Global Fan-in Wafer Level Packaging Market 2016-2020

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Global Fan-in Wafer Level Packaging Market 2016-2020
Global Fan-in Wafer Level Packaging Market 2016-2020
Global Fan-in Wafer Level Packaging Market 2016-2020 is the latest addition to Sandlerresearch.org
industry research reports collection.
Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most
preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from
application-specific integrated circuits (ASICs) and microprocessors to electrically erasable
programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP
and is gaining popularity among fabless and foundry companies globally.
The analysts forecast Global Fan-in Wafer Level Packaging Market to grow at a CAGR of 9.63% during
the period 2016-2020.
Covered in this Report
This report covers the present scenario and the growth prospects of the global Fan-in Wafer Level
Packaging Market for 2016-2020.
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Key vendors
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Other prominent vendors
Rudolph Technologies
SEMES
SUSS MicroTec
Ultratech
FlipChip International
Key regions
APAC
North America
Europe
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Market trend
Increase in wafer size
For a full, detailed list, view our report
Market driver
High demand for miniaturized electronics
For a full, detailed list, view our report
Market challenge
Cyclical nature of semiconductor industry
For a full, detailed list, view our report
Key Questions Answered in this Report
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?
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Wafer Level Packaging Market 2016-2020”report OR for any other market research and intelligence
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