Process Controls

HERMETICS
(Metal Can)
Process Capabilities
WAFER SAW & WASH
• Capabilities up to 8 inch wafer and 3
mils thick wafer
• Wafer Saw DAD 341 and Ultratech
603 Cleaner
• With CO2 Re-ionizer to maintain
water resistivity of 0.1 to 1 Meg-ohm
• 100% saw through and partial cut
DIE DEMOUNTER
• Manually operated using Viking equipment –
mostly being used for big die sizes
• Manual die plating process using butyrate plastic
sheet for smaller die sizes
• Viking 1010B
Process Controls
• Kerf width measurement
• Visual inspection
DIE ATTACH
• Eutectic Attach - ESEC 2003 semi-auto
attach process (forming gas N2/H2)
• Eutectic Attach - Manual using tunnel die
attach (forming gas N2/H2)
• Au/Si (380°C to 420°C); Au/Sn (320°C to
340°C)
• Epoxy Attach - AMI 3200 auto machine
• Epoxy Attach - Manual process using
dispenser I & J fisnar and AD3000
• Epoxy Cure - 170°C to 180°C @ 1hr
Process Controls
• Die Shear Test – max 5kg
• Die Punch Test – 90% silicon remaining
• Die Flick Test – 75% silicon remaining and
no more than 75% voids
DIE SHEAR TEST
WIREBOND
• Ultrasonic bonding
• M20 manual - capable for heavy wires (5.0 to
15 mils aluminum wire 99.99%).
• ASM509 and ASM559 automatic bonders capable for fine wires (1.0 mil to 2.0 mils
aluminum wire 99.99%)
• KNS1470 semi-auto bonder - capable for fine
wires (1.0 mil to 2.0 mils aluminum wire
99.99%)
• KNS484 manual bonders - capable for fine
wires (1.0 mils to 4.0 mils aluminum wire
99.99%)
Process Controls
• Wire Pull Test
WIRE PULL TESTER
SEAL
• Sealers for hermetic packages with
excellent hermeticity.
• Taylor & Windfield, Polaris 150 or 13
Process Controls
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Fine & Gross Leak
Crimp Test
Electrode imprint
Moisture Level - 50 PPM max
Oxygen Level - 500 PPM max
FINE LEAK
GROSS LEAK
MARKING
• Transfer Ink marking (black ink – single part)
• Markplate developer (AGFA Repromaster,
Markem 452E / 452W)
• Markem 300T / Markem U-1131 marking
using mark plate and ink
Process Controls
• Mark permanency test for ink
type process
• 100% visual inspection
STABILIZATION BAKE (Blue M-Oven)
• 883 condition C: 150°C to 155°C @ 24hrs
• 883 condition D: 200°C to 205°C @ 24 hrs
TEMPERATURE CYCLE (Ransco)
• Military:
No. of Cycles: 10 cycles
Cold Temp: -65°C to -75°C
Hot Temp: 150°C to 165°C
TEMPERATURE CYCLE
• Commercial:
No. of Cycles: 5 cycles
Cold Temp: -55°C to -75°C
Hot Temp: 150°C to 165°C
CENTRIFUGE (Triotech)
• Stress Level: 20,000 to 30,000
CENTRIFUGE
LEAD FINISH
• Manual pneumatic system solder dip
• Solder Dip: Pb (63Sn/37Pb) and Pbfree
(96.5Sn/3.0Ag/0.5Cu) Solder Alloy; Flux water
soluble
Process Controls
• Solderability Test
FINE LEAK (Alcatel Helium)
• 100% Fine leak test
• Helium purity: 95%
GROSS LEAK (Triotech / Binks)
• 100% Gross leak test
• Galden
FINE LEAK
PACK
• Pack in box, tube or styrofor
GROSS LEAK