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TECHNICAL OVERVIEW
Tech Paper #024
Chip Protection in Tape Automated Bonding
J. Boutillier and R. Roche
CII-Honeywell Bull, France
Summary
This paper demonstrates how Honeywell chose the best glob top encapsulant for their
Tap Automated Bonding (TAB) semiconductor packaging process, while requiring cure
temperatures less than 110°C as well as extended pot life greater than one day. Data
is also presented, confirming H70E-2’s performance from analytical techniques such
as: DSC, NMR, GC/MS, IR, SEM, X-ray Fluorescence, Ion Chromatography and
Atomic Absorption Spectroscopy. The paper’s concepts may be extended to all glob top
applications, especially COB (Chip on Board) format.
Conclusions
EPO-TEK® H70E-2 was chosen to best meet performance criteria such as:
• Thermo Cycling from -30°C to 145°C
for 10 cycles
• Pressure Cooker Test (PCT) moisture +
NaCl salt test for 64 hours
© Epoxy Technology Inc. 2012
EPO-302-01
• 85°C/85%RH for 1000 hours
• Solvent and chemical resistance
Epoxy Technology Inc. • 14 Fortune Drive • Billerica, MA 01821
phone 978-667-3805 fax 978-663-9782 Toll Free 800-227-2201 [email protected]
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