuit design (Ph.D., Christian Sintamarean, September. 2012),ET-FB WP4.3 Design tool integration (Post.Doc., Huai Wang, April 2012),ET-FB - Ke Ma very soon Status •System level reliability prediction methods are being studied and applied for power converters •Cooling design for IGBT module testing setup. •Thermal modeling and analysis of SiC devices in PV inverter application case (by taking into account the parameter variations with electrical stresses and temperature, study in two PV inverter topologies). •Agreement with ANSYS to work on software packages (e.g. Simplorer, Icepak) for multi-domain power electronic simulations. •Publications including one accepted IES-magazine paper in title of “Toward Reliable Power Electronics” Next Step •Accumulate the experiences in using ANSYS software packages (e.g. Icepak, Simplorer, etc.) and figure out the connection/integration among them. •Apply Icepak for cooling design of the IGBT module testing system. •Experimental work on parameter characterization of SiC devices to verify the electrical/thermal models; start to look at the failure mechanisms and lifetime model of SiC devices. •Continue the work to develop a simple tool for lifetime prediction of IGBT modules and capacitors in power converters (with selectable part no. of components, heat sink, topologies and control schemes) •ANSYS training on Simplorer and Maxwell in May-June, 2013 and on Icepak in Fall, 2013. 18 CORPE – WP5 Real time monitoring and prediction (Paul Thoegersen, KK-Electronics) I : 4 Y WP5.1 Life time prediction methods for real time field operation (Ph.D, Pramod Ghimire), ET-SMN/PT WP5.2 Verification of selected methods for real time field operation (Post.Doc.),ET WP5.3 Field logging- indepent/ build in sensor/software (Post.Doc., Sanjay K. Chaudhary) Status : WP5.1: New Vce measurement circuit running (Pramod presents status) Power Module wear out in controlled steps (20, 40, 60, 80 and 100%) started WP5.2: HW design on measurement circuit prototype WP5.3: Just started, first meetings on Field Logger held (see below) Expected results: •New features integrated into the gate driver circuit that gives the user an indication •of transistor state and remaining lifetime. •New ideas and algorithms for field data logging including mission profile data selection, multidimensional data storage, data reduction methods including pre- and post-processing of data 19 CORPE – WP6 Application design (Synergy HTF-IEPE) (Companies) I : 6 Y WP6.1 IGBT diagnose – special driver with other features (KK electronics) (Link to IEPE Post. Doc. Szymon Michal Beczkowski, KK-electronic ) WP6.2 Frequency converter based pump system ( Link to IEPE demonstrator with 1. IEPE PhD ) WP6.3 Low Voltage MW power converter (Link to IEPE demonstrator IEPE Post. Doc. Ionut Trintis, Vestas, Danfoss, KK) WP6.4 Medium Voltage MW power converter (Link to IEPE demonstrator 1.PhD+1.Post. Doc. , Vestas, Danfoss, KK), Status : On-going activity Expected results: New type of IGBT diagnostics using VCE, New type of IGBT module goal double power density. Test system for verifying lifetime models of IGBt. Center of Reliable Power Electronics 20 CORPE – Obel Professorship Status : •3 experimental set-up planned (one running, one expect to be ready within the first year of Obel professorship and the third few months after); 2 of them are in cooperation with Danish companies •2 major projects (2 MEuero each) submitted: Danish Council for Independent Research, ERC European Advanced Grant •3 major international cooperation started •Team building: 1 PhD started, 1 PhD recruited, 1 PhD to be selected, 1 PhD to be re-announced, involvement in other 3 PhD’s, cooperation with 3 guests and 8 AAU staff members •3 journal papers and 13 conference papers in 2012 •IEEE fellowship •1 PhD and M.Sc course in reliability planned Expected results (2nd year Obel professorship): • 3 experimental set-up running • 1 project funded • International cooperation's consolidated with mutual visits, project submissions, international tutorials • 5 journal papers and 15 conference papers in 2013 • 4 PhD as principal supervisor started Center of Reliable Power Electronics 21 CORPE – Industry-University • WP1 • Collaboration with Danfoss Silicon Power on study of wire lift-off: - shear tests are carried out at Danfoss; - combined (FIB, SEM, microsectioning, optical microscopy and electrical characterisation) analysis is carried out at Phys&Nano; • Collaborations with Grundfos: - investigation of water diffusion in composite materials (walls of terminal box); - modeling and experimental study (AquaRIUM setup) of thermal diffusion of water vapor in closed boxes. • Collaboration agreement with kk-electronic on physical investigation of interfaces and liftedoff wires of power modules after accelerated tests. WP2 Received aged P3 modules with a known mission profile, data log of current load during lifetime, cooling water temperature during the module lifetime. (Support activity in WP2.1 (verification of lifetime models) and WP2.3(data for Rainflow analysis)) 22 CORPE – Industry-University • WP3 • • • • • – • Thin film capacitors from Grundfos for analysis and tests in labs. Danfoss has joined the work on capacitors Danfoss has supplied a list of capacitors they would like to have tested Collaboration on test systems for capacitors Collaboration on test systems for power semiconductor devices WP5 Field logging- indepent/ build in sensor/software KK and Danfooss initial Build-in or add-on device ? – What to measure – nr of sensors – external/internal ? (Temperature, vibrations, moist + ?) – Moist/condensation/dirt/salt – how do we measure/handle that ? – Lightning and transient overvoltages (from grid or direct) to be included ? – Commercial logger overview should be made Data compression and storage requirement – Methodology of treating raw data – Data compression from high resolution data. – Rain-flow counting, Coffin-Manson, Arrhenius – Multi-dimensional data handling – Event-triggered logs (special/extreme situations) – Time stamps for synchronisation with other data/systems WP6 - Build up demonstrator activities in IEPE, but close relation ship with CORPE PhD students in WP 2 and WP 5 23 CORPE – Industry-University • • • • Open-NPC module: use of IR Camera to measure the temperature inside an NPC converter (Danfoss Solar) Optic-fiber based measurement of chip temperature: use of fastest optic fiber probes to measure the temperature in different point of the chip and validate IR measurement and/or measure the temperature in a module during operation in real world converter (Danfoss Silicon Power) Parallel power converters for higher power density (student project, KK-electronics) Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters (KK-electronics, Vestas) 24 CORPE – in operation WP No Name 0 WP0: Management Steering Committee 1 2 3 4 5 6 Activities 2011 2012 2013 2014 2015 2016 Project Leader Participants Ressources ET U-I X X X X X X X X X X X X X X X X FBL X X X X X X X X X X X X X X VP Nano, GF, VWS, RWTH, Calce P1 X X X X X X X X X X X X X FBL ET, Calce P2 X X X X X X X GF, ET, VWS, DPE, Nano, KK PD1 X X X X X X X X X KP AU, Nano P3 (X) (X) (X) X X X X X X SMN ET, VWS, KK, DPE, ETH P4 Calce, ET, AU PD2 SMN GF, VWS, ET, Nano P5 KP Nano, AU, GF P6 AU, Nano, GF, DPE PD3 FBL ET, RWTH, ETH P7 FBL ET, Calce P8 ET, GF, ETH, DPE, KK, VWS PD4 KK, VWS P9 KK, VWS, DPE, ET PD5 WP1: Analysis, understanding and modeling All Nano Failure mechanism in power modules U Multi-physics based modelling U Wear out failures mapping I-U WP2: Life time prediction and design A new life time prediction method for power modules U Life time design with thermal management U-I Modelling of life time U X X X X X (X) X X X X X X X X WP3: Accelerated test and verification X X Nano Development of accelerated test I-U Physical characterization U Test of selected model systems I-U X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X WP4: Design tools ET Multidisciplinary design tool for power circuits U Emerging devices and circuit design U Design tool integration U-I X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X WP5: Real time monitoring and prediction X PT (KK) Life time prediction methods for real time field operation U-I Verification of selected methods for real time field operation I-U Field Logging I-U X X X X X (X) (X) (X) (X) X X X X X X X X X X X X X X SMN X PD7 WP6: Application design DPE, GF, KK, VWS Intelligent drive circuit and power converter I-U X X X X X DPE DPE, ET, ETH PD6 Frequency converter based pump system I-U (X) (X) (X) (X) X X X X X X X X X GF GF, ET PD6 Low Voltage MW power converter I-U X X X X X X X X X KK VWS, KK, DPE, ET PD6 Medium Voltage MW power converter I-U X X X X X VWS ET, RWTH PD6 (X) (X) (X) (X) DPE: Danfoss Power Electronics; VWS: Vestas Wind Systems; KK: KK-Electronic; GF: Grundfos Management; ET: Aalborg University, Energy; Nano: Aalborg University, Nano; AU: Aarhus University; RWTH: Aachen; ETH: ETH; Calce: University of Maryland X: Activated (X): Alternative solution 30-04-2013 25 CORPE – in operation CORPE – Work Packages – related activities Presentation of the Ph.D. Student with CORPE activities Name Active wihtin CORPE Funding: Morten Arnfeldt Hygum Affilliation Work Package number Work Package name Rui Wu Kristian Bonderup Pedersen Tonny Christiansen Uimin Choi Dennis Acton Nielsen Amir Sajjad Bahman Nicolae-Christian Sintamarean Pramod Ghimire Energy Technology at AAU Physics & Nanotechnology at AAU Energy Technology at AAU Energy Technology at AAU Physics & Nanotechnology at AAU Energy Technology at AAU Energy Technology at AAU Energy Technology at AAU 1.2 2.1 2.2 3.1 3.2 4.1 4.2 5.1 Active within other funding activities: Ke Ma Energy Technology at AAU Yongheng Yang Dao Zhou Energy Technology at AAU Energy Technology at AAU Cristian Busca Energy Technology at AAU Zian Qjn Nick Baker (pending) (pending) hamid Soltani? Energy Technology at AAU Energy Technology at AAU Energy Technology at AAU Energy Technology at AAU China Scholarship Council Power Electronics Conversion System for 10 MW Wind Turbines Grid Detection and Control of Single-phase Photovoltaic Systems China Scholarship Council under Grid Faults Industrial Reliability and Control Strategies for Wind Turbine System Modeling life time of electrical components and systems in wind Vestas turbines Control Strategies for Reliable Operation of WTGs Based on Power China Scholarship Council Electronics Technologies Obel Electro-Thermal Modeling of Power Semiconductor Devices Obel Strategies to predict and increase power converters lifetime FTP Reliability in Capacitors Physics & Nanotechnology at AAU 1.1 Failure Mechanism in Power Modules Multi-Physics based modeling of power electronic components and circuits A new life time prediction method for power modules Modeling of real-world stress in Power Semiconductor Devices Long term stability and failure mechanism in capacitors Physical characterization of components for power electronics Multidisciplinary design tool for power circuits Emerging devices and circuit design Life time prediction methods for real time field operation Start date End date 01-11-2012 31-10-2015 01-01-2013 01-04-2013 31-12-2015 31-03-2016 01-11-2012 01-09-2012 01-09-2012 31-10-2015 31-08-2015 31-08-2015 01-07-2010 30-06-2013 01-09-2011 01-01-2012 31-08-2014 31-12-2014 01-09-2010 31-08-2013 01-10-2012 01-01-2013 30-09-2015 31-12-2015 Presentation of the Guests with CORPE activities Name Yam Prasad Siwakoti Xibo Yuan Sudip Ghosh Lenos Hadjidemetriou Affilliation Guest Ph.D. From India Guest Post Doc Guest M.Sc. Guest Ph.D. Work Package number ? ? ? ? Work Package name ? ? ? ? Start date End date 15-04-2013 15-09-2013 01-03-2013 01-04-2014 01-03-2013 01-06-2013 27-03-2013 18-04-2013 26 CORPE – in operation Annual Plan 2013 1 2 3 Tue Wed Thu 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Fri Sat Sun M on Tue Wed 2 Thu Fri Sat Sun M on Tue Wed 3 Thu Fri Sat Sun M on Tue Wed 4 Thu Fri Sat Sun M on Tue Wed Thu CM AB SC Wed 8 Thu 13 Thu Fri Sat Sun NH NH Sat Sun M on M on Tue 22 Wed 1 January NH CM Fri 6 Thu Sat Sun M on Tue February Fri Sat Sat Sun M on Sun M on Tue Wed Tue Wed NH 14 Thu Fri Sat 10 Thu Fri 18 Fri Thu Sun M on Sat Sun M on Tue Wed CM Sat Sun M on M on Tue Wed July Fri Tue Wed CM NH 27 Thu Fri 23 Thu Fri Sat Sun M on Tue Wed 11 Thu Fri Sat Sat Tue Wed 15 Thu Fri Tue Tue 9 Fri Sun M on Tue Wed 12 Thu Fri Sat Sun M on Tue Wed 16 Thu Sun Fri 19 Thu Fri Sat Sun M on Tue Wed 20 Thu Fri Sat Sun NH Sat Sat Sun M on CW Sun M on Tue Wed Sat M on Tue Wed Sun M on Tue Wed 32 Thu Fri Sat Sat Wed 36 Thu Fri Sat Sun M on Tue 40 Wed Thu Fri Sat Sun M on WP Fri Sat M on November Sun M on December Tue Tue Wed CM WP Tue Wed CM WP 49 Thu Fri 45 Thu Fri 41 Thu Wed CM Sun Tue Sun 24 Thu Fri Sat Sun M on Tue Wed M on Tue NH CM 25 Thu Fri Wed M on Tue WPL CM Tue Wed 17 Thu Fri CM SC WPL NH 21 Thu Fri Sat Sun 28 Thu Fri Wed Thu Sat Sun M on Tue Wed 29 Thu WPL Wed Tue Thu NL Sat Sun M on Tue Wed 26 Thu Sun M on Tue Wed 33 Thu Fri Sat Sun Wed 37 Thu Fri Sat Sun M on Tue Wed Fri Sat Sun M on Tue Wed 30 Thu M on Tue Wed 34 Thu Fri Sat Sun M on Sun Fri Sat 38 Thu Fri Sat Sun CW/C Sat Sat Sun M on Tue Wed 42 Thu Fri Sat Sun M on AB SC Sun M on Tue Sat Sun M on Tue Wed Sun CM WP WPL SC AB M on Tue Wed Wed WPL M on Sat Wed 43 Thu 39 Thu Tue Wed Thu Fri CM SC WPL WP Fri Sat Sun M on Sun M on Tue WPL 44 Fri Sat Wed Thu CM Tue Wed 46 Thu Fri Sat Sun M on Tue Wed 47 Thu WPL 48 Fri Sat Sun M on CM Sat Tue CM 35 Fri CM Fri Fri WPL WPL CM Tue M on CM September October Sun CM WP M on M on CM August Sun Sat WP 31 Fri Sun WPL CM WP Thu Sat CM WP June Wed CM CM WP Wed Tue 7 Thu CM WP M on May Fri WP March April Wed WP 5 50 Thu Fri Sat Sun M on Tue WPL CM Center Management Meeting WP Meeting - only as an indicator, must be coordinated within the WP WP Leader Meeting Steering Committee Meeting Advisory Board Meeting *) Event marked with bold font indicates the event already executed Wed 51 Thu Tue Wed NL Fri CW/C CW NL NH Sat Sun M on Tue Wed 52 Thu NH NH NH Thu Fri Sat Sun M on WPL 1 Fri Sat Tue NH Centre Workshop/Conference Centre Workshop Newsletter National Holiday 27 30-04-2013 CORPE – in operation Milestones 28 07-10-12 CORPE – in operation Equipment for CORPE – located special areas • Characterization of power semiconductor devices (low voltage, medium voltage) – switching losses • Termographical equipment (Flir) • CALT system • Double thermal chamber system for stressor loading • Power cycling systems for power modules, capacitors (many and in collaboration with companies) • SIMS (Nano-department) • More to come Software-tools • Reliasoft • Ansys • Sherlock • PLECS, Saber etc 29 CORPE – achievements International activities • ETH was attending workshop (software, reliability models) • • • • • RWTH also attending workshop (high power devices) Keynote presentation at IECON-Canada, ICRERA –Japan (2012) Presentation at ECPE workshop in December Keynotes 2013 in Germany, 2xTurkey, Russia, Taiwan (so far) Cooperation with Prof. Busatto group, Italy, follow-up Visit of Ass. Prof. Francesco Lannuzzo, August-October “Overcurrent laboratory testing of Power Semiconductor Devices” Tutorial at ECCE-Europe • Cooperation with ARCES group, Italy, follow-up • Course for PhD students on power semiconductor devices • ECPE proposal •Cooperation with IFSTTAR and GE2Lab group, France, follow-up • TSEP working during the operation of the converter (active thermal control) • Paper and tutorial at IECON 2013 30 CORPE – achievements Results 2012 • ECPE tutorial on reliability in summer 2011 • Student projects are running 2011, 2012, 2013 • First papers published on reliability with paper awards, + 20 journal publications • New Professor in reliability – Marco Liserre + 2 PhD’s and 2 Post Doc’s • Contacts with new international partners (eg. EU project) • Conference PEDG’2012 – received 200 digests – 130 papers accepted – 210 participants • Post docs started, 9 PhDs hired now, + 15 involved • HTF-project (IEPE), 110 mio dkr • PhD course on reliability summer 2012 • Work package meetings with conceptual definition of reliability (Danfoss, Grundfos presentations); what is reliability ? Stressor day, device test day • PhD’s are in companies from time to time • New companies are interested to join the center • Special Issue IEEE IES magazine 2014 – Also maybeIEEE Trans on PE • Sharepoint and web-site running • Center workshop and symposium in November 2012 31 Goals 2013 Key topics (most operational) • Meeting with Advisory Board January 16th 2013 • Strong coordination with HTF-project (IEPE) • Meeting in all Work Packages – now they have man-power • Papers for APEC 2013, ECCE 2013, ECCE Europe, PCIM, TIA. TPEL, TIE • Course on reliability to be held for M.Sc students 2013 • Number of workshops, outreach • Pre-Standardization Work – overview and action • Lab-facilities continously to be settled • Continue research and coordination • Promotion of the outcome • Planning of tutorials – conferences • Overview paper for reliability • PhD’s in companies and abroad • Get the first significant results • Hold annual symposium and internal workshops • Research highlights according to mile-stones 32