Speedstack PCB layer stackup design and documentation system

Professional HDI and flex-rigid
PCB stackup design
& documentation for
PCB fabricators & designers
Speedstack
Speedstack HDI
Speedstack Flex
Professional HDI and
flex-rigid stack documentation
Transmission line modeling
Model/document mesh/
crosshatch ground planes
Impedance control
Supply-chain management
& cost control
polarinstruments.com
Compatibility with
third-party stackup tools
Speedstack PCB Stackup design & documentation
Stackup design environment
Speedstack is a comprehensive stackup design environment for PCB fabricators, pre-layout
engineers and value-add PCB brokers. By collating libraries of materials, costs and suppliers with
critical design data, such as transmission line specifications or impedance control, Speedstack lets
you produce error-free build documentation. Speedstack’s end-to-end approach to stackup design
allows you to create documents that can be shared at every stage of the PCB supply chain and
drastically reduces the time you need to create, document and control PCB layer stackups.
Why use Polar’s Speedstack?
Versatile stack creation
Speedstack gives you two key methods for stackup creation: manual layer-by-layer design, a
Virtual Material Mode (VMM) to document generic stackups and explore design options before
committing to real materials. Both methods give you the flexibility to manually edit stacks to
balance performance, material availability and cost.
What does Speedstack bring you?
Supply chain control
Speedstack combines a generic library of materials of set dielectric thicknesses with the materials
libraries from PCB base-material suppliers in the Polar Speedstack Material Partner Program in
addition to your own materials libraries. So you can replace hours of complex calculations and
guesswork with accurate data on how different materials or suppliers will affect your board’s
final performance.
Cost control
By improving collaboration between designers and fabricators Speedstack helps you to define the
optimum combination of materials to minimise your build costs. OEMs can tightly specify critical
performance parameters, while fabricators can share material recommendations with OEMs to
ensure that the most cost-effective materials are used in the build.
Clear & accurate documentation
Your completed stackups are presented in graphical or report formats and can be exported in a
choice of file formats, including Gerber, JPEG and PDF. This makes it easier for you and your
fabricator to visualise and replicate the stackup design accurately. Your Speedstack documents
will also include clear and accurate information on your PCB materials, drill details and impedance
control specifications.
Speedstack features
•
•
•
•
•
Enhances supplier management and cost control
Comprehensive stackup editing tools
Flexible report generator allows you to tailor your printouts
Easy error-free documentation & communication
Impedance control data for lossless lines
(Speedstack HDI/Flex PCB)
• Transmission line field solver & insertion loss modeling
(Speedstack HDI/Flex Si)
• VMM - Virtual Material Mode - rapid library-free stack specification
Who should use Speedstack?
Pre-layout designers and supply chain managers
A checklist of design rules for stackup and fabrication helps you to ensure each
supplier’s manufacturing capabilities are factored into the stackup process. When
sourcing PCBs from multiple suppliers or moving from prototype to volume
production, you can make the most effective choice of suppliers and ensure that
your chosen suppliers can meet your build criteria.
PCB fabricators
Stackup pan and zoom
feature
Documentation on the preferred stackups can be completed in minutes and shared
with customers or other companies within your PCB supply chain. This greatly
reduces your engineering time, increasing the accuracy of documenting stackups
compared to using traditional methods.
The Speedstack .sci file contains detailed information on the layer stackup, including drill details and precise impedance
control specifications and presents this information to your customers and suppliers in an easy-to-read format, reducing
communication errors and the loss of critical information.
Speedstack introduces two enhanced products. Speedstack HDI makes re-ordering and renaming sub-stacks quick and
easy with the Navigator – especially useful for HDI constructions. Speedstack Flex allows PCB fabricators and OEM
engineers to create and document flex-rigid PCB layer stackups. You create accurate and efficient flex-rigid PCB
stackups in minutes, with error-free documentation for tighter control over the finished board.
Impedance control on lossless PCBs:
With a direct link into Polar's Si8000m controlled impedance design system, Speedstack PCB/Speedstack HDI
PCB/Speedstack Flex PCB will be the choice for PCB fabricators, value-add brokers and pre-layout designers who want
fast design and documentation of controlled impedance PCB stackups. Speedstack allows you to share accurate, easyto-read stackup documentation with every company and individual in your supply chain, including verification prior to
pre-build tests. You’ll experience closer collaboration between fabricators, OEMs and brokers and discuss and resolve
potential issues early in the fabrication process.
Test data for controlled impedance
With Speedstack HDI/Flex Si or Speedstack HDI/Flex PCB you can output test files
for Polar’s CITS controlled impedance test systems directly for each stackup. As an
OEM, you can specify clear impedance test criteria to suppliers or brokers;
fabricators can link the required impedance test characteristics to each build.
Flex-rigid stackup documentation with Speedstack Flex
With Speedstack Flex’s navigator you can link and document as many cross
sections as you require to fully document your flex-rigid build up. Speedstack Flex
documents common flex-rigid constructions, including doublets where stacked pairs
of flex link two rigid sections of the flex-rigid construction. The navigator documents each rigid and flex-rigid section with
as many "substacks" and layers as your design needs. A range of materials, including flexible adhesives, bond ply and
flexi core, can be enabled or disabled for each layer, and impedance structures can be added to each sub-stack.
Mesh/crosshatch ground planes
Use Speedstack Flex in conjunction with Si8000m and Si9000e field solvers to model and document mesh /
crosshatch ground. Mesh geometry and structure data are easily shared between Si8000m and Si9000e.
Controlling impedance & transmission line losses
For PCBs with the latest ultra-high-speed chipsets operating over a broad band of frequencies, managing insertion
loss is as critical as controlling impedance. Speedstack’s three versions allow you to select the design tools which
are right for your PCB performance; Speedstack also supports XML export so that you can script and integrate with
other tools.
Press cycle documentation with Speedstack HDI
The Speedstack HDI navigator enables you to link and
document the multiple stages in HDI build ups stage by stage
and also the completed final product. There is no limit to the
number of press cycles you can document.
Using Speedstack HDI PCB in fabrication
Designed for fabricators who need to manage controlled
impedance builds, Speedstack HDI PCB uses the proven
Polar Si8000m multiple dielectric boundary element field solver
to provide the impedance data for a wide range of single and
multiple dielectric structures for the stack, including modeling
the resin-rich areas between differential traces for maximum
accuracy. Speedstack HDI PCB gives you full access to the
stand-alone Si8000m Quicksolver.
Using Speedstack HDI Si for transmission line design
Speedstack HDI Si takes the impedance-control capabilities
integrated into Speedstack HDI PCB and adds insertion loss
control through a direct link to the Polar Si9000e PCB
transmission line design system.
Insertion loss & impedance control on multi-GHz PCBs:
Speedstack HDI Si
Speedstack HDI Si uses the fast and accurate frequency-dependent transmission line modeling of the Si9000e to
model insertion loss and extract full transmission line parameters from over 100 popular PCB transmission line
structures. You can extract RLGC matrices and graph dielectric, copper and combined losses and quickly extract,
graph or export S-parameters in Touchstone™ format. Use the Si9000e for single or multiple dielectric builds and
include solder-mask performance by setting mask coverage to be adjacent, between and above traces.
Pre-layout design with Speedstack HDI Si
Speedstack HDI Si quickly guides you through the complex decisions required to create efficient stackups prior to
layout. With Speedstack HDI Si’s documentation you can discuss material selections with your fabricator prior to
production and optimise your materials for cost, signal integrity, manufacturability and reliability. Alternatively, you
can use generic materials to create your stackup and allow your fabricator to fine tune the stackup using different
materials to improve manufacturing cost and yield.
Related Polar products
Si8000m controlled impedance field solver for lossless lines
The Si8000m boundary element method field solver builds on the familiar easy-to-use user interface in earlier Polar
impedance design systems. The Si8000m adds enhanced modeling to predict the finished impedance of multiple
dielectric PCB builds and also takes into account the local variations in dielectric constant on close spaced
differential structures.
The Si8000m includes modeling for surface coating and calculates the resist thickness adjacent to above and between
surface traces and can be tailored to the particular resist application method in use on your boards. The new Si8000m
also extracts even mode, odd mode and common impedance, increasingly important characteristics on high-speed
systems such as USB and LVDS.
Frequency-dependent impedance modeling with the Si9000e transmission line field solver –
ideal for high speed differential signalling
The Si9000e PCB controlled impedance frequency-dependent boundary element field solver combines powerful
impedance calculation over a wide range of structures and unprecedented ease of use. Si9000e is the ideal tool for
ultra-high-speed serial data channels.
With its fast, accurate, frequency-dependent transmission line modeling, the Si9000e is designed to model transmission
line loss, impedance at given frequencies and extract full transmission line parameters over a wide range of popular
PCB transmission lines (over 100 structures). Employing boundary element method field solving, the Si9000e extracts
RLGC matrices and rapidly plots a range of transmission line information for the structure you are designing. Loss is
graphed three ways with clear indication of dielectric, copper and total attenuation.
Coupon Generation with CGen
Choose the optional CGen PCB for controlled impedance coupons
– see CGen literature LIT232.
Close the loop between modeling and test with the CITS880s
The CITS880s now with both coupon test and onboard test capability is the perfect
complement to measure and traceably verify your finished PCBs and production test
coupons. Simple to use yet accurate and repeatable – see CITS880s literature LIT248.
End-to-end insertion loss control with Speedflex HDI Si
Adding the Atlas Si GHz-PCB test system to the Si9000e insertion loss control tools in
Speedstack HDI Si gives you complete control over insertion losses throughout the
fabrication process – see Atlas Si literature LIT233.
Speedstack material partner program
Speedstack Product Matrix:
USA / CANADA / MEXICO
Polar Instruments Inc
T: (503) 356 5270
E: [email protected]
ASIA / PACIFIC / SINGAPORE
* Polar Instruments (Asia Pacific) Pte Ltd
T: +65 6873 7470
E: [email protected]
CHINA
* Polar Instruments (China) Ltd
East China - Shanghai
T: +86 21 3530 7470
E: [email protected]
South China - Zhuhai
T: +86 756 336 7470
E: [email protected]
INDIA
* Polar Instruments (India) Pvt Ltd
T: +91 80 4911 6666
E: [email protected]
JAPAN
* Gardien Japan Co. Ltd
T: +81 3 3904 6230
E: [email protected]
KOREA
* Polar Instruments Korea Corp
T: +82 2 2644 2493 / 4
E: [email protected]
TAIWAN
* Polar Instruments Taiwan
T: +886 2 2991 7470
E: [email protected]
GERMANY, AUSTRIA, SWITZERLAND
* Polar Instruments GmbH
T: +43 7666 20041-0
E: [email protected]
UNITED KINGDOM / EUROPE
Polar Instruments (Europe) Ltd
T: +44 23 9226 9113
E: [email protected]
REST OF WORLD
Polar Instruments Ltd
(Head Office)
T: +44 23 9226 9113
E: [email protected]
* Authorised distributor for Polar Instruments Ltd's products. These
independent operations are neither agents or subsidiaries of Polar
Instruments Ltd.
© Polar Instruments 2016.
Polar Instruments pursues a policy of continuous improvement.
The specifications in this document may therefore be changed
without notice.
All trademarks recognised.
LIT238: 2016
Speedstack PCB
Editor
X
Speedstack HDI PCB
X
Speedstack Si
X
Speedstack Flex PCB
Speedstack HDI Si
Speedstack Flex Si
Specifications:
HDI Navigator
XFE
Editor
(Crosshatch)
X
X
X
X
X
X
X
X
X
Unlimited
Finished thickness compensation
Yes
CITS Test file generation
Stack documentation
Target system
Allegro
Ucamco
Integr8tor
IPC
IPC-2581-B
Zuken
Batch Export Impedance:
Insertion loss
Insertion loss
Included with Polarcare
Yes
Mechanical & Laser
Cadence Design Systems
Mentor Graphics
Impedance
Including blind & buried
Via documentation
Export stackup:
Impedance
User configurable
Drill documentation
Options:
Impedance
Insertion loss
Max layers
Materials library
Signal Integrity
Xpedition
CR-8000
Target system
Constraints Manager
UcamX
DFM Center
Si Projects
Si8000m
Speedstack PCB
Speedstack HDI PCB
Speedstack Flex PCB
Rigid controlled impedance pcb stackup design
As above plus HDI & Sequential lamination support
As above plus Flexrigid capability
Speedstack Si
Speedstack HDI Si
Speedstack Flex Si
Rigid impedance & insertion loss pcb stackup design
As above plus HDI & Sequential lamination support
As above plus Flexrigid capability
Ordering information:
Si9000e
About Polar Instruments
Polar Instruments is a market leader in designing and manufacturing tools to simplify and enhance the design,
fabrication and testing of printed circuit boards (PCBs). Their innovative tools include the industry-standard
Controlled Impedance Test System (CITS) which provides the global PCB industry with an easy-to-use test
system for high-speed digital and RF boards, as well as class-leading tools for fast and accurate design and
testing of controlled impedance in PCBs. Polar also leads the industry in tools for automated PCB layer stackup
design and documentation. Polar Instruments was established in 1976 and now has operations and channel
partners in the US, UK, Europe and Asia Pacific.
polarinstruments.com